型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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位大小 | 速度 | ROM(单词) | RAM(字节) | RAM(字数) | CPU系列 | 总线兼容性 | 外部数据总线宽度 | 地址总线宽度 | 最大时钟频率 | I/O 线路数量 |
表面贴装
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标称供电电压 |
uPs/uCs/外围集成电路类型
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技术 | 其他特性 | 边界扫描 | 格式 | 集成缓存 | 低功率模式 |
ROM可编程性
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最大压摆率
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最大供电电压
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最小供电电压
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温度等级
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JESD-30 代码 |
认证状态
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JESD-609代码 |
湿度敏感等级
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最高工作温度
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最低工作温度
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峰值回流温度(摄氏度)
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筛选级别
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处于峰值回流温度下的最长时间
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端子数量
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封装主体材料
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封装代码
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封装等效代码
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封装形状
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封装形式
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端子面层
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端子形式
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端子节距
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端子位置
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座面最大高度
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宽度
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长度 |
Source Content uid
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mfrid
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零件包装代码
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包装说明
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针数
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是否符合REACH标准
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ECCN代码
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HTS代码
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YTEOL
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Date Of Intro
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Country Of Origin
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CC1111F32RSP
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | YES | SoC | CMOS | OTHER | S-PQCC-N36 | Not Qualified | e4 | 3 | 85 °C | 260 | 30 | 36 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 900 µm | 6 mm | 6 mm | CC1111F32RSP | 2477 | QFN | QFN-36 | 36 | compliant | 5A992.C | 8542.31.00.01 | 15 | ||||||||||||||||||||||||||||
MCIMX6Y1DVK05AA
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | SoC | CMOS | 1.5 V | 1.275 V | OTHER | S-PBGA-B272 | 3 | 95 °C | 260 | 40 | 272 | PLASTIC/EPOXY | LFBGA | BGA272,17X17,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1.23 mm | 9 mm | 9 mm | MCIMX6Y1DVK05AA | 2245 | MAPBGA-272 | compliant | 5A992 | 8542.31.00.01 | 2016-10-10 | |||||||||||||||||||||||||||||||
MCIMX356AJQ5C
NXP Semiconductors
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查询价格和库存 |
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Yes | Active | YES | 1.8 V | SoC | CMOS | 1.47 V | 1.33 V | INDUSTRIAL | S-PBGA-B400 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | AEC-Q100 | 40 | 400 | PLASTIC/EPOXY | LFBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 17 mm | 17 mm | MCIMX356AJQ5C | 2245 | MABGA-400 | compliant | 5A992.C | 8542.31.00.01 | 5 | Mainland China | ||||||||||||||||||||||||
MCIMX515CJM6C
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | 1 V | SoC | CMOS | 1.1 V | 950 mV | OTHER | S-PBGA-B529 | Not Qualified | e1 | 3 | 85 °C | -20 °C | 260 | 40 | 529 | PLASTIC/EPOXY | LFBGA | BGA529,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 19 mm | 19 mm | MCIMX515CJM6C | 2245 | MAPBGA-529 | compliant | 5A992.C | 8542.31.00.01 | 5 | Mainland China | |||||||||||||||||||||||||
MCIMX6G2DVK05AB
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 528 MHz | 16 | 26 | YES | MULTIFUNCTION PERIPHERAL | CMOS | YES | FIXED POINT | YES | YES | 1.3 V | 1.15 V | OTHER | S-PBGA-B272 | 3 | 95 °C | 260 | 40 | 272 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1.23 mm | 9 mm | 9 mm | MCIMX6G2DVK05AB | 2245 | BGA-272 | compliant | 5A992.C | 8542.31.00.01 | 11.81 | 2017-05-31 | Mainland China | |||||||||||||||||||||||
CY8C6347FMI-BLD43T
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | YES | 1.1 V | Bluetooth SoC | CMOS | R-PBGA-B104 | e1 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 104 | PLASTIC/EPOXY | VFBGA | BGA104,9X14,14 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 350 µm | BOTTOM | 650 µm | 3.841 mm | 5 mm | 2065 | compliant | |||||||||||||||||||||||||||||||||||
CY8C4145LQI-PS433
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | PSoC | e4 | 3 | NOT SPECIFIED | NOT SPECIFIED | Nickel/Palladium/Gold (Ni/Pd/Au) | 2065 | compliant | 8542.31.00.01 | 9.47 | |||||||||||||||||||||||||||||||||||||||||||||||||||
MCIMX253DJM4A
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | 1.45 V | SoC | CMOS | ALSO REQUIRES 3.3 V I/O SUPPLY | 1.52 V | 1.38 V | OTHER | S-PBGA-B400 | Not Qualified | e1 | 3 | 70 °C | -20 °C | 260 | 40 | 400 | PLASTIC/EPOXY | LFBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 17 mm | 17 mm | MCIMX253DJM4A | 2245 | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400 | compliant | 5A992.C | 8542.31.00.01 | 5 | Mainland China, Malaysia | ||||||||||||||||||||||||
CY8C5888AXI-LP096
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 32768 | I2C; USB | 33 MHz | 62 | YES | 1.8 V | CMOS | YES | 5.5 V | 1.71 V | INDUSTRIAL | S-PQFP-G100 | Not Qualified | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Pure Tin (Sn) | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 2065 | TQFP-100 | compliant | 8.89 | ||||||||||||||||||||||||||
CY8C5888LTI-LP097
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 32768 | I2C; USB | 33 MHz | 38 | YES | 1.8 V | CMOS | YES | 5.5 V | 1.71 V | INDUSTRIAL | S-XQCC-N68 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 400 µm | QUAD | 1 mm | 8 mm | 8 mm | 2065 | QFN-68 | compliant | 8.89 | |||||||||||||||||||||||||
MCIMX6Y1DVM05AA
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | SoC | CMOS | 1.5 V | 1.275 V | OTHER | S-PBGA-B289 | 3 | 95 °C | 260 | 40 | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.32 mm | 14 mm | 14 mm | MCIMX6Y1DVM05AA | 2245 | MABGA-289 | compliant | 5A992 | 8542.31.00.01 | 2016-10-10 | |||||||||||||||||||||||||||||||
CY8C21434-24LTXI
Cypress Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Transferred | YES | 5 V | PROGRAMMABLE SoC | CMOS | ALSO OPERATES AT 2.7V AND 3.3V SUPPLY | 5.25 V | 4.75 V | INDUSTRIAL | S-XQCC-N32 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 40 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 1 mm | 5 mm | 5 mm | 1903 | QFN | QFN-32 | 32 | compliant | EAR99 | 8542.31.00.01 | ||||||||||||||||||||||||
CY8C21334-24PVXIT
Cypress Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Transferred | YES | 5 V | PROGRAMMABLE SoC | CMOS | ALSO OPERATES AT 3.3V SUPPLY | 5.25 V | 4.75 V | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 20 | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 3 mm | 5.3 mm | 7.2 mm | 1903 | SSOP | SSOP-20 | 20 | compliant | EAR99 | 8542.31.00.01 | ||||||||||||||||||||||||
CY8C5888AXQ-LP096
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 32768 | I2C; I2S, LIN; PS/2; SPI, USB | 33 MHz | 62 | YES | 3.3 V | CMOS | YES | 5.5 V | 1.71 V | INDUSTRIAL | S-PQFP-G100 | Not Qualified | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Pure Tin (Sn) | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 2065 | TQFP-100 | compliant | 8.89 | ||||||||||||||||||||||||||
MCIMX27MOP4A
Freescale Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Transferred | YES | 1.45 V | SoC | CMOS | ALSO OPERATES 1.3V AT 266MHZ; UNAVAILABLE FOR IMPORT OR SALE IN US | 1.52 V | 1.38 V | INDUSTRIAL | S-PBGA-B473 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 473 | PLASTIC/EPOXY | LFBGA | BGA473,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 800 µm | BOTTOM | 1.54 mm | 19 mm | 19 mm | MCIMX27MOP4A | 1999 | BGA | 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473 | 473 | compliant | 5A002.A | 8542.31.00.01 | ||||||||||||||||||||||||
CY8C21334-24PVXI
Cypress Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Transferred | YES | 5 V | PROGRAMMABLE SoC | CMOS | ALSO OPERATES AT 2.7V AND 3.3V SUPPLY | 5.25 V | 4.75 V | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 20 | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 2 mm | 5.3 mm | 7.2 mm | 1903 | SSOP | SSOP-20 | 20 | compliant | EAR99 | 8542.31.00.01 | ||||||||||||||||||||||||
CY8C5868LTI-LP038
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 32768 | I2C; USB; PS/2 | 33 MHz | 48 | YES | 1.8 V | CMOS | YES | 5.5 V | 1.71 V | INDUSTRIAL | S-XQCC-N68 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 400 µm | QUAD | 1 mm | 8 mm | 8 mm | 2065 | QFN-68 | compliant | 8.89 | |||||||||||||||||||||||||
CY8C29466-24PVXI
Cypress Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Transferred | 8 | 24 MHz | 32768 | 2048 | 1024 | M8C | 24 MHz | 24 | YES | 5 V | CMOS | ALSO OPERATES AT 3V SUPPLY | NO | FLASH | 14 mA | 5.25 V | 4.75 V | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 20 | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 2 mm | 5.3 mm | 10.2 mm | 1903 | SSOP | SSOP-28 | 28 | compliant | EAR99 | 8542.31.00.01 | ||||||||||||||
MCIMX6G1CVM05AB
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | SoC | CMOS | 1.3 V | 1.15 V | INDUSTRIAL | S-PBGA-B289 | e1 | 3 | 105 °C | -40 °C | 260 | 40 | 289 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.32 mm | 14 mm | 14 mm | MCIMX6G1CVM05AB | 2245 | BGA-289 | compliant | 5A992.C | 8542.31.00.01 | 11.81 | Mainland China | ||||||||||||||||||||||||||||
CY8C29466-24PVXIT
Cypress Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Transferred | 8 | 24 MHz | 32768 | 2048 | 1024 | M8C | 24 MHz | 24 | YES | 5 V | CMOS | ALSO OPERATES AT 3V SUPPLY | NO | FLASH | 14 mA | 5.25 V | 4.75 V | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 20 | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 2 mm | 5.3 mm | 10.2 mm | 1903 | SSOP | SSOP-28 | 28 | compliant | EAR99 | 8542.31.00.01 |