型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
数据手册 |
价格/库存
|
风险等级 | 是否无铅 |
是否Rohs认证
|
生命周期 | 内存密度 | 内存宽度 | 组织 |
标称供电电压 (Vsup)
|
最长访问时间 | 最大时钟频率 (fCLK) | 内存集成电路类型 | I/O 类型 | 功能数量 | 端口数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 可输出 | 并行/串行 |
最大待机电流
|
最小待机电流
|
最大压摆率
|
最大供电电压 (Vsup)
|
最小供电电压 (Vsup)
|
技术 |
温度等级
|
JESD-30 代码 |
认证状态
|
JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) |
处于峰值回流温度下的最长时间
|
端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
|
端子面层
|
端子形式
|
端子节距
|
端子位置
|
座面最大高度
|
长度 |
宽度
|
mfrid
|
包装说明
|
是否符合REACH标准
|
YTEOL
|
零件包装代码
|
针数
|
Country Of Origin
|
ECCN代码
|
HTS代码
|
GPT Applications Level 1
|
GPT Applications Level 2
|
GPT Applications Level Application
|
Source Content uid
|
制造商包装代码
|
||
CY7C1041G30-10ZSXI
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3 V | 10 ns | 100 MHz | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 8 mA | 1 V | 45 µA | 3.6 V | 2.2 V | CMOS | R-PDSO-G44 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.194 mm | 18.415 mm | 10.16 mm | 2065 | TSOP2-44 | compliant | 4.9 | ||||||||||||||||
IS61LV5128AL-10TLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 8 | 512KX8 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 20 mA | 3.14 V | 95 µA | 3.63 V | 3.135 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 10 | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 18.415 mm | 10.16 mm | 2070 | LEAD FREE, PLASTIC, TSOP2-44 | compliant | 4.9 | TSOP2 | 44 | Mainland China, Taiwan | 3A991.B.2.A | 8542.32.00.41 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | |||||||
AS7C34098A-10TCN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 8 mA | 3 V | 170 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e3 | 3 | 70 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 18.415 mm | 10.16 mm | 1689 | LEAD FREE, TSOP2-44 | compliant | 4.9 | TSOP2 | 44 | Mainland China | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||
AS7C34098A-10TIN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 8 mA | 3 V | 180 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3/e6 | 3 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.415 mm | 10.16 mm | 1689 | compliant | 4.9 | TSOP2 | 44 | Mainland China | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||
IS61C256AL-12JLI-TR
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 12 ns | STANDARD SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-J28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 28 | PLASTIC/EPOXY | SOJ | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | J BEND | 1.27 mm | DUAL | 3.56 mm | 18.415 mm | 7.62 mm | 2070 | SOJ, | compliant | 4 | SOJ | 28 | Mainland China, Taiwan | EAR99 | 8542.32.00.41 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | |||||||||||||
IS61C256AL-12JLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 12 ns | STANDARD SRAM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 2 V | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-J28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 28 | PLASTIC/EPOXY | SOJ | SOJ28,.34 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | J BEND | 1.27 mm | DUAL | 3.56 mm | 18.415 mm | 7.62 mm | 2070 | SOJ, SOJ28,.34 | compliant | 4 | SOJ | 28 | Mainland China, Taiwan | EAR99 | 8542.32.00.41 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | |||||||
IS61LV25616AL-10TL
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 10 mA | 2 V | 100 µA | 3.63 V | 3.135 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 18.415 mm | 10.16 mm | 2070 | LEAD FREE, PLASTIC, TSOP2-44 | compliant | 4.9 | TSOP2 | 44 | Mainland China, Taiwan | 3A991.B.2.A | 8542.32.00.41 | |||||||||||
IS61LV25616AL-10TLI-TR
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 2 V | 100 µA | 3.63 V | 3.135 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 18.415 mm | 10.16 mm | 2070 | TSOP2, TSOP44,.46,32 | compliant | 4.9 | TSOP2 | 44 | Mainland China, Taiwan | 3A991.B.2.A | 8542.32.00.41 | ||||||||||
IS61LV25616AL-10TLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 2 V | 110 µA | 3.63 V | 3.135 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 18.415 mm | 10.16 mm | 2070 | TSOP2, TSOP44,.46,32 | compliant | 4.9 | TSOP2 | 44 | Mainland China, Taiwan | 3A991.B.2.A | 8542.32.00.41 | ||||||||||
IS61C256AL-12TLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 12 ns | STANDARD SRAM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 2 V | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 85 °C | -40 °C | 260 | 10 | 28 | PLASTIC/EPOXY | TSOP1 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | 2070 | TSOP1, TSSOP28,.53,22 | compliant | 4 | TSOP | 28 | Mainland China, Taiwan | EAR99 | 8542.32.00.41 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | ||||||||
IS61LV12816L-10TL
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 2.0972 Mbit | 16 | 128KX16 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 mA | 2 V | 60 µA | 3.63 V | 2.97 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e3 | 70 °C | 260 | 10 | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 18.415 mm | 10.16 mm | 2070 | TSOP2, TSOP44,.46,32 | compliant | 4.9 | TSOP2 | 44 | Mainland China, Taiwan | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||
M48Z02-150PC1
STMicroelectronics
|
查询价格和库存 |
|
Yes | Active | 16.384 kbit | 8 | 2KX8 | 5 V | STANDARD SRAM | COMMON | 1 | 1 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 3 mA | 4.75 V | 80 µA | 5.5 V | 4.75 V | CMOS | COMMERCIAL | R-PDIP-T24 | Not Qualified | e3 | 70 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 9.65 mm | 34.545 mm | 15.24 mm | 2443 | DIP-24 | compliant | 4 | DIP | 24 | Malaysia | EAR99 | 8542.32.00.41 | M48Z02-150PC1 | |||||||||||||
CY62128ELL-45SXI
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 5 V | 45 ns | STANDARD SRAM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 µA | 2 V | 16 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G32 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 20 | 32 | PLASTIC/EPOXY | SOP | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 2.997 mm | 20.4465 mm | 11.303 mm | 2065 | 0.450 INCH, LEAD FREE, SOIC-32 | compliant | 4 | Mainland China, Taiwan | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | ||||||||||||
23K256-I/ST
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 3 V | 20 MHz | STANDARD SRAM | SEPARATE | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3-STATE | NO | SERIAL | 4 µA | 2.7 V | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2188 | compliant | 4 | SOIC | 8 | Thailand | EAR99 | 8542.32.00.51 | Industrial Automation,Renewable Energy,Robotics and Drones | Control Systems | Industrial control systems | 23K256-I/ST | |||||
CY62128ELL-45ZXI
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 5 V | 45 ns | STANDARD SRAM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 µA | 2 V | 16 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 20 | 32 | PLASTIC/EPOXY | TSOP1 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | 2065 | 8 X 20 MM, LEAD FREE, TSOP1-32 | compliant | 4 | Philippines, Taiwan | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | ||||||||||||
N25S830HAS22I
onsemi
|
查询价格和库存 |
|
Yes | Active | 262.144 kbit | 8 | 32KX8 | 3 V | 20 MHz | STANDARD SRAM | SEPARATE | 1 | 1, (3 LINE) | 32000 | 32.768 k | SYNCHRONOUS | 3-STATE | SERIAL | 4 µA | 2.7 V | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.91 mm | 2260 | 0.150 INCH, GREEN, PLASTIC, SOIC-8 | compliant | 4 | SOIC-8 Narrow Body | 8 | Thailand | EAR99 | 8542.32.00.41 | N25S830HAS22I | 751AZ | ||||||||
IS63LV1024L-12JL
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 12 ns | STANDARD SRAM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.5 mA | 2 V | 90 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-J32 | Not Qualified | e3 | 70 °C | 260 | 10 | 32 | PLASTIC/EPOXY | SOJ | SOJ32,.34 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | J BEND | 1.27 mm | DUAL | 3.56 mm | 20.955 mm | 7.62 mm | 2070 | SOJ, SOJ32,.34 | compliant | 4 | SOJ | 32 | Mainland China, Taiwan | 3A991.B.2.B | 8542.32.00.41 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | |||||||||
IS61WV25616BLL-10TLI-TR
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 9 mA | 2 V | 45 µA | 3.6 V | 2.4 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | 2070 | TSOP2, TSOP44,.46,32 | compliant | 4.9 | TSOP2 | 44 | Mainland China, Taiwan | 3A991.B.2.A | 8542.32.00.41 | Computing and Data Storage | Memory Technologies | Memory chips | |||||||||
CY62148EV30LL-45BVXI
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 4.1943 Mbit | 8 | 512KX8 | 3 V | 45 ns | STANDARD SRAM | COMMON | 1 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 7 µA | 1.5 V | 20 µA | 3.6 V | 2.2 V | CMOS | INDUSTRIAL | R-PBGA-B36 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 36 | PLASTIC/EPOXY | VFBGA | BGA36,6X8,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 750 µm | BOTTOM | 1 mm | 8 mm | 6 mm | 2065 | VFBGA-36 | compliant | 4 | ||||||||||||||
IS61WV25616BLL-10TLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 10 ns | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 9 mA | 2 V | 45 µA | 3.6 V | 2.4 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 18.415 mm | 10.16 mm | 2070 | TSOP2-44 | compliant | 4.9 | TSOP2 | 44 | Mainland China, Taiwan | 3A991.B.2.A | 8542.32.00.41 | Computing and Data Storage | Memory Technologies | Memory chips |