所有内容版权所有 © 2006 - 2021
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||
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| 制造商型号 |
Composite Price
|
风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 数据速率 | 功能数量 |
电源
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最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度（摄氏度）
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
|
封装形式
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表面贴装
|
端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
|
Source Content uid
|
IHS 制造商
|
零件包装代码
|
包装说明
|
针数
|
制造商包装代码
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是否符合REACH标准
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ECCN代码
|
HTS代码
|
交付时间
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Samacsys Manufacturer
|
|
|
ADF4360-2BCPZRL7
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 3.3 V | BICMOS | 1 | 3.3 V | INDUSTRIAL | BASEBAND CIRCUIT | S-XQCC-N24 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | ADF4360-2BCPZRL7 | ANALOG DEVICES INC | QFN | HVQCCN, LCC24,.16SQ,20 | 24 | CP-24-14 | compliant | EAR99 | 8542.39.00.01 | |||||
|
AT86RF231-ZU
Microchip Technology Inc
|
查询价格 |
|
Yes | Yes | Active | 3 V | CMOS | 1 | 1.8,3 V | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N32 | e3 | Not Qualified | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | AT86RF231-ZU | MICROCHIP TECHNOLOGY INC | 5 X 5 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, GREEN, MO-220VHHD-6, QFN-32 | compliant | 13 weeks | ||||||||||||
|
AT86RF231-ZF
Microchip Technology Inc
|
查询价格 |
|
Yes | Yes | Active | 3 V | CMOS | 1 | 1.8,3 V | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N32 | e3 | Not Qualified | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | AT86RF231-ZF | MICROCHIP TECHNOLOGY INC | 5 X 5 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, GREEN, MO-220VHHD-6, QFN-32 | compliant | 5A992.C | 8542.39.00.01 | 13 weeks | ||||||||||
|
ADF4360-6BCPZ
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 3.3 V | BICMOS | 1 | 3.3 V | INDUSTRIAL | BASEBAND CIRCUIT | S-XQCC-N24 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | ADF4360-6BCPZ | ANALOG DEVICES INC | QFN | HVQCCN, LCC24,.16SQ,20 | 24 | CP-24-14 | compliant | EAR99 | 8542.39.00.01 | |||||
|
ADF4360-2BCPZ
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 3.3 V | BICMOS | 1 | 3.3 V | INDUSTRIAL | BASEBAND CIRCUIT | S-XQCC-N24 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | ADF4360-2BCPZ | ANALOG DEVICES INC | QFN | HVQCCN, LCC24,.16SQ,20 | 24 | CP-24-14 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||
|
MAX2674EWT+T
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | BICMOS | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | R-PBGA-B6 | e1 | Not Qualified | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 6 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 400 µm | BOTTOM | 865 µm | 1.27 mm | 690 µm | MAXIM INTEGRATED PRODUCTS INC | BGA | VFBGA, | 6 | compliant | 5A991.G | 8542.33.00.01 | 6 weeks | Maxim Integrated | |||||||
|
AT86RF233-ZU
Microchip Technology Inc
|
查询价格 |
|
Yes | Yes | Active | 3 V | CMOS | 1 | 1.8,3 V | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N32 | Not Qualified | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | AT86RF233-ZU | MICROCHIP TECHNOLOGY INC | 5 X 5 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, GREEN, MO-220VHHD-6, QFN-32 | compliant | 5A992.C | 8542.39.00.01 | 12 weeks | ||||||||||||
|
TRF370333IRGET
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 5 V | 1 | 5 V | 235 mA | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PQCC-N24 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | TRF370333IRGET | TEXAS INSTRUMENTS INC | QFN | HVQCCN, LCC24,.16SQ,20 | 24 | compliant | EAR99 | 8542.39.00.01 | 1 week | Texas Instruments | ||||
|
ADF4360-4BCPZRL7
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 3.3 V | BICMOS | 1 | 3.3 V | INDUSTRIAL | BASEBAND CIRCUIT | S-XQCC-N24 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | ADF4360-4BCPZRL7 | ANALOG DEVICES INC | QFN | HVQCCN, LCC24,.16SQ,20 | 24 | CP-24-14 | compliant | EAR99 | 8542.39.00.01 | |||||
|
ADF7020-1BCPZ
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 3 V | 1 | 2.5/3.3 V | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N48 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 48 | UNSPECIFIED | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 7 mm | 1 mm | ADF7020-1BCPZ | ANALOG DEVICES INC | QFN | HVQCCN, LCC48,.27SQ,20 | 48 | CP-48-5 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | |||||
|
ADF4360-4BCPZ
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 3.3 V | BICMOS | 1 | 3.3 V | INDUSTRIAL | BASEBAND CIRCUIT | S-XQCC-N24 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | ADF4360-4BCPZ | ANALOG DEVICES INC | QFN | HVQCCN, LCC24,.16SQ,20 | 24 | CP-24-14 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||
|
MAX2309ETI+
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 2.75 V | 1 | 3/3.3 V | 41.5 µA | INDUSTRIAL | BASEBAND CIRCUIT | S-XQCC-N28 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 28 | UNSPECIFIED | HVQCCN | LCC28,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC28,.2SQ,20 | 28 | compliant | EAR99 | 8542.39.00.01 | 6 weeks | ||||||
|
ADF4360-9BCPZRL7
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 3.3 V | 1 | 3.3 V | INDUSTRIAL | BASEBAND CIRCUIT | S-XQCC-N24 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | ADF4360-9BCPZRL7 | ANALOG DEVICES INC | QFN | HVQCCN, LCC24,.16SQ,20 | 24 | CP-24-14 | compliant | EAR99 | 8542.39.00.01 | ||||||
|
CC2511F32RSPR
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | CMOS | 1 | 3 V | AUTOMOTIVE | RF AND BASEBAND CIRCUIT | S-XQCC-N36 | e4 | Not Qualified | 3 | 150 °C | -50 °C | 260 | NOT SPECIFIED | 36 | UNSPECIFIED | HVQCCN | LCC36,.25SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 900 µm | CC2511F32RSPR | TEXAS INSTRUMENTS INC | QFN | HVQCCN, LCC36,.25SQ,20 | 36 | compliant | 5A992.C | 8542.31.00.01 | 1 week | |||||
|
CC2511F32RSP
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | CMOS | 1 | 3 V | AUTOMOTIVE | RF AND BASEBAND CIRCUIT | S-XQCC-N36 | e4 | Not Qualified | 3 | 150 °C | -50 °C | 260 | NOT SPECIFIED | 36 | UNSPECIFIED | HVQCCN | LCC36,.25SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 900 µm | CC2511F32RSP | TEXAS INSTRUMENTS INC | QFN | HVQCCN, LCC36,.25SQ,20 | 36 | compliant | 5A992.C | 8542.31.00.01 | 1 week | Texas Instruments | ||||
|
ADF4360-9BCPZ
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 3.3 V | BICMOS | 1 | 3.3 V | INDUSTRIAL | BASEBAND CIRCUIT | S-XQCC-N24 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 24 | UNSPECIFIED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | ADF4360-9BCPZ | ANALOG DEVICES INC | QFN | HVQCCN, LCC24,.16SQ,20 | 24 | CP-24-14 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||
|
ADF7020-1BCPZ-RL7
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 3 V | 1 | 2.5/3.3 V | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N48 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 48 | UNSPECIFIED | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 7 mm | 1 mm | ADF7020-1BCPZ-RL7 | ANALOG DEVICES INC | QFN | HVQCCN, LCC48,.27SQ,20 | 48 | CP-48-5 | compliant | EAR99 | 8542.39.00.01 | ||||||
|
CC1101RGPR
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3 V | 500 Mbps | 1 | 1.8/3.6 V | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PQCC-N20 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 20 | PLASTIC/EPOXY | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | CC1101RGPR | TEXAS INSTRUMENTS INC | HVQCCN, LCC20,.16SQ,20 | compliant | 5A991.B | 8542.39.00.01 | 6 weeks | Texas Instruments | ||||||
|
CC1101RGP
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 3 V | 500 Mbps | 1 | 1.8/3.6 V | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PQCC-N20 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 20 | PLASTIC/EPOXY | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | CC1101RGP | TEXAS INSTRUMENTS INC | HVQCCN, LCC20,.16SQ,20 | compliant | 5A991.B | 8542.39.00.01 | 6 weeks | Texas Instruments | ||||||
|
MAX2055EUP+TD
Maxim Integrated Products
|
查询价格 |
|
Yes | Yes | Active | 5 V | BICMOS | 1 | INDUSTRIAL | BASEBAND CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 20 | PLASTIC/EPOXY | HTSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.1 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP | HTSSOP, | 20 | compliant | EAR99 | 8542.33.00.01 | 6 weeks | ||||||||
所有内容版权所有 © 2006 - 2021
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
