多功能外围设备封装型号_多功能外围设备厂家价格-bom2buy

							Most Relevant												Technical													Compliance			Operating Conditions					Physical										Dimensions			Other
制造商型号	制造商	数据手册	价格/库存	风险等级	是否无铅	是否Rohs认证	生命周期	位大小	速度	RAM（字节）	RAM（字数）	CPU系列	总线兼容性	外部数据总线宽度	地址总线宽度	最大时钟频率	I/O 线路数量	表面贴装	标称供电电压	uPs/uCs/外围集成电路类型	技术	其他特性	边界扫描	格式	集成缓存	低功率模式	串行 I/O 数	电源	最大压摆率	最大供电电压	最小供电电压	温度等级	JESD-30 代码	认证状态	JESD-609代码	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	端子面层	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	Source Content uid	包装说明	是否符合REACH标准	Country Of Origin	ECCN代码	HTS代码	交付时间	YTEOL	零件包装代码	针数	Date Of Intro
MCIMX6Q5EYM10ADR	NXP Semiconductors		查询价格和库存		Yes		Active																													3			260	40							TIN SILVER COPPER							MCIMX6Q5EYM10ADR	,	unknown	Malaysia	5A992.C	8542.31.00.01	[object Object]	5.61
MCIMX257DJM4A	NXP Semiconductors		查询价格和库存			Yes	Active	32	400 MHz					16	26	24 MHz		YES	1.45 V	MULTIFUNCTION PERIPHERAL	CMOS	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	FIXED POINT	YES	YES		1.2/1.5,1.8/3.3 V		1.52 V	1.38 V	OTHER	S-PBGA-B400	Not Qualified	e1	3	70 °C	-20 °C	260	40	400	PLASTIC/EPOXY	LFBGA	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.6 mm	17 mm	17 mm	MCIMX257DJM4A	LFBGA, BGA400,20X20,32	compliant	Mainland China, Malaysia	5A992.C	8542.31.00.01	[object Object]	5
SCH3114I-NU	Microchip Technology Inc		查询价格和库存			Yes	Active				256		LPC	4	4		46	YES	3.3 V	MULTIFUNCTION PERIPHERAL	CMOS		NO					3.3 V	1 mA	3.63 V	2.97 V	INDUSTRIAL	S-PQFP-G128	Not Qualified	e3		85 °C	-40 °C			128	PLASTIC/EPOXY	TQFP	TQFP128,.63SQ,16	SQUARE	FLATPACK, THIN PROFILE	MATTE TIN	GULL WING	400 µm	QUAD	1.2 mm	14 mm	14 mm	SCH3114I-NU	VTQFP-128	compliant		3A991.A.2	8542.31.00.01	[object Object]
CC1111F32RSPR	Texas Instruments		查询价格和库存		Yes	Yes	Active			4096		8051					21	YES			CMOS											OTHER	S-PQCC-N36	Not Qualified	e4	3	85 °C		260	30	36	PLASTIC/EPOXY	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	NICKEL PALLADIUM GOLD	NO LEAD	500 µm	QUAD	900 µm	6 mm	6 mm	CC1111F32RSPR	HVQCCN,	compliant		5A992.C	8542.31.00.01		15	QFN	36
LPC47B272-MS	Microchip Technology Inc		查询价格和库存			Yes	Active				256		IRDA, PC-AT, PC-XT, PS/2, PCI				37	YES	3.3 V	MULTIFUNCTION PERIPHERAL			NO				2		15 mA	3.63 V	2.97 V	COMMERCIAL	R-PQFP-G100				70 °C				100	PLASTIC/EPOXY	QFP	QFP100,.7X.9	RECTANGULAR	FLATPACK		GULL WING	650 µm	QUAD	3.4 mm	14 mm	20 mm	LPC47B272-MS	QFP-100	compliant		3A991.A.2	8542.31.00.01	[object Object]
CC1111F32RSP	Texas Instruments		查询价格和库存		Yes	Yes	Active			4096		8051					21	YES			CMOS											OTHER	S-PQCC-N36	Not Qualified	e4	3	85 °C		260	30	36	PLASTIC/EPOXY	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	NICKEL PALLADIUM GOLD	NO LEAD	500 µm	QUAD	900 µm	6 mm	6 mm	CC1111F32RSP	HVQCCN,	compliant		5A992.C	8542.31.00.01		15	QFN	36
MCIMX515CJM6C	NXP Semiconductors		查询价格和库存			Yes	Active											YES	1 V	MULTIFUNCTION PERIPHERAL	CMOS							1.2 V		1.1 V	950 mV	OTHER	S-PBGA-B529	Not Qualified	e1	3	85 °C	-20 °C	260	40	529	PLASTIC/EPOXY	LFBGA	BGA529,23X23,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.6 mm	19 mm	19 mm	MCIMX515CJM6C	LFBGA, BGA529,23X23,32	compliant	Mainland China	5A992.C	8542.31.00.01	[object Object]	5
MCIMX6S5EVM10AD	NXP Semiconductors		查询价格和库存			Yes	Active											YES		SoC	CMOS									1.5 V	1.35 V	OTHER	S-PBGA-B624		e1	3	105 °C	-20 °C	260	40	624	PLASTIC/EPOXY	LFBGA	BGA624,25X25,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.6 mm	21 mm	21 mm	MCIMX6S5EVM10AD	LFBGA,	compliant	Mainland China	5A992.C	8542.31.00.01	[object Object]	5.61
MCIMX6S5DVM10AD	NXP Semiconductors		查询价格和库存			Yes	Active											YES		SoC	CMOS									1.5 V	1.35 V	OTHER	S-PBGA-B624		e1	3	95 °C		260	40	624	PLASTIC/EPOXY	LFBGA	BGA624,25X25,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.6 mm	21 mm	21 mm	MCIMX6S5DVM10AD	LFBGA,	compliant	Mainland China	5A992.C	8542.31.00.01	[object Object]	5.61
MCIMX357CJQ5C	NXP Semiconductors		查询价格和库存			Yes	Active				65536		1-WIRE; CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB	16	26	24 MHz	4	YES		MULTIFUNCTION PERIPHERAL	CMOS	IT ALSO OPERATES AT 1.22 TO 1.47 V	YES				2		400 mA	1.47 V	1.33 V	INDUSTRIAL	S-PBGA-B400	Not Qualified	e1	3	85 °C	-40 °C	260	40	400	PLASTIC/EPOXY	LFBGA	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.6 mm	17 mm	17 mm	MCIMX357CJQ5C	LFBGA, BGA400,20X20,32	compliant	Mainland China	5A992.C	8542.31.00.01		5
MCIMX255AJM4A	NXP Semiconductors		查询价格和库存			Yes	Active	32	400 MHz					16	26	24 MHz		YES	1.45 V	MULTIFUNCTION PERIPHERAL	CMOS	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	FIXED POINT	YES	YES		1.2/1.5,1.8/3.3 V		1.52 V	1.38 V	INDUSTRIAL	S-PBGA-B400	Not Qualified	e1	3	85 °C	-40 °C	260	40	400	PLASTIC/EPOXY	LFBGA	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.6 mm	17 mm	17 mm	MCIMX255AJM4A	LFBGA, BGA400,20X20,32	compliant	Mainland China	5A992.C	8542.31.00.01	[object Object]	5
EFR32MG13P732F512GM48-D	Silicon Laboratories Inc		查询价格和库存				Active											YES	3.3 V	SoC	CMOS									3.8 V	1.8 V		S-XQCC-N48		e3	2	85 °C	-40 °C	260	40	48	UNSPECIFIED	HVQCCN	LCC48,.27SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	MATTE TIN	NO LEAD	500 µm	QUAD	900 µm	7 mm	7 mm			unknown			8542.31.00.01					2019-06-14
EFR32MG13P732F512GM32-D	Silicon Laboratories Inc		查询价格和库存				Active											YES	3.3 V	SoC	CMOS									3.8 V	1.8 V		S-XQCC-N32			3	85 °C	-40 °C	260	40	32	UNSPECIFIED	HVQCCN	LCC32,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		NO LEAD	500 µm	QUAD	900 µm	5 mm	5 mm			unknown			8542.31.00.01					2019-06-14
EFR32MG13P733F512GM48-D	Silicon Laboratories Inc		查询价格和库存				Active											YES	3.3 V	SoC	CMOS									3.8 V	1.62 V		S-XQCC-N48				85 °C	-40 °C			48	UNSPECIFIED	HVQCCN	LCC48,.28SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		NO LEAD	500 µm	QUAD	900 µm	7 mm	7 mm			unknown			8542.31.00.01					2019-06-14
EFR32MG13P732F512IM32-D	Silicon Laboratories Inc		查询价格和库存				Active											YES	3.3 V	SoC	CMOS									3.8 V	1.8 V		S-XQCC-N32			3	125 °C	-40 °C	260	40	32	UNSPECIFIED	HVQCCN	LCC32,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		NO LEAD	500 µm	QUAD	900 µm	5 mm	5 mm			unknown			8542.31.00.01					2019-06-14
MCIMX31CJKN5D	NXP Semiconductors		查询价格和库存			Yes	Active	32	532 MHz					16	26	75 MHz		YES		MULTIFUNCTION PERIPHERAL	CMOS		YES	FIXED POINT	YES	YES		1.2/1.5,1.8/3.3 V		1.65 V	1.52 V	INDUSTRIAL	S-PBGA-B457	Not Qualified	e1	3	85 °C	-40 °C	260	40	457	PLASTIC/EPOXY	LFBGA	BGA457,26X26,20	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	TIN SILVER COPPER	BALL	500 µm	BOTTOM	1.3 mm	14 mm	14 mm	MCIMX31CJKN5D	LFBGA, BGA457,26X26,20	compliant	Mainland China	5A992.C	8542.31.00.01	[object Object]	5
SCH3114-NU	Microchip Technology Inc		查询价格和库存			Yes	Active				256		LPC	4	4		46	YES	3.3 V	MULTIFUNCTION PERIPHERAL	CMOS		NO					3.3 V	1 mA	3.63 V	2.97 V	COMMERCIAL	S-PQFP-G128	Not Qualified	e3	3	70 °C		260	40	128	PLASTIC/EPOXY	TQFP	TQFP128,.63SQ,16	SQUARE	FLATPACK, THIN PROFILE	Matte Tin (Sn) - annealed	GULL WING	400 µm	QUAD	1.2 mm	14 mm	14 mm	SCH3114-NU	VTQFP-128	compliant				[object Object]
MCIMX6G2AVM05AB	NXP Semiconductors		查询价格和库存			Yes	Active		528 MHz		131072		CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB	16	16	24 MHz	10	YES		MULTIFUNCTION PERIPHERAL	CMOS		YES	FIXED POINT	YES	YES	5		500 mA	1.3 V	1.15 V	AUTOMOTIVE	S-PBGA-B289		e2	3	125 °C	-40 °C	260	40	289	PLASTIC/EPOXY	LFBGA	BGA289,17X17,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	TIN SILVER	BALL	800 µm	BOTTOM	1.32 mm	14 mm	14 mm	MCIMX6G2AVM05AB	LFBGA,	compliant		5A992.C	8542.31.00.01	[object Object]	8.45			2017-05-31
66AK2G12ABYA60	Texas Instruments		查询价格和库存		Yes	Yes	Active											YES	900 mV	SYSTEM ON CHIP	CMOS									945 mV	855 mV	INDUSTRIAL	S-PBGA-B625		e1	3	105 °C	-40 °C	260	30	625	PLASTIC/EPOXY	LFBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.56 mm	21 mm	21 mm	66AK2G12ABYA60	LFBGA, BGA625,25X25,32	compliant		5A992.C	8542.31.00.01		15
MCIMX6G2DVM05AB	NXP Semiconductors		查询价格和库存			Yes	Active		528 MHz					16	26			YES		MULTIFUNCTION PERIPHERAL	CMOS		YES	FIXED POINT	YES	YES				1.3 V	1.15 V	OTHER	S-PBGA-B289		e1	3	95 °C		260	40	289	PLASTIC/EPOXY	LFBGA		SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	TIN SILVER COPPER	BALL	800 µm	BOTTOM	1.32 mm	14 mm	14 mm	MCIMX6G2DVM05AB	LFBGA,	compliant		5A992.C	8542.31.00.01	[object Object]	8.45			2017-05-31

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