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制造商 (50)
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制造商型号 Composite Price
风险等级 是否无铅 是否Rohs认证 生命周期 标称供电电压 技术 电信集成电路类型 其他特性 晶体频率 破损率 负电源额定电压 功能数量 电源 最大压摆率 温度等级 JESD-30 代码 JESD-609代码 认证状态 湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度) 处于峰值回流温度下的最长时间 端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 表面贴装 端子面层 端子形式 端子节距 端子位置 宽度 长度 座面最大高度 零件包装代码
包装说明
针数
制造商包装代码
BA6566FP-E2
ROHM Semiconductor
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Yes Yes Active BIPOLAR TELEPHONE SPEECH CIRCUIT 1 2/7 V 0.125 mA OTHER R-PDSO-G26 e2 Not Qualified 60 °C -35 °C 260 10 26 PLASTIC/EPOXY HSSOP SOP32,.3,32 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH YES Tin/Copper (Sn/Cu) GULL WING 0.8 mm DUAL 5.4 mm 13.6 mm 2.11 mm SOIC HSSOP, SOP32,.3,32 24
BA8206F-E2
ROHM Semiconductor
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Yes Yes Active 24 V BIPOLAR TELEPHONE RINGER CIRCUIT 1 24 V 0.0017 mA COMMERCIAL EXTENDED R-PDSO-G8 e3/e2 Not Qualified 75 °C -25 °C 260 10 8 PLASTIC/EPOXY LSOP SOP8,.25 RECTANGULAR SMALL OUTLINE, LOW PROFILE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 4.4 mm 5 mm 1.6 mm SOIC SOP-8 8
MT88E39AS1
Microsemi Corporation
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Yes Yes Active 3 V CMOS TELEPHONE CALLING NO IDENTIFICATION CIRCUIT IT CAN ALSO OPERATE WITH 5V NOMINAL VOLTAGE 1 INDUSTRIAL R-PDSO-G16 e3 Not Qualified 85 °C -40 °C 260 30 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm SOIC SOP, 16
MT88E39ASR1
Microsemi Corporation
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Yes Yes Active 3 V CMOS TELEPHONE CALLING NO IDENTIFICATION CIRCUIT IT CAN ALSO OPERATE WITH 5V NOMINAL VOLTAGE 1 INDUSTRIAL R-PDSO-G16 e3 Not Qualified 85 °C -40 °C 260 30 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm SOIC SOP, 16
NTE1690
NTE Electronics Inc
$5.3955
Active CMOS TELEPHONE DIALER CIRCUIT 1 OTHER R-PDIP-T16 Not Qualified 60 °C -30 °C 16 PLASTIC/EPOXY RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL DIP , 16
NTE1648
NTE Electronics Inc
$1.3350
Active BIPOLAR TELEPHONE RINGER CIRCUIT 1 OTHER R-PDIP-T8 Not Qualified 65 °C -45 °C 8 PLASTIC/EPOXY RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL DIP , 8
NTE1693
NTE Electronics Inc
$4.4063
Active CMOS TELEPHONE DIALER CIRCUIT 1:2 1 OTHER R-PDIP-T16 Not Qualified 60 °C -30 °C 16 PLASTIC/EPOXY RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL DIP , 16
BA6566F-T1
ROHM Semiconductor
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Yes Yes Active TELEPHONE SPEECH CIRCUIT 1 R-PDSO-G18 e2 Not Qualified 260 10 18 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Tin/Copper (Sn/Cu) GULL WING 1.27 mm DUAL 5.4 mm 11.2 mm 1.9 mm SOIC SOP, 18
LT1684CS
Linear Technology
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No Transferred 10 V BIPOLAR TELEPHONE RINGER CIRCUIT -10 V 1 +-10 V 0.00095 mA OTHER R-PDSO-G14 e0 Not Qualified 1 125 °C 0 °C 235 20 14 PLASTIC/EPOXY SOP SOP14,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 3.9 mm 8.649 mm 1.752 mm SOIC SOP, SOP14,.25 14 S
BA6566FP-T1
ROHM Semiconductor
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Yes Yes Active TELEPHONE SPEECH CIRCUIT 1 R-PDSO-G24 e2 Not Qualified 260 10 24 PLASTIC/EPOXY HSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH YES Tin/Copper (Sn/Cu) GULL WING 0.8 mm DUAL 5.4 mm 13.6 mm 2.11 mm SOIC HSSOP, 24
BA6566F-E2
ROHM Semiconductor
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Yes Yes Active BIPOLAR TELEPHONE SPEECH CIRCUIT 1 2/7 V 0.125 mA OTHER R-PDSO-G18 e2 Not Qualified 60 °C -35 °C 260 10 18 PLASTIC/EPOXY SOP SOP18,.3 RECTANGULAR SMALL OUTLINE YES Tin/Copper (Sn/Cu) GULL WING 1.27 mm DUAL 5.4 mm 11.2 mm 1.9 mm SOIC SOP, SOP18,.3 18
TEA1062ATD-T
NXP Semiconductors
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Yes Obsolete 2.7 V BIPOLAR TELEPHONE SPEECH CIRCUIT 1 3.4 V 0.00135 mA COMMERCIAL EXTENDED R-PDSO-G16 Not Qualified 1 75 °C -25 °C 260 40 16 PLASTIC/EPOXY SOP SOP16,.25 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 3.9 mm 9.9 mm 1.75 mm SOIC SOP, SOP16,.25 16
BA6566FPE2
ROHM Semiconductor
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Yes Yes Active TELEPHONE SPEECH CKT 1 R-PDSO-G26 e3/e2 Not Qualified 260 10 26 PLASTIC/EPOXY HSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH YES TIN/TIN COPPER GULL WING 0.8 mm DUAL 5.4 mm 13.6 mm 2.11 mm SOIC HSSOP, 24
TEA1062TD-T
NXP Semiconductors
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Obsolete 2.7 V TELEPHONE SPEECH CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G16 Not Qualified 75 °C -25 °C 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 3.9 mm 9.9 mm 1.75 mm SOIC SOP, 16
935083220112
NXP Semiconductors
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Yes Yes Obsolete 2.7 V TELEPHONE SPEECH CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G16 e4 Not Qualified 1 75 °C -25 °C 260 40 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES NICKEL PALLADIUM GOLD GULL WING 1.27 mm DUAL 3.9 mm 9.9 mm 1.75 mm SOIC SOP, 16
935083220118
NXP Semiconductors
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Yes Yes Active 2.7 V TELEPHONE SPEECH CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G16 e4 Not Qualified 1 75 °C -25 °C 260 40 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES NICKEL PALLADIUM GOLD GULL WING 1.27 mm DUAL 3.9 mm 9.9 mm 1.75 mm SOIC SOP, 16
BA6566FPT1
ROHM Semiconductor
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Yes Yes Active TELEPHONE SPEECH CKT 1 R-PDSO-G26 e3/e2 Not Qualified 260 10 26 PLASTIC/EPOXY HSSOP RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH YES TIN/TIN COPPER GULL WING 0.8 mm DUAL 5.4 mm 13.6 mm 2.11 mm SOIC HSSOP, 24
BA6566F-E1
ROHM Semiconductor
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Yes Yes Active BIPOLAR TELEPHONE SPEECH CIRCUIT 1 2/7 V 0.125 mA OTHER R-PDSO-G18 e2 Not Qualified 60 °C -35 °C 260 10 18 PLASTIC/EPOXY SOP SOP18,.3 RECTANGULAR SMALL OUTLINE YES Tin/Copper (Sn/Cu) GULL WING 1.27 mm DUAL 5.4 mm 11.2 mm 1.9 mm SOIC SOP, SOP18,.3 18
BU8307CF-E2
ROHM Semiconductor
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Yes Yes Active 5 V CMOS TELEPHONE DIALER CIRCUIT SELECTABLE MAKE/BREAK RATIO 1:2 3.58 MHz 1:1.5 1 3 V 0.001 mA COMMERCIAL R-PDSO-G24 e3/e2 Not Qualified 60 °C -10 °C 260 10 24 PLASTIC/EPOXY SOP SOP24,.3 RECTANGULAR SMALL OUTLINE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 5.4 mm 15 mm 1.9 mm SOIC SOP-24 24
TEA1062AT/C4,118
NXP Semiconductors
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Yes Yes Active 2.7 V BIPOLAR TELEPHONE SPEECH CIRCUIT 1 3.4 V 0.00135 mA COMMERCIAL EXTENDED R-PDSO-G16 e4 Not Qualified 1 75 °C -25 °C 260 30 16 PLASTIC/EPOXY SOP SOP16,.25 RECTANGULAR SMALL OUTLINE YES NICKEL PALLADIUM GOLD GULL WING 1.27 mm DUAL 3.9 mm 9.9 mm 1.75 mm SOIC SOP, SOP16,.25 16
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