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首页 > 电子元器件选型 > 电信电路 > 其他电信集成电路

CC2430ZF128RTCR

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CC2430ZF128RTCR
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Texas Instruments

System-on-Chip Solution for 2.4 GHz IEEE 802.15.4 / ZigBee™ 48-VQFN -40 to 85

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¥83.3152
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生命周期状态： Not Recommended
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(8)
CC2430EM_REFDES CC2430EM Reference Design | TI.com
CC2430EM_REFDES: The CC2430EM reference design contains schematics and layout files for the CC2430EM module used in development kits. The reference design demonstrates good techniques for CC2430 decoupling and RF layout. For optimum RF performance, the reference design should be copied accurately. This is a 2-layer reference design with a discrete/microstrip balun and SMA antenna connector designed for a single ended 50 ohm antenna
OAD Flash Board Reference Design
OAD_FB_REFDES: The OAD (Over the Air Download) flash board reference design demonstrates how to connect an external SPI flash to the SoC debug/flash connector on several Chipcon development boards.
CC2430EM Reference Design
CC2430EM_REFDES: The CC2430EM reference design contains schematics and layout files for the CC2430EM module used in development kits. The reference design demonstrates good techniques for CC2430 decoupling and RF layout. For optimum RF performance, the reference design should be copied accurately. This is a 2-layer reference design with a discrete/microstrip balun and SMA antenna connector designed for a single ended 50 ohm antenna
CC2430DB Reference Design
CC2430DB_REFDES: The CC2430DB reference design contains schematics and layout files for the CC2430DB module used in development kits. The reference design demonstrates good techniques for CC2430 decoupling and RF layout. For optimum RF performance, these parts should be copied accurately. This is a 4-layer reference design with a discrete/microstrip balun and an inverted F PCB antenna. In addition to the RF part, this design contains a USB connector and a number of IO units. Most of the CC2430 application examples are using this HW platform.
OAD_FB_REFDES OAD Flash Board Reference Design | TI.com
OAD_FB_REFDES: The OAD (Over the Air Download) flash board reference design demonstrates how to connect an external SPI flash to the SoC debug/flash connector on several Chipcon development boards.
CC2430BALUN_REFDES CC2430 Anaren Balun Reference Design | TI.com
CC2430BALUN_REFDES: The Anaren Balun Optimized for CC2430 Reference Design contains schematics and layout files for a module which has compatible pinout with the CC2430EM used in development kits. This reference design demonstrates how a chip balun can be implemented with CC2430 to make a compact design. This is a 2 layer reference design with a chip balun and SMA antenna connector designed for a single ended 50 Ω antenna.
CC2430DB_REFDES CC2430DB Reference Design | TI.com
CC2430DB_REFDES: The CC2430DB reference design contains schematics and layout files for the CC2430DB module used in development kits. The reference design demonstrates good techniques for CC2430 decoupling and RF layout. For optimum RF performance, these parts should be copied accurately. This is a 4-layer reference design with a discrete/microstrip balun and an inverted F PCB antenna. In addition to the RF part, this design contains a USB connector and a number of IO units. Most of the CC2430 application examples are using this HW platform.
CC2430 Anaren Balun Reference Design
CC2430BALUN_REFDES: The Anaren Balun Optimized for CC2430 Reference Design contains schematics and layout files for a module which has compatible pinout with the CC2430EM used in development kits. This reference design demonstrates how a chip balun can be implemented with CC2430 to make a compact design. This is a 2 layer reference design with a chip balun and SMA antenna connector designed for a single ended 50 Ω antenna.
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