电信信令电路封装型号_电信信令电路厂家价格-bom2buy

型号

型号						Most Relevant		Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	mfrid	包装说明	是否符合REACH标准	HTS代码	YTEOL	零件包装代码	针数
LMC567CN/NOPB National Semiconductor Corporation		查询价格和库存			Yes	Transferred	5 V	CMOS	1	1.3 mA	OTHER	TONE DECODER CIRCUIT	R-PDIP-T8	e3	Not Qualified	1	125 °C	-25 °C	260	40	8	PLASTIC/EPOXY	DIP		RECTANGULAR	IN-LINE	NO	Matte Tin (Sn)	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	9.817 mm	5.08 mm	LMC567CN/NOPB	2216	PLASTIC, DIP-8	compliant	8542.39.00.01
MT8870DSR1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	9 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G18	e3	Not Qualified	1	85 °C	-40 °C			18	PLASTIC/EPOXY	SOP	SOP18,.4	RECTANGULAR	SMALL OUTLINE	YES	Matte Tin (Sn)	GULL WING	1.27 mm	DUAL	7.5 mm	11.55 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AB, SOIC-18	compliant		24.48
MT8870DNR1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	9 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SSOP	SSOP20,.3	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	5.3 mm	7.2 mm	2 mm		2188	5.30 MM, LEAD FREE, MO-150AE, SSOP-20	compliant		24.48
MT8888CS1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	11 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SOP	SOP20,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	12.8 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AC, SOIC-20	compliant		24.48
MT8880CSR1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	11 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SOP	SOP20,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	12.8 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AC, SOIC-20	compliant		24.48
MT8870DS1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	9 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G18	e3	Not Qualified	1	85 °C	-40 °C			18	PLASTIC/EPOXY	SOP	SOP18,.4	RECTANGULAR	SMALL OUTLINE	YES	Matte Tin (Sn)	GULL WING	1.27 mm	DUAL					2188		compliant		24.48
MT8880CS1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	11 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SOP	SOP20,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	12.8 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AC, SOIC-20	compliant		24.48
MT88L70AS1 Microchip Technology Inc		查询价格和库存			Yes	Active	3 V	CMOS	1	5.5 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G18	e3	Not Qualified		85 °C	-40 °C			18	PLASTIC/EPOXY	SOP	SOP18,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	11.55 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AB, SOIC-18	compliant		24.48
MT88L70ASR1 Microchip Technology Inc		查询价格和库存			Yes	Active	3 V	CMOS	1	5.5 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G18	e3	Not Qualified		85 °C	-40 °C			18	PLASTIC/EPOXY	SOP	SOP18,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	11.55 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AB, SOIC-18	compliant		24.48
BU8871F-E2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V	CMOS	1	3.4 mA	COMMERCIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G18	e3/e2	Not Qualified		70 °C	-10 °C	260	10	18	PLASTIC/EPOXY	SOP	SOP18,.3	RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOP, SOP18,.3	compliant	8542.39.00.01		SOIC	18
MT8889CSR1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	11 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SOP	SOP20,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	12.8 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AC, SOIC-20	compliant		24.48
MT88L70ANR1 Microchip Technology Inc		查询价格和库存			Yes	Active	3 V	CMOS	1	5.5 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SSOP	SSOP20,.3	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	5.3 mm	7.2 mm	2 mm		2188	5.30 MM, LEAD FREE, MO-150AE, SSOP-20	compliant		24.48
MT88L70AN1 Microchip Technology Inc		查询价格和库存			Yes	Active	3 V	CMOS	1	5.5 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SSOP	SSOP20,.3	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	5.3 mm	7.2 mm	2 mm		2188	5.30 MM, LEAD FREE, MO-150AE, SSOP-20	compliant		24.48
BU8872FS-T2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V	CMOS	1	4.4 mA		DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	LSSOP,	compliant	8542.39.00.01		SOIC	16
BU8872FSE1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V		1			DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	LSSOP,	unknown			SOIC	16
BU8872FSE2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V		1			DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	LSSOP,	unknown			SOIC	16
BU8872FST1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V		1			DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	LSSOP,	unknown			SOIC	16
BU8872FS-E1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V	CMOS	1	4.4 mA		DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	SSOP-16	compliant	8542.39.00.01		SOIC	16
BU8872FST2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V		1			DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	SSOP-16	unknown			SOIC	16
BU8872FS-T1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V	CMOS	1	4.4 mA		DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	LSSOP,	compliant	8542.39.00.01		SOIC	16

型号						Most Relevant		Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	mfrid	包装说明	是否符合REACH标准	HTS代码	YTEOL	零件包装代码	针数
LMC567CN/NOPB National Semiconductor Corporation		查询价格和库存			Yes	Transferred	5 V	CMOS	1	1.3 mA	OTHER	TONE DECODER CIRCUIT	R-PDIP-T8	e3	Not Qualified	1	125 °C	-25 °C	260	40	8	PLASTIC/EPOXY	DIP		RECTANGULAR	IN-LINE	NO	Matte Tin (Sn)	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	9.817 mm	5.08 mm	LMC567CN/NOPB	2216	PLASTIC, DIP-8	compliant	8542.39.00.01
MT8870DSR1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	9 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G18	e3	Not Qualified	1	85 °C	-40 °C			18	PLASTIC/EPOXY	SOP	SOP18,.4	RECTANGULAR	SMALL OUTLINE	YES	Matte Tin (Sn)	GULL WING	1.27 mm	DUAL	7.5 mm	11.55 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AB, SOIC-18	compliant		24.48
MT8870DNR1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	9 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SSOP	SSOP20,.3	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	5.3 mm	7.2 mm	2 mm		2188	5.30 MM, LEAD FREE, MO-150AE, SSOP-20	compliant		24.48
MT8888CS1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	11 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SOP	SOP20,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	12.8 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AC, SOIC-20	compliant		24.48
MT8880CSR1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	11 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SOP	SOP20,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	12.8 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AC, SOIC-20	compliant		24.48
MT8870DS1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	9 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G18	e3	Not Qualified	1	85 °C	-40 °C			18	PLASTIC/EPOXY	SOP	SOP18,.4	RECTANGULAR	SMALL OUTLINE	YES	Matte Tin (Sn)	GULL WING	1.27 mm	DUAL					2188		compliant		24.48
MT8880CS1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	11 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SOP	SOP20,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	12.8 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AC, SOIC-20	compliant		24.48
MT88L70AS1 Microchip Technology Inc		查询价格和库存			Yes	Active	3 V	CMOS	1	5.5 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G18	e3	Not Qualified		85 °C	-40 °C			18	PLASTIC/EPOXY	SOP	SOP18,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	11.55 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AB, SOIC-18	compliant		24.48
MT88L70ASR1 Microchip Technology Inc		查询价格和库存			Yes	Active	3 V	CMOS	1	5.5 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G18	e3	Not Qualified		85 °C	-40 °C			18	PLASTIC/EPOXY	SOP	SOP18,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	11.55 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AB, SOIC-18	compliant		24.48
BU8871F-E2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V	CMOS	1	3.4 mA	COMMERCIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G18	e3/e2	Not Qualified		70 °C	-10 °C	260	10	18	PLASTIC/EPOXY	SOP	SOP18,.3	RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	11.2 mm	1.9 mm		2363	SOP, SOP18,.3	compliant	8542.39.00.01		SOIC	18
MT8889CSR1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS	1	11 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SOP	SOP20,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	12.8 mm	2.65 mm		2188	0.300 INCH, LEAD FREE, MS-013AC, SOIC-20	compliant		24.48
MT88L70ANR1 Microchip Technology Inc		查询价格和库存			Yes	Active	3 V	CMOS	1	5.5 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SSOP	SSOP20,.3	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	5.3 mm	7.2 mm	2 mm		2188	5.30 MM, LEAD FREE, MO-150AE, SSOP-20	compliant		24.48
MT88L70AN1 Microchip Technology Inc		查询价格和库存			Yes	Active	3 V	CMOS	1	5.5 mA	INDUSTRIAL	DTMF SIGNALING CIRCUIT	R-PDSO-G20	e3	Not Qualified		85 °C	-40 °C			20	PLASTIC/EPOXY	SSOP	SSOP20,.3	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	5.3 mm	7.2 mm	2 mm		2188	5.30 MM, LEAD FREE, MO-150AE, SSOP-20	compliant		24.48
BU8872FS-T2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V	CMOS	1	4.4 mA		DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	LSSOP,	compliant	8542.39.00.01		SOIC	16
BU8872FSE1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V		1			DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	LSSOP,	unknown			SOIC	16
BU8872FSE2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V		1			DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	LSSOP,	unknown			SOIC	16
BU8872FST1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V		1			DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	LSSOP,	unknown			SOIC	16
BU8872FS-E1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V	CMOS	1	4.4 mA		DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	SSOP-16	compliant	8542.39.00.01		SOIC	16
BU8872FST2 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V		1			DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	SSOP-16	unknown			SOIC	16
BU8872FS-T1 ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	5 V	CMOS	1	4.4 mA		DTMF SIGNALING CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified				260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	4.4 mm	6.6 mm	1.6 mm		2363	LSSOP,	compliant	8542.39.00.01		SOIC	16

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