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制造商型号 |
Composite Price
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 收发器数量 | 数据速率 |
电信集成电路类型
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功能数量 |
电源
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最大压摆率
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温度等级
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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筛选级别
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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IHS 制造商
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是否符合REACH标准
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HTS代码
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交付时间
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包装说明
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ECCN代码
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零件包装代码
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针数
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制造商包装代码
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RN4871-V/RM118
Microchip Technology Inc
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查询价格 |
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Active | TELECOM CIRCUIT | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | 12 weeks | |||||||||||||||||||||||||||||||||||||||
ATA8403C-6AQY-66
Microchip Technology Inc
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查询价格 |
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Active | 3 V | TELECOM CIRCUIT | 1 | OTHER | S-PDSO-G8 | 85 °C | -55 °C | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | 18 weeks | TSSOP-8 | ||||||||||||||||||||
RN4871-I/RM128
Microchip Technology Inc
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查询价格 |
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Active | 3.3 V | 10 Mbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XXMA-N16 | 85 °C | -40 °C | 16 | UNSPECIFIED | MODULE,16LEAD(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.2 mm | UNSPECIFIED | 9 mm | 11.5 mm | 2.1 mm | MICROCHIP TECHNOLOGY INC | compliant | 13 weeks | MODULE-16 | ||||||||||||||||||||
RN4870-V/RM118
Microchip Technology Inc
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查询价格 |
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Active | 3.3 V | 10 Mbps | TELECOM CIRCUIT | 1 | COMMERCIAL | R-XXMA-N33 | 70 °C | -20 °C | 33 | UNSPECIFIED | MODULE,33LEAD(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.1 mm | UNSPECIFIED | 12 mm | 22 mm | 2.4 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | 4 weeks 1 day | MODULE-33 | |||||||||||||||||||
RN4871-I/RM140
Microchip Technology Inc
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查询价格 |
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Active | 3.3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XXMA-N16 | 85 °C | -40 °C | TS 16949 | 16 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | 1.2 mm | UNSPECIFIED | 9 mm | 11.5 mm | 2.16 mm | MICROCHIP TECHNOLOGY INC | compliant | 8 weeks 6 days | MODULE-16 | |||||||||||||||||||||
RN4678-V/RM100
Microchip Technology Inc
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查询价格 |
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Active | 1.9 V | 1 Gbps | TELECOM CIRCUIT | 1 | OTHER | R-XXMA-N33 | 70 °C | -20 °C | TS 16949 | 33 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | UNSPECIFIED | 12 mm | 22 mm | 2.4 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | 4 weeks 3 days | MODULE-33 | ||||||||||||||||||||
IS1871SF-202
Microchip Technology Inc
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查询价格 |
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Active | 3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N32 | 85 °C | -40 °C | TS 16949 | 32 | UNSPECIFIED | HVQCCN | LCC32,.16SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 4 mm | 4 mm | 900 µm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | QFN-32 | |||||||||||||||||||
RN4871U-V/RM118
Microchip Technology Inc
|
查询价格 |
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Active | TELECOM CIRCUIT | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | 12 weeks | |||||||||||||||||||||||||||||||||||||||
RN4020-V/RMBEC133
Microchip Technology Inc
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查询价格 |
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Active | 3.3 V | TELECOM CIRCUIT | 1 | OTHER | R-XXMA-N24 | 85 °C | -30 °C | TS 16949 | 24 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | UNSPECIFIED | 11.5 mm | 19.5 mm | 2.3 mm | MICROCHIP TECHNOLOGY INC | compliant | 10 weeks | MODULE-24 | ||||||||||||||||||||||
CYW4343WKUBGT
Cypress Semiconductor
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查询价格 |
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Active | 1.2 V | TELECOM CIRCUIT | 1 | OTHER | R-PBGA-B74 | 70 °C | -30 °C | 74 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 400 µm | BOTTOM | 2.87 mm | 4.87 mm | 550 µm | CYPRESS SEMICONDUCTOR CORP | compliant | 8542.31.00.01 | VFBGA, | 5A992.C | ||||||||||||||||||||
SA616DK/01,118
NXP Semiconductors
|
查询价格 |
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Yes | Active | 3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G20 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 20 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.5 mm | NXP SEMICONDUCTORS | compliant | 8542.39.00.01 | LSSOP, | SSOP2 | 20 | SOT266-1 | |||||||||||
MRF24J40ME-I/RM
Microchip Technology Inc
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查询价格 |
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Yes | Active | 3.3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XDMA-N12 | 85 °C | -40 °C | TS 16949 | 12 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 2.54 mm | DUAL | 22.86 mm | 33.02 mm | 3.48 mm | MICROCHIP TECHNOLOGY INC | compliant | 11 weeks 6 days | MODULE-12 | ||||||||||||||||||||
TLK1501IRCPR
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 2.5 V | TTL | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | 6 weeks | HVFQFP, TQFP64,.47SQ | 5A991.B.1 | QFP | 64 | |||||
TLK1501IRCP
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 2.5 V | TTL | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | 1 week | HVFQFP, TQFP64,.47SQ | 5A991.B.1 | QFP | 64 | |||||
BGM13S32F512GA-V3
Silicon Laboratories Inc
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查询价格 |
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Active | TELECOM CIRCUIT | SILICON LABORATORIES INC | unknown | , | ||||||||||||||||||||||||||||||||||||||||
TLK2501IRCP
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 2.5 V | 1 | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | 1 week | HVFQFP, TQFP64,.47SQ | 5A991.B.1 | QFP | 64 | |||||
SA606DK/01,118
NXP Semiconductors
|
查询价格 |
|
Yes | Active | 3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G20 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.5 mm | NXP SEMICONDUCTORS | compliant | 8542.39.00.01 | LSSOP, | SSOP2 | 20 | SOT266-1 | |||||||||||
ATA8402C-6AQY-66
Microchip Technology Inc
|
查询价格 |
|
Yes | Active | 3 V | TELECOM CIRCUIT | 1 | 3 V | 11.6 µA | INDUSTRIAL | S-PDSO-G8 | e3 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | MICROCHIP TECHNOLOGY INC | compliant | 8542.39.00.01 | 13 weeks | LEAD FREE, TSSOP-8 | |||||||||||||
TLK2501IRCPR
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 2.5 V | 1 | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | 6 weeks | HVFQFP, TQFP64,.47SQ | 5A991.B.1 | QFP | 64 | |||||
HTRC11001T/02EE,11
NXP Semiconductors
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查询价格 |
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Yes | Active | 5 V | TELECOM CIRCUIT | 1 | 5 V | 10 µA | INDUSTRIAL | R-PDSO-G14 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 4 mm | 8.75 mm | NXP SEMICONDUCTORS | compliant | 8542.39.00.01 | SOP, SOP14,.25 | SOIC | 14 | SOT108-1 |