Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
制造商型号 | 制造商 | 数据手册 |
价格/库存
|
风险等级 | 是否无铅 |
是否Rohs认证
|
生命周期 | 内存密度 | 内存宽度 |
部门规模
|
组织 |
标称供电电压 (Vsup)
|
电源
|
最长访问时间 | 最大时钟频率 (fCLK) | 内存集成电路类型 | 其他特性 | 备用内存宽度 | 启动块 | 命令用户界面 | 通用闪存接口 | 数据轮询 | 数据保留时间-最小值 | 耐久性 | 功能数量 | 端口数量 | 部门数/规模 | 字数代码 | 字数 | 工作模式 | 输出特性 | 页面大小 | 并行/串行 |
编程电压
|
就绪/忙碌
|
串行总线类型
|
最大待机电流
|
最大压摆率
|
最大供电电压 (Vsup)
|
最小供电电压 (Vsup)
|
技术 |
温度等级
|
切换位
|
类型
|
写保护
|
JESD-30 代码 |
认证状态
|
JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) |
筛选级别
|
处于峰值回流温度下的最长时间
|
端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
|
端子面层
|
端子形式
|
端子节距
|
端子位置
|
座面最大高度
|
长度 |
宽度
|
零件包装代码
|
包装说明
|
针数
|
是否符合REACH标准
|
Country Of Origin
|
ECCN代码
|
HTS代码
|
交付时间
|
YTEOL
|
Source Content uid
|
Date Of Intro
|
MX29LV160DBTI-70G
|
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | 16.7772 Mbit | 16 | 16K,8K,32K,64K | 1MX16 | 3 V | 3/3.3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 15 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | TSOP1 | TSOP1, TSSOP48,.8,20 | 48 | unknown | Taiwan | 3A991.B.1.A | 8542.32.00.51 | [object Object] | 3.15 | ||||||||||||||||
MX29LV800CBTI-70G
|
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Yes | Active | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3 V | 3/3.3 V | 70 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin (Sn) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | TSOP | TFBGA, TSSOP48,.8,20 | 48 | unknown | Taiwan | 3A991.B.1.A | 8542.32.00.51 | [object Object] | 3.15 | |||||||||||||
MX29F040CTI-70G
|
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 8 | 64K | 512KX8 | 5 V | 5 V | 70 ns | FLASH | YES | YES | 100000 Write/Erase Cycles | 1 | 8 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5 V | 5 µA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G32 | Not Qualified | e6 | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | TSOP1 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Tin/Bismuth (Sn/Bi) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | TSOP1 | TSOP1, TSSOP32,.8,20 | 32 | unknown | Taiwan | EAR99 | 8542.32.00.51 | [object Object] | 3.15 | ||||||||||||||||
MX29F040CQI-70G
|
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 8 | 64K | 512KX8 | 5 V | 5 V | 70 ns | FLASH | YES | YES | 100000 Write/Erase Cycles | 1 | 8 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5 V | 5 µA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.55 mm | 14.05 mm | 11.43 mm | LCC | QCCJ, LDCC32,.5X.6 | 32 | unknown | Taiwan | 3A991.B.1.A | 8542.32.00.51 | [object Object] | 3.15 | ||||||||||||||||
MX29GL256FLT2I-90Q
|
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 16 | 128K | 16MX16 | 3 V | 3.3 V | 100 ns | FLASH | 8 | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 10 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 56 | PLASTIC/EPOXY | TSOP1 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | TSOP1 | TSOP1, TSSOP56,.8,20 | 56 | unknown | Taiwan | EAR99 | 8542.32.00.51 | [object Object] | 3.15 | |||||||||||||||||
SST39VF1601C-70-4C-B3KE
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 16.7772 Mbit | 16 | 8K,4K,16K,32K | 1MX16 | 3 V | 3/3.3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 20 µA | 35 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | TS 16949 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | BGA | TFBGA-48 | 48 | compliant | Thailand | 3A991.B.1.A | 8542.32.00.51 | [object Object] | 4.3 | SST39VF1601C-70-4C-B3KE | ||||||||
MX29GL256FUXFI-11G
|
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 16 | 128K | 16MX16 | 3 V | 3/3.3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 10 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | BGA | LBGA, BGA64,8X8,40 | 64 | unknown | Taiwan | EAR99 | 8542.32.00.51 | [object Object] | 4.7 | |||||||||||||||||
SST39VF1601C-70-4I-EKE
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 16.7772 Mbit | 16 | 8K,4K,16K,32K | 1MX16 | 3 V | 3/3.3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 20 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | TSOP1 | TSOP-48 | 48 | compliant | Thailand | EAR99 | 8542.32.00.51 | [object Object] | 4.3 | SST39VF1601C-70-4I-EKE | |||||||
SST39VF1601C-70-4C-EKE
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 16.7772 Mbit | 16 | 8K,4K,16K,32K | 1MX16 | 3 V | 3/3.3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 20 µA | 35 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 70 °C | 260 | TS 16949 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | TSOP1 | TSOP-48 | 48 | compliant | Thailand | 3A991.B.1.A | 8542.32.00.51 | [object Object] | 4.3 | SST39VF1601C-70-4C-EKE | ||||||||
MT29F2G08ABAGAH4-IT:G
|
Micron Technology Inc
|
查询价格和库存 |
|
Active | FLASH | 3.3 V | SLC NAND TYPE | NOT SPECIFIED | NOT SPECIFIED | compliant | EAR99 | 8542.32.00.51 | [object Object] | 5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SDINBDG4-8G
|
Western Digital Corp
|
查询价格和库存 |
|
Active | 68.7195 Gbit | 8 | 8GX8 | 3.3 V | FLASH CARD | 3000 Write/Erase Cycles | 1 | 8000000000 | 8.5899 G | SYNCHRONOUS | SERIAL | 3.6 V | 2.7 V | CMOS | OTHER | MLC NAND TYPE | R-PBGA-B153 | 85 °C | -25 °C | 153 | PLASTIC/EPOXY | VFBGA | BGA153,14X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 500 µm | BOTTOM | 800 µm | 13.5 mm | 11 mm | VFBGA, BGA153,14X14,20 | unknown | EAR99 | 8542.32.00.51 | [object Object] | 7 | 2020-10-29 | ||||||||||||||||||||||||||||||||||||
SDINBDG4-8G-I1
|
Western Digital Corp
|
查询价格和库存 |
|
Active | 68.7195 Gbit | 8 | 8GX8 | 3.3 V | 200 MHz | FLASH CARD | 1 | 3000 Write/Erase Cycles | 1 | 8000000000 | 8.5899 G | SYNCHRONOUS | PARALLEL | 3.3 V | 3.6 V | 2.7 V | CMOS | MLC NAND TYPE | R-PBGA-B153 | 85 °C | -25 °C | 153 | PLASTIC/EPOXY | VFBGA | BGA153,14X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 500 µm | BOTTOM | 800 µm | 13 mm | 11.5 mm | , | unknown | EAR99 | 8542.32.00.51 | [object Object] | 6.85 | |||||||||||||||||||||||||||||||||||
IS25LP064A-JBLE
|
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 1 | 64MX1 | 3 V | 133 MHz | FLASH | 1 | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 35 µA | 25 µA | 3.6 V | 2.3 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | S-PDSO-G8 | e3 | 1 | 105 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | SOP, SOP8,.3 | compliant | Mainland China, Taiwan | EAR99 | 8542.32.00.51 | [object Object] | 5.6 | |||||||||||||||||||||||
SST49LF008A-33-4C-NHE
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 8.3886 Mbit | 8 | 4K | 1MX8 | 3.3 V | 3.3 V | 120 ns | 33 MHz | FLASH | TOP | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 256 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | 100 µA | 24 µA | 3.6 V | 3 V | CMOS | OTHER | YES | NOR TYPE | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | 245 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | QFJ | ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32 | 32 | compliant | Thailand | 3A991.B.1.A | 8542.32.00.51 | [object Object] | 4.25 | SST49LF008A-33-4C-NHE | |||||||||||
SST49LF080A-33-4C-NHE-T
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 8.3886 Mbit | 8 | 4K | 1MX8 | 3.3 V | 3.3 V | 120 ns | 33 MHz | FLASH | TOP | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 256 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 3.3 V | 100 µA | 24 µA | 3.6 V | 3 V | CMOS | OTHER | YES | NOR TYPE | R-PQCC-J32 | Not Qualified | e3 | 85 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | compliant | Thailand | 3A991.B.1.A | 8542.32.00.51 | [object Object] | 4.25 | SST49LF080A-33-4C-NHE-T | ||||||||||||||||||
MT29F2G08ABAEAWP-IT:E
|
Micron Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 2.1475 Gbit | 8 | 128K | 256MX8 | 3.3 V | 3/3.3 V | FLASH | YES | NO | 10 | 100000 Write/Erase Cycles | 1 | 2K | 256000000 | 268.4355 M | ASYNCHRONOUS | 2K words | PARALLEL | YES | 100 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | SLC NAND TYPE | R-PDSO-G48 | Not Qualified | e3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | TSOP1, TSSOP48,.8,20 | compliant | 5.2 | ||||||||||||||||||||||
MX29LV040CTI-70G
|
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 8 | 64K | 512KX8 | 3 V | 3/3.3 V | 70 ns | FLASH | YES | YES |