所有内容版权所有 © 2006 - 2021
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||
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| 制造商型号 |
Composite Price
|
风险等级 |
是否无铅
|
是否Rohs认证
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生命周期
|
标称供电电压 | 技术 | 应用程序 | 功能数量 |
电源
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最大压摆率
|
温度等级
|
电信集成电路类型
|
JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度（摄氏度）
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
|
封装形式
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表面贴装
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端子面层
|
端子形式
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端子节距
|
端子位置
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宽度
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长度 |
座面最大高度
|
Source Content uid
|
IHS 制造商
|
零件包装代码
|
包装说明
|
针数
|
是否符合REACH标准
|
ECCN代码
|
HTS代码
|
交付时间
|
Samacsys Manufacturer
|
制造商包装代码
|
|
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ONET1191PRGTT
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | SONET;SDH | 1 | 3.3 V | 49 µA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PQCC-N16 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 1 mm | ONET1191PRGTT | TEXAS INSTRUMENTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | compliant | 5A991.B.1 | 8542.39.00.01 | 1 week | Texas Instruments | |||
|
ONET1191PRGTR
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | SONET;SDH | 1 | 3.3 V | 49 µA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PQCC-N16 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 1 mm | ONET1191PRGTR | TEXAS INSTRUMENTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | compliant | 5A991.B.1 | 8542.39.00.01 | 6 weeks | ||||
|
ONET4201PARGTR
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | SONET;SDH | 1 | 3.3 V | 45 mA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PQCC-N16 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 1 mm | ONET4201PARGTR | TEXAS INSTRUMENTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | compliant | 5A991.B.1 | 8542.33.00.01 | 26 weeks | ||||
|
ONET4201PARGTT
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | SONET;SDH | 1 | 3.3 V | 45 mA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PQCC-N16 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 1 mm | ONET4201PARGTT | TEXAS INSTRUMENTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | compliant | 5A991.B.1 | 8542.33.00.01 | 6 weeks | ||||
|
SY88993AVKG-TR
Microchip Technology Inc
|
查询价格 |
|
Yes | Active | 3.3 V | 1 | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PDSO-G10 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | DUAL | 3 mm | 3 mm | 1.1 mm | SY88993AVKG-TR | MICROCHIP TECHNOLOGY INC | 3 X 3 MM, LEAD FREE, MSOP-10 | compliant | EAR99 | 8542.39.00.01 | 8 weeks | |||||||||||
|
MAX3272AETP+T
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | BIPOLAR | ATM;SDH;SONET | 1 | 3.3 V | 44 µA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC20,.16SQ,20 | 20 | compliant | EAR99 | 8542.33.00.01 | 13 weeks | Maxim Integrated | |||
|
SY56034ARMG
Microchip Technology Inc
|
查询价格 |
|
Yes | Active | 2.5 V | 1 | INDUSTRIAL | ATM/SONET/SDH MUX/DEMUX | S-XQCC-N32 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | 40 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 900 µm | SY56034ARMG | MICROCHIP TECHNOLOGY INC | 5 X 5 MM, LEAD FREE, MLF-32 | compliant | EAR99 | 8542.39.00.01 | 6 weeks | |||||||||||
|
ONET1151MRGTT
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | SONET; SDH | 1 | 100 mA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PQCC-N16 | e4 | 2 | 100 °C | -40 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 1 mm | ONET1151MRGTT | TEXAS INSTRUMENTS INC | HVQCCN, LCC16,.12SQ,20 | compliant | 5A991.B.1 | 8542.39.00.01 | 6 weeks | ||||||||
|
TLK1102ERGET
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | SONET | 1 | 3.3 V | 290 µA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PQCC-N24 | e4 | Not Qualified | 2 | 100 °C | -40 °C | 260 | NOT SPECIFIED | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | TLK1102ERGET | TEXAS INSTRUMENTS INC | QFN | HVQCCN, LCC24,.16SQ,20 | 24 | compliant | 5A991.B.1 | 8542.39.00.01 | 1 week | ||||
|
SI5324D-C-GM
Silicon Laboratories Inc
|
查询价格 |
|
Yes | Active | 1.8 V | SONET;SDH | 1 | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-XQCC-N36 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 36 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 950 µm | SILICON LABORATORIES INC | QFN | HVQCCN, | 36 | compliant | 8542.39.00.01 | ||||||||||||||
|
SI5324C-C-GM
Silicon Laboratories Inc
|
查询价格 |
|
Yes | Active | 1.8 V | SONET;SDH | 1 | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-XQCC-N36 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 36 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 950 µm | SILICON LABORATORIES INC | QFN | HVQCCN, | 36 | compliant | EAR99 | 8542.39.00.01 | Silicon Labs | ||||||||||||
|
MAX3747AEUB+
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | BIPOLAR | SONET | 1 | 3.3 V | 41 µA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PDSO-N10 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 10 | PLASTIC/EPOXY | SON | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | SOIC | SON, TSSOP10,.19,20 | 10 | compliant | EAR99 | 8542.33.00.01 | 6 weeks | Maxim Integrated | |||
|
MAX3645EEE+
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | BIPOLAR | SONET | 1 | 3.3/5 V | 27 µA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | R-PDSO-G16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Tin (Sn) | GULL WING | 635 µm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | MAXIM INTEGRATED PRODUCTS INC | SSOP | SSOP, SSOP16,.25 | 16 | compliant | EAR99 | 8542.33.00.01 | 6 weeks | Maxim Integrated | |||
|
MAX3747BEUB+T
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | BIPOLAR | 1 | 3.3 V | 43 mA | INDUSTRIAL | R-PDSO-G10 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | MAXIM INTEGRATED PRODUCTS INC | TSSOP, TSSOP10,.19,20 | compliant | 8542.39.00.01 | 6 weeks | Maxim Integrated | |||||||||||||
|
MAX3969ETP+
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | BIPOLAR | ATM | 1 | 3/5 V | 45 µA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC20,.16SQ,20 | 20 | compliant | EAR99 | 8542.33.00.01 | 15 weeks | Maxim Integrated | |||
|
MAX3665EUA+
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | 1 | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.1 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | TSSOP, | 8 | compliant | EAR99 | 8542.33.00.01 | 6 weeks | Maxim Integrated | ||||||||
|
AD9553BCPZ
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 3.3 V | CMOS | SONET;SDH | 1 | 3.3 V | 185 µA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-XQCC-N32 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | AD9553BCPZ | ANALOG DEVICES INC | QFN | HVQCCN, LCC32,.2SQ,20 | 32 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | CP-32-7 | |||
|
MAX3747AEUB+T
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | BIPOLAR | SONET | 1 | 3.3 V | 41 µA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PDSO-N10 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 10 | PLASTIC/EPOXY | SON | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | SOIC | SON, TSSOP10,.19,20 | 10 | compliant | EAR99 | 8542.33.00.01 | 13 weeks | Maxim Integrated | |||
|
MAX3645EEE+T
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | BIPOLAR | SONET | 1 | 3.3/5 V | 27 µA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | R-PDSO-G16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Tin (Sn) | GULL WING | 635 µm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | MAXIM INTEGRATED PRODUCTS INC | SSOP | SSOP, SSOP16,.25 | 16 | compliant | EAR99 | 8542.33.00.01 | 6 weeks | Maxim Integrated | |||
|
ONET1141LRGET
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | SONET; SDH | 1 | 170 mA | INDUSTRIAL | ATM/SONET/SDH SUPPORT CIRCUIT | S-PQCC-N24 | e4 | 2 | 100 °C | -40 °C | 260 | NOT SPECIFIED | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | ONET1141LRGET | TEXAS INSTRUMENTS INC | HVQCCN, LCC24,.16SQ,20 | compliant | 5A991.B.1 | 8542.39.00.01 | 6 weeks | ||||||||
所有内容版权所有 © 2006 - 2021
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
