2-382811-1中文资料_PDF数据手册

2-382811-1

加入BOM

SHUNT, ECON, PHBRSN, BLACK

技术详情

价格 & 库存

详细参数

Source Content uid

2-382811-1

Brand Name

AMP

不含铅

符合

Active

compliant

EAR99

31 weeks

2404

0.41

0.2 inch

0.25 inch

2.498 inch

PLUG

INTERCONNECTION DEVICE

NOT APPLICABLE

FEMALE

NOT APPLICABLE

RECTANGULAR

15 mΩ

SQ PIN-SKT

25 Cycles

YES

1000000000 Ω

BLACK

GLASS FILLED POLYESTER

0.1 inch

STRAIGHT

BOARD

ONE

85 °C

-40 °C

GENERAL PURPOSE

100u inch

3 A

CSA, UL

2.54 mm

SOLDER

94V-0

文档下载

2-382811-1 TE's AMP 也适用于 2-382811-1

参考设计

(2)

Intel IMVP7 2nd Generation Core Mobile (Core i7) Power Management Reference Design

TIDA-00020: The Intel Core i7 power management design is a complete solution for the Intel™ IMVP-7 Serial VID (SVID) Power System The design features an IMVP-7 3-Phase CPU supply, a single-phase GPU Vcore supply, a 1.05VCCIO supply, and a DDR3L/DDR4 memory rail. To greatly improve power density and thermal performance, TI's 5-mm x 6mm NEXFET Power Block MOSFETs are used.

Intel IMVP7 3rd Generation Core Mobile (Core i7) Power Management Reference Design

TIDA-00021: The Intel Core i7 power management design is a complete solution for Intel IMVP-7 SVID. A GUI communication program is available along with several test points on the board to evaluate the static and dynamic performance of the CPU's DC/DC Controller. The design features an IMVP-7 3-Phase CPU supply, a 2 Phase GPU Vcore supply, a 1.05VCCIO supply, and a DDR3L/DDR4 memory rail. To greatly improve power density and thermal performance, TI's 5-mm x 6mm NEXFET Power Block MOSFETs are used.

< / 共 2 个参考设计 >

显示更多价格 & 库存吗?

苏公网安备 32059002001042号

联系我们

美国总部

61 South Fair Oaks Avenue, Suite 200

Pasadena, CA 91105, USA

苏州总部

苏州工业园区月亮湾路 15 号中新大厦 4406-4411

江苏省苏州市, 215021

邮箱：service@bom2buy.com

电话：(0512) 62988549

2-382811-1

详细参数

文档下载

参考设计

价格走势

库存走势

站内导航

友情链接

联系我们

美国总部

苏州总部

创建 BOM

确认BOM数据

上传失败

正在上传

登录

2-382811-1

详细参数

文档下载

参考设计

价格走势

库存走势

完善邮箱信息

站内导航

友情链接

联系我们

美国总部

苏州总部