Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
制造商型号 | 制造商 | 数据手册 |
价格/库存
|
风险等级 |
是否无铅
|
是否Rohs认证
|
生命周期
|
位大小 | 速度 | RAM(字节) | RAM(字数) | CPU系列 | 总线兼容性 | 外部数据总线宽度 | 地址总线宽度 | 最大时钟频率 | I/O 线路数量 |
表面贴装
|
标称供电电压 |
uPs/uCs/外围集成电路类型
|
技术 | 其他特性 | 边界扫描 | 格式 | 集成缓存 | 低功率模式 | 串行 I/O 数 |
电源
|
最大压摆率
|
最大供电电压
|
最小供电电压
|
温度等级
|
JESD-30 代码 |
认证状态
|
JESD-609代码 |
湿度敏感等级
|
最高工作温度
|
最低工作温度
|
峰值回流温度(摄氏度)
|
处于峰值回流温度下的最长时间
|
端子数量
|
封装主体材料
|
封装代码
|
封装等效代码
|
封装形状
|
封装形式
|
端子面层
|
端子形式
|
端子节距
|
端子位置
|
座面最大高度
|
宽度
|
长度 |
Source Content uid
|
包装说明
|
是否符合REACH标准
|
Country Of Origin
|
ECCN代码
|
HTS代码
|
交付时间
|
YTEOL
|
零件包装代码
|
针数
|
Date Of Intro
|
MCIMX6Q5EYM10ADR
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 3 | 260 | 40 | TIN SILVER COPPER | MCIMX6Q5EYM10ADR | , | unknown | Malaysia | 5A992.C | 8542.31.00.01 | [object Object] | 5.61 | |||||||||||||||||||||||||||||||||||||||||||||||
MCIMX257DJM4A
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 32 | 400 MHz | 16 | 26 | 24 MHz | YES | 1.45 V | MULTIFUNCTION PERIPHERAL | CMOS | ALSO REQUIRES 3.3 V I/O SUPPLY | YES | FIXED POINT | YES | YES | 1.2/1.5,1.8/3.3 V | 1.52 V | 1.38 V | OTHER | S-PBGA-B400 | Not Qualified | e1 | 3 | 70 °C | -20 °C | 260 | 40 | 400 | PLASTIC/EPOXY | LFBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.6 mm | 17 mm | 17 mm | MCIMX257DJM4A | LFBGA, BGA400,20X20,32 | compliant | Mainland China, Malaysia | 5A992.C | 8542.31.00.01 | [object Object] | 5 | ||||||||||||
SCH3114I-NU
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 256 | LPC | 4 | 4 | 46 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | CMOS | NO | 3.3 V | 1 mA | 3.63 V | 2.97 V | INDUSTRIAL | S-PQFP-G128 | Not Qualified | e3 | 85 °C | -40 °C | 128 | PLASTIC/EPOXY | TQFP | TQFP128,.63SQ,16 | SQUARE | FLATPACK, THIN PROFILE | MATTE TIN | GULL WING | 400 µm | QUAD | 1.2 mm | 14 mm | 14 mm | SCH3114I-NU | VTQFP-128 | compliant | 3A991.A.2 | 8542.31.00.01 | [object Object] | ||||||||||||||||||||
CC1111F32RSPR
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 4096 | 8051 | 21 | YES | CMOS | OTHER | S-PQCC-N36 | Not Qualified | e4 | 3 | 85 °C | 260 | 30 | 36 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 900 µm | 6 mm | 6 mm | CC1111F32RSPR | HVQCCN, | compliant | 5A992.C | 8542.31.00.01 | 15 | QFN | 36 | |||||||||||||||||||||||||
LPC47B272-MS
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 256 | IRDA, PC-AT, PC-XT, PS/2, PCI | 37 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | NO | 2 | 15 mA | 3.63 V | 2.97 V | COMMERCIAL | R-PQFP-G100 | 70 °C | 100 | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | GULL WING | 650 µm | QUAD | 3.4 mm | 14 mm | 20 mm | LPC47B272-MS | QFP-100 | compliant | 3A991.A.2 | 8542.31.00.01 | [object Object] | |||||||||||||||||||||||||||
CC1111F32RSP
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 4096 | 8051 | 21 | YES | CMOS | OTHER | S-PQCC-N36 | Not Qualified | e4 | 3 | 85 °C | 260 | 30 | 36 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 900 µm | 6 mm | 6 mm | CC1111F32RSP | HVQCCN, | compliant | 5A992.C | 8542.31.00.01 | 15 | QFN | 36 | |||||||||||||||||||||||||
MCIMX515CJM6C
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | 1 V | MULTIFUNCTION PERIPHERAL | CMOS | 1.2 V | 1.1 V | 950 mV | OTHER | S-PBGA-B529 | Not Qualified | e1 | 3 | 85 °C | -20 °C | 260 | 40 | 529 | PLASTIC/EPOXY | LFBGA | BGA529,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.6 mm | 19 mm | 19 mm | MCIMX515CJM6C | LFBGA, BGA529,23X23,32 | compliant | Mainland China | 5A992.C | 8542.31.00.01 | [object Object] | 5 | ||||||||||||||||||||||
MCIMX6S5EVM10AD
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | SoC | CMOS | 1.5 V | 1.35 V | OTHER | S-PBGA-B624 | e1 | 3 | 105 °C | -20 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.6 mm | 21 mm | 21 mm | MCIMX6S5EVM10AD | LFBGA, | compliant | Mainland China | 5A992.C | 8542.31.00.01 | [object Object] | 5.61 | |||||||||||||||||||||||||
MCIMX6S5DVM10AD
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | YES | SoC | CMOS | 1.5 V | 1.35 V | OTHER | S-PBGA-B624 | e1 | 3 | 95 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.6 mm | 21 mm | 21 mm | MCIMX6S5DVM10AD | LFBGA, | compliant | Mainland China | 5A992.C | 8542.31.00.01 | [object Object] | 5.61 | ||||||||||||||||||||||||||
MCIMX357CJQ5C
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 65536 | 1-WIRE; CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB | 16 | 26 | 24 MHz | 4 | YES | MULTIFUNCTION PERIPHERAL | CMOS | IT ALSO OPERATES AT 1.22 TO 1.47 V | YES | 2 | 400 mA | 1.47 V | 1.33 V | INDUSTRIAL | S-PBGA-B400 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 400 | PLASTIC/EPOXY | LFBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.6 mm | 17 mm | 17 mm | MCIMX357CJQ5C | LFBGA, BGA400,20X20,32 | compliant | Mainland China | 5A992.C | 8542.31.00.01 | 5 | |||||||||||||||
MCIMX255AJM4A
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 32 | 400 MHz | 16 | 26 | 24 MHz | YES | 1.45 V | MULTIFUNCTION PERIPHERAL | CMOS | ALSO REQUIRES 3.3 V I/O SUPPLY | YES | FIXED POINT | YES | YES | 1.2/1.5,1.8/3.3 V | 1.52 V | 1.38 V | INDUSTRIAL | S-PBGA-B400 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 400 | PLASTIC/EPOXY | LFBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.6 mm | 17 mm | 17 mm | MCIMX255AJM4A | LFBGA, BGA400,20X20,32 | compliant | Mainland China | 5A992.C | 8542.31.00.01 | [object Object] | 5 | ||||||||||||
EFR32MG13P732F512GM48-D
|
Silicon Laboratories Inc
|
查询价格和库存 |
|
Active | YES | 3.3 V | SoC | CMOS | 3.8 V | 1.8 V | S-XQCC-N48 | e3 | 2 | 85 °C | -40 °C | 260 | 40 | 48 | UNSPECIFIED | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 900 µm | 7 mm | 7 mm | unknown | 8542.31.00.01 | 2019-06-14 | |||||||||||||||||||||||||||||||
EFR32MG13P732F512GM32-D
|
Silicon Laboratories Inc
|
查询价格和库存 |
|
Active | YES | 3.3 V | SoC | CMOS | 3.8 V | 1.8 V | S-XQCC-N32 | 3 | 85 °C | -40 °C | 260 | 40 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 900 µm | 5 mm | 5 mm | unknown | 8542.31.00.01 | 2019-06-14 | |||||||||||||||||||||||||||||||||
EFR32MG13P733F512GM48-D
|
Silicon Laboratories Inc
|
查询价格和库存 |
|
Active | YES | 3.3 V | SoC | CMOS | 3.8 V | 1.62 V | S-XQCC-N48 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | LCC48,.28SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 900 µm | 7 mm | 7 mm | unknown | 8542.31.00.01 | 2019-06-14 | ||||||||||||||||||||||||||||||||||||
EFR32MG13P732F512IM32-D
|
Silicon Laboratories Inc
|
查询价格和库存 |
|
Active | YES | 3.3 V | SoC | CMOS | 3.8 V | 1.8 V | S-XQCC-N32 | 3 | 125 °C | -40 °C | 260 | 40 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 900 µm | 5 mm | 5 mm | unknown | 8542.31.00.01 | 2019-06-14 | |||||||||||||||||||||||||||||||||
MCIMX31CJKN5D
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 32 | 532 MHz | 16 | 26 | 75 MHz | YES | MULTIFUNCTION PERIPHERAL | CMOS | YES | FIXED POINT | YES | YES | 1.2/1.5,1.8/3.3 V | 1.65 V | 1.52 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | MCIMX31CJKN5D | LFBGA, BGA457,26X26,20 | compliant | Mainland China | 5A992.C | 8542.31.00.01 | [object Object] | 5 | ||||||||||||||
SCH3114-NU
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 256 | LPC | 4 | 4 | 46 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | CMOS | NO | 3.3 V | 1 mA | 3.63 V | 2.97 V | COMMERCIAL | S-PQFP-G128 | Not Qualified | e3 | 3 | 70 °C | 260 | 40 | 128 | PLASTIC/EPOXY | TQFP | TQFP128,.63SQ,16 | SQUARE | FLATPACK, THIN PROFILE | Matte Tin (Sn) - annealed | GULL WING | 400 µm | QUAD | 1.2 mm | 14 mm | 14 mm | SCH3114-NU | VTQFP-128 | compliant | [object Object] | ||||||||||||||||||||
MCIMX6G2AVM05AB
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 528 MHz | 131072 | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | 16 | 16 | 24 MHz | 10 | YES | MULTIFUNCTION PERIPHERAL | CMOS | YES | FIXED POINT | YES | YES | 5 | 500 mA | 1.3 V | 1.15 V | AUTOMOTIVE | S-PBGA-B289 | e2 | 3 | 125 °C | -40 °C | 260 | 40 | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER | BALL | 800 µm | BOTTOM | 1.32 mm | 14 mm | 14 mm | MCIMX6G2AVM05AB | LFBGA, | compliant | 5A992.C | 8542.31.00.01 | [object Object] | 8.45 | 2017-05-31 | ||||||||||||
66AK2G12ABYA60
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | YES | 900 mV | SYSTEM ON CHIP | CMOS | 945 mV | 855 mV | INDUSTRIAL | S-PBGA-B625 | e1 | 3 | 105 °C | -40 °C | 260 | 30 | 625 | PLASTIC/EPOXY | LFBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.56 mm | 21 mm | 21 mm | 66AK2G12ABYA60 | LFBGA, BGA625,25X25,32 | compliant | 5A992.C | 8542.31.00.01 | 15 | |||||||||||||||||||||||||
MCIMX6G2DVM05AB
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 528 MHz | 16 | 26 | YES | MULTIFUNCTION PERIPHERAL | CMOS | YES | FIXED POINT | YES | YES | 1.3 V | 1.15 V | OTHER | S-PBGA-B289 | e1 | 3 | 95 °C | 260 | 40 | 289 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.32 mm | 14 mm | 14 mm | MCIMX6G2DVM05AB | LFBGA, | compliant | 5A992.C | 8542.31.00.01 | [object Object] | 8.45 | 2017-05-31 |