service@bom2buy.com (0512) 62988549

无法从文档中提取型号,请重试

数字传输控制器: 1,299 个筛选结果
运营商类型 (2)
数据速率 (4)
-
-
制造商 (48)
-
-
-
-
-
标称供电电压 (7)
-
技术 (5)
-
-
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
制造商型号 Composite Price
风险等级 是否无铅 是否Rohs认证 生命周期 标称供电电压 技术 运营商类型 数据速率 运营商类型(2) ISDN访问速率 功能数量 最小输出高电压 最大输出低电流 最大输出低电压 电源 参照点 最大压摆率 温度等级 电信集成电路类型 JESD-30 代码 JESD-609代码 认证状态 湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度) 处于峰值回流温度下的最长时间 端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 表面贴装 端子面层 端子形式 端子节距 端子位置 宽度 长度 座面最大高度 零件包装代码
包装说明
针数
制造商包装代码
是否符合REACH标准
ECCN代码
HTS代码
82V2108PXG
Integrated Device Technology Inc
查询价格
Yes Yes Active 3.3 V CMOS 1 3.3 V INDUSTRIAL FRAMER R-PQFP-G128 e3 Not Qualified 3 85 °C -40 °C 260 30 128 PLASTIC/EPOXY FQFP QFP128,.67X.93,20 RECTANGULAR FLATPACK, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 14 mm 20 mm 3.4 mm PQFP GREEN, PLASTIC, QFP-128 128 PXG128 compliant EAR99 8542.39.00.01
MT9076BB1
Microsemi Corporation
查询价格
Yes Active 3.3 V 1 INDUSTRIAL FRAMER S-PQFP-G80 e3 Not Qualified 85 °C -40 °C 260 30 80 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 14 mm 14 mm 1.6 mm QFP LQFP, 80 compliant 8542.39.00.01
XRT86VL30IV80-F
MaxLinear Inc
查询价格
Yes Active 1.8 V 1 INDUSTRIAL FRAMER S-PQFP-G80 e3 Not Qualified 3 85 °C -40 °C 260 40 80 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 12 mm 12 mm 1.6 mm LFQFP, compliant 8542.39.00.01
XRT86VL30IV-F
MaxLinear Inc
查询价格
Yes Active 1.8 V 1 INDUSTRIAL FRAMER R-PQFP-G128 e3 Not Qualified 3 85 °C -40 °C 260 40 128 PLASTIC/EPOXY LFQFP RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 14 mm 20 mm 1.6 mm LFQFP, compliant 8542.39.00.01
DS21Q59L+
Maxim Integrated Products
查询价格
Yes Yes Active 3.3 V CMOS CEPT PCM-30/E-1 1 3.3 V COMMERCIAL FRAMER S-PQFP-G100 e3 Not Qualified 3 70 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm QFP LFQFP, QFP100,.63SQ,20 100 compliant EAR99 8542.39.00.01
MT9075BP1
Microsemi Corporation
查询价格
Yes Yes Active 5 V CMOS CEPT PCM-30/E-1 1 5 V 150 mA INDUSTRIAL FRAMER S-PQCC-J68 e3 Not Qualified 85 °C -40 °C 260 30 68 PLASTIC/EPOXY QCCJ LDCC68,1.0SQ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 24.23 mm 24.23 mm 4.57 mm LCC QCCJ, LDCC68,1.0SQ 68 compliant 8542.39.00.01
DS26518GN+
Maxim Integrated Products
查询价格
Yes Yes Active 1.8 V CEPT PCM-30/E-1 T-1(DS1) 1 1.8,3.3 V 450 µA INDUSTRIAL FRAMER S-PBGA-B256 Not Qualified 3 85 °C -40 °C 260 30 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES BALL 1 mm BOTTOM 17 mm 17 mm 1.76 mm BGA BGA, BGA256,16X16,40 256 compliant EAR99 8542.39.00.01
TP3404V
National Semiconductor Corporation
查询价格
No Transferred 5 V 144 Mbps BASIC 1 2.4 V 1 mA 400 mV 5 V U COMMERCIAL TIME SLOT ASSIGNER S-PQCC-J28 e0 Not Qualified 2A 70 °C 245 30 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 11.43 mm 11.43 mm 4.57 mm PLASTIC, LCC-28 not_compliant 8542.39.00.01
DS2155GN
Maxim Integrated Products
查询价格
No No Obsolete 3.3 V CEPT PCM-30/E-1 T-1(DS1) 1 3.3 V INDUSTRIAL FRAMER S-PBGA-B100 e0 Not Qualified 3 85 °C -40 °C 240 20 100 PLASTIC/EPOXY FBGA QFP100,.63SQ,20 SQUARE GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 10 mm 10 mm BGA 10 X 10 MM, 0.80 MM PITCH, CSBGA-100 100 not_compliant EAR99 8542.39.00.01
DS2155G+
Maxim Integrated Products
查询价格
Yes Yes Obsolete 3.3 V CEPT PCM-30/E-1 1 3.3 V COMMERCIAL FRAMER S-PBGA-B100 e3 Not Qualified 3 70 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY FBGA BGA100,10X10,32 SQUARE GRID ARRAY, FINE PITCH YES Matte Tin (Sn) BALL 800 µm BOTTOM 10 mm 10 mm BGA 10 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, CSBGA-100 100 compliant EAR99 8542.39.00.01
DS2155G+T&R
Maxim Integrated Products
查询价格
Yes Yes Obsolete 3.3 V CEPT PCM-30/E-1 T-1(DS1) 1 3.3 V COMMERCIAL FRAMER S-PBGA-B100 e1 Not Qualified 3 70 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY FBGA BGA100,10X10,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 10 mm 10 mm BGA 10 X 10 MM, ROHS COMPLIANT, CSBGA-100 100 compliant EAR99 8542.39.00.01
MT8979AP
Zarlink Semiconductor Inc
查询价格
No Obsolete 5 V CMOS CEPT PCM-30/E-1 1 5 V 16 µA INDUSTRIAL FRAMER S-PQCC-J44 e0 Not Qualified 1 85 °C -40 °C 225 30 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm PLASTIC, MS-018AC, LCC-44 unknown 8542.39.00.01
T8100A--SC4-DB
LSI Corporation
查询价格
No No Contact Manufacturer 3.3 V 1 COMMERCIAL TIME SLOT ASSIGNER S-PQFP-G208 e0 Not Qualified 70 °C 225 30 208 PLASTIC/EPOXY FQFP SQUARE FLATPACK, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 28 mm 28 mm 4.1 mm QFP FQFP, 208 unknown
DS2155GNB+
Maxim Integrated Products
查询价格
Yes Yes Obsolete 3.3 V CEPT PCM-30/E-1 T-1(DS1) 1 3.3 V INDUSTRIAL FRAMER S-PBGA-B100 e1 Not Qualified 3 85 °C -40 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY FBGA BGA100,10X10,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 10 mm 10 mm BGA 10 X 10 MM, ROHS COMPLIANT, CSBGA-100 100 compliant 8542.39.00.01
DS2155GNB
Maxim Integrated Products
查询价格
No No Obsolete 3.3 V CEPT PCM-30/E-1 T-1(DS1) 1 3.3 V INDUSTRIAL FRAMER S-PBGA-B100 Not Qualified 1 85 °C -40 °C 225 NOT SPECIFIED 100 PLASTIC/EPOXY FBGA BGA100,10X10,32 SQUARE GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM 10 mm 10 mm BGA 10 X 10 MM, CSBGA-100 100 not_compliant 8542.39.00.01
T-8100A--SC4-DB
Broadcom Limited
查询价格
No Active 3.3 V 1 3.3 V 275 µA COMMERCIAL TIME SLOT ASSIGNER S-PQFP-G208 e0 Not Qualified 70 °C 225 30 208 PLASTIC/EPOXY FQFP QFP208,1.2SQ,20 SQUARE FLATPACK, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 28 mm 28 mm 4.1 mm FQFP, QFP208,1.2SQ,20 compliant 8542.39.00.01
MT8976AP1
Zarlink Semiconductor Inc
查询价格
Yes Obsolete 5 V 1 INDUSTRIAL FRAMER S-PQCC-J44 e3 Not Qualified 3 85 °C -40 °C 260 30 44 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES Matte Tin (Sn) J BEND 1.27 mm QUAD 16.585 mm 16.585 mm 4.57 mm LEAD FREE, PLASTIC, MS-018AC, LCC-44 compliant 8542.39.00.01
T-8100A--BAL4-DB
Broadcom Limited
查询价格
No Active 3.3 V 1 3.3 V 275 µA INDUSTRIAL TIME SLOT ASSIGNER S-PBGA-B217 e0 Not Qualified 85 °C -40 °C 225 30 217 PLASTIC/EPOXY BGA BGA217,17X17,50 SQUARE GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 23 mm 23 mm 2.32 mm BGA, BGA217,17X17,50 compliant 8542.39.00.01
DS2155G
Maxim Integrated Products
查询价格
No No Obsolete 3.3 V CEPT PCM-30/E-1 T-1(DS1) 1 3.3 V COMMERCIAL FRAMER S-PBGA-B100 e0 Not Qualified 3 70 °C 240 20 100 PLASTIC/EPOXY FBGA QFP100,.63SQ,20 SQUARE GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 10 mm 10 mm BGA 10 X 10 MM, 0.80 MM PITCH, CSBGA-100 100 not_compliant 8542.39.00.01
T8100A--BAL4-DB
LSI Corporation
查询价格
No No Contact Manufacturer 3.3 V 1 INDUSTRIAL TIME SLOT ASSIGNER S-PBGA-B217 e0 Not Qualified 85 °C -40 °C 225 30 217 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 23 mm 23 mm 2.32 mm BGA PLASTIC, BGA-217 217 compliant
12345下一页
Add to list:
注册 or 登录