型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
价格/库存
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风险等级 | 是否无铅 |
是否Rohs认证
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生命周期 | 内存密度 | 内存宽度 |
部门规模
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组织 |
标称供电电压 (Vsup)
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最长访问时间 | 最大时钟频率 (fCLK) | 内存集成电路类型 | 其他特性 | 备用内存宽度 | 启动块 | 命令用户界面 | 通用闪存接口 | 数据轮询 | 数据保留时间-最小值 | 耐久性 | 功能数量 | 部门数/规模 | 字数代码 | 字数 | 工作模式 | 输出特性 | 页面大小 | 并行/串行 |
编程电压
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就绪/忙碌
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串行总线类型
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最大待机电流
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最大压摆率
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最大供电电压 (Vsup)
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最小供电电压 (Vsup)
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技术 |
温度等级
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切换位
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类型
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最长写入周期时间 (tWC)
|
写保护
|
JESD-30 代码 |
认证状态
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JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) |
筛选级别
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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座面最大高度
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长度 |
宽度
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mfrid
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是否符合REACH标准
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Country Of Origin
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YTEOL
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GPT Applications Level 1
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GPT Applications Level 2
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GPT Applications Level Application
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零件包装代码
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包装说明
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针数
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ECCN代码
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HTS代码
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S29AL008J70TFI020
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 20 | 1000000 Write/Erase Cycles | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 5 µA | 12 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | 2065 | compliant | Thailand | 4.25 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | |||||||||||||||
S29AL008J70TFI023
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 12 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | 2065 | compliant | 4.25 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | ||||||||||||||||||
MX29LV160DBTI-70G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | 16.7772 Mbit | 16 | 16K,8K,32K,64K | 1MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 15 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | 4307504 | compliant | Taiwan | 3.15 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | TSOP1 | 20 X 12 MM, ROHS COMPLIANT, MO-142, TSOP1-48 | 48 | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||||
MX29LV800CBTI-70G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Yes | Active | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3 V | 70 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin (Sn) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | 4307504 | unknown | Taiwan | 3.15 | Internet of Things (IoT),Environmental M... more | Intelligent Transportation Systems,Gamin... more | Consumer electronics | TSOP | TFBGA, TSSOP48,.8,20 | 48 | 3A991.B.1.A | 8542.32.00.51 | ||||||||||||
S25FL128SAGMFI001
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 4 | 32MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.41 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | compliant | Mainland China, Taiwan, Thailand | 7.6 | Consumer Electronics,Computing and Data Storage,Healthcare | Computing and Data Storage,Data Storage Devices,Medical Devices | Firmware storage | |||||||||||||||||||
S25FL128SAGMFI003
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 4 | 32MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | BOTTOM | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | compliant | Mainland China, Taiwan, Thailand | 7.6 | Consumer Electronics,Computing and Data Storage,Healthcare | Computing and Data Storage,Data Storage Devices,Medical Devices | Firmware storage | |||||||||||||||||||
S25FL128SAGMFV003
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 2 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 300 µA | 100 µA | 3.6 V | 2.7 V | CMOS | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | e3 | 3 | 105 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | compliant | 5.65 | Consumer Electronics,Computing and Data Storage,Healthcare | Computing and Data Storage,Data Storage Devices,Medical Devices | Firmware storage | |||||||||||||||||||||||||
S25FL128SAGMFI000
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 4 | 32MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | BOTTOM | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | compliant | Mainland China, Taiwan, Thailand | 7.6 | Consumer Electronics,Computing and Data Storage,Healthcare | Computing and Data Storage,Data Storage Devices,Medical Devices | Firmware storage | |||||||||||||||||||
MX29F040CTI-70G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 8 | 64K | 512KX8 | 5 V | 70 ns | FLASH | YES | YES | 100000 Write/Erase Cycles | 1 | 8 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5 V | 5 µA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G32 | Not Qualified | e6 | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | TSOP1 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Tin/Bismuth (Sn/Bi) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | 4307504 | unknown | Taiwan | 3.15 | Internet of Things (IoT),Environmental M... more | Intelligent Transportation Systems,Gamin... more | Memory chips,Consumer electronics | TSOP1 | TSOP1, TSSOP32,.8,20 | 32 | EAR99 | 8542.32.00.51 | |||||||||||||||
S29GL128P10TFI010
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 1 | 128K | 128MX1 | 3 V | 100 ns | FLASH | 8 | YES | YES | YES | 1 | 128 | 128000000 | 134.2177 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | 2065 | compliant | Taiwan, Thailand | 5.5 | TSOP-56 | ||||||||||||||||||||
MX29F040CQI-70G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Yes | Active | 4.1943 Mbit | 8 | 64K | 512KX8 | 5 V | 70 ns | FLASH | YES | YES | 100000 Write/Erase Cycles | 1 | 8 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5 V | 5 µA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.55 mm | 14.05 mm | 11.43 mm | 4307504 | compliant | Taiwan | 3.15 | Internet of Things (IoT),Environmental M... more | Intelligent Transportation Systems,Gamin... more | Memory chips,Consumer electronics | LCC | ROHS COMPLIANT, PLASTIC, MS-016, LCC-32 | 32 | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||||
MX29GL256FLT2I-90Q
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 16 | 128K | 16MX16 | 3 V | 100 ns | FLASH | 8 | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 10 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 56 | PLASTIC/EPOXY | TSOP1 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | 4307504 | compliant | Taiwan | 4.82 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | TSOP1 | 14 X 20 MM, HALOGEN FREE AND ROHS COMPLIANT, MO-142, TSOP1-56 | 56 | EAR99 | 8542.32.00.51 | ||||||||||||||||
S25FL128SAGNFI000
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 4 | 32MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2065 | compliant | Taiwan, Thailand | 5.75 | Consumer Electronics,Computing and Data Storage,Healthcare | Computing and Data Storage,Data Storage Devices,Medical Devices | Firmware storage | ||||||||||||||||||||
S25FL128SAGNFI003
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 4 | 32MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | BOTTOM | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2065 | compliant | 5.75 | Consumer Electronics,Computing and Data Storage,Healthcare | Computing and Data Storage,Data Storage Devices,Medical Devices | Firmware storage | ||||||||||||||||||||
S25FL128SAGNFI001
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 4 | 32MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | BOTTOM | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2065 | compliant | Taiwan, Thailand | 5.75 | Consumer Electronics,Computing and Data Storage,Healthcare | Computing and Data Storage,Data Storage Devices,Medical Devices | Firmware storage | |||||||||||||||||||
MX29GL256FUXFI-11G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 16 | 128K | 16MX16 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 10 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | 4307504 | unknown | Taiwan | 4.7 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory |