数字传输控制器封装型号_数字传输控制器厂家价格-bom2buy

型号

型号						Most Relevant			Technical					Compliance			Operating Conditions				Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	运营商类型（2）	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	HTS代码	Country Of Origin	YTEOL	ECCN代码
MT9074APR1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V		CEPT PCM-30/E-1	T-1(DS1)	1	200 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C		68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm	2192	LCC	LEAD FREE, PLASTIC, MS-018AE, LCC-68	68	compliant	8542.39.00.01
PM4358-NGI Microsemi Corporation		查询价格和库存			Yes	Transferred	1.8 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B256			3	85 °C	-40 °C		256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM				2192		BGA,		compliant	8542.39.00.01
MT8976AP Microsemi Corporation		查询价格和库存		No	No	Transferred	5 V	CMOS			1	10 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e0	Not Qualified		85 °C	-40 °C		44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD				2192	LPCC	QCCJ, LDCC44,.7SQ	44	unknown	8542.39.00.01
MT9074AP1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V		CEPT PCM-30/E-1	T-1(DS1)	1	200 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C		68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm	2192	LCC	LEAD FREE, PLASTIC, MS-018AE, LCC-68	68	compliant	8542.39.00.01
L-T-8105---SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C			208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	QFP	FQFP, QFP208,1.2SQ,20	208	compliant	8542.39.00.01
L-T-8105---BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C		217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA	BGA, BGA217,17X17,50	217	unknown	8542.39.00.01
L-T-8100A--BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C		217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA	BGA, BGA217,17X17,50	217	compliant	8542.39.00.01
L-T-8102---SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C			208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	QFP	FQFP, QFP208,1.2SQ,20	208	compliant	8542.39.00.01
L-T-8100A--SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C			208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	QFP	FQFP, QFP208,1.2SQ,20	208	compliant	8542.39.00.01
L-T-8102---BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C		217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA	BGA, BGA217,17X17,50	217	unknown	8542.39.00.01
BT8390KPF Synaptics Incorporated		查询价格和库存			No	Active	5 V	CMOS			1	175 mA	COMMERCIAL	FRAMER	R-PQFP-G128	e0	Not Qualified		70 °C			128	PLASTIC/EPOXY	QFP	QFP128,.55X.93,20	RECTANGULAR	FLATPACK	YES	Tin/Lead (Sn/Pb)	GULL WING	500 µm	QUAD				223327797		QFP, QFP128,.55X.93,20		compliant	8542.39.00.01
CN8394KTF Synaptics Incorporated		查询价格和库存			No	Active	3.3 V	CMOS			16	90 mA	COMMERCIAL	FRAMER	R-PQFP-G128	e0	Not Qualified		70 °C			128	PLASTIC/EPOXY	QFP	QFP128,.63X.87,20	RECTANGULAR	FLATPACK	YES	Tin/Lead (Sn/Pb)	GULL WING	500 µm	QUAD				223327797		QFP, QFP128,.63X.87,20		compliant	8542.39.00.01
CN8398KBG Synaptics Incorporated		查询价格和库存			No	Active	3.3 V	CMOS			16	155 mA	COMMERCIAL	FRAMER	S-XBGA-B272	e0	Not Qualified		70 °C			272	CERAMIC	BGA	BGA272,20X20,50	SQUARE	GRID ARRAY	YES	Tin/Lead (Sn/Pb)	BALL	1.27 mm	BOTTOM				223327797		BGA, BGA272,20X20,50		compliant	8542.39.00.01
BT8330EPF Synaptics Incorporated		查询价格和库存			No	Active	5 V	CMOS			1	175 mA	INDUSTRIAL	FRAMER	S-PQFP-G80	e0	Not Qualified		85 °C	-40 °C		80	PLASTIC/EPOXY	QFP	QFP80,.7SQ	SQUARE	FLATPACK	YES	Tin/Lead (Sn/Pb)	GULL WING	635 µm	QUAD				223327797		QFP, QFP80,.7SQ		compliant	8542.39.00.01
MT9079AP Microsemi Corporation		查询价格和库存			No	Transferred	5 V	CMOS			1	7 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e0	Not Qualified		85 °C	-40 °C		44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD				2192	LPCC	QCCJ, LDCC44,.7SQ	44	unknown	8542.39.00.01
MT8977AP Microsemi Corporation		查询价格和库存		No	No	Transferred	5 V	CMOS			1	10 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e0	Not Qualified		85 °C	-40 °C		44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD				2192	LPCC		44	unknown	8542.39.00.01
DS3173+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	449 µA	COMMERCIAL	FRAMER	S-PBGA-B400	e1	Not Qualified		70 °C			400	PLASTIC/EPOXY	BGA	BGA400,20X20,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	27 mm	27 mm	2.54 mm	2164	BGA	BGA, BGA400,20X20,50	400	compliant	8542.39.00.01	Japan, Mainland China, Malaysia, Philipp... more	9
PM5326-FEI Microchip Technology Inc		查询价格和库存				Active	1.2 V				1			FRAMER	S-PBGA-B1292							1292	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM				2188		FCBGA-1292		compliant	8542.31.00.01			5A991.B
DS3173N+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	449 µA	INDUSTRIAL	FRAMER	S-PBGA-B400	e1	Not Qualified		85 °C	-40 °C		400	PLASTIC/EPOXY	BGA	BGA400,20X20,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	27 mm	27 mm	2.54 mm	2164	BGA	27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400	400	compliant	8542.39.00.01
DS26518GN Maxim Integrated Products		查询价格和库存		No	No	Transferred	1.8 V		CEPT PCM-30/E-1	T-1(DS1)	1	450 µA	INDUSTRIAL	FRAMER	S-PBGA-B256		Not Qualified	3	85 °C	-40 °C	245	256	PLASTIC/EPOXY	BGA	BGA256,16X16,40	SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.76 mm	2164	BGA	BGA, BGA256,16X16,40	256	not_compliant	8542.39.00.01	Japan, Mainland China, Malaysia, Philipp... more	3	EAR99

型号						Most Relevant			Technical					Compliance			Operating Conditions				Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	运营商类型（2）	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	HTS代码	Country Of Origin	YTEOL	ECCN代码
MT9074APR1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V		CEPT PCM-30/E-1	T-1(DS1)	1	200 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C		68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm	2192	LCC	LEAD FREE, PLASTIC, MS-018AE, LCC-68	68	compliant	8542.39.00.01
PM4358-NGI Microsemi Corporation		查询价格和库存			Yes	Transferred	1.8 V	CMOS			1		INDUSTRIAL	FRAMER	S-PBGA-B256			3	85 °C	-40 °C		256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM				2192		BGA,		compliant	8542.39.00.01
MT8976AP Microsemi Corporation		查询价格和库存		No	No	Transferred	5 V	CMOS			1	10 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e0	Not Qualified		85 °C	-40 °C		44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD				2192	LPCC	QCCJ, LDCC44,.7SQ	44	unknown	8542.39.00.01
MT9074AP1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V		CEPT PCM-30/E-1	T-1(DS1)	1	200 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C		68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm	2192	LCC	LEAD FREE, PLASTIC, MS-018AE, LCC-68	68	compliant	8542.39.00.01
L-T-8105---SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C			208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	QFP	FQFP, QFP208,1.2SQ,20	208	compliant	8542.39.00.01
L-T-8105---BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C		217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA	BGA, BGA217,17X17,50	217	unknown	8542.39.00.01
L-T-8100A--BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C		217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA	BGA, BGA217,17X17,50	217	compliant	8542.39.00.01
L-T-8102---SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C			208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	QFP	FQFP, QFP208,1.2SQ,20	208	compliant	8542.39.00.01
L-T-8100A--SC4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e6	Not Qualified		70 °C			208	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	YES	TIN BISMUTH	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	2145	QFP	FQFP, QFP208,1.2SQ,20	208	compliant	8542.39.00.01
L-T-8102---BAL4-DB LSI Corporation		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	275 µA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e1	Not Qualified		85 °C	-40 °C		217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	2145	BGA	BGA, BGA217,17X17,50	217	unknown	8542.39.00.01
BT8390KPF Synaptics Incorporated		查询价格和库存			No	Active	5 V	CMOS			1	175 mA	COMMERCIAL	FRAMER	R-PQFP-G128	e0	Not Qualified		70 °C			128	PLASTIC/EPOXY	QFP	QFP128,.55X.93,20	RECTANGULAR	FLATPACK	YES	Tin/Lead (Sn/Pb)	GULL WING	500 µm	QUAD				223327797		QFP, QFP128,.55X.93,20		compliant	8542.39.00.01
CN8394KTF Synaptics Incorporated		查询价格和库存			No	Active	3.3 V	CMOS			16	90 mA	COMMERCIAL	FRAMER	R-PQFP-G128	e0	Not Qualified		70 °C			128	PLASTIC/EPOXY	QFP	QFP128,.63X.87,20	RECTANGULAR	FLATPACK	YES	Tin/Lead (Sn/Pb)	GULL WING	500 µm	QUAD				223327797		QFP, QFP128,.63X.87,20		compliant	8542.39.00.01
CN8398KBG Synaptics Incorporated		查询价格和库存			No	Active	3.3 V	CMOS			16	155 mA	COMMERCIAL	FRAMER	S-XBGA-B272	e0	Not Qualified		70 °C			272	CERAMIC	BGA	BGA272,20X20,50	SQUARE	GRID ARRAY	YES	Tin/Lead (Sn/Pb)	BALL	1.27 mm	BOTTOM				223327797		BGA, BGA272,20X20,50		compliant	8542.39.00.01
BT8330EPF Synaptics Incorporated		查询价格和库存			No	Active	5 V	CMOS			1	175 mA	INDUSTRIAL	FRAMER	S-PQFP-G80	e0	Not Qualified		85 °C	-40 °C		80	PLASTIC/EPOXY	QFP	QFP80,.7SQ	SQUARE	FLATPACK	YES	Tin/Lead (Sn/Pb)	GULL WING	635 µm	QUAD				223327797		QFP, QFP80,.7SQ		compliant	8542.39.00.01
MT9079AP Microsemi Corporation		查询价格和库存			No	Transferred	5 V	CMOS			1	7 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e0	Not Qualified		85 °C	-40 °C		44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD				2192	LPCC	QCCJ, LDCC44,.7SQ	44	unknown	8542.39.00.01
MT8977AP Microsemi Corporation		查询价格和库存		No	No	Transferred	5 V	CMOS			1	10 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e0	Not Qualified		85 °C	-40 °C		44	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD				2192	LPCC		44	unknown	8542.39.00.01
DS3173+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	449 µA	COMMERCIAL	FRAMER	S-PBGA-B400	e1	Not Qualified		70 °C			400	PLASTIC/EPOXY	BGA	BGA400,20X20,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	27 mm	27 mm	2.54 mm	2164	BGA	BGA, BGA400,20X20,50	400	compliant	8542.39.00.01	Japan, Mainland China, Malaysia, Philipp... more	9
PM5326-FEI Microchip Technology Inc		查询价格和库存				Active	1.2 V				1			FRAMER	S-PBGA-B1292							1292	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM				2188		FCBGA-1292		compliant	8542.31.00.01			5A991.B
DS3173N+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	3.3 V				1	449 µA	INDUSTRIAL	FRAMER	S-PBGA-B400	e1	Not Qualified		85 °C	-40 °C		400	PLASTIC/EPOXY	BGA	BGA400,20X20,50	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1.27 mm	BOTTOM	27 mm	27 mm	2.54 mm	2164	BGA	27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400	400	compliant	8542.39.00.01
DS26518GN Maxim Integrated Products		查询价格和库存		No	No	Transferred	1.8 V		CEPT PCM-30/E-1	T-1(DS1)	1	450 µA	INDUSTRIAL	FRAMER	S-PBGA-B256		Not Qualified	3	85 °C	-40 °C	245	256	PLASTIC/EPOXY	BGA	BGA256,16X16,40	SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.76 mm	2164	BGA	BGA, BGA256,16X16,40	256	not_compliant	8542.39.00.01	Japan, Mainland China, Malaysia, Philipp... more	3	EAR99

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