所有内容版权所有 © 2006 - 2021
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||
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| 制造商型号 |
Composite Price
|
风险等级 |
是否无铅
|
是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 数据速率 | 其他特性 | 功能数量 |
电源
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最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度（摄氏度）
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
|
封装形式
|
表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
|
Source Content uid
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IHS 制造商
|
零件包装代码
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包装说明
|
针数
|
制造商包装代码
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是否符合REACH标准
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HTS代码
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交付时间
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Samacsys Manufacturer
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ECCN代码
|
|
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A5191HRTLG-XTP
ON Semiconductor
|
查询价格 |
|
Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQFP-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Tin (Sn) | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | A5191HRTLG-XTP | ON SEMICONDUCTOR | QFP | 7.00 X 7.00 MM, GREEN, LQFP-32 | 32 | 561AB | compliant | 8542.39.00.01 | 17 weeks | |||||
|
A5191HRTLG-XTD
ON Semiconductor
|
查询价格 |
|
Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQFP-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Tin (Sn) | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | A5191HRTLG-XTD | ON SEMICONDUCTOR | QFP | 7.00 X 7.00 MM, GREEN, LQFP-32 | 32 | 561AB | compliant | 8542.39.00.01 | 17 weeks | ON Semiconductor | ||||
|
ST7540
STMicroelectronics
|
查询价格 |
|
Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | ST7540 | STMICROELECTRONICS | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | 8542.39.00.01 | 14 weeks | STMicroelectronics | EAR99 | ||||||
|
ST7540TR
STMicroelectronics
|
查询价格 |
|
Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | ST7540TR | STMICROELECTRONICS | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | 8542.39.00.01 | 14 weeks | STMicroelectronics | EAR99 | ||||||
|
A5191HRTPG-XTP
ON Semiconductor
|
查询价格 |
|
Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 245 | 40 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin (Sn) | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | A5191HRTPG-XTP | ON SEMICONDUCTOR | QLCC | GREEN, PLASTIC, LCC-28 | 28 | 776AA | compliant | 8542.39.00.01 | 1 week | |||||
|
A5191HRTNG-XTP
ON Semiconductor
|
查询价格 |
|
Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-XQCC-N32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | A5191HRTNG-XTP | ON SEMICONDUCTOR | QFN | 5.00 X 5.00 MM, GREEN, QFN-32 | 32 | 488AM | compliant | 8542.39.00.01 | 18 weeks | ON Semiconductor | ||||||
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MAX2992GCB+T
Maxim Integrated Products
|
查询价格 |
|
Yes | Active | e3 | 3 | Matte Tin (Sn) | MAXIM INTEGRATED PRODUCTS INC | , | compliant | 8542.39.00.01 | Maxim Integrated | ||||||||||||||||||||||||||||||||||||
|
TDA5051AT/C1,518
NXP Semiconductors
|
查询价格 |
|
Yes | Active | 5 V | CMOS | 5 V | 68 µA | COMMERCIAL | MODEM | R-PDSO-G16 | Not Qualified | 3 | 70 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | TDA5051AT/C1,518 | NXP SEMICONDUCTORS | SOP | SOP, SOP16,.4 | 16 | SOT162-1 | compliant | 8542.39.00.01 | ||||||||||||||
|
SI2404-C-FTR
Silicon Laboratories Inc
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | 2.4 Gbps | 1 | COMMERCIAL | MODEM | S-PDSO-G24 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | SILICON LABORATORIES INC | TSSOP | ROHS COMPLIANT, TSSOP-24 | 24 | compliant | 8542.39.00.01 | |||||||||||||||
|
A5191HRTPG-XTD
ON Semiconductor
|
查询价格 |
|
Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 245 | 40 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin (Sn) | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | A5191HRTPG-XTD | ON SEMICONDUCTOR | QLCC | QCCJ, LDCC28,.5SQ | 28 | 776AA | compliant | 8542.39.00.01 | 17 weeks | ON Semiconductor | ||||
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BCM3300KTB
Broadcom Limited
|
查询价格 |
|
Active | BROADCOM INC | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||||||||
|
MX604TN
CML Microcircuits Plc
|
查询价格 |
|
Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 2.5 µA | INDUSTRIAL | MODEM | R-PDSO-G24 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TSSOP | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | CML MICROCIRCUITS LTD | TSSOP | TSSOP, TSSOP24,.25 | 24 | compliant | 8542.39.00.01 | ||||||||||||||
|
SI2457-C-FT
Silicon Laboratories Inc
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | 56 Mbps | 1 | COMMERCIAL | MODEM | S-PDSO-G24 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | SILICON LABORATORIES INC | TSSOP | ROHS COMPLIANT, TSSOP-24 | 24 | compliant | 8542.39.00.01 | |||||||||||||||
|
MAX2992GCB+
Maxim Integrated Products
|
查询价格 |
|
Yes | Active | e3 | 3 | Matte Tin (Sn) | MAXIM INTEGRATED PRODUCTS INC | , | compliant | 8542.39.00.01 | Maxim Integrated | ||||||||||||||||||||||||||||||||||||
|
LTC5585IUF#PBF
Analog Devices Inc
|
查询价格 |
|
No | Yes | Active | 5 V | CMOS | 1 | INDUSTRIAL | MODEM-DEMODULATOR | S-PQCC-N24 | e3 | 1 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | LTC5585IUF#PBF | ANALOG DEVICES INC | HVQCCN, | 24 | 05-08-1697 | compliant | ||||||||||||
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CMX909BD5
CML Microcircuits Plc
|
查询价格 |
|
Yes | Yes | Active | 3 V | 38.4 Mbps | 1 | 3.3/5 V | INDUSTRIAL | MODEM | R-PDSO-G24 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 24 | PLASTIC/EPOXY | SSOP | SSOP24,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 5.3 mm | 8.2 mm | 2 mm | CML MICROCIRCUITS LTD | SSOP | SSOP, SSOP24,.3 | 24 | compliant | 8542.39.00.01 | ||||||||||
|
CMX589AE2
CML Microcircuits Plc
|
查询价格 |
|
Yes | Yes | Active | 3.3 V | CMOS | 200 Mbps | HALF DUPLEX; FULL DUPLEX | 1 | 3.3/5 V | INDUSTRIAL | MODEM | R-PDSO-G24 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 24 | PLASTIC/EPOXY | TSSOP | TSSOP24,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | CML MICROCIRCUITS LTD | TSSOP | TSSOP, TSSOP24,.25 | 24 | compliant | 8542.39.00.01 | ||||||||
|
MPL360BT-I/Y8X
Microchip Technology Inc
|
查询价格 |
|
Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-PQFP-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.2 mm | MPL360BT-I/Y8X | MICROCHIP TECHNOLOGY INC | TQFP-48 | compliant | 8542.31.00.01 | 11 weeks | 5A992.C | |||||||||||||||||||
|
MPL360B-I/SCB
Microchip Technology Inc
|
查询价格 |
|
Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-XQCC-N48 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | 900 µm | MPL360B-I/SCB | MICROCHIP TECHNOLOGY INC | QFN-48 | compliant | 8542.39.00.01 | 7 weeks | 5A992.C | |||||||||||||||||||
|
MPL360BT-I/SCB
Microchip Technology Inc
|
查询价格 |
|
Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-XQCC-N48 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | 900 µm | MPL360BT-I/SCB | MICROCHIP TECHNOLOGY INC | QFN-48 | compliant | 8542.39.00.01 | 7 weeks | 5A992.C | |||||||||||||||||||
所有内容版权所有 © 2006 - 2021
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
