所有内容版权所有 © 2006 - 2020
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||
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| 制造商型号 |
Composite Price
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风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 数据速率 | 其他特性 | 功能数量 | 电源 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度（摄氏度） | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 |
IHS 制造商
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零件包装代码
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包装说明
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针数
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制造商包装代码
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Reach Compliance Code
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HTS代码
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交付时间
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ECCN代码
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特征
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A5191HRTLG-XTP
ON Semiconductor
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查询价格 |
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Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQFP-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Tin (Sn) | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | ON SEMICONDUCTOR | QFP | 7.00 X 7.00 MM, GREEN, LQFP-32 | 32 | 561AB | compliant | 8542.39.00.01 | 1 week | |||||
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A5191HRTPG-XTP
ON Semiconductor
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查询价格 |
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Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 245 | 40 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin (Sn) | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | ON SEMICONDUCTOR | QLCC | GREEN, PLASTIC, LCC-28 | 28 | 776AA | compliant | 8542.39.00.01 | 1 week | |||||
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ST7540TR
STMicroelectronics
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查询价格 |
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Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | STMICROELECTRONICS | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | 8542.39.00.01 | 14 weeks | EAR99 | |||||||
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ST7540
STMicroelectronics
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查询价格 |
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Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | STMICROELECTRONICS | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | 8542.39.00.01 | 14 weeks | EAR99 | |||||||
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MAX2992GCB+T
Maxim Integrated Products
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查询价格 |
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Yes | Active | e3 | 3 | Matte Tin (Sn) | MAXIM INTEGRATED PRODUCTS INC | , | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||
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TDA5051AT/C1,518
NXP Semiconductors
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查询价格 |
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Yes | Active | NXP SEMICONDUCTORS | SOP | SOP, SOP16,.4 | 16 | SOT162-1 | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||
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A5191HRTLG-XTD
ON Semiconductor
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查询价格 |
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Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQFP-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Tin (Sn) | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | ON SEMICONDUCTOR | QFP | 7.00 X 7.00 MM, GREEN, LQFP-32 | 32 | 561AB | compliant | 8542.39.00.01 | 17 weeks | |||||
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A5191HRTPG-XTD
ON Semiconductor
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查询价格 |
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Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 245 | 40 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin (Sn) | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | ON SEMICONDUCTOR | QLCC | QCCJ, LDCC28,.5SQ | 28 | 776AA | compliant | 8542.39.00.01 | 1 week | |||||
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SI2457-C-FT
Silicon Laboratories Inc
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查询价格 |
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Yes | Yes | Active | 3.3 V | 56 Mbps | 1 | COMMERCIAL | MODEM | S-PDSO-G24 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | SILICON LABORATORIES INC | TSSOP | TSSOP, | 24 | compliant | 8542.39.00.01 | ||||||||||||||
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MAX2992GCB+
Maxim Integrated Products
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查询价格 |
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Yes | Active | e3 | 3 | Matte Tin (Sn) | MAXIM INTEGRATED PRODUCTS INC | , | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||
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MPL360BT-I/Y8X
Microchip Technology Inc
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查询价格 |
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Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-PQFP-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.2 mm | MICROCHIP TECHNOLOGY INC | TQFP-48 | compliant | 11 weeks | |||||||||||||||||||||
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ST7538Q
STMicroelectronics
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查询价格 |
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Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | S-PQFP-G44 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.6 mm | STMICROELECTRONICS | QFP | LQFP, QFP44,.47SQ,32 | 44 | compliant | 8542.39.00.01 | 14 weeks | EAR99 | |||||||
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NCN49597MNRG
ON Semiconductor
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查询价格 |
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Yes | Active | 3.3 V | 3.3 V | 60 µA | INDUSTRIAL | PROGRAMMABLE MODEM | S-PQCC-N52 | Not Qualified | 115 °C | -40 °C | 52 | PLASTIC/EPOXY | QCCN | LCC52,.31SQ,20 | SQUARE | CHIP CARRIER | YES | NO LEAD | 500 µm | QUAD | ON SEMICONDUCTOR | QCCN, LCC52,.31SQ,20 | 52 | 485M | compliant | 8542.39.00.01 | 1 week | |||||||||||||||||
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CPC5621ATR
IXYS Integrated Circuits Division
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查询价格 |
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Yes | Yes | Active | 3.3 V | IT CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY | 1 | 3.3/5 V | 10 µA | INDUSTRIAL | MODEM-SUPPORT CIRCUIT | R-PDSO-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | SSOP | SSOP32,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 635 µm | DUAL | 7.493 mm | 10.287 mm | 2.134 mm | IXYS INTEGRATED CIRCUITS DIVISION | SOIC | SSOP, SSOP32,.4 | 32 | unknown | 8542.39.00.01 | EAR99 | Modem-Support Circuit | |||||
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DAC8742HPBSR
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 31.25 Mbps | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQFP-G32 | e4 | 3 | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | PLASTIC/EPOXY | TFQFP | TQFP32,.28SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 5 mm | 5 mm | 1.2 mm | TEXAS INSTRUMENTS INC | TFQFP, TQFP32,.28SQ | compliant | 6 weeks | EAR99 | ||||||||||||
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SI2400-FS
Silicon Laboratories Inc
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查询价格 |
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Yes | Yes | Active | 3.3 V | 2.4 Mbps | ALSO OPERATES AT 5V SUPPLY | 1 | 3.3/5 V | 32 µA | COMMERCIAL | MODEM | R-PDSO-G16 | e3 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | SILICON LABORATORIES INC | SOIC | SOP, SOP16,.25 | 16 | compliant | 8542.39.00.01 | ||||||||
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DAC8741HRGET
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 31.25 Mbps | DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQCC-N24 | 2 | 125 °C | -55 °C | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | TEXAS INSTRUMENTS INC | HVQCCN, | compliant | 6 weeks | |||||||||||||||||
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DS8500-JND+
Maxim Integrated Products
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查询价格 |
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Yes | Yes | Active | 1.2 Mbps | 1 | 3/3.3 V | 285 nA | INDUSTRIAL | MODEM | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.20SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC20,.20SQ,25 | 20 | compliant | 8542.39.00.01 | 6 weeks | EAR99 | ||||||
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MPL360B-I/SCB
Microchip Technology Inc
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查询价格 |
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Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-XQCC-N48 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | 900 µm | MICROCHIP TECHNOLOGY INC | QFN-48 | unknown | 7 weeks | |||||||||||||||||||||
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MPL360B-I/Y8X
Microchip Technology Inc
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查询价格 |
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Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-PQFP-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.2 mm | MICROCHIP TECHNOLOGY INC | TQFP-48 | compliant | 10 weeks | |||||||||||||||||||||
所有内容版权所有 © 2006 - 2020
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
