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数字传输控制器: 1,299 个筛选结果
运营商类型 (2)
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制造商 (48)
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Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
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PM4358-NGI
Microchip Technology Inc
查询价格
Active 1.8 V CMOS 1 INDUSTRIAL FRAMER S-PBGA-B256 85 °C -40 °C 256 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL BOTTOM MICROCHIP TECHNOLOGY INC BGA, compliant 5A991.B 8542.31.00.01 6 weeks
XRT86VL30IV80-F
MaxLinear Inc
查询价格
Yes Active 1.8 V 1 INDUSTRIAL FRAMER S-PQFP-G80 e3 Not Qualified 3 85 °C -40 °C 260 40 80 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 12 mm 12 mm 1.6 mm MAXLINEAR INC LFQFP, compliant 8542.39.00.01
XRT86VL30IV-F
MaxLinear Inc
查询价格
Yes Active 1.8 V 1 INDUSTRIAL FRAMER R-PQFP-G128 e3 Not Qualified 3 85 °C -40 °C 260 40 128 PLASTIC/EPOXY LFQFP RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 14 mm 20 mm 1.6 mm MAXLINEAR INC LFQFP, compliant 8542.39.00.01
PM4351-RGI
Microchip Technology Inc
查询价格
Yes Active 3.3 V CMOS 1 INDUSTRIAL FRAMER S-PBGA-B81 85 °C -40 °C 81 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL BOTTOM MICROCHIP TECHNOLOGY INC CABGA-81 compliant 5A991.B 8542.31.00.01 8 weeks
MT8976AP1
Zarlink Semiconductor Inc
查询价格
Yes Obsolete 5 V 1 INDUSTRIAL FRAMER S-PQCC-J44 e3 Not Qualified 3 85 °C -40 °C 260 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES Matte Tin (Sn) J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm ZARLINK SEMICONDUCTOR INC LEAD FREE, PLASTIC, MS-018AC, LCC-44 compliant 8542.39.00.01
MT8977AP
Zarlink Semiconductor Inc
查询价格
No Obsolete 5 V CMOS 1 5 V 10 µA INDUSTRIAL FRAMER S-PQCC-J44 e0 Not Qualified 1 85 °C -40 °C 225 30 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm ZARLINK SEMICONDUCTOR INC QCCJ, LDCC44,.7SQ compliant 8542.39.00.01
MT8976APR1
Zarlink Semiconductor Inc
查询价格
Yes Obsolete 5 V 1 INDUSTRIAL FRAMER S-PQCC-J44 e3 Not Qualified 3 85 °C -40 °C 260 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES Matte Tin (Sn) J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm ZARLINK SEMICONDUCTOR INC LEAD FREE, PLASTIC, MS-018AC, LCC-44 compliant 8542.39.00.01
MT8977APR
Zarlink Semiconductor Inc
查询价格
No Obsolete 5 V CMOS 1 INDUSTRIAL FRAMER S-PQCC-J44 e0 Not Qualified 1 85 °C -40 °C 225 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm ZARLINK SEMICONDUCTOR INC QCCJ, compliant 8542.39.00.01
MT8979APR1
Microsemi Corporation
查询价格
Yes Yes Transferred 5 V CMOS 1 INDUSTRIAL FRAMER S-PQCC-J44 e3 Not Qualified 85 °C -40 °C 260 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm MICROSEMI CORP QCCJ, compliant 8542.39.00.01 LPCC 44
82V2108PXG8
Integrated Device Technology Inc
查询价格
Yes Yes Transferred 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e3 Not Qualified 85 °C -40 °C 260 30 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, QFP-128 compliant EAR99 8542.39.00.01 QFP 128 82V2108PXG8
82V2108PX8
Integrated Device Technology Inc
查询价格
No No Obsolete 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e0 Not Qualified 3 85 °C -40 °C 225 20 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, QFP-128 not_compliant EAR99 8542.39.00.01 QFP 128 82V2108PX8
82V2108PX
Integrated Device Technology Inc
查询价格
No No Obsolete 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e0 Not Qualified 3 85 °C -40 °C 225 20 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, QFP-128 not_compliant EAR99 8542.39.00.01 QFP 128 82V2108PX
MT8979APR
Microsemi Corporation
查询价格
No No Transferred 5 V CMOS CEPT PCM-30/E-1 1 5 V 16 mA INDUSTRIAL FRAMER S-PQCC-J44 e0 Not Qualified 85 °C -40 °C 225 30 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm MICROSEMI CORP PLASTIC, MS-018AC, LCC-44 unknown 8542.39.00.01 LPCC 44
MT8979AP1
Microsemi Corporation
查询价格
Yes Yes Obsolete 5 V CMOS 1 INDUSTRIAL FRAMER S-PQCC-J44 e3 Not Qualified 85 °C -40 °C 260 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm MICROSEMI CORP QCCJ, compliant 8542.39.00.01 LPCC 44
MT8976APR
Microsemi Corporation
查询价格
No No Obsolete 5 V CMOS 1 5 V 10 µA INDUSTRIAL FRAMER S-PQCC-J44 e0 Not Qualified 1 85 °C -40 °C 225 30 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm ZARLINK SEMICONDUCTOR INC QCCJ, LDCC44,.7SQ compliant 8542.39.00.01 LPCC 44
MT8977APR1
Microsemi Corporation
查询价格
Yes Yes Obsolete 5 V CMOS 1 INDUSTRIAL FRAMER S-PQCC-J44 e3 Not Qualified 3 85 °C -40 °C 260 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm ZARLINK SEMICONDUCTOR INC QCCJ, compliant 8542.39.00.01 LPCC 44
T-8105---BAL4-DB
LSI Corporation
查询价格
No No Transferred 3.3 V 1 3.3 V 275 µA INDUSTRIAL TIME SLOT ASSIGNER S-PBGA-B217 e0 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 217 PLASTIC/EPOXY BGA BGA217,17X17,50 SQUARE GRID ARRAY YES Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 23 mm 23 mm 2.32 mm AGERE SYSTEMS INC BGA, BGA217,17X17,50 unknown 8542.39.00.01 BGA 217
IDT82V2108PX8
Integrated Device Technology Inc
查询价格
No No Obsolete 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e0 Not Qualified 3 85 °C -40 °C 225 20 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, QFP-128 not_compliant 8542.39.00.01 QFP 128 IDT82V2108PX8
IDT82V2108PX
Integrated Device Technology Inc
查询价格
No No Obsolete 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e0 Not Qualified 3 85 °C -40 °C 225 20 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES Tin/Lead (Sn/Pb) GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, QFP-128 not_compliant 8542.39.00.01 QFP 128 IDT82V2108PX
IDT82V2108PXG8
Integrated Device Technology Inc
查询价格
Yes Yes Transferred 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e3 Not Qualified 85 °C -40 °C 260 30 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm INTEGRATED DEVICE TECHNOLOGY INC PLASTIC, QFP-128 compliant 8542.39.00.01 QFP 128 IDT82V2108PXG8
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