型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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Source Content uid
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mfrid
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包装说明
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是否符合REACH标准
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HTS代码
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YTEOL
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零件包装代码
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针数
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LMC567CN/NOPB
National Semiconductor Corporation
|
查询价格和库存 |
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Yes | Transferred | 5 V | CMOS | 1 | 1.3 mA | OTHER | TONE DECODER CIRCUIT | R-PDIP-T8 | e3 | Not Qualified | 1 | 125 °C | -25 °C | 260 | 40 | 8 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | Matte Tin (Sn) | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.817 mm | 5.08 mm | LMC567CN/NOPB | 2216 | PLASTIC, DIP-8 | compliant | 8542.39.00.01 | |||||||
MT8870DSR1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 5 V | CMOS | 1 | 9 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | 2188 | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | compliant | 24.9 | |||||||||
MT8870DNR1
Microchip Technology Inc
|
查询价格和库存 |
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Yes | Active | 5 V | CMOS | 1 | 9 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | 2188 | 5.30 MM, LEAD FREE, MO-150AE, SSOP-20 | compliant | 24.9 | ||||||||||
MT8888CS1
Microchip Technology Inc
|
查询价格和库存 |
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Yes | Active | 5 V | CMOS | 1 | 10 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | 2188 | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | compliant | 24.9 | ||||||||||
MT8880CSR1
Microchip Technology Inc
|
查询价格和库存 |
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Yes | Active | 5 V | CMOS | 1 | 11 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | 2188 | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | compliant | 24.9 | ||||||||||
MT8880CS1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 5 V | CMOS | 1 | 10 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | 2188 | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | compliant | 24.9 | ||||||||||
MT8870DS1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 5 V | CMOS | 1 | 9 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2188 | compliant | 24.9 | |||||||||||||
MT88L70AS1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 3 V | CMOS | 1 | 5.5 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | 2188 | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | compliant | 24.9 | ||||||||||
MT88L70ASR1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 3 V | CMOS | 1 | 5.5 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | 2188 | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | compliant | 24.9 | ||||||||||
BU8871F-E2
ROHM Semiconductor
|
查询价格和库存 |
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Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 µA | COMMERCIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 70 °C | -10 °C | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | SOP18,.3 | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOP, SOP18,.3 | compliant | 8542.39.00.01 | SOIC | 18 | |||||
MT8889CSR1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 5 V | CMOS | 1 | 11 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | 2188 | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | compliant | 24.9 | ||||||||||
MT88L70ANR1
Microchip Technology Inc
|
查询价格和库存 |
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Yes | Active | 3 V | CMOS | 1 | 5.5 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | 2188 | 5.30 MM, LEAD FREE, MO-150AE, SSOP-20 | compliant | 24.9 | ||||||||||
MT88L70AN1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 3 V | CMOS | 1 | 5.5 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | 2188 | 5.30 MM, LEAD FREE, MO-150AE, SSOP-20 | compliant | 24.9 | ||||||||||
BU8872FS-T2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 4.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | 2363 | LSSOP, | compliant | 8542.39.00.01 | SOIC | 16 | ||||||||||
BU8872FSE1
ROHM Semiconductor
|
查询价格和库存 |
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Yes | Yes | Active | 5 V | 1 | DTMF SIGNALING CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | 2363 | LSSOP, | unknown | SOIC | 16 | ||||||||||||
BU8872FSE2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | DTMF SIGNALING CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | 2363 | LSSOP, | unknown | SOIC | 16 | ||||||||||||
BU8872FS-E1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 4.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | 2363 | SSOP-16 | compliant | 8542.39.00.01 | SOIC | 16 | ||||||||||
BU8872FST1
ROHM Semiconductor
|
查询价格和库存 |
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Yes | Yes | Active | 5 V | 1 | DTMF SIGNALING CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | 2363 | LSSOP, | unknown | SOIC | 16 | ||||||||||||
BU8872FST2
ROHM Semiconductor
|
查询价格和库存 |
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Yes | Yes | Active | 5 V | 1 | DTMF SIGNALING CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | 2363 | SSOP-16 | unknown | SOIC | 16 | ||||||||||||
BU8872FS-T1
ROHM Semiconductor
|
查询价格和库存 |
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Yes | Yes | Active | 5 V | 1 | 4.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | 2363 | LSSOP, | compliant | 8542.39.00.01 | SOIC | 16 |