型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Other | ||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 | 是否无铅 |
是否Rohs认证
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生命周期 | 标称供电电压 | 最大模拟输入电压 | 模拟输入通道数量 | 最大线性误差 (EL) | 位数 |
表面贴装
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转换器类型 | 输入位码 | 功能数量 |
最大稳定时间
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最大压摆率
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技术 |
温度等级
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JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) |
处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
端子面层
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端子形式
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端子节距
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端子位置
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mfrid
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是否符合REACH标准
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Country Of Origin
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ECCN代码
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HTS代码
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YTEOL
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Source Content uid
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零件包装代码
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针数
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制造商包装代码
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包装说明
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MAX114CNG+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | e3 | 1 | 260 | 30 | MATTE TIN | 2164 | compliant | Japan, Mainland China, Malaysia, Philipp... more | EAR99 | 8542.39.00.01 | 9 | ||||||||||||||||||||||||||||||||
LTC2634CUD-HMX10#PBF
Linear Technology
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | COMMERCIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | 2136 | compliant | LTC2634CUD-HMX10#PBF | QFN | 16 | UD | |||||||||||
LTC2634IMSE-HZ8#PBF
Linear Technology
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 2136 | compliant | LTC2634IMSE-HZ8#PBF | MSOP | 10 | MSE | ||||||||||
LTC2634IMSE-HMX10#PBF
Linear Technology
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 2136 | compliant | LTC2634IMSE-HMX10#PBF | MSOP | 10 | MSE | ||||||||||
LTC2634CMSE-LZ10#PBF
Linear Technology
|
查询价格和库存 |
|
Yes | Transferred | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | COMMERCIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 2136 | compliant | LTC2634CMSE-LZ10#PBF | MSOP | 10 | MSE | ||||||||||||
MAX114ENG+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | e3 | 1 | 260 | 30 | MATTE TIN | 2164 | compliant | Japan, Mainland China, Malaysia, Philipp... more | EAR99 | 8542.39.00.01 | 9 | , | |||||||||||||||||||||||||||||||
LTC2634CUD-HMI8#PBF
Linear Technology
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | COMMERCIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | 2136 | compliant | LTC2634CUD-HMI8#PBF | QFN | 16 | UD | |||||||||||
LTC2634CUD-HZ8#PBF
Linear Technology
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | COMMERCIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | 2136 | compliant | LTC2634CUD-HZ8#PBF | QFN | 16 | UD | |||||||||||
LTC2634CMSE-LMX12#PBF
Linear Technology
|
查询价格和库存 |
|
Yes | Transferred | 0.06 % | 12 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | COMMERCIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 2136 | compliant | LTC2634CMSE-LMX12#PBF | MSOP | 10 | MSE | ||||||||||||
LTC2634IMSE-LMI12#PBF
Linear Technology
|
查询价格和库存 |
|
Yes | Transferred | 0.06 % | 12 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 2136 | compliant | LTC2634IMSE-LMI12#PBF | MSOP | 10 | MSE | |||||||||||
LTC2634IUD-HMI10#PBF
Linear Technology
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | 2136 | compliant | LTC2634IUD-HMI10#PBF | QFN | 16 | UD | ||||||||||
DAC104S085CISD/NOPB
National Semiconductor Corporation
|
查询价格和库存 |
|
Yes | Transferred | 0.19 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 6 µs | 650 µA | CMOS | INDUSTRIAL | R-PDSO-N10 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | SON | SOLCC10,.11,20 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | NO LEAD | 500 µm | DUAL | 2216 | unknown | ||||||||||||||
DAC124S085CISD/NOPB
National Semiconductor Corporation
|
查询价格和库存 |
|
Yes | Transferred | 0.19 % | 12 | YES | D/A CONVERTER | BINARY | 4 | 8.5 µs | 650 µA | CMOS | INDUSTRIAL | R-PDSO-N10 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | SON | SOLCC10,.11,20 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | NO LEAD | 500 µm | DUAL | 2216 | unknown | ||||||||||||||
TDC-GP2
ams
|
查询价格和库存 |
|
Transferred | 1731037 | unknown | 8542.39.00.01 | TDC-GP2 | , | ||||||||||||||||||||||||||||||||||||||||
DAC128S085CISQ/NOPB
National Semiconductor Corporation
|
查询价格和库存 |
|
Yes | Transferred | 0.195 % | 12 | YES | D/A CONVERTER | BINARY | 8 | 8.5 µs | CMOS | AUTOMOTIVE | S-PQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 40 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.16SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | 2216 | compliant | |||||||||||||||
DAC121C085CIMM/NOPB
National Semiconductor Corporation
|
查询价格和库存 |
|
Yes | Transferred | 0.19 % | 12 | YES | D/A CONVERTER | BINARY | 1 | 8.5 µs | CMOS | AUTOMOTIVE | R-PDSO-G8 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 635 µm | DUAL | 2216 | compliant | |||||||||||||||
LMP90100MHE/NOPB
National Semiconductor Corporation
|
查询价格和库存 |
|
Yes | Transferred | 3 V | 7 | 0.0015 % | 24 | YES | D/A CONVERTER | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 105 °C | -40 °C | 260 | 40 | 28 | PLASTIC/EPOXY | TSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 635 µm | DUAL | 2216 | compliant | ||||||||||||||||
LMP90099MHE/NOPB
National Semiconductor Corporation
|
查询价格和库存 |
|
Yes | Transferred | 3 V | 7 | 0.0015 % | 24 | YES | D/A CONVERTER | CMOS | AUTOMOTIVE | R-PDSO-G28 | Not Qualified | 125 °C | -40 °C | 28 | PLASTIC/EPOXY | TSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GULL WING | 635 µm | DUAL | 2216 | unknown | |||||||||||||||||||||
DAC104S085CIMM/NOPB
National Semiconductor Corporation
|
查询价格和库存 |
|
Yes | Transferred | 0.19 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 6 µs | 650 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 2216 | compliant | ||||||||||||||
DAC108S085CIMT/NOPB
National Semiconductor Corporation
|
查询价格和库存 |
|
Yes | Transferred | 0.195 % | 10 | YES | D/A CONVERTER | BINARY | 8 | 6 µs | CMOS | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 40 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 635 µm | DUAL | 2216 | compliant |