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制造商型号 | 制造商 | 数据手册 |
价格/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 数据速率 | 其他特性 | 功能数量 |
电源
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最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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Source Content uid
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零件包装代码
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包装说明
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针数
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制造商包装代码
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是否符合REACH标准
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HTS代码
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交付时间
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ECCN代码
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Country Of Origin
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YTEOL
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Date Of Intro
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A5191HRTLG-XTP
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onsemi
|
查询价格和库存 |
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Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQFP-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | A5191HRTLG-XTP | QFP | 7.00 X 7.00 MM, GREEN, LQFP-32 | 32 | 561AB | compliant | 8542.39.00.01 | [object Object] | |||||||
MPL360BT-I/Y8X
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Microchip Technology Inc
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查询价格和库存 |
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Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-PQFP-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.2 mm | MPL360BT-I/Y8X | TQFP-48 | compliant | 8542.31.00.01 | [object Object] | 5A992.C | ||||||||||||||||||||
A5191HRTPG-XTP
|
onsemi
|
查询价格和库存 |
|
Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | A5191HRTPG-XTP | QLCC | GREEN, PLASTIC, LCC-28 | 28 | 776AA | compliant | 8542.39.00.01 | [object Object] | |||||||
ST7540
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STMicroelectronics
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查询价格和库存 |
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Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | ST7540 | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | 8542.39.00.01 | [object Object] | EAR99 | |||||||||
MPL360BT-I/SCB
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Microchip Technology Inc
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查询价格和库存 |
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Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-XQCC-N48 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | LCC48,.25SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | 900 µm | MPL360BT-I/SCB | QFN-48 | compliant | 8542.39.00.01 | [object Object] | 5A992.C | ||||||||||||||||||||
ST7540TR
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STMicroelectronics
|
查询价格和库存 |
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Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | ST7540TR | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | 8542.39.00.01 | [object Object] | EAR99 | |||||||||
A5191HRTLG-XTD
|
onsemi
|
查询价格和库存 |
|
Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQFP-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | A5191HRTLG-XTD | QFP | 7.00 X 7.00 MM, GREEN, LQFP-32 | 32 | 561AB | compliant | 8542.39.00.01 | [object Object] | |||||||
TDA5051AT/C1,518
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NXP Semiconductors
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查询价格和库存 |
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Yes | Active | 5 V | CMOS | 5 V | 68 µA | COMMERCIAL | MODEM | R-PDSO-G16 | Not Qualified | 3 | 70 °C | 260 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | TDA5051AT/C1,518 | SOP | SOP, SOP16,.4 | 16 | SOT162-1 | compliant | 8542.39.00.01 | [object Object] | EAR99 | |||||||||||||||
LTC5585IUF#PBF
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Analog Devices Inc
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查询价格和库存 |
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No | Yes | Active | 5 V | CMOS | 1 | INDUSTRIAL | MODEM-DEMODULATOR | S-PQCC-N24 | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | LTC5585IUF#PBF | HVQCCN, | 24 | 05-08-1697 | compliant | Malaysia | 8.5 | ||||||||||||
MPL360B-I/Y8X
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Microchip Technology Inc
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查询价格和库存 |
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Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-PQFP-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.2 mm | MPL360B-I/Y8X | TQFP-48 | compliant | 8542.39.00.01 | [object Object] | 5A992.C | ||||||||||||||||||||
MPL360B-I/SCB
|
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 3.3 V | 1 | INDUSTRIAL | PROGRAMMABLE MODEM | S-XQCC-N48 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | LCC48,.25SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | 900 µm | MPL360B-I/SCB | QFN-48 | compliant | 8542.39.00.01 | [object Object] | 5A992.C | ||||||||||||||||||||
A5191HRTPG-XTD
|
onsemi
|
查询价格和库存 |
|
Yes | Active | 3.3 V | CMOS | 1.2 Mbps | 1 | 3.3/5 V | 600 nA | INDUSTRIAL | MODEM | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | A5191HRTPG-XTD | QLCC | QCCJ, LDCC28,.5SQ | 28 | 776AA | compliant | 8542.39.00.01 | [object Object] | |||||||
DAC8742HPBSR
|
Texas Instruments
|
查询价格和库存 |
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Yes | Yes | Active | 31.25 Mbps | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQFP-G32 | e4 | 3 | 125 °C | -55 °C | 260 | 30 | 32 | PLASTIC/EPOXY | TFQFP | TQFP32,.28SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | QUAD | 5 mm | 5 mm | 1.2 mm | DAC8742HPBSR | TFQFP, TQFP32,.28SQ | compliant | 8542.39.00.01 | EAR99 | Taiwan | 15 | 2017-12-16 | |||||||||||
DS8500-JND+
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Maxim Integrated Products
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查询价格和库存 |
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Yes | Yes | Transferred | 1.2 Mbps | 1 | 3/3.3 V | 285 nA | INDUSTRIAL | MODEM | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.20SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | QFN | HVQCCN, LCC20,.20SQ,25 | 20 | compliant | 8542.39.00.01 | EAR99 | Japan, Mainland China, Malaysia, Philipp... more | 9 | ||||||||
DAC8741HRGET
|
Texas Instruments
|
查询价格和库存 |
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Yes | Yes | Active | 31.25 Mbps | DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQCC-N24 | e4 | 2 | 125 °C | -55 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | DAC8741HRGET | HVQCCN, | compliant | 8542.39.00.01 | EAR99 | 15 | |||||||||||||
DAC8740HRGET
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 31.25 Mbps | DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQCC-N24 | e4 | 2 | 125 °C | -55 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.15SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | DAC8740HRGET | HVQCCN, LCC24,.15SQ,20 | compliant | 15 | 2017-12-16 | |||||||||||||
ST7538QTR
|
STMicroelectronics
|
查询价格和库存 |
|
Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | S-PQFP-G44 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | NICKEL PALLADIUM GOLD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.6 mm | ST7538QTR | QFP | LQFP, QFP44,.47SQ,32 | 44 | compliant | 8542.39.00.01 | [object Object] | EAR99 | |||||||||
ST7538Q
|
STMicroelectronics
|
查询价格和库存 |
|
Active | 5 V | BCDMOS | 4.8 Mbps | 1 | 5,9 V | INDUSTRIAL | MODEM | S-PQFP-G44 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | NICKEL PALLADIUM GOLD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.6 mm | ST7538Q | QFP | LQFP, QFP44,.47SQ,32 | 44 | compliant | 8542.39.00.01 | [object Object] | EAR99 | |||||||||
XK3-C-A1-UT-U
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Digi International Inc
|
查询价格和库存 |
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Active | compliant | [object Object] | 2020-04-01 | |||||||||||||||||||||||||||||||||||||||||||
SI2457-C-FT
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Silicon Laboratories Inc
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查询价格和库存 |
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Yes | Yes | Transferred | 3.3 V | 56 Mbps | 1 | COMMERCIAL | MODEM | S-PDSO-G24 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | TSSOP | ROHS COMPLIANT, TSSOP-24 | 24 | compliant | 8542.39.00.01 |