多功能外围设备封装型号_多功能外围设备厂家价格-bom2buy

型号

型号						Most Relevant								Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	RAM（字数）	总线兼容性	外部数据总线宽度	地址总线宽度	最大时钟频率	I/O 线路数量	表面贴装	标称供电电压	uPs/uCs/外围集成电路类型	技术	其他特性	边界扫描	串行 I/O 数	最大压摆率	最大供电电压	最小供电电压	温度等级	JESD-30 代码	认证状态	JESD-609代码	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	端子面层	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	mfrid	是否符合REACH标准	YTEOL	Source Content uid	Country Of Origin	ECCN代码	HTS代码	包装说明	Date Of Intro
CY8C4245PVI-482 Infineon Technologies AG		查询价格和库存			Yes	Active									PROGRAMMABLE SoC								INDUSTRIAL		Not Qualified	e4	3			260	30							Nickel/Palladium/Gold (Ni/Pd/Au)							2065	compliant	9.22
MCIMX6Q5EYM10ADR NXP Semiconductors		查询价格和库存		Yes	Yes	Active																					3			260	40							TIN SILVER COPPER							2245	compliant	11.81	MCIMX6Q5EYM10ADR	Malaysia	5A992.C	8542.31.00.01
SCH3114I-NU Microchip Technology Inc		查询价格和库存			Yes	Active	256	LPC	4	4		46	YES	3.3 V	MULTIFUNCTION PERIPHERAL	CMOS		NO		1 mA	3.63 V	2.97 V	INDUSTRIAL	S-PQFP-G128	Not Qualified	e3		85 °C	-40 °C			128	PLASTIC/EPOXY	TQFP	TQFP128,.63SQ,16	SQUARE	FLATPACK, THIN PROFILE	Matte Tin (Sn)	GULL WING	400 µm	QUAD	1.2 mm	14 mm	14 mm	2188	compliant	9.89	SCH3114I-NU	Thailand	3A991.A.2	8542.31.00.01	VTQFP-128
CY8C4124PVI-442 Infineon Technologies AG		查询价格和库存			Yes	Active	2048	I2C, I2S, SPI, UART			24 MHz	24	YES	1.8 V	MULTIFUNCTION PERIPHERAL	CMOS		NO		7.2 mA	5.5 V	1.71 V	INDUSTRIAL	R-PDSO-G28	Not Qualified	e4	3	85 °C	-40 °C	260	30	28	PLASTIC/EPOXY	SSOP	SSOP28,.3	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	650 µm	DUAL	2 mm	5.3 mm	10.2 mm	2065	compliant	9.22
CY8C4245LQI-483 Infineon Technologies AG		查询价格和库存			Yes	Active									PROGRAMMABLE SoC								INDUSTRIAL		Not Qualified	e4	3			NOT SPECIFIED	NOT SPECIFIED							Nickel/Palladium/Gold (Ni/Pd/Au)							2065	compliant	9.22
CY8C4124LQI-443T Infineon Technologies AG		查询价格和库存			Yes	Active	2048	I2C; SPI; UART			24 MHz	34	YES	1.8 V		CMOS		NO			5.5 V	1.71 V	INDUSTRIAL	S-XQCC-N56		e4	3	105 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	56	UNSPECIFIED	HQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	800 µm	QUAD	1.6 mm	10 mm	10 mm	2065	compliant	9.22					TQFP-44
CY8C4125AZI-PS423 Infineon Technologies AG		查询价格和库存			Yes	Active							YES	3.3 V	PROGRAMMABLE SoC	CMOS					5.5 V	1.8 V	INDUSTRIAL	S-PQFP-G48			3	105 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	48	PLASTIC/EPOXY	LFQFP	QFP48,.35SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Pure Tin (Sn)	GULL WING	500 µm	DUAL	1.6 mm	7 mm	7 mm	2065	compliant	9.47				8542.31.00.01
CY8C4246AZI-L433 Infineon Technologies AG		查询价格和库存			Yes	Active							YES	3.3 V	PROGRAMMABLE SoC	CMOS					5.5 V	1.71 V	INDUSTRIAL	S-PQFP-G48			3	105 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	48	PLASTIC/EPOXY	LFQFP	QFP48,.35SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Pure Tin (Sn)	GULL WING	500 µm	QUAD	1.6 mm	7 mm	7 mm	2065	compliant	7.05				8542.31.00.01
CY8C4246AZI-M443 Infineon Technologies AG		查询价格和库存			Yes	Active									PROGRAMMABLE SoC								INDUSTRIAL				3			NOT SPECIFIED	NOT SPECIFIED							Pure Tin (Sn)							2065	compliant	6.38					TQFP-48
CY8C4145AZI-PS423 Infineon Technologies AG		查询价格和库存			Yes	Active							YES	3.3 V	PROGRAMMABLE SoC	CMOS					5.5 V	1.8 V		S-PQFP-G48			3	105 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	48	PLASTIC/EPOXY	LFQFP	QFP48,.35SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Pure Tin (Sn)	GULL WING	500 µm	DUAL	1.6 mm	7 mm	7 mm	2065	compliant	9.47				8542.31.00.01
CY8C5888AXI-LP096 Infineon Technologies AG		查询价格和库存			Yes	Active	32768	I2C; USB			33 MHz	62	YES	1.8 V		CMOS		YES			5.5 V	1.71 V	INDUSTRIAL	S-PQFP-G100	Not Qualified		3	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	100	PLASTIC/EPOXY	LFQFP	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Pure Tin (Sn)	GULL WING	500 µm	QUAD	1.6 mm	14 mm	14 mm	2065	compliant	8.89					TQFP-100
CY8C5888LTQ-LP097 Infineon Technologies AG		查询价格和库存			Yes	Active	32768	I2C; I2S, LIN; PS/2; SPI, USB			33 MHz	38	YES	3.3 V		CMOS		YES			5.5 V	1.71 V	INDUSTRIAL	S-XQCC-N68	Not Qualified	e4	3	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	68	UNSPECIFIED	HVQCCN	LCC68,.32SQ,16	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	400 µm	QUAD	1 mm	8 mm	8 mm	2065	compliant	8.89					QFN-68
CY8C5868AXI-LP032 Infineon Technologies AG		查询价格和库存			Yes	Active	32768	I2C; USB; PS/2			33 MHz	72	YES	1.8 V		CMOS		YES			5.5 V	1.71 V	INDUSTRIAL	S-PQFP-G100	Not Qualified	e4	3	85 °C	-40 °C	260	30	100	PLASTIC/EPOXY	LFQFP	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	500 µm	QUAD	1.6 mm	14 mm	14 mm	2065	compliant	8.89					TQFP-100
CY8C5888LTI-LP097 Infineon Technologies AG		查询价格和库存			Yes	Active	32768	I2C; USB			33 MHz	38	YES	1.8 V		CMOS		YES			5.5 V	1.71 V	INDUSTRIAL	S-XQCC-N68	Not Qualified	e4	3	85 °C	-40 °C	260	30	68	UNSPECIFIED	HVQCCN	LCC68,.32SQ,16	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	400 µm	QUAD	1 mm	8 mm	8 mm	2065	compliant	8.89					QFN-68
CY8C5868LTI-LP039 Infineon Technologies AG		查询价格和库存			Yes	Active	32768	I2C; USB; PS/2			33 MHz	48	YES	1.8 V		CMOS		YES			5.5 V	1.71 V	INDUSTRIAL	S-XQCC-N68	Not Qualified	e4	3	85 °C	-40 °C	260	30	68	UNSPECIFIED	HVQCCN	LCC68,.32SQ,16	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	400 µm	QUAD	1 mm	8 mm	8 mm	2065	compliant	8.89					QFN-68
MCIMX6Q5EYM10AD NXP Semiconductors		查询价格和库存			Yes	Active							YES		SoC	CMOS	24MHZ NOMINAL FREQ AVAILABLE				1.5 V	1.35 V	OTHER	S-PBGA-B624		e1	3	105 °C	-20 °C	260	40	624	PLASTIC/EPOXY	LFBGA		SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	800 µm	BOTTOM	1.6 mm	21 mm	21 mm	2245	compliant	11.81	MCIMX6Q5EYM10AD	Malaysia	5A992.C	8542.31.00.01	FCBGA-624
MCIMX6S5EVM10AD NXP Semiconductors		查询价格和库存			Yes	Active							YES		SoC	CMOS					1.5 V	1.35 V	OTHER	S-PBGA-B624		e1	3	105 °C	-20 °C	260	40	624	PLASTIC/EPOXY	LFBGA	BGA624,25X25,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	800 µm	BOTTOM	1.6 mm	21 mm	21 mm	2245	compliant	11.81	MCIMX6S5EVM10AD	Mainland China	5A992.C	8542.31.00.01	MABGA-624
MCIMX6S5DVM10AD NXP Semiconductors		查询价格和库存			Yes	Active							YES		SoC	CMOS					1.5 V	1.35 V	OTHER	S-PBGA-B624		e1	3	95 °C		260	40	624	PLASTIC/EPOXY	LFBGA	BGA624,25X25,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	800 µm	BOTTOM	1.6 mm	21 mm	21 mm	2245	compliant	11.81	MCIMX6S5DVM10AD	Mainland China	5A992.C	8542.31.00.01	MABGA-624
MIMX8MM6CVTKZAA NXP Semiconductors		查询价格和库存			Yes	Active	288K	ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB				16	YES	950 mV	SoC	CMOS	24MHZ NOM CRYSTAL FREQ AVAILABLE	YES			1 V	900 mV	INDUSTRIAL	S-PBGA-B486		e2	3	105 °C	-40 °C	260	40	486	PLASTIC/EPOXY	LFBGA	BGA486,27X27,20	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Tin/Silver (Sn/Ag)	BALL	500 µm	BOTTOM	1.25 mm	14 mm	14 mm	2245	compliant	9.98	MIMX8MM6CVTKZAA	Mainland China, South Korea	5A992.C	8542.31.00.01	FCBGA-486	2019-02-21
EFR32MG13P732F512IM48-D Silicon Laboratories Inc		查询价格和库存				Active							YES	3.3 V	SoC	CMOS					3.8 V	1.62 V		S-XQCC-N48				125 °C	-40 °C			48	UNSPECIFIED	HVQCCN	LCC48,.28SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		NO LEAD	500 µm	QUAD	900 µm	7 mm	7 mm	2406	unknown					8542.31.00.01	QFN-48	2019-06-14

型号						Most Relevant								Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	RAM（字数）	总线兼容性	外部数据总线宽度	地址总线宽度	最大时钟频率	I/O 线路数量	表面贴装	标称供电电压	uPs/uCs/外围集成电路类型	技术	其他特性	边界扫描	串行 I/O 数	最大压摆率	最大供电电压	最小供电电压	温度等级	JESD-30 代码	认证状态	JESD-609代码	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	端子面层	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	mfrid	是否符合REACH标准	YTEOL	Source Content uid	Country Of Origin	ECCN代码	HTS代码	包装说明	Date Of Intro
CY8C4245PVI-482 Infineon Technologies AG		查询价格和库存			Yes	Active									PROGRAMMABLE SoC								INDUSTRIAL		Not Qualified	e4	3			260	30							Nickel/Palladium/Gold (Ni/Pd/Au)							2065	compliant	9.22
MCIMX6Q5EYM10ADR NXP Semiconductors		查询价格和库存		Yes	Yes	Active																					3			260	40							TIN SILVER COPPER							2245	compliant	11.81	MCIMX6Q5EYM10ADR	Malaysia	5A992.C	8542.31.00.01
SCH3114I-NU Microchip Technology Inc		查询价格和库存			Yes	Active	256	LPC	4	4		46	YES	3.3 V	MULTIFUNCTION PERIPHERAL	CMOS		NO		1 mA	3.63 V	2.97 V	INDUSTRIAL	S-PQFP-G128	Not Qualified	e3		85 °C	-40 °C			128	PLASTIC/EPOXY	TQFP	TQFP128,.63SQ,16	SQUARE	FLATPACK, THIN PROFILE	Matte Tin (Sn)	GULL WING	400 µm	QUAD	1.2 mm	14 mm	14 mm	2188	compliant	9.89	SCH3114I-NU	Thailand	3A991.A.2	8542.31.00.01	VTQFP-128
CY8C4124PVI-442 Infineon Technologies AG		查询价格和库存			Yes	Active	2048	I2C, I2S, SPI, UART			24 MHz	24	YES	1.8 V	MULTIFUNCTION PERIPHERAL	CMOS		NO		7.2 mA	5.5 V	1.71 V	INDUSTRIAL	R-PDSO-G28	Not Qualified	e4	3	85 °C	-40 °C	260	30	28	PLASTIC/EPOXY	SSOP	SSOP28,.3	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	650 µm	DUAL	2 mm	5.3 mm	10.2 mm	2065	compliant	9.22
CY8C4245LQI-483 Infineon Technologies AG		查询价格和库存			Yes	Active									PROGRAMMABLE SoC								INDUSTRIAL		Not Qualified	e4	3			NOT SPECIFIED	NOT SPECIFIED							Nickel/Palladium/Gold (Ni/Pd/Au)							2065	compliant	9.22
CY8C4124LQI-443T Infineon Technologies AG		查询价格和库存			Yes	Active	2048	I2C; SPI; UART			24 MHz	34	YES	1.8 V		CMOS		NO			5.5 V	1.71 V	INDUSTRIAL	S-XQCC-N56		e4	3	105 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	56	UNSPECIFIED	HQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	800 µm	QUAD	1.6 mm	10 mm	10 mm	2065	compliant	9.22					TQFP-44
CY8C4125AZI-PS423 Infineon Technologies AG		查询价格和库存			Yes	Active							YES	3.3 V	PROGRAMMABLE SoC	CMOS					5.5 V	1.8 V	INDUSTRIAL	S-PQFP-G48			3	105 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	48	PLASTIC/EPOXY	LFQFP	QFP48,.35SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Pure Tin (Sn)	GULL WING	500 µm	DUAL	1.6 mm	7 mm	7 mm	2065	compliant	9.47				8542.31.00.01
CY8C4246AZI-L433 Infineon Technologies AG		查询价格和库存			Yes	Active							YES	3.3 V	PROGRAMMABLE SoC	CMOS					5.5 V	1.71 V	INDUSTRIAL	S-PQFP-G48			3	105 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	48	PLASTIC/EPOXY	LFQFP	QFP48,.35SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Pure Tin (Sn)	GULL WING	500 µm	QUAD	1.6 mm	7 mm	7 mm	2065	compliant	7.05				8542.31.00.01
CY8C4246AZI-M443 Infineon Technologies AG		查询价格和库存			Yes	Active									PROGRAMMABLE SoC								INDUSTRIAL				3			NOT SPECIFIED	NOT SPECIFIED							Pure Tin (Sn)							2065	compliant	6.38					TQFP-48
CY8C4145AZI-PS423 Infineon Technologies AG		查询价格和库存			Yes	Active							YES	3.3 V	PROGRAMMABLE SoC	CMOS					5.5 V	1.8 V		S-PQFP-G48			3	105 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	48	PLASTIC/EPOXY	LFQFP	QFP48,.35SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Pure Tin (Sn)	GULL WING	500 µm	DUAL	1.6 mm	7 mm	7 mm	2065	compliant	9.47				8542.31.00.01
CY8C5888AXI-LP096 Infineon Technologies AG		查询价格和库存			Yes	Active	32768	I2C; USB			33 MHz	62	YES	1.8 V		CMOS		YES			5.5 V	1.71 V	INDUSTRIAL	S-PQFP-G100	Not Qualified		3	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	100	PLASTIC/EPOXY	LFQFP	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Pure Tin (Sn)	GULL WING	500 µm	QUAD	1.6 mm	14 mm	14 mm	2065	compliant	8.89					TQFP-100
CY8C5888LTQ-LP097 Infineon Technologies AG		查询价格和库存			Yes	Active	32768	I2C; I2S, LIN; PS/2; SPI, USB			33 MHz	38	YES	3.3 V		CMOS		YES			5.5 V	1.71 V	INDUSTRIAL	S-XQCC-N68	Not Qualified	e4	3	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	68	UNSPECIFIED	HVQCCN	LCC68,.32SQ,16	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	400 µm	QUAD	1 mm	8 mm	8 mm	2065	compliant	8.89					QFN-68
CY8C5868AXI-LP032 Infineon Technologies AG		查询价格和库存			Yes	Active	32768	I2C; USB; PS/2			33 MHz	72	YES	1.8 V		CMOS		YES			5.5 V	1.71 V	INDUSTRIAL	S-PQFP-G100	Not Qualified	e4	3	85 °C	-40 °C	260	30	100	PLASTIC/EPOXY	LFQFP	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	500 µm	QUAD	1.6 mm	14 mm	14 mm	2065	compliant	8.89					TQFP-100
CY8C5888LTI-LP097 Infineon Technologies AG		查询价格和库存			Yes	Active	32768	I2C; USB			33 MHz	38	YES	1.8 V		CMOS		YES			5.5 V	1.71 V	INDUSTRIAL	S-XQCC-N68	Not Qualified	e4	3	85 °C	-40 °C	260	30	68	UNSPECIFIED	HVQCCN	LCC68,.32SQ,16	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	400 µm	QUAD	1 mm	8 mm	8 mm	2065	compliant	8.89					QFN-68
CY8C5868LTI-LP039 Infineon Technologies AG		查询价格和库存			Yes	Active	32768	I2C; USB; PS/2			33 MHz	48	YES	1.8 V		CMOS		YES			5.5 V	1.71 V	INDUSTRIAL	S-XQCC-N68	Not Qualified	e4	3	85 °C	-40 °C	260	30	68	UNSPECIFIED	HVQCCN	LCC68,.32SQ,16	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	400 µm	QUAD	1 mm	8 mm	8 mm	2065	compliant	8.89					QFN-68
MCIMX6Q5EYM10AD NXP Semiconductors		查询价格和库存			Yes	Active							YES		SoC	CMOS	24MHZ NOMINAL FREQ AVAILABLE				1.5 V	1.35 V	OTHER	S-PBGA-B624		e1	3	105 °C	-20 °C	260	40	624	PLASTIC/EPOXY	LFBGA		SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	800 µm	BOTTOM	1.6 mm	21 mm	21 mm	2245	compliant	11.81	MCIMX6Q5EYM10AD	Malaysia	5A992.C	8542.31.00.01	FCBGA-624
MCIMX6S5EVM10AD NXP Semiconductors		查询价格和库存			Yes	Active							YES		SoC	CMOS					1.5 V	1.35 V	OTHER	S-PBGA-B624		e1	3	105 °C	-20 °C	260	40	624	PLASTIC/EPOXY	LFBGA	BGA624,25X25,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	800 µm	BOTTOM	1.6 mm	21 mm	21 mm	2245	compliant	11.81	MCIMX6S5EVM10AD	Mainland China	5A992.C	8542.31.00.01	MABGA-624
MCIMX6S5DVM10AD NXP Semiconductors		查询价格和库存			Yes	Active							YES		SoC	CMOS					1.5 V	1.35 V	OTHER	S-PBGA-B624		e1	3	95 °C		260	40	624	PLASTIC/EPOXY	LFBGA	BGA624,25X25,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	800 µm	BOTTOM	1.6 mm	21 mm	21 mm	2245	compliant	11.81	MCIMX6S5DVM10AD	Mainland China	5A992.C	8542.31.00.01	MABGA-624
MIMX8MM6CVTKZAA NXP Semiconductors		查询价格和库存			Yes	Active	288K	ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB				16	YES	950 mV	SoC	CMOS	24MHZ NOM CRYSTAL FREQ AVAILABLE	YES			1 V	900 mV	INDUSTRIAL	S-PBGA-B486		e2	3	105 °C	-40 °C	260	40	486	PLASTIC/EPOXY	LFBGA	BGA486,27X27,20	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Tin/Silver (Sn/Ag)	BALL	500 µm	BOTTOM	1.25 mm	14 mm	14 mm	2245	compliant	9.98	MIMX8MM6CVTKZAA	Mainland China, South Korea	5A992.C	8542.31.00.01	FCBGA-486	2019-02-21
EFR32MG13P732F512IM48-D Silicon Laboratories Inc		查询价格和库存				Active							YES	3.3 V	SoC	CMOS					3.8 V	1.62 V		S-XQCC-N48				125 °C	-40 °C			48	UNSPECIFIED	HVQCCN	LCC48,.28SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		NO LEAD	500 µm	QUAD	900 µm	7 mm	7 mm	2406	unknown					8542.31.00.01	QFN-48	2019-06-14

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