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其他内存集成电路: 58,141 个筛选结果
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Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
制造商型号 Composite Price
风险等级 是否无铅 是否Rohs认证 生命周期 内存密度 内存宽度 组织 标称供电电压 (Vsup) 电源 最长访问时间 内存集成电路类型 其他特性 混合内存类型 功能数量 字数代码 字数 工作模式 最大待机电流 最大压摆率 最大供电电压 (Vsup) 最小供电电压 (Vsup) 技术 温度等级 JESD-30 代码 认证状态 JESD-609代码 湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度) 筛选级别 处于峰值回流温度下的最长时间 端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 表面贴装 端子面层 端子形式 端子节距 端子位置 座面最大高度 长度 宽度 IHS 制造商
包装说明
是否符合REACH标准
HTS代码
零件包装代码
针数
ECCN代码
交付时间
Samacsys Description
S72XS256RE0AHBH23
Cypress Semiconductor
查询价格
Active 268.4355 Mbit 16 16MX16 1.8 V MEMORY CIRCUIT 1 16000000 16.7772 M SYNCHRONOUS 1.95 V 1.7 V CMOS INDUSTRIAL S-PBGA-B133 85 °C -40 °C 133 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 1 mm 8 mm 8 mm CYPRESS SEMICONDUCTOR CORP BGA-133 compliant 8542.32.00.71
FM25C160B-G
Cypress Semiconductor
查询价格
Yes Active 16.384 kbit 8 2KX8 5 V 5 V MEMORY CIRCUIT 1 2000 2.048 k SYNCHRONOUS 10 µA 4 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES Tin (Sn) GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm CYPRESS SEMICONDUCTOR CORP SOP, SOP8,.25 compliant 8542.32.00.71 SOIC 8 EAR99 1 week FM25C160B-G Serial-SPI FRAM Memory, 16kbit, 4.5 → 5.5 V 8-Pin SOIC
FM25C160B-GTR
Cypress Semiconductor
查询价格
Yes Active 16.384 kbit 8 2KX8 5 V 5 V MEMORY CIRCUIT 1 2000 2.048 k SYNCHRONOUS 10 µA 4 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e4 3 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm CYPRESS SEMICONDUCTOR CORP SOP, SOP8,.25 compliant 8542.32.00.71 SOIC 8 EAR99 CYPRESS SEMICONDUCTOR - FM25C160B-GTR - F-RAM, NON-VOL, 16KBIT, 20MHZ, SOIC-8
MR0A08BYS35
Everspin Technologies
查询价格
Yes Active 1.0486 Mbit 8 128KX8 3.3 V 3.3 V 35 ns MEMORY CIRCUIT N/A 1 128000 131.072 k ASYNCHRONOUS 7 mA 65 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G44 Not Qualified 3 70 °C NOT SPECIFIED NOT SPECIFIED 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm EVERSPIN TECHNOLOGIES INC TSOP2, TSOP44,.46,32 compliant 8542.32.00.71 TSOP2 44 EAR99
47L04-I/SN
Microchip Technology Inc
查询价格
Yes Active 4.096 kbit 8 512X8 3 V MEMORY CIRCUIT IT ALSO HAS EEPROM BACKUP OF 512 X 8 BITS 1 512 512 words SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 e3 3 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOP, compliant 11 weeks SRAM 4k, 3.0V EERAM IND
47C04-I/SN
Microchip Technology Inc
查询价格
Yes Active 4.096 kbit 8 512X8 5 V MEMORY CIRCUIT IT ALSO HAS EEPROM BACKUP OF 512 X 8 BITS 1 512 512 words SYNCHRONOUS 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G8 e3 3 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOP, compliant 11 weeks
47L16-E/SN
Microchip Technology Inc
查询价格
Yes Active 16.384 kbit 8 2KX8 3 V MEMORY CIRCUIT 1 2000 2.048 k SYNCHRONOUS 3.6 V 2.7 V CMOS AUTOMOTIVE R-PDSO-G8 e3 3 125 °C -40 °C 260 40 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOP, compliant 11 weeks
47L04-I/ST
Microchip Technology Inc
查询价格
Yes Active 4.096 kbit 8 512X8 3 V MEMORY CIRCUIT 1 512 512 words SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 e3 1 85 °C -40 °C 260 40 8 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) - annealed GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC TSSOP, compliant 5 weeks
FM25L04B-G
Cypress Semiconductor
查询价格
Yes Yes Active 4.096 kbit 8 512X8 3.3 V 3/3.3 V MEMORY CIRCUIT 1 512 512 words SYNCHRONOUS 6 µA 3 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm CYPRESS SEMICONDUCTOR CORP SOP, SOP8,.25 compliant 8542.32.00.71 SOIC 8 EAR99 Cypress Semiconductor FM25L04B-G SPI FRAM Memory, 4kbit, 2.7 to 3.6 V SOIC 8-Pin
FM25L04B-GTR
Cypress Semiconductor
查询价格
Yes Yes Active 4.096 kbit 8 512X8 3.3 V 3/3.3 V MEMORY CIRCUIT 1 512 512 words SYNCHRONOUS 6 µA 3 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e4 3 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm CYPRESS SEMICONDUCTOR CORP SOP, SOP8,.25 compliant 8542.32.00.71 SOIC 8 EAR99
USBF129T-I/SN
Microchip Technology Inc
查询价格
Yes Active 4.1943 Mbit 8 512KX8 MEMORY CIRCUIT 1 512000 524.288 k SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 e3 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOP, compliant 8542.32.00.71 9 weeks
47L16-I/SN
Microchip Technology Inc
查询价格
Yes Active 16.384 kbit 8 2KX8 3 V MEMORY CIRCUIT IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS 1 2000 2.048 k SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 e3 3 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOP, compliant 11 weeks
MR256A08BCMA35
Everspin Technologies
查询价格
Yes Active 262.144 kbit 8 32KX8 3.3 V 3.3 V 35 ns MEMORY CIRCUIT N/A 1 32000 32.768 k ASYNCHRONOUS 7 mA 65 µA 3.6 V 3 V CMOS INDUSTRIAL S-PBGA-B48 Not Qualified 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY LFBGA BGA48,6X8,30 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 750 µm BOTTOM 1.35 mm 8 mm 8 mm EVERSPIN TECHNOLOGIES INC LFBGA, BGA48,6X8,30 compliant 8542.32.00.71 BGA 48 EAR99 MRAM 256Kb 3.3V 35ns 32Kx8 Parallel MRAM
47C16-I/SN
Microchip Technology Inc
查询价格
Yes Active 16.384 kbit 8 2KX8 5 V MEMORY CIRCUIT IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS 1 2000 2.048 k SYNCHRONOUS 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G8 e3 3 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOP, compliant 11 weeks SRAM 16k, 5.0V EERAM IND
MR4A16BMA35
Everspin Technologies
查询价格
Yes Active 16.7772 Mbit 16 1MX16 3.3 V 3.3 V 35 ns MEMORY CIRCUIT N/A 1 1000000 1.0486 M ASYNCHRONOUS 14 mA 3.6 V 3 V CMOS COMMERCIAL S-PBGA-B48 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY LFBGA BGA48,6X8,30 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 750 µm BOTTOM 1.35 mm 10 mm 10 mm EVERSPIN TECHNOLOGIES INC LFBGA, BGA48,6X8,30 compliant 8542.32.00.71 BGA 48 EAR99
DS2401+T&R
Maxim Integrated Products
查询价格
Yes Yes Active 64 bit 1 64X1