EPROM封装型号_EPROM厂家价格-bom2buy

型号

型号				Most Relevant					Technical															Compliance			Operating Conditions			Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	生命周期	内存密度	内存宽度	组织	标称供电电压 (Vsup)	最长访问时间	内存集成电路类型	I/O 类型	功能数量	字数代码	字数	工作模式	输出特性	并行/串行	编程电压	最大待机电流	最大压摆率	最大供电电压 (Vsup)	最小供电电压 (Vsup)	技术	温度等级	JESD-30 代码	认证状态	JESD-609代码	最高工作温度	最低工作温度	筛选级别	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	座面最大高度	长度	宽度	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	ECCN代码	HTS代码	YTEOL	Country Of Origin
AS27C256-25ECAM/Q Micross Components		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	250 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified	e4	125 °C	-55 °C	MIL-STD-883	32	CERAMIC, METAL-SEALED COFIRED	WQCCN		RECTANGULAR	CHIP CARRIER, WINDOW	YES	PALLADIUM GOLD	NO LEAD	1.27 mm	QUAD	3.048 mm	13.97 mm	11.43 mm	1776	QFJ	0.450 X 0.550 INCH, WINDOWED, CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	2
QP27C256L-250/XA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	250 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256-250/XA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	250 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP7C271-55WI e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	55 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			130 µA	5.5 V	4.5 V	CMOS	INDUSTRIAL	R-GDIP-T28			85 °C	-40 °C		28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	0.300 INCH, CERAMIC, WINDOWED, DIP-28	28	compliant	EAR99	8542.32.00.61	3.75
QP7C271-55WC e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	55 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			120 µA	5.5 V	4.5 V	CMOS	COMMERCIAL	R-GDIP-T28			70 °C			28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	0.300 INCH, CERAMIC, WINDOWED, DIP-28	28	compliant	EAR99	8542.32.00.61	3.75
QP7C271-55WMB e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	55 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			130 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	0.300 INCH, CERAMIC, WINDOWED, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256-300/QYA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	300 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256L-170/YC e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	170 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
5962-8606314QXX e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	170 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified	e0	125 °C	-55 °C	MIL-PRF-38535 Class Q	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE		DUAL				1937079	DIP	CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	4.25	USA
AS27C256-20ECAM Micross Components		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	200 ns	UVPROM	COMMON	1	32000	32.768 k	ASYNCHRONOUS	3-STATE	PARALLEL	12.5 V	300 µA	25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified	e4	125 °C	-55 °C	38535Q/M;38534H;883B	32	CERAMIC, METAL-SEALED COFIRED	QCCN	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	YES	PALLADIUM GOLD	NO LEAD	1.27 mm	QUAD	3.048 mm	13.97 mm	11.43 mm	1776	QFJ	0.450 X 0.550 INCH, CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	2
QP27C256L-300/YA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	300 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256-150/UA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	150 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256-120/QXA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	150 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256L-150/YC e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	150 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256-300/YA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	300 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
AS27C256-20ECAXT Micross Components		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	200 ns	UVPROM	COMMON	1	32000	32.768 k	ASYNCHRONOUS	3-STATE	PARALLEL	12.5 V	300 µA	25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C		32	CERAMIC, METAL-SEALED COFIRED	QCCN	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	YES		NO LEAD	1.27 mm	QUAD	3.048 mm	13.97 mm	11.43 mm	1776	QFJ	0.450 X 0.550 INCH, CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	2
QP27C256L-170/ZA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	170 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
AS27C256-20ECAM/Q Micross Components		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	200 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified	e4	125 °C	-55 °C	MIL-STD-883	32	CERAMIC, METAL-SEALED COFIRED	WQCCN		RECTANGULAR	CHIP CARRIER, WINDOW	YES	PALLADIUM GOLD	NO LEAD	1.27 mm	QUAD	3.048 mm	13.97 mm	11.43 mm	1776	QFJ	0.450 X 0.550 INCH, WINDOWED, CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	2
QP27C256L-150/ZA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	150 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256L-300/XA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	300 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75

型号				Most Relevant					Technical															Compliance			Operating Conditions			Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	生命周期	内存密度	内存宽度	组织	标称供电电压 (Vsup)	最长访问时间	内存集成电路类型	I/O 类型	功能数量	字数代码	字数	工作模式	输出特性	并行/串行	编程电压	最大待机电流	最大压摆率	最大供电电压 (Vsup)	最小供电电压 (Vsup)	技术	温度等级	JESD-30 代码	认证状态	JESD-609代码	最高工作温度	最低工作温度	筛选级别	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	座面最大高度	长度	宽度	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	ECCN代码	HTS代码	YTEOL	Country Of Origin
AS27C256-25ECAM/Q Micross Components		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	250 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified	e4	125 °C	-55 °C	MIL-STD-883	32	CERAMIC, METAL-SEALED COFIRED	WQCCN		RECTANGULAR	CHIP CARRIER, WINDOW	YES	PALLADIUM GOLD	NO LEAD	1.27 mm	QUAD	3.048 mm	13.97 mm	11.43 mm	1776	QFJ	0.450 X 0.550 INCH, WINDOWED, CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	2
QP27C256L-250/XA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	250 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256-250/XA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	250 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP7C271-55WI e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	55 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			130 µA	5.5 V	4.5 V	CMOS	INDUSTRIAL	R-GDIP-T28			85 °C	-40 °C		28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	0.300 INCH, CERAMIC, WINDOWED, DIP-28	28	compliant	EAR99	8542.32.00.61	3.75
QP7C271-55WC e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	55 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			120 µA	5.5 V	4.5 V	CMOS	COMMERCIAL	R-GDIP-T28			70 °C			28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	0.300 INCH, CERAMIC, WINDOWED, DIP-28	28	compliant	EAR99	8542.32.00.61	3.75
QP7C271-55WMB e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	55 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			130 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	0.300 INCH, CERAMIC, WINDOWED, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256-300/QYA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	300 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256L-170/YC e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	170 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
5962-8606314QXX e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	170 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified	e0	125 °C	-55 °C	MIL-PRF-38535 Class Q	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE		DUAL				1937079	DIP	CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	4.25	USA
AS27C256-20ECAM Micross Components		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	200 ns	UVPROM	COMMON	1	32000	32.768 k	ASYNCHRONOUS	3-STATE	PARALLEL	12.5 V	300 µA	25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified	e4	125 °C	-55 °C	38535Q/M;38534H;883B	32	CERAMIC, METAL-SEALED COFIRED	QCCN	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	YES	PALLADIUM GOLD	NO LEAD	1.27 mm	QUAD	3.048 mm	13.97 mm	11.43 mm	1776	QFJ	0.450 X 0.550 INCH, CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	2
QP27C256L-300/YA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	300 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256-150/UA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	150 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256-120/QXA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	150 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256L-150/YC e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	150 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256-300/YA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	300 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75
AS27C256-20ECAXT Micross Components		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	200 ns	UVPROM	COMMON	1	32000	32.768 k	ASYNCHRONOUS	3-STATE	PARALLEL	12.5 V	300 µA	25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C		32	CERAMIC, METAL-SEALED COFIRED	QCCN	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	YES		NO LEAD	1.27 mm	QUAD	3.048 mm	13.97 mm	11.43 mm	1776	QFJ	0.450 X 0.550 INCH, CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	2
QP27C256L-170/ZA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	170 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
AS27C256-20ECAM/Q Micross Components		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	200 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified	e4	125 °C	-55 °C	MIL-STD-883	32	CERAMIC, METAL-SEALED COFIRED	WQCCN		RECTANGULAR	CHIP CARRIER, WINDOW	YES	PALLADIUM GOLD	NO LEAD	1.27 mm	QUAD	3.048 mm	13.97 mm	11.43 mm	1776	QFJ	0.450 X 0.550 INCH, WINDOWED, CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	2
QP27C256L-150/ZA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	150 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			60 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD				1937079	QFJ	CERAMIC, LCC-32	32	compliant	3A001.A.2.C	8542.32.00.61	3.75
QP27C256L-300/XA e2v technologies		查询价格和库存		Active	262.144 kbit	8	32KX8	5 V	300 ns	UVPROM		1	32000	32.768 k	ASYNCHRONOUS		PARALLEL			25 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified		125 °C	-55 °C	MIL-STD-883 Class B	28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL				1937079	DIP	HERMETIC SEALED, CERAMIC, DIP-28	28	compliant	3A001.A.2.C	8542.32.00.61	3.75

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