型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 运营商类型 | 数据速率 | 运营商类型(2) | ISDN访问速率 | 功能数量 | 最小输出高电压 | 最大输出低电流 | 最大输出低电压 |
参照点
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最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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Source Content uid
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mfrid
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零件包装代码
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包装说明
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针数
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是否符合REACH标准
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ECCN代码
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HTS代码
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YTEOL
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Country Of Origin
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IDT82V2108PXG8
Integrated Device Technology Inc
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查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 85 °C | -40 °C | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | IDT82V2108PXG8 | 2068 | QFP | PLASTIC, QFP-128 | 128 | compliant | EAR99 | 8542.39.00.01 | |||||||||||||||
XRT86VX38IB329
MaxLinear Inc
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查询价格和库存 |
|
No | Active | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B329 | Not Qualified | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 329 | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 17 mm | 17 mm | 1.71 mm | 71690464 | FBGA, | compliant | 8542.39.00.01 | ||||||||||||||||||||
PEF22552PG
Infineon Technologies AG
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查询价格和库存 |
|
Transferred | 1.8 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B160 | Not Qualified | 85 °C | -40 °C | 160 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 15 mm | 15 mm | 1.6 mm | PEF22552PG | 2065 | BGA | LBGA, | 160 | unknown | 8542.39.00.01 | ||||||||||||||||||||||
XRT86VX38IB256
MaxLinear Inc
|
查询价格和库存 |
|
No | Active | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.78 mm | 71690464 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||||
XRT86VL30IV-F
MaxLinear Inc
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查询价格和库存 |
|
Yes | Obsolete | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 128 | PLASTIC/EPOXY | LFQFP | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 1.6 mm | 71690464 | LFQFP, | compliant | 8542.39.00.01 | 0 | |||||||||||||||||
PEB2054
Siemens
|
查询价格和库存 |
|
Transferred | 5 V | CMOS | 1 | 9.5 mA | COMMERCIAL | TIME SLOT ASSIGNER | S-PQCC-J44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | SQUARE | CHIP CARRIER | YES | J BEND | QUAD | 2403 | LCC | , | 44 | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||
PEF22552P
Infineon Technologies AG
|
查询价格和库存 |
|
Transferred | 1.8 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B160 | e1 | Not Qualified | 85 °C | -40 °C | 160 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 15 mm | 15 mm | 1.6 mm | PEF22552P | 2065 | BGA | LBGA, | 160 | unknown | 8542.39.00.01 | ||||||||||||||||||||
PEB2055
Siemens
|
查询价格和库存 |
|
Transferred | 5 V | CMOS | 1 | 9.5 mA | COMMERCIAL | TIME SLOT ASSIGNER | S-PQCC-J44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | SQUARE | CHIP CARRIER | YES | J BEND | QUAD | 2403 | LCC | , | 44 | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||
MT9076BPR1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Transferred | 3.3 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | 98 µA | INDUSTRIAL | FRAMER | S-PQCC-J68 | e3 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | 2192 | LCC | LEAD FREE, PLASTIC, MS-018AE, LCC-68 | 68 | compliant | 8542.39.00.01 | ||||||||||||||||
TP3404V/NOPB
Texas Instruments
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查询价格和库存 |
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Yes | Obsolete | 5 V | 144 Mbps | BASIC | 1 | 2.4 V | 1 mA | 400 mV | U | 75 mA | COMMERCIAL | TIME SLOT ASSIGNER | S-PQCC-J28 | e3 | Not Qualified | 3 | 70 °C | 245 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 11.43 mm | 11.43 mm | 4.57 mm | TP3404V/NOPB | 2477 | QLCC | LCC-28 | 28 | compliant | 8542.39.00.01 | 0 | ||||||||
FLIXF3204BEC0SE001
Cortina Systems Inc
|
查询价格和库存 |
|
Transferred | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | 2569982 | BGA | BGA, | 256 | compliant | 8542.39.00.01 | ||||||||||||||||||||||
DS21Q59LN+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQFP-G100 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2164 | QFP | 14 X 14 MM, ROHS COMPLIANT, LQFP-100 | 100 | compliant | EAR99 | 8542.39.00.01 | 3 | Japan, Mainland China, Malaysia, Philipp... more | ||||||||||||
FLIXF3204BEC0SE001
Intel Corporation
|
查询价格和库存 |
|
Transferred | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | 2071 | BGA | BGA, | 256 | unknown | 8542.39.00.01 | ||||||||||||||||||||||
FLIXF3204BEC0SE000
Cortina Systems Inc
|
查询价格和库存 |
|
Transferred | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | 2569982 | BGA | BGA, | 256 | compliant | 8542.39.00.01 | ||||||||||||||||||||||
PEF2035-N
Siemens
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查询价格和库存 |
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Transferred | 5 V | 1 | FRAMER | S-PQCC-J44 | Not Qualified | 44 | PLASTIC/EPOXY | SQUARE | CHIP CARRIER | YES | J BEND | QUAD | 2403 | , | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||||||||
FLIXF3204BEC0SE000
Inphi Corporation
|
查询价格和库存 |
|
Transferred | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | 116151958 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||||||||
FLIXF3204BEC0SE001
Inphi Corporation
|
查询价格和库存 |
|
Transferred | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | 116151958 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||||||||
FLIXF3204BEC0SE000
Intel Corporation
|
查询价格和库存 |
|
Transferred | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.8 mm | 2071 | BGA | BGA, | 256 | unknown | 8542.39.00.01 | ||||||||||||||||||||||
DS2155GN+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B100 | e1 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 10 mm | 10 mm | 2164 | BGA | 10 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, CSBGA-100 | 100 | compliant | 8542.39.00.01 | ||||||||||||||||||||
DS26514GN+
Maxim Integrated Products
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查询价格和库存 |
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Yes | Yes | Transferred | 1.8 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | 250 µA | INDUSTRIAL | FRAMER | S-PBGA-B256 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | 2164 | BGA | BGA, BGA256,16X16,40 | 256 | compliant | EAR99 | 8542.39.00.01 | 3 | Japan, Mainland China, Malaysia, Philipp... more |