型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 | 是否无铅 |
是否Rohs认证
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生命周期 | 内存密度 | 内存宽度 | 组织 |
标称供电电压 (Vsup)
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最长访问时间 | 最大时钟频率 (fCLK) | 内存集成电路类型 | 其他特性 | I/O 类型 | 功能数量 | 端口数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 并行/串行 |
编程电压
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最大待机电流
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最大压摆率
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最大供电电压 (Vsup)
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最小供电电压 (Vsup)
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技术 |
温度等级
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JESD-30 代码 |
认证状态
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JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) |
处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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座面最大高度
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长度 |
宽度
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Source Content uid
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mfrid
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包装说明
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是否符合REACH标准
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Country Of Origin
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ECCN代码
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HTS代码
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YTEOL
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零件包装代码
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针数
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AT27BV010-90JU
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3 V | 90 ns | OTP ROM | ALSO OPERATES AT 5V SUPPLY | COMMON | 1 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 20 µA | 8 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 245 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | AT27BV010-90JU | 2188 | GREEN, PLASTIC, MS-016AE, LCC-32 | compliant | Thailand | EAR99 | 8542.32.00.71 | 24.48 | |||||
AT27BV256-70JU
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 3 V | 70 ns | OTP ROM | ALSO OPERATES AT 5V SUPPLY | COMMON | 1 | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 20 µA | 8 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 245 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | AT27BV256-70JU | 2188 | compliant | Thailand | EAR99 | 8542.32.00.51 | 24.48 | ||||||
AT27BV1024-90JU
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.0486 Mbit | 16 | 64KX16 | 3 V | 90 ns | OTP ROM | ALSO OPERATES AT 5V SUPPLY | COMMON | 1 | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 20 µA | 8 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | S-PQCC-J44 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 245 | 40 | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 4.572 mm | 16.5862 mm | 16.5862 mm | AT27BV1024-90JU | 2188 | compliant | Thailand | EAR99 | 8542.32.00.51 | 24.48 | ||||||
BQ2026DBZR
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 1.536 kbit | 1 | 1.5KX1 | 16.67 kHz | OTP ROM | COMMON | 1 | 1500 | 1.536 k | ASYNCHRONOUS | OPEN-DRAIN | SERIAL | 20 nA | 5.5 V | 2.65 V | CMOS | OTHER | R-PDSO-G3 | Not Qualified | e4 | 1 | 70 °C | -20 °C | 260 | NOT SPECIFIED | 3 | PLASTIC/EPOXY | SOP | TO-236 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 950 µm | DUAL | 1.12 mm | 2.92 mm | 1.3 mm | BQ2026DBZR | 2477 | SOT-23, 3 PIN | compliant | EAR99 | 8542.39.00.01 | 15 | |||||||||||
BQ2026LPR
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 1.536 kbit | 1 | 1.5KX1 | 16.67 kHz | OTP ROM | COMMON | 1 | 1500 | 1.536 k | ASYNCHRONOUS | OPEN-DRAIN | SERIAL | 20 nA | 5.5 V | 2.65 V | CMOS | OTHER | O-XBCY-T3 | Not Qualified | e3 | 70 °C | -20 °C | NOT SPECIFIED | NOT SPECIFIED | 3 | UNSPECIFIED | TO-92 | SIP3,.1,50 | ROUND | CYLINDRICAL | NO | Matte Tin (Sn) | THROUGH-HOLE | 1.27 mm | BOTTOM | 5.34 mm | 4.3 mm | 4.3 mm | BQ2026LPR | 2477 | TO-92, 3 PIN | compliant | EAR99 | 8542.39.00.01 | 15 | ||||||||||||
AT27C010-45JU
Atmel Corporation
|
查询价格和库存 |
|
Yes | Yes | Transferred | 1.0486 Mbit | 8 | 128KX8 | 5 V | 45 ns | OTP ROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 µA | 35 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 2 | 85 °C | -40 °C | 245 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | 1773 | GREEN, PLASTIC, MS-016AE, LCC-32 | unknown | EAR99 | 8542.32.00.71 | QFJ | 32 | ||||||||||
AT27C256R-70PU
Atmel Corporation
|
查询价格和库存 |
|
Yes | Yes | Transferred | 262.144 kbit | 8 | 32KX8 | 5 V | 70 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 20 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDIP-T28 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 245 | 40 | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.826 mm | 37.0205 mm | 15.24 mm | 1773 | 0.600 INCH, GREEN, PLASTIC, MS-011AB, DIP-28 | unknown | EAR99 | 8542.32.00.71 | DIP | 28 | ||||||||
AT27C040-90JU-T
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 4.1943 Mbit | 8 | 512KX8 | 5 V | 90 ns | OTP ROM | COMMON | 1 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 10 µA | 30 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | e3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | AT27C040-90JU-T | 2188 | LCC-32 | compliant | Thailand | EAR99 | 8542.31.00.01 | 24.48 | |||||||||||
AT27C4096-55JU-T
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 4.1943 Mbit | 16 | 256KX16 | 5 V | 55 ns | OTP ROM | COMMON | 1 | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 40 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQCC-J44 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 4.572 mm | 16.586 mm | 16.586 mm | 2188 | LCC-44 | compliant | Thailand | EAR99 | 8542.31.00.01 | 24.48 | |||||||||||||||
DS2502S+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 1.024 kbit | 8 | 128X8 | 5 V | 15 µs | OTP ROM | MICROLAN COMPATIBLE | COMMON | 1 | 128 | 128 words | ASYNCHRONOUS | SERIAL | 6 V | 2.8 V | CMOS | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2164 | SOP, SOP8,.25 | compliant | Japan, Mainland China, Malaysia, Philipp... more | EAR99 | 8542.32.00.71 | 9 | SOIC | 8 | |||||||||
AT27C256R-70JU-T
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 70 ns | OTP ROM | COMMON | 1 | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 20 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | AT27C256R-70JU-T | 2188 | QCCJ, | compliant | Thailand | EAR99 | 8542.31.00.01 | 24.48 | ||||||||||||||
AT27C2048-55JU-T
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 2.0972 Mbit | 16 | 128KX16 | 5 V | 55 ns | OTP ROM | COMMON | 1 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 35 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQCC-J44 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 4.572 mm | 16.586 mm | 16.586 mm | 2188 | QCCJ, | compliant | Thailand | EAR99 | 8542.31.00.01 | 24.48 | |||||||||||||||
AT27C256R-70JU-306
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 70 ns | OTP ROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | AT27C256R-70JU-306 | 2188 | LCC-32 | compliant | Thailand | EAR99 | 8542.31.00.01 | 3.75 | |||||||||||||||||||||
DS2502P-E48+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 1.024 kbit | 1 | 1KX1 | OTP ROM | COMMON | 1 | 1000 | 1.024 k | ASYNCHRONOUS | SERIAL | 5 µA | 5 nA | 6 V | 2.8 V | CMOS | INDUSTRIAL | R-PDSO-C6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | SOC | SOC6,.17 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | C BEND | 1.27 mm | DUAL | 1.5 mm | 3.94 mm | 3.76 mm | 2164 | SOC, SOC6,.17 | compliant | Japan, Mainland China, Malaysia, Philipp... more | EAR99 | 8542.32.00.71 | 9 | SOIC | 6 | ||||||||||
DS2502P+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 1.024 kbit | 8 | 128X8 | 5 V | 15 µs | OTP ROM | MICROLAN COMPATIBLE | COMMON | 1 | 128 | 128 words | ASYNCHRONOUS | SERIAL | 6 V | 2.8 V | CMOS | INDUSTRIAL | R-PDSO-C6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | SOC | SOC6,.17 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | C BEND | 1.27 mm | DUAL | 1.5 mm | 3.94 mm | 3.76 mm | 2164 | SOC, SOC6,.17 | compliant | Japan, Mainland China, Malaysia, Philipp... more | EAR99 | 8542.32.00.71 | 9 | SOIC | 6 | |||||||||
DS2502P-E64+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 1.024 kbit | 1 | 1KX1 | 5 V | OTP ROM | 1 | 1000 | 1.024 k | SYNCHRONOUS | SERIAL | 6 V | 2.8 V | MOS | INDUSTRIAL | R-PDSO-C6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | LSOC | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | MATTE TIN | C BEND | 1.27 mm | DUAL | 1.5 mm | 3.94 mm | 3.76 mm | 2164 | TSOC-6 | compliant | Japan, Mainland China, Malaysia, Philipp... more | EAR99 | 8542.32.00.71 | 9 | SOIC | 6 | |||||||||||||
DS2502R+T&R
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 1.024 kbit | 8 | 128X8 | 5 V | 15 µs | OTP ROM | MICROLAN COMPATIBLE | COMMON | 1 | 128 | 128 words | ASYNCHRONOUS | SERIAL | 6 V | 2.8 V | CMOS | INDUSTRIAL | R-PDSO-G3 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 3 | PLASTIC/EPOXY | TSSOP | TO-236 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.12 mm | 2.92 mm | 1.3 mm | 2164 | TSSOP, TO-236 | compliant | Japan, Mainland China, Malaysia, Philipp... more | EAR99 | 8542.32.00.71 | 9 | SOT-23 | 3 | |||||||||
AT27C256R-45PU
Atmel Corporation
|
查询价格和库存 |
|
Yes | Yes | Transferred | 262.144 kbit | 8 | 32KX8 | 5 V | 45 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 20 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDIP-T28 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.826 mm | 37.0205 mm | 15.24 mm | 1773 | 0.600 INCH, GREEN, PLASTIC, MS-011AB, DIP-28 | unknown | EAR99 | 8542.32.00.71 | DIP | 28 | ||||||||||
AT27C512R-70PU
Atmel Corporation
|
查询价格和库存 |
|
Yes | Yes | Transferred | 524.288 kbit | 8 | 64KX8 | 5 V | 70 ns | OTP ROM | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 20 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDIP-T28 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Matte Tin (Sn) | THROUGH-HOLE | 2.54 mm | DUAL | 4.826 mm | 37.0205 mm | 15.24 mm | 1773 | 0.600 INCH, GREEN, PLASTIC, MS-011AB, DIP-28 | unknown | EAR99 | 8542.32.00.71 | DIP | 28 | |||||||||
AT27C512R-70JU
Atmel Corporation
|
查询价格和库存 |
|
Yes | Yes | Transferred | 524.288 kbit | 8 | 64KX8 | 5 V | 70 ns | OTP ROM | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 20 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 2 | 85 °C | -40 °C | 245 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | 1773 | GREEN, PLASTIC, MS-016AE, LCC-32 | unknown | EAR99 | 8542.32.00.71 | QFJ | 32 |