型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 其他特性 | 破损率 | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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mfrid
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零件包装代码
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包装说明
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针数
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是否符合REACH标准
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HTS代码
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Source Content uid
|
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BA6566F-T1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP-18 | 18 | compliant | 8542.39.00.01 | ||||||||||||
BA6566FP-T1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSOP-24 | 24 | compliant | 8542.39.00.01 | ||||||||||||
BA8206F-E1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 24 V | BIPOLAR | 1 | 1.7 µA | OTHER | TELEPHONE RINGER CIRCUIT | R-PDSO-G8 | e3/e2 | Not Qualified | 70 °C | -25 °C | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2363 | SOIC | LSOP, SOP8,.25 | 8 | compliant | 8542.39.00.01 | |||||
PCD3332-1T
NXP Semiconductors
|
查询价格和库存 |
|
Active | SELECTABLE MAKE/BREAK RATIO 2:1 | 3:2 | 1 | OTHER | TELEPHONE MULTIFUNCTION CIRCUIT | R-PDSO-G28 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 17.9 mm | 2.65 mm | 2245 | SOP, | unknown | 8542.39.00.01 | PCD3332-1T | ||||||||||||||
BA8206F-T1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE RINGER CIRCUIT | R-PDSO-G8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2363 | SOIC | SOP-8 | 8 | compliant | 8542.39.00.01 | ||||||||||||
PCD3332-1T-T
NXP Semiconductors
|
查询价格和库存 |
|
Active | SELECTABLE MAKE/BREAK RATIO 2:1 | 3:2 | 1 | OTHER | TELEPHONE MULTIFUNCTION CIRCUIT | R-PDSO-G28 | e4 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 7.5 mm | 17.9 mm | 2.65 mm | 2245 | SOIC | SOP, | 28 | unknown | 8542.39.00.01 | PCD3332-1T-T | ||||||||||
BU8307CF-T1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | SELECTABLE MAKE/BREAK RATIO 1:2 | 1:1.5 | 1 | TELEPHONE DIALER CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 15 mm | 1.9 mm | 2363 | SOIC | SOP-24 | 24 | compliant | 8542.39.00.01 | |||||||||
BA6566FPE2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSSOP, | 24 | unknown | |||||||||||||
BA8206FE2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE RINGER CKT | R-PDSO-G8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2363 | SOIC | LSOP, | 8 | unknown | |||||||||||||
TEA1062/C4/M1,112
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Yes | Active | 2.7 V | 1 | COMMERCIAL EXTENDED | TELEPHONE SPEECH CIRCUIT | R-PDIP-T16 | e4 | Not Qualified | 1 | 75 °C | -25 °C | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | NICKEL PALLADIUM GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 38.1 mm | 4.32 mm | 2245 | DIP | DIP, | 16 | compliant | 8542.39.00.01 | TEA1062/C4/M1,112 | ||||||||
BA6566FT2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | unknown | |||||||||||||
BA6566FT1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | unknown | |||||||||||||
BA6566FP-E1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | BIPOLAR | 1 | 125 µA | OTHER | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 60 °C | -35 °C | 260 | 10 | 24 | PLASTIC/EPOXY | HSSOP | SOP32,.3,32 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSOP-24 | 24 | compliant | 8542.39.00.01 | ||||||
BA6566FE1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | unknown | |||||||||||||
BA6566F-T2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | compliant | 8542.39.00.01 | ||||||||||||
BA6566FP-T2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSSOP, | 24 | compliant | 8542.39.00.01 | ||||||||||||
BA6566FPT1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSSOP, | 24 | unknown | |||||||||||||
BA6566FPT2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | HSSOP, | 24 | unknown | |||||||||||||
BA6566FE2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | SOIC | SOP, | 18 | unknown | |||||||||||||
BA6566FPE1
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 1 | TELEPHONE SPEECH CKT | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | SOIC | POWER, HSOP-24 | 24 | unknown |