型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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速度 | RAM(字数) | 总线兼容性 | 外部数据总线宽度 | 地址总线宽度 | 最大时钟频率 | I/O 线路数量 |
表面贴装
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标称供电电压 |
uPs/uCs/外围集成电路类型
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技术 | 其他特性 | 边界扫描 | 格式 | 集成缓存 | 低功率模式 | 串行 I/O 数 |
最大压摆率
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最大供电电压
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最小供电电压
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温度等级
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JESD-30 代码 |
认证状态
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JESD-609代码 |
湿度敏感等级
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最高工作温度
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最低工作温度
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峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量
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封装主体材料
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封装代码
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封装等效代码
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封装形状
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封装形式
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端子面层
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端子形式
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端子节距
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端子位置
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座面最大高度
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宽度
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长度 |
mfrid
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是否符合REACH标准
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YTEOL
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Source Content uid
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包装说明
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Country Of Origin
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ECCN代码
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HTS代码
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零件包装代码
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针数
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Date Of Intro
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CY8C4245AXI-483
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 2048 | I2C; IDE; IRDA; LIN; SPI; UART | 48 MHz | 36 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | CMOS | NO | 3 | 13.8 mA | 5.5 V | 1.71 V | INDUSTRIAL | S-PQFP-G44 | Not Qualified | e3 | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Matte Tin (Sn) | GULL WING | 800 µm | QUAD | 1.6 mm | 10 mm | 10 mm | 2065 | compliant | 9.22 | ||||||||||||||||||
MCIMX257CJM4A
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | 1.45 V | SoC | CMOS | ALSO REQUIRES 3.3 V I/O SUPPLY | 1.52 V | 1.38 V | INDUSTRIAL | S-PBGA-B400 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 400 | PLASTIC/EPOXY | LFBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 17 mm | 17 mm | 2245 | compliant | 5 | MCIMX257CJM4A | MAPBGA-400 | Mainland China, Malaysia | 5A992.C | 8542.31.00.01 | |||||||||||||||||||
MCIMX357CJQ5C
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | 1.8 V | SoC | CMOS | IT ALSO OPERATES AT 1.22 TO 1.47 V | 1.47 V | 1.33 V | INDUSTRIAL | S-PBGA-B400 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 400 | PLASTIC/EPOXY | LFBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 17 mm | 17 mm | 2245 | compliant | 5 | MCIMX357CJQ5C | MAPBGA-400 | Mainland China | 5A992.C | 8542.31.00.01 | |||||||||||||||||||
CY8C5666AXI-LP004
Cypress Semiconductor
|
查询价格和库存 |
|
Yes | Transferred | 8192 | I2C; USB; PS/2 | 33 MHz | 72 | YES | 1.8 V | CMOS | YES | 5.5 V | 1.71 V | INDUSTRIAL | S-PQFP-G100 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Pure Tin (Sn) | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 1903 | compliant | TQFP-100 | 3A991.A.3 | 8542.31.00.01 | QFP | 100 | ||||||||||||||||||
CY8C4246AZI-L433
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | PSoC | INDUSTRIAL | 3 | NOT SPECIFIED | NOT SPECIFIED | Pure Tin (Sn) | 2065 | compliant | 7.05 | 8542.31.00.01 | ||||||||||||||||||||||||||||||||||||||||||||||
MCIMX6G2AVM07AB
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 696 MHz | 16 | 26 | YES | MULTIFUNCTION PERIPHERAL | CMOS | YES | FIXED POINT | YES | YES | 1.3 V | 1.25 V | AUTOMOTIVE | S-PBGA-B289 | e2 | 3 | 125 °C | -40 °C | 260 | 40 | 289 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 1.32 mm | 14 mm | 14 mm | 2245 | compliant | 11.81 | MCIMX6G2AVM07AB | BGA-289 | Mainland China | 5A992.C | 8542.31.00.01 | 2017-05-31 | |||||||||||||||
CY8C4245AZI-483
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 2048 | I2C; IDE; IRDA; LIN; SPI; UART | 48 MHz | 36 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | CMOS | NO | 3 | 13.8 mA | 5.5 V | 1.71 V | INDUSTRIAL | S-PQFP-G48 | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Pure Tin (Sn) | GULL WING | 500 µm | QUAD | 1.6 mm | 7 mm | 7 mm | 2065 | compliant | 9.22 | ||||||||||||||||||||
CC1111F32RSPR
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | YES | SoC | CMOS | OTHER | S-PQCC-N36 | Not Qualified | e4 | 3 | 85 °C | 260 | 30 | 36 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 900 µm | 6 mm | 6 mm | 2477 | compliant | 15 | CC1111F32RSPR | HVQCCN, | 5A992.C | 8542.31.00.01 | QFN | 36 | |||||||||||||||||||||||
MCIMX6G3DVM05AB
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 528 MHz | 16 | 26 | YES | MULTIFUNCTION PERIPHERAL | CMOS | YES | FIXED POINT | YES | YES | 1.3 V | 1.15 V | OTHER | S-PBGA-B289 | e1 | 3 | 95 °C | 260 | 40 | 289 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.32 mm | 14 mm | 14 mm | 2245 | compliant | 11.81 | MCIMX6G3DVM05AB | BGA-289 | Mainland China | 5A992.C | 8542.31.00.01 | 2017-05-31 | ||||||||||||||||
EFR32MG12P232F512GM68-CR
Silicon Laboratories Inc
|
查询价格和库存 |
|
Yes | Active | YES | 3.3 V | SoC | CMOS | 3.8 V | 1.8 V | INDUSTRIAL | S-XQCC-N68 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 68 | UNSPECIFIED | HVQCCN | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 400 µm | QUAD | 900 µm | 8 mm | 8 mm | 2406 | unknown | QFN-68 | 8542.31.00.01 | |||||||||||||||||||||||||
EFR32MG12P132F512GM68-CR
Silicon Laboratories Inc
|
查询价格和库存 |
|
Yes | Active | YES | 3.3 V | SoC | CMOS | 3.8 V | 1.8 V | INDUSTRIAL | S-XQCC-N68 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 68 | UNSPECIFIED | HVQCCN | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 400 µm | QUAD | 900 µm | 8 mm | 8 mm | 2406 | unknown | QFN-68 | 8542.31.00.01 | |||||||||||||||||||||||||
CY8C4014LQI-421T
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 3 | NOT SPECIFIED | NOT SPECIFIED | 2065 | compliant | 10.13 | ||||||||||||||||||||||||||||||||||||||||||||||||||
CY8C4014LQI-422T
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 1024 | I2C | 16 MHz | 20 | YES | 3.3 V | CMOS | NO | 5.5 V | 1.71 V | INDUSTRIAL | S-XQCC-N24 | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | NO LEAD | 500 µm | QUAD | 600 µm | 4 mm | 4 mm | 2065 | compliant | 10.13 | QFN-24 | ||||||||||||||||||||||
MCIMX6Y1CVM05AB
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | SoC | CMOS | 1.5 V | 1.275 V | S-PBGA-B289 | e1 | 3 | 105 °C | -40 °C | 260 | 40 | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.32 mm | 14 mm | 14 mm | 2245 | compliant | 7.64 | MCIMX6Y1CVM05AB | MABGA-289 | Mainland China | 5A992.C | 8542.31.00.01 | 2017-11-21 | ||||||||||||||||||||||
MCIMX6Y1CVK05AB
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | SoC | CMOS | 1.5 V | 1.275 V | S-PBGA-B272 | e4 | 3 | 105 °C | -40 °C | 260 | 40 | 272 | PLASTIC/EPOXY | LFBGA | BGA272,17X17,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Nickel/Gold (Ni/Au) | BALL | 500 µm | BOTTOM | 1.23 mm | 9 mm | 9 mm | 2245 | compliant | 7.64 | MCIMX6Y1CVK05AB | MABGA-272 | Mainland China | 5A992.C | 8542.31.00.01 | 2017-11-21 | ||||||||||||||||||||||
CY8C4014PVI-422
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 1024 | I2C | 16 MHz | 20 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | CMOS | NO | 4.5 mA | 5.5 V | 1.8 V | INDUSTRIAL | R-PDSO-G28 | e4 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 2 mm | 5.3 mm | 10.2 mm | 2065 | compliant | 10.81 | ||||||||||||||||||||
MCIMX6Y2DVM05AA
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | SoC | CMOS | 1.5 V | 1.275 V | OTHER | S-PBGA-B289 | 3 | 95 °C | 260 | 40 | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.32 mm | 14 mm | 14 mm | 2245 | compliant | MCIMX6Y2DVM05AA | MAPBGA-289 | 5A992 | 8542.31.00.01 | 2016-10-10 | ||||||||||||||||||||||||||
CY8C6347FMI-BLD53T
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | YES | 1.1 V | Bluetooth SoC | CMOS | R-PBGA-B104 | e1 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 104 | PLASTIC/EPOXY | VFBGA | BGA104,9X14,14 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 350 µm | BOTTOM | 650 µm | 3.841 mm | 5 mm | 2065 | compliant | ||||||||||||||||||||||||||||||
MCIMX6G3CVM05AB
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | SoC | CMOS | 1.3 V | 1.15 V | INDUSTRIAL | S-PBGA-B289 | e1 | 3 | 105 °C | -40 °C | 260 | 40 | 289 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.32 mm | 14 mm | 14 mm | 2245 | compliant | 11.81 | MCIMX6G3CVM05AB | BGA-289 | Mainland China | 5A992.C | 8542.31.00.01 | |||||||||||||||||||||||
CC1111F32RSP
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | YES | SoC | CMOS | OTHER | S-PQCC-N36 | Not Qualified | e4 | 3 | 85 °C | 260 | 30 | 36 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 900 µm | 6 mm | 6 mm | 2477 | compliant | 15 | CC1111F32RSP | QFN-36 | 5A992.C | 8542.31.00.01 | QFN | 36 |