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数字传输控制器: 1,299 个筛选结果
运营商类型 (2)
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制造商 (48)
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XRT86VL30IV-F
MaxLinear Inc
查询价格
Yes Active 1.8 V 1 INDUSTRIAL FRAMER R-PQFP-G128 e3 Not Qualified 3 85 °C -40 °C 260 40 128 PLASTIC/EPOXY LFQFP RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 14 mm 20 mm 1.6 mm MAXLINEAR INC LFQFP, compliant 8542.39.00.01
XRT86VL30IV80-F
MaxLinear Inc
查询价格
Yes Active 1.8 V 1 INDUSTRIAL FRAMER S-PQFP-G80 e3 Not Qualified 3 85 °C -40 °C 260 40 80 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 12 mm 12 mm 1.6 mm MAXLINEAR INC LFQFP, compliant 8542.39.00.01
TP3404V
National Semiconductor Corporation
查询价格
No Transferred 5 V 144 Mbps BASIC 1 2.4 V 1 mA 400 mV 5 V U COMMERCIAL TIME SLOT ASSIGNER S-PQCC-J28 e0 Not Qualified 2A 70 °C 245 30 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 11.43 mm 11.43 mm 4.57 mm NATIONAL SEMICONDUCTOR CORP PLASTIC, LCC-28 not_compliant 8542.39.00.01
82V2108PXG
Integrated Device Technology Inc
查询价格
Yes Yes Transferred 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e3 Not Qualified 3 85 °C -40 °C 260 30 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC GREEN, PLASTIC, QFP-128 compliant 8542.39.00.01 PQFP 128 PXG128 EAR99 PQFP 14.0 X 20.0 X 2.7 MM
MT9076BB1
Microsemi Corporation
查询价格
Yes Transferred 3.3 V 1 INDUSTRIAL FRAMER S-PQFP-G80 e3 Not Qualified 85 °C -40 °C 260 30 80 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 14 mm 14 mm 1.6 mm MICROSEMI CORP LQFP, compliant 8542.39.00.01 QFP 80
MT8976AP1
Zarlink Semiconductor Inc
查询价格
Yes Obsolete 5 V 1 INDUSTRIAL FRAMER S-PQCC-J44 e3 Not Qualified 3 85 °C -40 °C 260 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES Matte Tin (Sn) J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm ZARLINK SEMICONDUCTOR INC LEAD FREE, PLASTIC, MS-018AC, LCC-44 compliant 8542.39.00.01
MT8976APR1
Zarlink Semiconductor Inc
查询价格
Yes Obsolete 5 V 1 INDUSTRIAL FRAMER S-PQCC-J44 e3 Not Qualified 3 85 °C -40 °C 260 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES Matte Tin (Sn) J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm ZARLINK SEMICONDUCTOR INC LEAD FREE, PLASTIC, MS-018AC, LCC-44 compliant 8542.39.00.01
IDT82V2108PXG
Integrated Device Technology Inc
查询价格
Yes Yes Transferred 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e3 Not Qualified 85 °C -40 °C 260 30 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, QFP-128 compliant 8542.39.00.01 QFP 128 EAR99
MT8977AP
Zarlink Semiconductor Inc
查询价格
No Obsolete 5 V CMOS 1 5 V 10 µA INDUSTRIAL FRAMER S-PQCC-J44 e0 Not Qualified 1 85 °C -40 °C 225 30 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm ZARLINK SEMICONDUCTOR INC QCCJ, LDCC44,.7SQ compliant 8542.39.00.01
DS2155G+
Maxim Integrated Products
查询价格
Yes Yes Obsolete 3.3 V CEPT PCM-30/E-1 1 3.3 V COMMERCIAL FRAMER S-PBGA-B100 e3 Not Qualified 3 70 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY FBGA BGA100,10X10,32 SQUARE GRID ARRAY, FINE PITCH YES Matte Tin (Sn) BALL 800 µm BOTTOM 10 mm 10 mm MAXIM INTEGRATED PRODUCTS INC 10 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, CSBGA-100 compliant 8542.39.00.01 BGA 100 EAR99 1 week
DS2155GNB+
Maxim Integrated Products
查询价格
Yes Yes Obsolete 3.3 V CEPT PCM-30/E-1 T-1(DS1) 1 3.3 V INDUSTRIAL FRAMER S-PBGA-B100 e1 Not Qualified 3 85 °C -40 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY FBGA BGA100,10X10,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 10 mm 10 mm MAXIM INTEGRATED PRODUCTS INC 10 X 10 MM, ROHS COMPLIANT, CSBGA-100 compliant 8542.39.00.01 BGA 100
MT8979APR1
Microsemi Corporation
查询价格
Yes Yes Transferred 5 V CMOS 1 INDUSTRIAL FRAMER S-PQCC-J44 e3 Not Qualified 85 °C -40 °C 260 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm MICROSEMI CORP QCCJ, compliant 8542.39.00.01 LPCC 44
DS2155G+T&R
Maxim Integrated Products
查询价格
Yes Yes Obsolete 3.3 V CEPT PCM-30/E-1 T-1(DS1) 1 3.3 V COMMERCIAL FRAMER S-PBGA-B100 e1 Not Qualified 3 70 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY FBGA BGA100,10X10,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 10 mm 10 mm MAXIM INTEGRATED PRODUCTS INC 10 X 10 MM, ROHS COMPLIANT, CSBGA-100 compliant 8542.39.00.01 BGA 100 EAR99 1 week
DS3173
Maxim Integrated Products
查询价格
No No Obsolete 3.3 V 1 3.3 V 449 µA COMMERCIAL FRAMER S-PBGA-B400 e0 Not Qualified 70 °C 240 NOT SPECIFIED 400 PLASTIC/EPOXY BGA BGA400,20X20,50 SQUARE GRID ARRAY YES Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 27 mm 27 mm 2.54 mm MAXIM INTEGRATED PRODUCTS INC 27 X 27 MM, 1.27 MM PITCH, CSBGA-400 not_compliant 8542.39.00.01 BGA 400 EAR99 1 week
DS2181A
Maxim Integrated Products
查询价格
No No Obsolete 5 V CMOS CEPT PCM-30/E-1 1 5 V COMMERCIAL FRAMER R-PDIP-T40 e0 Not Qualified 1 70 °C 245 NOT SPECIFIED 40 PLASTIC/EPOXY DIP DIP40,.6 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 15.24 mm 52.3875 mm 4.064 mm MAXIM INTEGRATED PRODUCTS INC 0.600 INCH, DIP-40 not_compliant 8542.39.00.01 DIP 40 EAR99 1 week
82V2108PX
Integrated Device Technology Inc
查询价格
No No Obsolete 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e0 Not Qualified 3 85 °C -40 °C 225 20 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, QFP-128 not_compliant 8542.39.00.01 QFP 128 EAR99
DS26514G+
Maxim Integrated Products
查询价格
Yes Yes Obsolete 1.8 V 1 COMMERCIAL FRAMER S-PBGA-B256 e1 Not Qualified 3 70 °C 260 NOT SPECIFIED 256 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 17 mm 17 mm 1.76 mm MAXIM INTEGRATED PRODUCTS INC BGA, compliant 8542.39.00.01 BGA 256 1 week
MT8977APR
Zarlink Semiconductor Inc
查询价格
No Obsolete 5 V CMOS 1 INDUSTRIAL FRAMER S-PQCC-J44 e0 Not Qualified 1 85 °C -40 °C 225 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm ZARLINK SEMICONDUCTOR INC QCCJ, compliant 8542.39.00.01
IDT82V2108PX
Integrated Device Technology Inc
查询价格
No No Obsolete 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e0 Not Qualified 3 85 °C -40 °C 225 20 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, QFP-128 not_compliant 8542.39.00.01 QFP 128
DS2155GNB
Maxim Integrated Products
查询价格
No No Obsolete 3.3 V CEPT PCM-30/E-1 T-1(DS1) 1 3.3 V INDUSTRIAL FRAMER S-PBGA-B100 Not Qualified 1 85 °C -40 °C 225 NOT SPECIFIED 100 PLASTIC/EPOXY FBGA BGA100,10X10,32 SQUARE GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM 10 mm 10 mm MAXIM INTEGRATED PRODUCTS INC 10 X 10 MM, CSBGA-100 not_compliant 8542.39.00.01 BGA 100
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