所有筛选条件 其他特性 模拟集成电路 - 其他类型 模拟输入最大值 应用程序 电池馈电 电池供电 运营商类型 运营商类型（2） 运营商类型（3） 压伸定律 数据速率 滤波器 最大增益公差 混合 ISDN访问速率 输入代码 输入类型 JESD-30 代码 JESD-609代码 长度 线性编码 制造商 湿度敏感等级 安装特点 负电源额定电压 最大噪声 信道数量 功能数量 端子数量 收发器数量 工作模式 最高工作温度 最低工作温度 输出 输出代码 最小输出高电压 最大输出低电流 最大输出低电压 最大输出电压 PSRR-Min 封装主体材料 封装代码 封装等效代码

"SEATED HGT-NOM" 3 3.3v and 5v power supply also require to operate the device 4 6,9,12,18,24,36,48,1,2,5.5,11Mbps data rate also available 1 also available with 1000 and 100 packing quantity 1 ALSO AVAILABLE WITH 280kbps data rate 4 ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps 48 ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE 2 also operates with 3.3v nominal supply 1 ALSO OPERATES WITH 5 V NOMINAL SUPPLY 3 ALSO REQUIRES 3.3V 3 DATA RATE 350 KBPS FOR FSK,MODULATION 1 HEIGHT CAPTURED NOMINAL 1 IT ALSO OPERATES AT 1.5 V AND 2.8 V NOMINAL SUPPLY VOLTAGE 1 LG-MAX 1 LG-MAX, WD-MAX 1 SEATED HEIGHT NOMINAL 2 SEATED HGT-NOM 1 SEATED HGT-NOM; Data Rate :For LTE Cat NB2-127kbps(DL) 1 SEATED HGT-NOM; Data Rate(kbps) :For LTE Cat M1-588(DL), Cat NB2-127(DL), 158.5(UL) 5 SEATED HGT-NOM; Data Rate: For LTE Cat M1-588kbps(DL) 1 SEATED HGT-NOM; OPERATED WITH 2.8V TO 4.3V 1 SEATED HGT-NOM; OPERATES WITH 2.8V TO 4.3V SUPPLY 1 SEATED HT-CALCULATED 10 SUPPLY VOLATGE IS FROM 1.8V TO 3.6V 1 SUPPLY VOLTAGE IS FROM 1.8V TO 3.6V 1

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ANALOG CIRCUIT 1

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1.995 V 3 2 V 8 3 V 8 3.4 V 2 3.45 V 4

Min (V) - Max (V)

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ATM;SDH;SONET 3 I2S 3 SONET 1 SONET;SDH 2

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CONSTANT CURRENT 3 CONSTANT CURRENT/RESISTIVE 1 RESISTIVE 5

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-15 TO -100 V 2 -15 TO -120 V 2 -42.5 TO -56 V 1 -44 TO -54 V 1 -48 V 3 -48 AND +72 V 2 -48 TO 72 V 1 -55 TO -59 V 1 5 V 2

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CEPT PCM-30/E-1 233 E-3 100 STS-1/OC-1 17 T-1(DS1) 88 T-3(DS3) 9

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STS-1/OC-1 90 T-1(DS1) 161 T-1C(DS1C) 2 T-3(DS3) 17

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T-1C(DS1C) 30 T-3(DS3) 90

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A/MU-LAW 9 CVSD 4

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数据速率 (50)

134 kbps 3 600 kbps 3 1 Mbps 2 1.2 Mbps 2 2 Mbps 8 2.4 Mbps 3 4 Mbps 5 8.6 Mbps 10 10 Mbps 5 20 Mbps 10 26.48 Mbps 2 31.25 Mbps 5 50 Mbps 2 53 Mbps 4 64 Mbps 3 106 Mbps 20 144 Mbps 14 192 Mbps 6 200 Mbps 10 250 Mbps 48 500 Mbps 4 848 Mbps 6 921.6 Mbps 3 1 Gbps 35 1.1 Gbps 3 1.119 Gbps 6 1.25 Gbps 4 2 Gbps 62 4 Gbps 14 5 Gbps 14 12 Gbps 14 50 Gbps 3 51.84 Gbps 3 54 Gbps 51 80 Gbps 4 100 Gbps 21 144.4 Gbps 3 480.24 Gbps 14 1 Tbps 14 1.5 Tbps 6 2.5 Tbps 11 3.125 Tbps 4 4 Tbps 7 4.25 Tbps 6 5 Tbps 3 6.25 Tbps 3 10 Tbps 4 10.3 Tbps 5 12.5 Tbps 7 28 Tbps 5

Min (Mbps) - Max (Mbps)

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NO 1 YES 53

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0.1 dB 1 0.75 dB 20 1.0 dB 7 1.2 dB 10 2.5 dB 1

Min (dB) - Max (dB)

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2-4 CONVERSION 13

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BASIC 34

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TWOS COMPLEMENT 8

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DIFFERENTIAL 10

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R-MDIP-T18 2,048 R-PDIP-T14 108 R-PDIP-T16 581 R-PDIP-T18 162 R-PDIP-T20 107 R-PDIP-T24 197 R-PDIP-T28 154 R-PDIP-T8 127 R-PDSO-G14 161 R-PDSO-G16 1,093 R-PDSO-G20 882 R-PDSO-G24 386 R-PDSO-G28 753 R-PDSO-G8 552 R-PDSO-N14 1,253 R-PDSO-N20 220 R-PQFP-G100 127 R-XDMA-P24 126 R-XUUC-N10 176 R-XUUC-N11 278 R-XUUC-N6 116 R-XXFO-X 322 R-XXMA-X 4,149 S-PBGA-B256 121 S-PDSO-G10 160 S-PDSO-G8 242 S-PQCC-J28 289 S-PQCC-J44 173 S-PQCC-J68 128 S-PQCC-N16 159 S-PQCC-N24 190 S-PQCC-N32 329 S-PQCC-N40 105 S-PQCC-N48 131 S-PQFP-G100 313 S-PQFP-G32 147 S-PQFP-G44 235 S-PQFP-G48 240 S-PQFP-G64 480 S-PQFP-G80 147 S-XDMA-N48 864 S-XDMA-P18 93 S-XQCC-N16 410 S-XQCC-N20 301 S-XQCC-N24 226 S-XQCC-N32 579 S-XQCC-N40 94 S-XQCC-N48 334 S-XQCC-N56 104 X-XUUC-N 107

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e0 5,051 e1 341 e2 25 e3 2,570 e3/e2 50 e3/e4 46 e4 1,015 e6 51 e6/e4 5

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2 mm 142 2.3 mm 57 2.5 mm 141 2.9 mm 84 3 mm 1,038 3.5 mm 57 4 mm 688 4.5 mm 73 4.89 mm 61 4.9 mm 222 4.925 mm 128 5 mm 1,330 5.5 mm 94 6 mm 464 6.5 mm 207 7 mm 903 7.2 mm 70 7.8 mm 83 8 mm 193 8.2 mm 61 8.65 mm 73 9 mm 179 9.7 mm 128 9.9 mm 178 10 mm 554 10.2 mm 104 10.211 mm 67 10.3 mm 102 10.9 mm 54 11 mm 135 11.505 mm 52 11.5316 mm 50 12 mm 113 12.8 mm 170 12.825 mm 73 14 mm 349 15 mm 126 17 mm 50 17.9 mm 208 18.034 mm 52 19 mm 47 20 mm 1,046 20.32 mm 52 21 mm 74 22 mm 55 25 mm 54 27 mm 159 28 mm 80 35 mm 79 50.8 mm 118

Min (mm) - Max (mm)

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14-BIT 3 16-BIT 46 NOT AVAILABLE 1

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制造商 (50)

Analog Devices Inc 878 Atmel Corporation 1,189 Avago Technologies 359 Broadcom Limited 578 CML Microcircuits Plc 233 Conexant Systems Inc 404 Connor-Winfield 263 Cypress Semiconductor 490 Data Device Corporation 547 Delta Electronics Inc 929 Dynex Semiconductor 210 Freescale Semiconductor 264 Hangzhou Silan Microelectronics CO LTD 380 Hitachi Ltd 204 Infineon Technologies AG 800 Integrated Device Technology Inc 739 Intel Corporation 239 Intersil Corporation 262 IXYS Corporation 271 LSI Corporation 1,864 Lumentum Operations LLC 325 MACOM 363 Marconi Circuit Technology Inc 209 Maxim Integrated Products 741 Microchip Technology Inc 1,232 Microsemi Corporation 946 Mietec Alcatel 256 Murata Connectivity 220 NXP Semiconductors 1,296 Octasic Inc 324 ON Semiconductor 204 Philips Semiconductors 276 Qorvo 892 Raltron Electronics Corporation 1,946 Renesas Electronics Corporation 272 RF Micro Devices Inc 594 Rochester Electronics LLC 387 Semtech Corporation 241 Sierra Semiconductor 376 Silicon Laboratories Inc 1,166 Skyworks Solutions Inc 231 Sony Semiconductor 4,166 STMicroelectronics 550 Synaptics Incorporated 371 Texas Instruments 1,200 u-blox AG 617 Vectron International 2,075 Viavi Solutions Inc 318 Vitesse Semiconductor Corporation 210 Zarlink Semiconductor Inc 620

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1 2,389 1; 3 1 2 420 2A 16 3 2,368 4 276 5 3 5A 1 NOT APPLICABLE 9 NOT SPECIFIED 88

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SURFACE MOUNT 1

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-48 V 28 -15 V 25 -12 V 20 -10 V 1 -8 V 9 -6 V 6 -5.2 V 165 -5 V 329 -3.3 V 13 -3 V 3 -2.5 V 9 -2 V 34 0.0 V 19

Min (V) - Max (V)

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17.0 dBrnC 1

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1 6 2 10

Min - Max

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1.0 22,852 2.0 49 4.0 35 8.0 3

Min - Max

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10 670 100 537 101 42 11 311 12 372 128 93 13 154 14 1,911 144 132 15 41 16 2,737 160 85 17 77 18 2,463 196 102 2 71 20 1,849 208 98 22 117 24 1,552 25 44 256 136 28 1,862 3 93 30 141 32 1,285 324 63 33 51 36 216 38 39 4 94 40 368 42 92 44 514 48 1,701 5 49 52 71 56 227 6 357 64 698 68 365 7 53 72 66 76 55 79 42 8 1,417 80 254 84 106 9 76 96 53

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1 37 2 5 4 11

Min - Max

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SYNCHRONOUS 4

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24.0 °C 4 25.0 °C 8 35.0 °C 2 40.0 °C 22 45.0 °C 3 50.0 °C 87 55.0 °C 58 58.0 °C 4 60.0 °C 235 65.0 °C 118 70.0 °C 7,177 71.0 °C 1 75.0 °C 316 80.0 °C 145 85.0 °C 17,918 90.0 °C 100 92.0 °C 1 95.0 °C 122 100.0 °C 92 105.0 °C 502 110.0 °C 142 115.0 °C 8 120.0 °C 24 125.0 °C 980 140.0 °C 4 150.0 °C 2

Min (°C) - Max (°C)

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-55.0 °C 617 -54.0 °C 52 -45.0 °C 23 -40.0 °C 16,869 -35.0 °C 65 -34.0 °C 2 -30.0 °C 996 -25.0 °C 1,380 -20.0 °C 1,632 -15.0 °C 17 -10.0 °C 483 -5.0 °C 44 0.0 °C 5,919 5.0 °C 2 10.0 °C 10 25.0 °C 8

Min (°C) - Max (°C)

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VOLTAGE 4

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BINARY/TWOS COMP 2 TWOS COMPLEMENT 8

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2 V 1 2.4 V 19 2.8 V 2 4.5 V 2

Min (V) - Max (V)

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1.6 mA 1 2 mA 3 2.4 mA 4 4.5 mA 4 7 mA 11 12 mA 3 24 mA 2

Min (A) - Max (A)

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400 mV 7 450 mV 17

Min (V) - Max (V)

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1.78 V 2 3 V 2 3.6 V 3

Min (V) - Max (V)

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20.0 dB 3 30.0 dB 3

Min (dB) - Max (dB)

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CERAMIC 581 CERAMIC, GLASS-SEALED 118 CERAMIC, METAL-SEALED COFIRED 389 METAL 2,273 PLASTIC/EPOXY 14,674 UNSPECIFIED 12,385

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BCC 104 BGA 757 CGA 29 DFP 73 DIE 1,207 DIP 4,076 FBGA 55 FQFP 89 HBGA 46 HLGA 92 HLSSOP 25 HQCCN 188 HQFP 36 HSON 37 HTFQFP 63 HTSON 24 HTSSOP 55 HVBCC 34 HVFQFP 28 HVQCCN 3,095 HVSON 311 LBGA 88 LFBGA 133 LFQFP 425 LGA 224 LQFP 117 LSOP 136 LSSOP 253 PGA 37 QCCJ 792 QCCN 910 QFF 153 QFP 1,372 QIP 23 SDIP 29 SON 1,601 SOP 2,355 SSOP 763 TFBGA 64 TFQFP 54 TO-92 30 TQFP 33 TSSOP 885 VBCC 29 VFBGA 429 VFLGA 38 VQCCN 216 VSON 70 VSSOP 40 XMA 143

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CAN10,.23 37 DIE OR CHIP 553 DILCC14,.75 1,249 DILCC20,.75 220 DIP14,.3 164 DIP16,.3 581 DIP18(UNSPEC) 68 DIP18,.3 79 DIP18,1.6,200 2,048 DIP20,.3 70 DIP24,.3 40 DIP24,.6 110 DIP28,.6 139 DIP40,.6 108 DIP8,.3 87 FL14,.75,100 41 LCC16,.12SQ,20 81 LCC16,.16SQ,25 43 LCC22,.2X.26,40/36 41 LCC24,.16SQ,20 58 LCC32,.2SQ,20 247 LCC48,.27SQ,20 131 LDCC28,.5SQ 182 LDCC44,.7SQ 136 LDCC68,1.0SQ 117 LDCC84,1.2SQ 46 MODULE(UNSPEC) 55 QFP100,.63SQ,20 166 QFP160,1.2SQ 39 QFP44,.5SQ,32 50 QFP48,.35SQ,20 97 QFP64,.47SQ,20 62 QFP64,.66SQ,32 47 QFP80,.7X.9,32 39 SOP14,.25 55 SOP16,.25 153 SOP16,.4 125 SOP20(UNSPEC) 52 SOP20,.4 166 SOP28,.4 174 SOP8,.25 157 SSOP16,.25 54 SSOP20,.25 80 SSOP28,.25 38 SSOP28,.3 42 TQFP64,.47SQ 57 TSSOP10,.19,20 83 TSSOP16,.25 55 TSSOP24,.25 39 TSSOP8,.19 117

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