型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
生命周期
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总线兼容性 | 外部数据总线宽度 | 地址总线宽度 |
表面贴装
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标称供电电压 |
uPs/uCs/外围集成电路类型
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技术 | 其他特性 | 边界扫描 | 低功率模式 | 内存组织 | 区块数量 |
最大压摆率
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最大供电电压
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最小供电电压
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温度等级
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JESD-30 代码 |
认证状态
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最高工作温度
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最低工作温度
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端子数量
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封装主体材料
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封装代码
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封装等效代码
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封装形状
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封装形式
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端子形式
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端子节距
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端子位置
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座面最大高度
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宽度
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长度 |
mfrid
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包装说明
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是否符合REACH标准
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HTS代码
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Country Of Origin
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YTEOL
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零件包装代码
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针数
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INTEL-5000V
Intel Corporation
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查询价格和库存 |
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Active | YES | CMOS | S-PBGA-B1432 | Not Qualified | 1432 | PLASTIC/EPOXY | BGA | BGA1432,38X38,40 | SQUARE | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA1432,38X38,40 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
82845PE
Intel Corporation
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查询价格和库存 |
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Active | YES | 1.5 V | CMOS | S-PBGA-B478 | Not Qualified | 478 | PLASTIC/EPOXY | BGA | BGA478,37X37,40 | SQUARE | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA478,37X37,40 | compliant | 8542.31.00.01 | |||||||||||||||||||||||
82845GE
Intel Corporation
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查询价格和库存 |
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Active | YES | 1.5 V | CMOS | S-PBGA-B478 | Not Qualified | 478 | PLASTIC/EPOXY | BGA | BGA478,37X37,40 | SQUARE | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA478,37X37,40 | compliant | 8542.31.00.01 | |||||||||||||||||||||||
INTEL-82915PM
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | R-PBGA-B1257 | Not Qualified | 1257 | PLASTIC/EPOXY | BGA | BGA1257,34X37,40 | RECTANGULAR | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA1257,34X37,40 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
NG88CUR/SL7YQ
Intel Corporation
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查询价格和库存 |
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Active | YES | 9.7 A | S-PBGA-B1092 | Not Qualified | 1092 | PLASTIC/EPOXY | BGA | BGA1092,35X35,43/32 | SQUARE | GRID ARRAY | BALL | 800 µm | BOTTOM | 2071 | BGA, BGA1092,35X35,43/32 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
INTEL-82915GME
Intel Corporation
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查询价格和库存 |
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Active | YES | CMOS | R-PBGA-B1257 | Not Qualified | 1257 | PLASTIC/EPOXY | BGA | BGA1257,34X37,40 | RECTANGULAR | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA1257,34X37,40 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
INTEL-82Q965
Intel Corporation
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查询价格和库存 |
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Active | YES | CMOS | S-PBGA-B1226 | Not Qualified | 1226 | PLASTIC/EPOXY | FBGA | BGA1226,43X43,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1226,43X43,32 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
INTEL-82945GT
Intel Corporation
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查询价格和库存 |
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Active | YES | CMOS | S-PBGA-B1466 | Not Qualified | 1466 | PLASTIC/EPOXY | FBGA | BGA1466,41X41,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1466,41X41,32 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
INTEL-82G965
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1226 | Not Qualified | 1226 | PLASTIC/EPOXY | FBGA | BGA1226,43X43,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1226,43X43,32 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
AM29C688-1XC
AMD
|
查询价格和库存 |
|
Active | 5 V | CMOS | 365 mA | COMMERCIAL | Not Qualified | 70 °C | DIE OR CHIP | 1653 | compliant | 8542.31.00.01 | Malaysia | 2 | |||||||||||||||||||||||||||||
INTEL-82946GZ
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1202 | Not Qualified | 1202 | PLASTIC/EPOXY | FBGA | BGA1202,43X43,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1202,43X43,32 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
INTEL-82946PL
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1202 | Not Qualified | 1202 | PLASTIC/EPOXY | FBGA | BGA1202,43X43,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1202,43X43,32 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
INTEL-82945GME
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1466 | Not Qualified | 1466 | PLASTIC/EPOXY | FBGA | BGA1466,41X41,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1466,41X41,32 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
INTEL-82910GML
Intel Corporation
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查询价格和库存 |
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Active | YES | CMOS | R-PBGA-B1257 | Not Qualified | 1257 | PLASTIC/EPOXY | BGA | BGA1257,34X37,40 | RECTANGULAR | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA1257,34X37,40 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
MB1431AP
FUJITSU Limited
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查询价格和库存 |
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Active | NO | 5 V | TTL | 151 mA | COMMERCIAL | R-PDIP-T48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | DIP | DIP48,.6 | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 2000 | DIP, DIP48,.6 | compliant | 8542.31.00.01 | 2 | |||||||||||||||||||
INTEL-E8501
Intel Corporation
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查询价格和库存 |
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Active | YES | CMOS | S-PBGA-B829 | Not Qualified | 829 | PLASTIC/EPOXY | BGA | BGA829,29X29,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2071 | BGA, BGA829,29X29,50 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
MB1430APFQ
FUJITSU Semiconductor Limited
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查询价格和库存 |
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Active | YES | 5 V | TTL | 145 mA | COMMERCIAL | R-PQFP-G64 | Not Qualified | 70 °C | 64 | PLASTIC/EPOXY | QFP | QFP64,.7X.95,40 | RECTANGULAR | FLATPACK | GULL WING | 1 mm | QUAD | 4317229 | QFP, QFP64,.7X.95,40 | compliant | 8542.31.00.01 | ||||||||||||||||||||
82439HX
Intel Corporation
|
查询价格和库存 |
|
Active | PENTIUM | 32 | 64 | YES | 3.3 V | MEMORY CONTROLLER, DRAM | CMOS | 0 TO 85 C OPERATING CASE TEMPERATURE | NO | YES | 512M X 8 | 8 | 3.6 V | 3.135 V | S-PBGA-B324 | Not Qualified | 324 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2.3 mm | 27 mm | 27 mm | 2071 | BGA, | compliant | 8542.31.00.01 | BGA | 324 | ||||||||
INTEL-82940GML
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1466 | Not Qualified | 1466 | PLASTIC/EPOXY | FBGA | BGA1466,41X41,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1466,41X41,32 | compliant | 8542.31.00.01 | ||||||||||||||||||||||||
82865G
Intel Corporation
|
查询价格和库存 |
|
Active | YES | S-PBGA-B932 | Not Qualified | 932 | PLASTIC/EPOXY | BGA | BGA932,35X35,40 | SQUARE | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA932,35X35,40 | compliant | 8542.31.00.01 |