数字传输控制器封装型号_数字传输控制器厂家价格-bom2buy

型号

型号						Most Relevant		Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	包装说明	是否符合REACH标准	HTS代码	YTEOL	零件包装代码	针数	Source Content uid	ECCN代码
TFRA84J131BL-21 Broadcom Limited		查询价格和库存				Active	1.5 V		1		INDUSTRIAL	FRAMER	S-PBGA-B909	e0	Not Qualified		85 °C	-40 °C	225	30	909	PLASTIC/EPOXY	BGA	BGA909,34X34,40	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	35 mm	35 mm	2.51 mm	1807	BGA, BGA909,34X34,40	compliant	8542.39.00.01
TTSI2K32T Avago Technologies		查询价格和库存				Active	3.3 V	CMOS	1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA,	unknown	8542.39.00.01
T7230A--ML Broadcom Limited		查询价格和库存				Active	5 V	CMOS	1		INDUSTRIAL	FRAMER	S-PQCC-J68	e0	Not Qualified		85 °C	-40 °C	225	30	68	PLASTIC/EPOXY	QCCJ		SQUARE	CHIP CARRIER	YES	TIN LEAD	J BEND	1.27 mm	QUAD	24.2316 mm	24.2316 mm	5.08 mm	1807	PLASTIC, LCC-68	compliant	8542.39.00.01	2
TFRA08C13 Avago Technologies		查询价格和库存				Active	3.3 V	CMOS	8			FRAMER	X-PBGA-B352	e0	Not Qualified				225	30	352	PLASTIC/EPOXY	BGA		UNSPECIFIED	GRID ARRAY	YES	TIN LEAD	BALL		BOTTOM				1778	BGA,	unknown	8542.39.00.01
T7230A--TL Avago Technologies		查询价格和库存				Active	5 V	CMOS	1		INDUSTRIAL	FRAMER	S-PQFP-G80	e0	Not Qualified		85 °C	-40 °C	240	30	80	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	12 mm	12 mm	1.6 mm	1778	LFQFP,	unknown	8542.39.00.01	2
TFRA08C13-DB Avago Technologies		查询价格和库存				Active	3.3 V	CMOS	8		INDUSTRIAL	FRAMER	S-PBGA-B352	e0	Not Qualified		85 °C	-40 °C	225	30	352	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	35 mm	35 mm	2.54 mm	1778	BGA,	unknown	8542.39.00.01
TFRA84J131BL-3 Broadcom Limited		查询价格和库存			No	Active	1.5 V		1		INDUSTRIAL	FRAMER	S-PBGA-B909		Not Qualified		85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	909	PLASTIC/EPOXY	BGA	BGA909,34X34,40	SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	35 mm	35 mm	2.51 mm	1807	PLASTIC, BGA-909	unknown	8542.39.00.01
PM4359-NGI Microchip Technology Inc		查询价格和库存			Yes	Active	1.8 V	CMOS	1		INDUSTRIAL	FRAMER	S-PBGA-B256			3	85 °C	-40 °C			256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM				2188	17 X 17 MM, ROHS COMPLIANT, CABGA-256	compliant
T-7630---TL-DB Broadcom Limited		查询价格和库存				Active	5 V	CMOS	1		INDUSTRIAL	FRAMER	S-PQFP-G144	e0	Not Qualified		85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	20 mm	20 mm	1.6 mm	1807	TQFP-144	compliant	8542.39.00.01	2
TTSI008321BL-1 Avago Technologies		查询价格和库存				Active	1.5 V		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e0	Not Qualified		85 °C	-40 °C	225	30	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm	1778	BGA,	unknown	8542.39.00.01
TFRA28J133BAL-1-DB Broadcom Limited		查询价格和库存				Active	3.3 V		1		INDUSTRIAL	FRAMER	S-PBGA-B456	e0	Not Qualified		85 °C	-40 °C	225	30	456	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	35 mm	35 mm	2.54 mm	1807	BGA,	compliant	8542.39.00.01
T-7633---TL-DB Broadcom Limited		查询价格和库存				Active	3.3 V	CMOS	1		INDUSTRIAL	FRAMER	S-PQFP-G144	e0	Not Qualified		85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	20 mm	20 mm	1.6 mm	1807	TQFP-144	compliant	8542.39.00.01	2
TTSI016641BL-1 Broadcom Limited		查询价格和库存				Active	1.5 V		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B324	e0	Not Qualified		85 °C	-40 °C	225	30	324	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	23 mm	23 mm	2.51 mm	1807	BGA,	compliant	8542.39.00.01
TTSI144641BL-1 Avago Technologies		查询价格和库存				Active	1.5 V		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B388	e0	Not Qualified		85 °C	-40 °C	225	30	388	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	27 mm	27 mm	2.51 mm	1778	BGA,	unknown	8542.39.00.01
MT9079AP1 Microsemi Corporation		查询价格和库存				Transferred						FRAMER																							2192		compliant	8542.39.00.01		LPCC	44
MT9079APR Microsemi Corporation		查询价格和库存				Transferred						FRAMER																							2192		compliant	8542.39.00.01		LPCC	44
MT8979APR1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V	CMOS	1		INDUSTRIAL	FRAMER	S-PQCC-J44	e3	Not Qualified		85 °C	-40 °C			44	PLASTIC/EPOXY	QCCJ		SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	16.585 mm	16.585 mm	4.57 mm	2192	LEAD FREE, PLASTIC, MS-018AC, LCC-44	compliant	8542.39.00.01		LPCC	44
MT9076BB1 Microchip Technology Inc		查询价格和库存			Yes	Obsolete	3.3 V		1	98 mA	INDUSTRIAL	FRAMER	S-PQFP-G80	e3	Not Qualified		85 °C	-40 °C			80	PLASTIC/EPOXY	LQFP		SQUARE	FLATPACK, LOW PROFILE	YES	MATTE TIN	GULL WING	650 µm	QUAD	14 mm	14 mm	1.6 mm	2188	14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BEC, LQFP-80	compliant		0
82V2108PXG8 Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	3.3 V	CMOS	1		INDUSTRIAL	FRAMER	R-PQFP-G128	e3	Not Qualified		85 °C	-40 °C			128	PLASTIC/EPOXY	FQFP	QFP128,.67X.93,20	RECTANGULAR	FLATPACK, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	20 mm	3.4 mm	2068	PLASTIC, QFP-128	compliant	8542.39.00.01		QFP	128	82V2108PXG8	EAR99
PEB2035-N Siemens		查询价格和库存				Transferred	5 V	CMOS	1		COMMERCIAL	FRAMER	S-PQCC-J44		Not Qualified		70 °C				44	PLASTIC/EPOXY			SQUARE	CHIP CARRIER	YES		J BEND		QUAD				2403	,	unknown	8542.39.00.01		LCC	44

型号						Most Relevant		Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	包装说明	是否符合REACH标准	HTS代码	YTEOL	零件包装代码	针数	Source Content uid	ECCN代码
TFRA84J131BL-21 Broadcom Limited		查询价格和库存				Active	1.5 V		1		INDUSTRIAL	FRAMER	S-PBGA-B909	e0	Not Qualified		85 °C	-40 °C	225	30	909	PLASTIC/EPOXY	BGA	BGA909,34X34,40	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	35 mm	35 mm	2.51 mm	1807	BGA, BGA909,34X34,40	compliant	8542.39.00.01
TTSI2K32T Avago Technologies		查询价格和库存				Active	3.3 V	CMOS	1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA,	unknown	8542.39.00.01
T7230A--ML Broadcom Limited		查询价格和库存				Active	5 V	CMOS	1		INDUSTRIAL	FRAMER	S-PQCC-J68	e0	Not Qualified		85 °C	-40 °C	225	30	68	PLASTIC/EPOXY	QCCJ		SQUARE	CHIP CARRIER	YES	TIN LEAD	J BEND	1.27 mm	QUAD	24.2316 mm	24.2316 mm	5.08 mm	1807	PLASTIC, LCC-68	compliant	8542.39.00.01	2
TFRA08C13 Avago Technologies		查询价格和库存				Active	3.3 V	CMOS	8			FRAMER	X-PBGA-B352	e0	Not Qualified				225	30	352	PLASTIC/EPOXY	BGA		UNSPECIFIED	GRID ARRAY	YES	TIN LEAD	BALL		BOTTOM				1778	BGA,	unknown	8542.39.00.01
T7230A--TL Avago Technologies		查询价格和库存				Active	5 V	CMOS	1		INDUSTRIAL	FRAMER	S-PQFP-G80	e0	Not Qualified		85 °C	-40 °C	240	30	80	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	12 mm	12 mm	1.6 mm	1778	LFQFP,	unknown	8542.39.00.01	2
TFRA08C13-DB Avago Technologies		查询价格和库存				Active	3.3 V	CMOS	8		INDUSTRIAL	FRAMER	S-PBGA-B352	e0	Not Qualified		85 °C	-40 °C	225	30	352	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	35 mm	35 mm	2.54 mm	1778	BGA,	unknown	8542.39.00.01
TFRA84J131BL-3 Broadcom Limited		查询价格和库存			No	Active	1.5 V		1		INDUSTRIAL	FRAMER	S-PBGA-B909		Not Qualified		85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	909	PLASTIC/EPOXY	BGA	BGA909,34X34,40	SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	35 mm	35 mm	2.51 mm	1807	PLASTIC, BGA-909	unknown	8542.39.00.01
PM4359-NGI Microchip Technology Inc		查询价格和库存			Yes	Active	1.8 V	CMOS	1		INDUSTRIAL	FRAMER	S-PBGA-B256			3	85 °C	-40 °C			256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM				2188	17 X 17 MM, ROHS COMPLIANT, CABGA-256	compliant
T-7630---TL-DB Broadcom Limited		查询价格和库存				Active	5 V	CMOS	1		INDUSTRIAL	FRAMER	S-PQFP-G144	e0	Not Qualified		85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	20 mm	20 mm	1.6 mm	1807	TQFP-144	compliant	8542.39.00.01	2
TTSI008321BL-1 Avago Technologies		查询价格和库存				Active	1.5 V		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e0	Not Qualified		85 °C	-40 °C	225	30	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm	1778	BGA,	unknown	8542.39.00.01
TFRA28J133BAL-1-DB Broadcom Limited		查询价格和库存				Active	3.3 V		1		INDUSTRIAL	FRAMER	S-PBGA-B456	e0	Not Qualified		85 °C	-40 °C	225	30	456	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	35 mm	35 mm	2.54 mm	1807	BGA,	compliant	8542.39.00.01
T-7633---TL-DB Broadcom Limited		查询价格和库存				Active	3.3 V	CMOS	1		INDUSTRIAL	FRAMER	S-PQFP-G144	e0	Not Qualified		85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	20 mm	20 mm	1.6 mm	1807	TQFP-144	compliant	8542.39.00.01	2
TTSI016641BL-1 Broadcom Limited		查询价格和库存				Active	1.5 V		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B324	e0	Not Qualified		85 °C	-40 °C	225	30	324	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	23 mm	23 mm	2.51 mm	1807	BGA,	compliant	8542.39.00.01
TTSI144641BL-1 Avago Technologies		查询价格和库存				Active	1.5 V		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B388	e0	Not Qualified		85 °C	-40 °C	225	30	388	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	27 mm	27 mm	2.51 mm	1778	BGA,	unknown	8542.39.00.01
MT9079AP1 Microsemi Corporation		查询价格和库存				Transferred						FRAMER																							2192		compliant	8542.39.00.01		LPCC	44
MT9079APR Microsemi Corporation		查询价格和库存				Transferred						FRAMER																							2192		compliant	8542.39.00.01		LPCC	44
MT8979APR1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V	CMOS	1		INDUSTRIAL	FRAMER	S-PQCC-J44	e3	Not Qualified		85 °C	-40 °C			44	PLASTIC/EPOXY	QCCJ		SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	16.585 mm	16.585 mm	4.57 mm	2192	LEAD FREE, PLASTIC, MS-018AC, LCC-44	compliant	8542.39.00.01		LPCC	44
MT9076BB1 Microchip Technology Inc		查询价格和库存			Yes	Obsolete	3.3 V		1	98 mA	INDUSTRIAL	FRAMER	S-PQFP-G80	e3	Not Qualified		85 °C	-40 °C			80	PLASTIC/EPOXY	LQFP		SQUARE	FLATPACK, LOW PROFILE	YES	MATTE TIN	GULL WING	650 µm	QUAD	14 mm	14 mm	1.6 mm	2188	14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BEC, LQFP-80	compliant		0
82V2108PXG8 Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	3.3 V	CMOS	1		INDUSTRIAL	FRAMER	R-PQFP-G128	e3	Not Qualified		85 °C	-40 °C			128	PLASTIC/EPOXY	FQFP	QFP128,.67X.93,20	RECTANGULAR	FLATPACK, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	20 mm	3.4 mm	2068	PLASTIC, QFP-128	compliant	8542.39.00.01		QFP	128	82V2108PXG8	EAR99
PEB2035-N Siemens		查询价格和库存				Transferred	5 V	CMOS	1		COMMERCIAL	FRAMER	S-PQCC-J44		Not Qualified		70 °C				44	PLASTIC/EPOXY			SQUARE	CHIP CARRIER	YES		J BEND		QUAD				2403	,	unknown	8542.39.00.01		LCC	44

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