所有筛选条件 其他特性 模拟集成电路 - 其他类型 应用程序 运营商类型 运营商类型（2） 运营商类型（3） 数据速率 JESD-30 代码 JESD-609代码 长度 制造商 湿度敏感等级 负电源额定电压 功能数量 端子数量 最高工作温度 最低工作温度 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 生命周期 是否无铅 峰值回流温度（摄氏度） 电源 认证状态 是否Rohs认证 筛选级别 座面最大高度 子类别 最大压摆率 标称供电电压 标称供电电压 (Vsup) 表面贴装 技术 电信集成电路类型 温度等级 端子面层 端子形式 端子节距 端子位置 处于峰值回流温度下的最长时间 宽度

also works in 5v nominal supply voltage 1,018,464 IT ALSO REQUIRE 3.3V 6 IT ALSO REQUIRES 3.3V 3 SEATED HT-CALCULATED 2

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ANALOG CIRCUIT 1

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ATM 289 ATM;SDH 9 ATM;SDH;SONET 1,019,360 ATM;SONET 54 SDH 27 SONET 163 SONET; SDH 29 SONET;SDH 3,134

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CEPT PCM-30/E-1 1 E-3 1 E-4 1 STS-1/OC-1 5 STS-3/OC-3 3

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STS-1/OC-1 1 STS-3/OC-3 1 T-1(DS1) 1 T-3(DS3) 5

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T-3(DS3) 1

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51.84 Gbps 5 155.52 Gbps 2

Min (Mbps) - Max (Mbps)

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R-CDSO-J6 25,584 R-CQCC-N16 1,054,127 R-MDIP-T14 56 R-PDSO-G16 319 R-PDSO-G20 81 R-PDSO-G28 468 R-PDSO-G5 50 R-PDSO-J6 7,539 R-PDSO-N13 22,447 R-PDSO-N15 16,956 R-PQFP-G100 49 R-PQFP-G128 75 R-PXFO-X 46 R-XDFO-F14 1,111 R-XDFO-T8 136 R-XDFO-X 165 R-XDMA-J14 64 R-XDMA-N14 1,300 R-XDMA-P18 231 R-XDMA-P24 180 R-XDMA-X14 86 R-XDSO-N16 3,877 R-XQCC-N14 6,692 R-XUUC-N13 126 R-XUUC-N7 130 R-XXFO-X 922 S-CQCC-N36 2,475 S-PBGA-B100 59 S-PBGA-B256 109 S-PBGA-B272 46 S-PBGA-B352 48 S-PBGA-B456 57 S-PDSO-G10 281 S-PQCC-N16 68 S-PQFP-G100 190 S-PQFP-G144 61 S-PQFP-G160 72 S-PQFP-G208 176 S-PQFP-G240 45 S-PQFP-G32 174 S-PQFP-G48 79 S-PQFP-G64 228 S-PQFP-G80 94 S-XDMA-P28 56 S-XQCC-N16 227 S-XQCC-N24 60 S-XQCC-N32 113 S-XQCC-N36 248 S-XQCC-N48 67 X-XXFO-X4 80

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e0 3,795 e1 114 e3 1,697 e3/e4 106 e4 1,119,508 e6 9 e6/e4 2

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3 mm 563 4 mm 146 4.9 mm 18 4.95 mm 20 5 mm 232 6 mm 58 6.5 mm 43 7 mm 288 7.49 mm 1,054,128 7.5 mm 6,730 8 mm 21 8.99 mm 2,520 9 mm 251 9.5 mm 12 9.9 mm 54 10 mm 220 11 mm 18 11.48 mm 12 12 mm 19 13 mm 41 13.97 mm 33,123 14 mm 284 15 mm 34 15.4 mm 12 16 mm 16 17 mm 68 17.93 mm 41 19 mm 10 19.05 mm 36 19.5 mm 28 19.86 mm 17 20 mm 95 20.32 mm 22,484 20.574 mm 1,250 21 mm 17 23 mm 28 24 mm 14 24.13 mm 19 25.4 mm 20,838 27 mm 167 28 mm 215 29.972 mm 29 30.48 mm 11 31 mm 32 32 mm 31 32.5 mm 12 35 mm 176 40 mm 61 45 mm 60 99.06 mm 180

Min (mm) - Max (mm)

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制造商 (50)

Agilent Technologies Inc 194 Analog Devices Inc 140 Applied Micro Circuits Corporation 165 Avago Technologies 678 Broadcom Limited 668 Conexant Systems Inc 88 Connor-Winfield 407 Corning Frequency Control Inc 60 Cypress Semiconductor 43 Dover Corporation 26 Ericsson 109 Exar Corporation 56 Giga 47 Hewlett Packard Co 238 Hitachi Ltd 32 Infineon Technologies AG 96 Integrated Device Technology Inc 2,872 Intel Corporation 146 LSI Corporation 1,565 MACOM 94 Maxim Integrated Products 389 Micrel Inc 252 Microchip Technology Inc 453 Microsemi Corporation 392 Mindspeed Technologies Inc 132 Mitsubishi Electric 141 NEC Electronics America Inc 54 NEC Electronics Group 67 Noisecom 44 NXP Semiconductors 71 Philips Semiconductors 48 PMC-Sierra Inc 190 Pulse Electronics Corporation 533 PulseR Ruggedized Solutions 33 Qorvo 67 Raltron Electronics Corporation 5,543 Renesas Electronics Corporation 42 Rochester Electronics LLC 126 Semtech Corporation 45 Siemens 39 Silicon Laboratories Inc 176 Spectrum Microwave 75 Synaptics Incorporated 42 Synergy Semiconductor Corp 34 Texas Instruments 162 Transwitch Corporation 92 TriQuint Semiconductor 615 Vectron International 1,133,475 Vitesse Semiconductor Corporation 165 Zarlink Semiconductor Inc 102

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1 1,127,340 2 264 2A 9 3 684 4 27 NOT APPLICABLE 6 NOT SPECIFIED 19

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-20 V 2 -8 V 12 -6.5 V 4 -5.2 V 605 -5 V 91 -4.5 V 48 -3.6 V 1 -3.35 V 2 -3.3 V 37 -3 V 3 -2.3 V 4 -2.2 V 8 -2 V 18

Min (V) - Max (V)

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1.0 1,149,803 2.0 25 4.0 20 8.0 3

Min - Max

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10 329 100 306 1152 45 12 67 128 100 13 22,617 132 34 14 9,465 144 91 15 16,956 16 1,058,780 160 78 18 310 196 39 20 308 208 233 24 378 240 49 256 110 272 47 28 669 30 58 304 33 32 403 324 37 352 55 36 2,747 384 24 388 26 4 134 40 27 400 43 424 24 44 43 456 57 48 185 5 58 52 87 520 34 6 33,173 600 24 63 25 64 271 68 127 7 150 700 26 792 25 8 217 80 110 9 66

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40.0 °C 2 43.0 °C 3 50.0 °C 8 55.0 °C 2 60.0 °C 180 65.0 °C 75 70.0 °C 573,335 75.0 °C 19 80.0 °C 13 85.0 °C 575,572 90.0 °C 2 95.0 °C 28 100.0 °C 56 105.0 °C 32 110.0 °C 7 115.0 °C 2 125.0 °C 314

Min (°C) - Max (°C)

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-55.0 °C 281 -45.0 °C 1 -40.0 °C 575,393 -35.0 °C 1 -30.0 °C 2 -25.0 °C 14 -24.0 °C 4 -20.0 °C 736 -10.0 °C 269 -5.0 °C 47 0.0 °C 572,926 10.0 °C 2

Min (°C) - Max (°C)

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CERAMIC 1,018,626 CERAMIC, GLASS-SEALED 13 CERAMIC, METAL-SEALED COFIRED 63,940 METAL 173 PLASTIC/EPOXY 51,220 UNSPECIFIED 17,071

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BGA 895 CGA 2 DFP 6 DIE 311 DIP 159 FBGA 55 FQFP 245 GQFF 4 HBGA 18 HFQFP 45 HLBGA 3 HLFQFP 79 HLQFP 20 HQCCN 19 HQFP 50 HSON 1 HSOP 8 HTFQFP 125 HTQFP 78 HTSSOP 98 HVBCC 10 HVQCCN 716 LBGA 200 LFBGA 21 LFQFP 229 LQFP 62 LSSOP 20 PGA 5 QCCJ 95 QCCN 1,063,627 QFF 58 QFP 484 SOC 3 SOF 4 SOJ 33,141 SON 43,369 SOP 778 SSOP 54 TFQFP 62 TQFP 10 TSOP 50 TSSOP 293 VBCC 6 VQCCN 22 VSON 1

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BGA196,14X14,40 22 BGA256,16X16,40 17 BGA256,20X20,50 27 BGA272,20X20,50 30 BGA324,22X22,40 26 BGA384,26X26,40 22 BGA400,20X20,50 26 BGA416,26X26,40 19 BGA456,26X26,50 21 BGA520,31X31,50 29 BGA792,39X39,40 20 DIE OR CHIP 37 DIP14,.3 56 DIP16,.3 32 DIP24,.6 34 GWDIP16,.3 31 LCC16,.12SQ,20 151 LCC16,.3x.2,40 1,018,464 LCC20,.16SQ,20 27 LCC24,.16SQ,20 24 LCC32,.2SQ,20 74 LCC48,.27SQ,20 20 LCC48,.28SQ,20 21 LDCC28,.5SQ 20 LDCC84,1.2SQ 18 QFL68,.75SQ,40 16 QFP100,.63SQ,20 65 QFP100,.7X.9 28 QFP144,1.2SQ 21 QFP160,1.2SQ 37 QFP208,1.2SQ,20 76 QFP32,.35SQ,32 20 QFP48,.35SQ,20 24 QFP64,.47SQ,20 64 QFP64,.51SQ,20 22 QFP68,.85SQ,40 28 QFP68,1.4SQ,50 22 SOP16,.25 51 SOP16,.4 175 SOP28,.4 44 SOP28,.5 196 SOP28,.76 189 SSOP16,.25 37 TQFP100,.63SQ 17 TQFP32,.35SQ,32 50 TQFP64,.47SQ 35 TSOP5/6,.11,37 50 TSSOP10,.19,20 172 TSSOP16,.25 19 TSSOP20,.25 30

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RECTANGULAR 1,144,173 ROUND 15 SQUARE 6,645 UNSPECIFIED 173

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CHIP CARRIER 1,063,740 CHIP CARRIER, HEAT SINK/SLUG 19 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE 718 CHIP CARRIER, VERY THIN PROFILE 26 CYLINDRICAL 14 FIBER OPTIC 3,029 FLANGE MOUNT 19 FLATPACK 573 FLATPACK, FINE PITCH 245 FLATPACK, GUARD RING 4 FLATPACK, HEAT SINK/SLUG 50 FLATPACK, HEAT SINK/SLUG, FINE PITCH 45 FLATPACK, HEAT SINK/SLUG, LOW PROFILE 20 FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH 79 FLATPACK, HEAT SINK/SLUG, THIN PROFILE 78 FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH 125 FLATPACK, LOW PROFILE 62 FLATPACK, LOW PROFILE, FINE PITCH 229 FLATPACK, THIN PROFILE 10 FLATPACK, THIN PROFILE, FINE PITCH 62 GRID ARRAY 921 GRID ARRAY, FINE PITCH 47 GRID ARRAY, HEAT SINK/SLUG 18 GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE 3 GRID ARRAY, LOW PROFILE 200 GRID ARRAY, LOW PROFILE, FINE PITCH 21 IN-LINE 167 MICROELECTRONIC ASSEMBLY 2,245 SMALL OUTLINE 77,303 SMALL OUTLINE, HEAT SINK/SLUG 9 SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH 98 SMALL OUTLINE, LOW PROFILE, SHRINK PITCH 20 SMALL OUTLINE, SHRINK PITCH 54 SMALL OUTLINE, THIN PROFILE 50 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 285 SMALL OUTLINE, VERY THIN PROFILE 1 UNCASED CHIP 435

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Active 1,006,461 Contact Manufacturer 1,670 End Of Life 5 Not Recommended 87,207 Obsolete 52,944 Transferred 3,626

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No 3,900 Yes 15,032

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215 4 217 115 220 14 225 468 235 8 240 1,069 245 234 250 34 260 15,221 NOT SPECIFIED 18,190

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+-5 V 3 -10,-20 V 2 -2,-5.2 V 35 -2,3.3 V 8 -20 V 2 -3.3 V 8 -3.3,-5 V 1 -3.4,-5.2,5 V 4 -4.5 V 7 -5 V 23 -5.2 V 95 -8 V 4 1.2 V 2 1.2,2.5/3.3 V 2 1.2/1.8 V 4 1.3 V 5 1.5,2.5 V 2 1.5,2.5,3.3 V 4 1.5,3.3 V 37 1.5,3/3.3 V 10 1.6/3.3 V 18 1.8 V 12 1.8,3.3 V 130 1.8,3.3,5 V 7 1.8/3.3 V 4 12 V 8 15 V 83 2 V 2 2,5 V 4 2.5 V 31 2.5,3.3 V 43 2.5,3.3,-5.2 V 2 2.5,3.3,5 V 22 2.5/3.3 V 11 3 V 6 3.3 V 1,234 3.3,-5.2 V 16 3.3,3.3/5 V 45 3.3,5 V 25 3.3,5,-4.5 V 4 3.3/5 V 248 3.3/5,GND/-5.2,5 V 9 3.4 V 2 3/3.3 V 2 3/5 V 57 5 V 713 5,-4.5 V 26 5,-5.2 V 20 5/-5 V 2 5/-5.2 V 2

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COMMERCIAL 117 Not Qualified 16,251

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No 17,892 Yes 1,127,803

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MIL-STD-883 74

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800 µm 155 900 µm 262 950 µm 94 1 mm 256 1.1 mm 317 1.2 mm 314 1.41 mm 14 1.5 mm 28 1.58 mm 30 1.6 mm 356 1.65 mm 15 1.67 mm 39 1.7 mm 93 1.72 mm 75 1.75 mm 79 1.97 mm 24 2.1 mm 16 2.12 mm 15 2.13 mm 1,054,140 2.28 mm 19 2.35 mm 56 2.43 mm 13 2.44 mm 22 2.45 mm 38 2.49 mm 15 2.5 mm 14 2.51 mm 95 2.54 mm 94 2.65 mm 6,772 2.8 mm 161 3.05 mm 21 3.1 mm 2,531 3.22 mm 12 3.302 mm 22 3.32 mm 14 3.4 mm 34 3.8 mm 17 3.81 mm 28 3.86 mm 31 4.07 mm 60 4.1 mm 90 4.191 mm 1,250 4.2 mm 19 4.3942 mm 27 4.57 mm 23 4.69 mm 33,122 5.08 mm 19,045 5.1 mm 15,719 6.35 mm 8,570 8.89 mm 14

Min (mm) - Max (mm)

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ATM/SONET/SDH ICs 2,818 Digital Transmission Interfaces 30 Network Interfaces 1 Other Analog ICs 1 Other Telecom ICs 230 Telecom Signaling Circuits 6

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510 nA 24 530 nA 24 35 µA 29 38 µA 12 40 µA 30 42 µA 59 45 µA 23 49 µA 13 50 µA 12 58 µA 18 60 µA 29 62 µA 15 65 µA 76 80 µA 10 90 µA 13 100 µA 27 120 µA 12 140 µA 17 155 µA 10 160 µA 27 170 µA 9 180 µA 16 200 µA 18 215 µA 23 230 µA 56 250 µA 14 280 µA 13 300 µA 14 320 µA 18 346 µA 9 350 µA 12 380 µA 11 450 µA 15 750 µA 11 35 mA 24 40 mA 1,018,477 45 mA 31 50 mA 9 63 mA 63 80 mA 10 100 mA 13 130 mA 27 140 mA 18 150 mA 18 160 mA 13 210 mA 15 250 mA 21 400 mA 12 500 mA 10 600 mA 13

Min (mA) - Max (mA)

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标称供电电压 (20)

1 V 6 1.1 V 4 1.2 V 16 1.3 V 6 1.5 V 119 1.6 V 9 1.8 V 350 2 V 6 2.5 V 172 2.6 V 2 3 V 250 3.3 V 1,101,977 3.4 V 2 3.5 V 1 5 V 45,723 6 V 16 8 V 24 12 V 11 15 V 83 26.4 V 1

Min (V) - Max (V)

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3.3 V 1

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NO 4,060 YES 1,146,973

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技术 (9)

BICMOS 181 BIPOLAR 751 CMOS 1,506 ECL 15 ECL100K 3 ECL10K 26 GAAS 133 HYBRID 565 MOS 8

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ATM SEGMENTATION AND REASSEMBLY DEVICE 3 ATM SWITCHING CIRCUIT 2 ATM/SONET/SDH CLOCK RECOVERY CIRCUIT 691 ATM/SONET/SDH ICS 12 ATM/SONET/SDH MUX/DEMUX 225 ATM/SONET/SDH NETWORK INTERFACE 338 ATM/SONET/SDH RECEIVER 573 ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE 166 ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER 74 ATM/SONET/SDH SUPPORT CIRCUIT 1,146,090 ATM/SONET/SDH SWITCHING CIRCUIT 107 ATM/SONET/SDH TERMINATOR 61 ATM/SONET/SDH TRANSCEIVER 1,734 ATM/SONET/SDH TRANSMITTER 977 CLOCK RECOVERY CIRCUIT 28 MUX/DEMUX 2 RECEIVER 1 SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER 10 SUPPORT CIRCUIT 64 TELECOM CIRCUIT 1 TERMINATOR 5 TRANSCEIVER 21 TRANSMITTER 18

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AUTOMOTIVE 34 COMMERCIAL 573,391 COMMERCIAL EXTENDED 25 INDUSTRIAL 575,313 MILITARY 278 OTHER 608

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GOLD 16 GOLD (80) OVER NICKEL (50) 1 Gold (Au) 11 Gold (Au) - with Nickel (Ni) barrier 1,085,919 GOLD OVER NICKEL 37 MATTE TIN 1,339 MATTE TIN (394) OVER COPPER 3 Matte Tin (Sn) 305 Matte Tin (Sn) - annealed 13 MATTE TIN/GOLD 106 NICKEL PALLADIUM GOLD 91 Nickel/Gold (Ni/Au) 33,102 Nickel/Palladium/Gold (Ni/Pd/Au) 325 NOT SPECIFIED 17 Palladium (Pd) 1 TIN 23 Tin (Sn) 14 TIN BISMUTH 6 TIN BISMUTH/NICKEL PALLADIUM GOLD 1 TIN BISMUTH/PALLADIUM 1 TIN LEAD 2,251 TIN SILVER COPPER 78 Tin/Bismuth (Sn/Bi) 1 Tin/Bismuth (Sn98Bi2) 2 Tin/Lead (Sn/Pb) 1,215 Tin/Lead (Sn10Pb90) 4 Tin/Lead (Sn63Pb37) 22 Tin/Lead (Sn75Pb25) 13 Tin/Lead (Sn80Pb20) 1 Tin/Lead (Sn85Pb15) 284 Tin/Lead/Silver (Sn/Pb/Ag) 1 Tin/Silver/Copper (Sn/Ag/Cu) 30 Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) 4 Tungsten/Nickel/Gold (W/Ni/Au) 2

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BALL 1,203 BUTT 16 C BEND 3 FLAT 1,287 GULL WING 2,937 J BEND 33,309 NO LEAD 1,109,603 PIN/PEG 707 S BEND 2 THROUGH-HOLE 449 UNSPECIFIED 1,486 WIRE 14

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400 µm 48 500 µm 1,960 600 µm 13 635 µm 2,796 640 µm 16 650 µm 302 762 µm 6 800 µm 253 900 µm 2 950 µm 50 1 mm 654 1.016 mm 50 1.02 mm 1,054,103 1.27 mm 8,145 1.778 mm 2 2.54 mm 77,981 5.08 mm 9 7.62 mm 180

Min (mm) - Max (mm)

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BOTTOM 1,245 DUAL 81,943 PERPENDICULAR 5 QUAD 1,066,075 SINGLE 115 UNSPECIFIED 1,214 UPPER 435

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10 22 15 66 20 676 30 1,501 40 14,192 NOT SPECIFIED 18,900

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3 mm 563 3.9 mm 101 4 mm 146 4.4 mm 63 5 mm 225 5.08 mm 1,054,128 5.1 mm 6,730 5.29 mm 11 6 mm 58 7 mm 284 7.5 mm 19 7.52 mm 43 8 mm 21 8.89 mm 33,123 8.99 mm 2,520 9 mm 251 9.5 mm 12 10 mm 220 11 mm 16 11.48 mm 12 12 mm 19 13 mm 41 13.716 mm 6,760 13.72 mm 15,722 13.89 mm 17 14 mm 361 15 mm 34 16 mm 16 17 mm 92 17.78 mm 22 19 mm 10 19.05 mm 36 19.304 mm 1,250 20 mm 18 20.32 mm 20,838 21 mm 17 23 mm 28 24 mm 14 24.13 mm 19 25.4 mm 13 27 mm 167 28 mm 215 29.3116 mm 10 29.972 mm 29 31 mm 32 32 mm 31 35 mm 176 40 mm 61 45 mm 60 60.96 mm 180

Min (mm) - Max (mm)

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