型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Other | ||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
生命周期
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表面贴装
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标称供电电压 | 技术 |
最大压摆率
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温度等级
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JESD-30 代码 |
认证状态
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最高工作温度
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最低工作温度
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端子数量
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封装主体材料
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封装代码
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封装等效代码
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封装形状
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封装形式
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端子形式
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端子节距
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端子位置
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mfrid
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包装说明
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是否符合REACH标准
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HTS代码
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Country Of Origin
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YTEOL
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82845PE
Intel Corporation
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查询价格和库存 |
|
Active | YES | 1.5 V | CMOS | S-PBGA-B478 | Not Qualified | 478 | PLASTIC/EPOXY | BGA | BGA478,37X37,40 | SQUARE | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA478,37X37,40 | compliant | 8542.31.00.01 | |||||||
82845GE
Intel Corporation
|
查询价格和库存 |
|
Active | YES | 1.5 V | CMOS | S-PBGA-B478 | Not Qualified | 478 | PLASTIC/EPOXY | BGA | BGA478,37X37,40 | SQUARE | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA478,37X37,40 | compliant | 8542.31.00.01 | |||||||
INTEL-82915PM
Intel Corporation
|
查询价格和库存 |
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Active | YES | CMOS | R-PBGA-B1257 | Not Qualified | 1257 | PLASTIC/EPOXY | BGA | BGA1257,34X37,40 | RECTANGULAR | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA1257,34X37,40 | compliant | 8542.31.00.01 | ||||||||
INTEL-5000V
Intel Corporation
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查询价格和库存 |
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Active | YES | CMOS | S-PBGA-B1432 | Not Qualified | 1432 | PLASTIC/EPOXY | BGA | BGA1432,38X38,40 | SQUARE | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA1432,38X38,40 | compliant | 8542.31.00.01 | ||||||||
FW82854
Intel Corporation
|
查询价格和库存 |
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Active | YES | S-PBGA-B732 | Not Qualified | 732 | PLASTIC/EPOXY | BGA | BGA732,29X29,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2071 | BGA, BGA732,29X29,50 | compliant | 8542.31.00.01 | |||||||||
INTEL-82915GME
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | R-PBGA-B1257 | Not Qualified | 1257 | PLASTIC/EPOXY | BGA | BGA1257,34X37,40 | RECTANGULAR | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA1257,34X37,40 | compliant | 8542.31.00.01 | ||||||||
INTEL-82946GZ
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1202 | Not Qualified | 1202 | PLASTIC/EPOXY | FBGA | BGA1202,43X43,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1202,43X43,32 | compliant | 8542.31.00.01 | ||||||||
AM29C688-1XC
AMD
|
查询价格和库存 |
|
Active | 5 V | CMOS | 365 mA | COMMERCIAL | Not Qualified | 70 °C | DIE OR CHIP | 1653 | compliant | 8542.31.00.01 | Malaysia | 2 | |||||||||||||
INTEL-82945GT
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1466 | Not Qualified | 1466 | PLASTIC/EPOXY | FBGA | BGA1466,41X41,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1466,41X41,32 | compliant | 8542.31.00.01 | ||||||||
INTEL-82G965
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1226 | Not Qualified | 1226 | PLASTIC/EPOXY | FBGA | BGA1226,43X43,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1226,43X43,32 | compliant | 8542.31.00.01 | ||||||||
INTEL-E8501
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B829 | Not Qualified | 829 | PLASTIC/EPOXY | BGA | BGA829,29X29,50 | SQUARE | GRID ARRAY | BALL | 1.27 mm | BOTTOM | 2071 | BGA, BGA829,29X29,50 | compliant | 8542.31.00.01 | ||||||||
MB1431AP
FUJITSU Limited
|
查询价格和库存 |
|
Active | NO | 5 V | TTL | 151 mA | COMMERCIAL | R-PDIP-T48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | DIP | DIP48,.6 | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 2000 | DIP, DIP48,.6 | compliant | 8542.31.00.01 | 2 | |||
INTEL-82910GML
Intel Corporation
|
查询价格和库存 |
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Active | YES | CMOS | R-PBGA-B1257 | Not Qualified | 1257 | PLASTIC/EPOXY | BGA | BGA1257,34X37,40 | RECTANGULAR | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA1257,34X37,40 | compliant | 8542.31.00.01 | ||||||||
INTEL-82Q965
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1226 | Not Qualified | 1226 | PLASTIC/EPOXY | FBGA | BGA1226,43X43,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1226,43X43,32 | compliant | 8542.31.00.01 | ||||||||
INTEL-82945GME
Intel Corporation
|
查询价格和库存 |
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Active | YES | CMOS | S-PBGA-B1466 | Not Qualified | 1466 | PLASTIC/EPOXY | FBGA | BGA1466,41X41,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1466,41X41,32 | compliant | 8542.31.00.01 | ||||||||
MB1430APFQ
FUJITSU Semiconductor Limited
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查询价格和库存 |
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Active | YES | 5 V | TTL | 145 mA | COMMERCIAL | R-PQFP-G64 | Not Qualified | 70 °C | 64 | PLASTIC/EPOXY | QFP | QFP64,.7X.95,40 | RECTANGULAR | FLATPACK | GULL WING | 1 mm | QUAD | 4317229 | QFP, QFP64,.7X.95,40 | compliant | 8542.31.00.01 | ||||
INTEL-82946PL
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1202 | Not Qualified | 1202 | PLASTIC/EPOXY | FBGA | BGA1202,43X43,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1202,43X43,32 | compliant | 8542.31.00.01 | ||||||||
INTEL-82940GML
Intel Corporation
|
查询价格和库存 |
|
Active | YES | CMOS | S-PBGA-B1466 | Not Qualified | 1466 | PLASTIC/EPOXY | FBGA | BGA1466,41X41,32 | SQUARE | GRID ARRAY, FINE PITCH | BALL | 800 µm | BOTTOM | 2071 | FBGA, BGA1466,41X41,32 | compliant | 8542.31.00.01 | ||||||||
82865G
Intel Corporation
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查询价格和库存 |
|
Active | YES | S-PBGA-B932 | Not Qualified | 932 | PLASTIC/EPOXY | BGA | BGA932,35X35,40 | SQUARE | GRID ARRAY | BALL | 1 mm | BOTTOM | 2071 | BGA, BGA932,35X35,40 | compliant | 8542.31.00.01 | |||||||||
MB1431APFQ
FUJITSU Semiconductor Limited
|
查询价格和库存 |
|
Active | YES | 5 V | TTL | 151 mA | COMMERCIAL | R-PQFP-G64 | Not Qualified | 70 °C | 64 | PLASTIC/EPOXY | QFP | QFP64,.7X.95,40 | RECTANGULAR | FLATPACK | GULL WING | 1 mm | QUAD | 4317229 | QFP, QFP64,.7X.95,40 | compliant | 8542.31.00.01 |