所有筛选条件 最长访问时间 其他特性 备用内存宽度 最大时钟频率 (fCLK) 命令用户界面 数据保留时间-最小值 耐久性 I/O 类型 I2C控制字节 JESD-30 代码 JESD-609代码 长度 制造商 内存密度 内存集成电路类型 内存宽度 湿度敏感等级 负电源额定电压 功能数量 端子数量 字数 字数代码 工作模式 最高工作温度 最低工作温度 组织 输出特性 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 并行/串行 生命周期 是否无铅 峰值回流温度（摄氏度） 最长访问时间 (50)

5 ns 6 7 ns 6 8 ns 3 9 ns 8 10 ns 18 11 ns 8 12 ns 105 13 ns 7 15 ns 109 18 ns 3 20 ns 58 25 ns 325 28 ns 8 30 ns 73 35 ns 683 40 ns 110 45 ns 1,212 48 ns 3 50 ns 180 55 ns 1,392 60 ns 161 65 ns 61 70 ns 1,529 75 ns 17 80 ns 281 85 ns 70 90 ns 1,541 100 ns 898 110 ns 17 120 ns 2,189 125 ns 12 130 ns 3 135 ns 9 150 ns 2,723 160 ns 4 170 ns 1,134 175 ns 3 180 ns 23 200 ns 2,898 250 ns 2,555 270 ns 19 300 ns 1,191 350 ns 199 390 ns 8 450 ns 675 500 ns 3 550 ns 37 600 ns 6 650 ns 10 1 µs 7

Min (ns) - Max (ns)

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00.1.142 317 100 YEAR DATA RETENTION 14 21V PROGRAMMING VOLTAGE 30 25V PROGRAMMING VOLTAGE 4 ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V 4 ALSO CONFIGURABLE AS 32K X 32 OR 64K X 16 3 ALSO OPERATES AT 1MHZ AT 2.7MIN 8 AUTO/SELF REFRESH 20 BYTE PROGRAMMABLE; PAGE WRITE 6 CAN ALSO BE CONFIGURED AS 512K X 16 9 CAN ALSO BE CONFIGURED AS 64K X 16 5 CONFIGURABLE AS 128K X 32 67 CONFIGURABLE AS 1M X 16 12 CONFIGURABLE AS 256 X 16 6 CONFIGURABLE AS 256K X 32 51 CONFIGURABLE AS 32K X 32 150 CONFIGURABLE AS 512K X 16 4 CONFIGURABLE AS 512K X 32 12 CONFIGURABLE AS 64K X 32 66 DATA RETENTION > 10 YEARS 8 DIAGNOSTIC PROM 79 FAST COLUMN ACCESS PROM 20 INPUT & OUTPUT TTL COMPATIBLE 2 IT ALSO CONFIGURED AS 64M X 1 4 IT ALSO REQUIRES 12V VDD SUPPLY 2 IT CAN ALSO CONFIGURED AS 128M X 2 AND 256M X 1 2 LG-MAX 5 LG_MAX 3 MEMORY CAN ALSO BE ORGANISED AS 64M X 1 2 OUTPUT REGISTERED 53 PAGE WRITE 51 POWER DOWN PROM 22 POWER SWITCHED PROM 422 PROCESSOR SPECIFIC PROM 10 PROCESSOR-INTELLIGENT PROM; BURST LOGIC; PROGRAMMABLE COMPATIBILITY WITH MANY COMMON MICROPROCESSORS 9 PROGRAMMABLE ADRESS LATCH ENABLE INPUT; POWER SWITCHED PROM 5 PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE 9 PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS 33 QUICK PULSE PROGRAMMING ALGORITHM 38 STATE MACHINE PROM 32 TTL COMPATIBLE I/O 44 TTL COMPATIBLE INPUT & OUTPUT LEVELS 20 TTL COMPATIBLE INPUTS/OUTPUTS 8 TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS 14 TTL/CMOS COMPATIBLE INPUTS/OUTPUTS 4 UNREGULATED BATTERY POWER SUPPLY RANGE 44 USER CONFIGURABLE AS 128K X 32 40 USER CONFIGURABLE AS 1M X 16 9 USER CONFIGURABLE AS 256K X 32 4 VERY HIGH-SPEED SNAP PULSE PROGRAMMING 4

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2 6 4 2 8 115 16 774

Min - Max

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最大时钟频率 (fCLK) (4)

1 MHz 1 2 MHz 8 104 MHz 6 133 MHz 2

Min (MHz) - Max (MHz)

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NO 1

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20 5 100 11

Min - Max

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100000.0 Write/Erase Cycles 5 1000000.0 Write/Erase Cycles 11

Min (Write/EraseCycles) - Max (Write/EraseCycles)

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COMMON 15,275 SEPARATE 8

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1010DDDR 3

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R-CDFP-F24 9 R-CDIP-T24 200 R-CDIP-T28 1,103 R-CDIP-T32 694 R-CDIP-T40 348 R-CDIP-T42 56 R-CQCC-J32 340 R-CQCC-N28 57 R-CQCC-N32 3,656 R-GDFP-F24 277 R-GDFP-F28 95 R-GDIP-T24 1,234 R-GDIP-T28 3,755 R-GDIP-T32 1,671 R-GDIP-T40 1,052 R-GDIP-T42 104 R-GQCC-J32 21 R-GQCC-N32 8 R-PDIP-T24 37 R-PDIP-T28 60 R-PDIP-T40 39 R-PDSO-G32 28 R-PDSO-G8 8 R-PQCC-J32 28 R-PQCC-N32 10 R-XDFP-F24 16 R-XDFP-F28 9 R-XDIP-T16 12 R-XDIP-T24 579 R-XDIP-T28 2,583 R-XDIP-T32 265 R-XDIP-T40 318 R-XQCC-J32 151 R-XQCC-N28 20 R-XQCC-N32 1,396 R-XQMA-P40 148 S-CPGA-P66 259 S-CQCC-J28 11 S-CQCC-J44 263 S-CQCC-N28 501 S-CQCC-N32 40 S-CQCC-N44 551 S-GQCC-J44 9 S-GQCC-N44 23 S-PQCC-J44 37 S-XPGA-P66 58 S-XPMA-P66 130 S-XQCC-J44 84 S-XQCC-N28 91 S-XQCC-N44 84

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e0 13,843 e1 2 e3 1,264 e4 591

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11.43 mm 242 11.455 mm 32 13.95 mm 115 13.97 mm 2,613 14.1 mm 266 15.367 mm 90 16.51 mm 454 16.535 mm 20 16.55 mm 122 16.5862 mm 23 16.65 mm 58 20.5 mm 16 27.3 mm 132 31.75 mm 106 31.877 mm 184 31.9405 mm 33 32 mm 22 32.005 mm 91 32.0675 mm 92 32.07 mm 18 32.135 mm 36 32.15 mm 26 36.83 mm 483 36.92 mm 423 37.0205 mm 129 37.084 mm 79 37.085 mm 38 37.147 mm 75 37.1475 mm 915 37.15 mm 61 37.215 mm 63 37.25 mm 186 37.275 mm 20 37.338 mm 64 41.885 mm 462 41.91 mm 242 42 mm 25 42.1 mm 104 42.1005 mm 584 42.165 mm 15 42.2 mm 66 42.295 mm 27 42.3 mm 159 52.07 mm 179 52.195 mm 399 52.26 mm 108 52.2605 mm 189 52.45 mm 123 54.635 mm 88 54.864 mm 43

Min (mm) - Max (mm)

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制造商 (50)

AMD 3,704 APTA Group Inc 36 Atmel Corporation 1,969 B&B Electronics Manufacturing Company 222 Catalyst Semiconductor 111 Cypress Semiconductor 1,277 Defense Logistics Agency 1,124 e2v technologies 1,299 Electronic Designs Inc 19 Fairchild Semiconductor Corporation 142 Force Technologies Ltd 253 FUJITSU Limited 168 FUJITSU Semiconductor Limited 180 Hitachi Ltd 85 Integrated Circuit Technology Corp 50 Integrated Silicon Solution Inc 54 Intel Corporation 1,136 LAPIS Semiconductor Co Ltd 54 LSI Corporation 220 Macronix International Co Ltd 207 Microchip Technology Inc 890 Micross Components 287 Mitsubishi Electric 97 Mosaic Semiconductor Inc 130 National Semiconductor Corporation 375 NEC Electronics America Inc 25 NEC Electronics Group 26 NTE Electronics Inc 19 NXP Semiconductors 28 OKI Electric Industry Co Ltd 26 Philips Semiconductors 74 Pyramid Semiconductor Corporation 65 QP Semiconductor 787 Renesas Electronics Corporation 115 Rochester Electronics LLC 1,276 Sharp Corp 23 SkyHigh Memory Limited 24 Spansion 329 STMicroelectronics 2,799 Texas Instruments 1,165 Thales Components Corp 20 Thales Group 107 Thomson Electron Tubes & Devices Corp 29 Thomson-CSF Compsants Specific 40 Toshiba America Electronic Components 112 Twilight Technology Inc 640 Vishay Semiconductors 455 VLSI Technology Inc 20 Waferscale Integration Inc 833 YAGEO Corporation 30

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内存密度 (19)

1.024 kbit 28 2.048 kbit 20 4.096 kbit 23 8.192 kbit 8 16.384 kbit 1,078 32.768 kbit 948 65.536 kbit 3,251 131.072 kbit 1,707 262.144 kbit 5,312 524.288 kbit 2,629 1.0486 Mbit 4,344 2.0972 Mbit 1,295 4.1943 Mbit 1,786 8.3886 Mbit 378 16.7772 Mbit 57 33.5544 Mbit 19 67.1089 Mbit 6 268.4355 Mbit 2 4.295 Gbit 1

Min (bit) - Max (bit)

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EEPROM 8 FLASH 8 UVPROM 18,857 UVPROM CARD 8 UVPROM MODULE 568

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内存宽度 (4)

4 32 8 20,019 16 2,781 32 39

Min - Max

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1 439 2 159 3 9 NOT APPLICABLE 1 NOT SPECIFIED 20

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-5.2 V 10 -5 V 3 -4.5 V 9

Min (V) - Max (V)

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1.0 17,465

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12 1 120 2 16 21 24 2,413 28 8,383 32 8,346 36 6 40 1,906 42 172 44 1,059 52 1 64 4 66 447 68 6 8 13

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64 words 8 128 words 1 256 words 39 512 words 16 1.024 k 15 2.048 k 1,130 4.096 k 931 8.192 k 3,216 16.384 k 1,900 32.768 k 5,163 65.536 k 4,028 131.072 k 3,209 262.144 k 1,709 524.288 k 1,102 1.0486 M 379 2.0972 M 37 16.7772 M 6 33.5544 M 2 536.8709 M 1

Min (words) - Max (words)

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64.0 8 128.0 1 256.0 39 512.0 16 1000.0 15 2000.0 1,130 4000.0 931 8000.0 3,216 16000.0 1,900 32000.0 5,163 64000.0 4,028 128000.0 3,209 256000.0 1,709 512000.0 1,102 1000000.0 379 2000000.0 37 1.6E7 6 3.2E7 2 5.12E8 1

Min - Max

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ASYNCHRONOUS 16,730 PROGRAMMABLE ASYNCHRONOUS 2 SYNCHRONOUS 630

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50.0 °C 6 55.0 °C 9 70.0 °C 7,476 75.0 °C 58 80.0 °C 3 85.0 °C 5,366 100.0 °C 150 105.0 °C 136 125.0 °C 9,607

Min (°C) - Max (°C)

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-55.0 °C 9,245 -40.0 °C 5,990 -25.0 °C 1 -20.0 °C 22 -10.0 °C 15 0.0 °C 7,538

Min (°C) - Max (°C)

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组织 (34)

128KX16 276 128KX32 32 128KX8 2,901 128X8 1 16KX16 193 16KX8 1,707 16MX4 6 1KX4 7 1KX8 8 1MX16 39 1MX8 340 256KX16 688 256KX32 2 256KX8 1,019 256X4 19 256X8 20 2KX16 52 2KX8 1,078 2MX16 19 2MX8 18 32KX16 18 32KX32 26 32KX8 5,119 32MX8 2 4KX16 35 4KX8 896 512KX16 36 512KX8 1,066 512MX8 1 512X8 16 64KX16 1,417 64KX8 2,611 64X16 8 8KX8 3,216

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3-STATE 16,619 OPEN-EMITTER 19 REGISTERED 211

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CERAMIC 5,427 CERAMIC, GLASS-SEALED 8,432 CERAMIC, METAL-SEALED COFIRED 8,214 PLASTIC/EPOXY 291 UNSPECIFIED 505

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BGA 1 DFP 292 DIE 4 DIP 7,866 FQFP 2 HVSON 5 LSSOP 10 PGA 463 QCCJ 527 QCCN 3,539 SOP 24 TBGA 1 TSOP1 4 TSSOP 2 VFBGA 1 VFLGA 1 WDFP 120 WDIP 6,048 WQCCJ 409 WQCCN 2,789

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BGA8,2X4,40/20 1 DIE OR CHIP 4 DIP(UNSPEC) 1 DIP16,.3 12 DIP24(UNSPEC) 6 DIP24,.3 422 DIP24,.6 888 DIP28(UNSPEC) 16 DIP28,.3 264 DIP28,.6 5,100 DIP32,.3 8 DIP32,.6 1,682 DIP40(UNSPEC) 4 DIP40,.6 1,290 DIP42,.6 152 DIP44,.6 3 DIP8,.3 1 FL24,.4 85 FL28,.4 45 LCC(UNSPEC) 9 LCC28(UNSPEC) 16 LCC28,.35X.55 4 LCC28,.45SQ 352 LCC28,.5SQ 4 LCC32(UNSPEC) 19 LCC32,.45X.55 3,529 LCC44,.65SQ 495 LDCC28,.5SQ 8 LDCC32(UNSPEC) 2 LDCC32,.45X.7 24 LDCC32,.5X.6 307 LDCC44,.7SQ 311 PGA40,6X10MOD 146 PGA66,11X11 312 SOLCC8,.11,20 2 SOP32,.56 16 SOP40,.56 1 SOP44,.63 1 SOP8,.25 2 TSOP40(UNSPEC) 10 TSSOP28,.53,22 2 TSSOP8,.25 2

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RECTANGULAR 20,471 SQUARE 2,173 UNSPECIFIED 19

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CHIP CARRIER 4,256 CHIP CARRIER, WINDOW 3,195 CHIP CARRIER,WINDOW 3 FLATPACK 298 FLATPACK, FINE PITCH 2 FLATPACK, WINDOW 120 GRID ARRAY 318 GRID ARRAY, THIN PROFILE 1 GRID ARRAY, VERY THIN PROFILE, FINE PITCH 2 IN-LINE 8,287 IN-LINE, WINDOW 6,048 MICROELECTRONIC ASSEMBLY 294 SMALL OUTLINE 24 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE 3 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH 2 SMALL OUTLINE, LOW PROFILE, SHRINK PITCH 10 SMALL OUTLINE, THIN PROFILE 4 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 2 UNCASED CHIP 4

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PARALLEL 17,345 SERIAL 17

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Active 3,291 Contact Manufacturer 1,034 Not Recommended 15 Obsolete 17,459 Transferred 1,527

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No 4,145 Yes 195

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225 538 240 108 245 119 250 12 260 18 NOT APPLICABLE 7 NOT SPECIFIED 7,153

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