缓冲放大器封装型号_缓冲放大器厂家价格-bom2buy

							Most Relevant									Technical								Compliance			Operating Conditions					Physical												Dimensions			Other
制造商型号	制造商	数据手册	价格/库存	风险等级	是否无铅	是否Rohs认证	生命周期	最大输入失调电压	标称带宽 (3dB)	标称压摆率	最大平均偏置电流 (IIB)	最大压摆率	功能数量	放大器类型	标称供电电压 (Vsup)	标称负供电电压 (Vsup)	技术	25C 时的最大偏置电流 (IIB)	负供电电压上限	最小输出电流	电源	供电电压上限	温度等级	标称均一增益带宽	JESD-30 代码	认证状态	JESD-609代码	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	包装方法	表面贴装	端子面层	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	Source Content uid	零件包装代码	包装说明	针数	制造商包装代码	是否符合REACH标准	Country Of Origin	ECCN代码	HTS代码	YTEOL
AD8079ARZ-REEL7	Analog Devices Inc		查询价格和库存		No	Yes	Active	20 mV	260 MHz	800 V/us	10 µA		2	BUFFER	5 V	-5 V			-6.3 V			6.3 V	INDUSTRIAL		R-PDSO-G8	Not Qualified	e3	1	85 °C	-40 °C	260	30	8	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE		YES	MATTE TIN	GULL WING	1.27 mm	DUAL	1.75 mm	3.9 mm	4.9 mm	AD8079ARZ-REEL7	SOIC	SOP,	8	R-8	compliant	Taiwan	EAR99	8542.39.00.01	8.5
DS15BA101SD/NOPB	Texas Instruments		查询价格和库存		Yes	Yes	Active					49 mA	1	BUFFER	3.3 V							3.6 V	INDUSTRIAL		S-PDSO-N8		e3	3	85 °C	-40 °C	260	30	8	PLASTIC/EPOXY	HVSON		SQUARE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	TR	YES	MATTE TIN	NO LEAD	500 µm	DUAL	800 µm	3 mm	3 mm	DS15BA101SD/NOPB	SON	HVSON,	8		compliant		EAR99	8542.39.00.01	15
DS15BA101SDE/NOPB	Texas Instruments		查询价格和库存		Yes	Yes	Active					49 mA	1	BUFFER	3.3 V							3.6 V	INDUSTRIAL		S-PDSO-N8		e3	3	85 °C	-40 °C	260	30	8	PLASTIC/EPOXY	HVSON		SQUARE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	TR	YES	MATTE TIN	NO LEAD	500 µm	DUAL	800 µm	3 mm	3 mm	DS15BA101SDE/NOPB	SON	HVSON,	8		compliant		EAR99	8542.39.00.01	15
MAX4219ESD+	Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	10 mV	200 MHz	600 V/us	12 µA	21 mA	3	BUFFER	5 V		BIPOLAR			60 mA	3.3/5/+-5 V	12 V	INDUSTRIAL		R-PDSO-G14	Not Qualified	e3	1	85 °C	-40 °C	260	30	14	PLASTIC/EPOXY	SOP	SOP14,.25	RECTANGULAR	SMALL OUTLINE		YES	MATTE TIN	GULL WING	1.27 mm	DUAL	1.75 mm	3.9 mm	8.65 mm		SOIC	SOP, SOP14,.25	14		compliant	Japan, Mainland China, Malaysia, Philipp... more	EAR99	8542.39.00.01	9
THS7327PHP	Texas Instruments		查询价格和库存		Yes	Yes	Active		500 MHz	1050 V/us	3.5 µA		1	BUFFER	3.3 V		CMOS			45 mA		5.5 V	INDUSTRIAL		S-PQFP-G48	Not Qualified	e4	3	85 °C	-40 °C	260	30	48	PLASTIC/EPOXY	HTFQFP		SQUARE	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TRAY	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	1.2 mm	7 mm	7 mm	THS7327PHP	QFP	HTFQFP,	48		compliant	Taiwan	EAR99	8542.33.00.01	15
THS7327PHPR	Texas Instruments		查询价格和库存		Yes	Yes	Active		500 MHz	1050 V/us	3.5 µA		1	BUFFER	3.3 V		CMOS			45 mA		5.5 V	INDUSTRIAL		S-PQFP-G48	Not Qualified	e4	3	85 °C	-40 °C	260	30	48	PLASTIC/EPOXY	HTFQFP		SQUARE	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TR	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	1.2 mm	7 mm	7 mm	THS7327PHPR	QFP	HTFQFP,	48		compliant	Taiwan	EAR99	8542.33.00.01	15
AD8074ARUZ	Analog Devices Inc		查询价格和库存		No	Yes	Active	27 mV	600 MHz	1600 V/us	9.5 µA	30 mA	3	BUFFER	5 V	-5 V		9.5 µA	-6 V		+-5 V	6 V	INDUSTRIAL		R-PDSO-G16	Not Qualified	e3	1	85 °C	-40 °C	260	30	16	PLASTIC/EPOXY	TSSOP	TSSOP16,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		YES	MATTE TIN	GULL WING	650 µm	DUAL	1.2 mm	4.4 mm	5 mm	AD8074ARUZ	TSSOP	TSSOP, TSSOP16,.25	16	RU-16	compliant	Malaysia	EAR99	8542.39.00.01	8.5
AD8074ARUZ-REEL	Analog Devices Inc		查询价格和库存		No	Yes	Active	27 mV	600 MHz	1600 V/us	9.5 µA	30 mA	3	BUFFER	5 V	-5 V		9.5 µA	-6 V		+-5 V	6 V	INDUSTRIAL		R-PDSO-G16	Not Qualified	e3	1	85 °C	-40 °C	260	30	16	PLASTIC/EPOXY	TSSOP	TSSOP16,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		YES	MATTE TIN	GULL WING	650 µm	DUAL	1.2 mm	4.4 mm	5 mm	AD8074ARUZ-REEL	TSSOP	TSSOP, TSSOP16,.25	16	RU-16	compliant	Malaysia	EAR99	8542.39.00.01	8.5
OPA692IDBVT	Texas Instruments		查询价格和库存		Yes	Yes	Active	2.5 mV	280 MHz	2100 V/us		5.1 mA	1	BUFFER	5 V	-5 V	BIPOLAR	45 µA	-6.5 V	10 A		6.5 V	INDUSTRIAL	280 Hz	R-PDSO-G6	Not Qualified	e4	2	85 °C	-40 °C	260	30	6	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TR	YES	NICKEL PALLADIUM GOLD	GULL WING	950 µm	DUAL	1.45 mm	1.6 mm	2.9 mm	OPA692IDBVT	SOT-23	LSSOP,	6		compliant		EAR99	8542.33.00.01	15
ADCLK905BCPZ-R7	Analog Devices Inc		查询价格和库存		No	Yes	Active						1	BUFFER	3.3 V					35 mA		6 V	AUTOMOTIVE		S-XQCC-N16	Not Qualified	e3	3	125 °C	-40 °C	260	30	16	UNSPECIFIED	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		YES	MATTE TIN	NO LEAD	500 µm	QUAD	900 µm	3 mm	3 mm	ADCLK905BCPZ-R7	QFN	HVQCCN,	16	CP-16-27	compliant	South Korea	EAR99	8542.39.00.01	8.5
OPA692IDBVR	Texas Instruments		查询价格和库存		Yes	Yes	Active	2.5 mV	280 MHz	2100 V/us		5.1 mA	1	BUFFER	5 V	-5 V	BIPOLAR	45 µA	-6.5 V	10 A		6.5 V	INDUSTRIAL	280 Hz	R-PDSO-G6	Not Qualified	e4	2	85 °C	-40 °C	260	30	6	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TR	YES	NICKEL PALLADIUM GOLD	GULL WING	950 µm	DUAL	1.45 mm	1.6 mm	2.9 mm	OPA692IDBVR	SOT-23	LSSOP,	6		compliant		EAR99	8542.33.00.01	15
THS7347IPHPR	Texas Instruments		查询价格和库存		Yes	Yes	Active		550 MHz	1050 V/us	3.5 µA		1	BUFFER	3.3 V		CMOS			45 mA		5.5 V	INDUSTRIAL		S-PQFP-G48	Not Qualified	e4	3	85 °C	-40 °C	260	30	48	PLASTIC/EPOXY	HTFQFP		SQUARE	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TR	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	1.2 mm	7 mm	7 mm	THS7347IPHPR	QFP	HTFQFP,	48		compliant	Taiwan	EAR99	8542.33.00.01	15
ADCLK914BCPZ-R7	Analog Devices Inc		查询价格和库存		No	Yes	Active						1	BUFFER	3.3 V		BICMOS					6 V	AUTOMOTIVE		S-XQCC-N16	Not Qualified	e3	3	125 °C	-40 °C	260	40	16	UNSPECIFIED	HVQCCN		SQUARE	CHIP CARRIER		YES	MATTE TIN	NO LEAD	500 µm	QUAD	900 µm	3 mm	3 mm	ADCLK914BCPZ-R7	QFN	HVQCCN,	16	CP-16-22	compliant	South Korea	EAR99	8542.39.00.01	8.5
ADCLK925BCPZ-R7	Analog Devices Inc		查询价格和库存		No	Yes	Active						1	BUFFER	3.3 V					35 mA		6 V	AUTOMOTIVE		S-XQCC-N16	Not Qualified	e3	3	125 °C	-40 °C	260	30	16	UNSPECIFIED	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		YES	MATTE TIN	NO LEAD	500 µm	QUAD	900 µm	3 mm	3 mm	ADCLK925BCPZ-R7	QFN	HVQCCN,	16	CP-16-27	compliant	South Korea	EAR99	8542.39.00.01	8.5
THS7347IPHP	Texas Instruments		查询价格和库存		Yes	Yes	Active		550 MHz	1050 V/us	3.5 µA		1	BUFFER	3.3 V		CMOS			45 mA		5.5 V	INDUSTRIAL		S-PQFP-G48	Not Qualified	e4	3	85 °C	-40 °C	260	30	48	PLASTIC/EPOXY	HTFQFP		SQUARE	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TRAY	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	1.2 mm	7 mm	7 mm	THS7347IPHP	QFP	HTFQFP,	48		compliant	Taiwan	EAR99	8542.33.00.01	15
ADCLK905BCPZ-WP	Analog Devices Inc		查询价格和库存		No	Yes	Active						1	BUFFER	3.3 V					35 mA		6 V	AUTOMOTIVE		S-XQCC-N16	Not Qualified	e3	3	125 °C	-40 °C	260	30	16	UNSPECIFIED	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		YES	MATTE TIN	NO LEAD	500 µm	QUAD	900 µm	3 mm	3 mm	ADCLK905BCPZ-WP	QFN	HVQCCN,	16	CP-16-27	compliant	South Korea	EAR99	8542.39.00.01	8.5
ADCLK914BCPZ-R2	Analog Devices Inc		查询价格和库存		No	Yes	Active						1	BUFFER	3.3 V		BICMOS					6 V	AUTOMOTIVE		S-XQCC-N16	Not Qualified	e3	3	125 °C	-40 °C	260	40	16	UNSPECIFIED	HVQCCN		SQUARE	CHIP CARRIER		YES	MATTE TIN	NO LEAD	500 µm	QUAD	900 µm	3 mm	3 mm	ADCLK914BCPZ-R2	QFN	HVQCCN,	16	CP-16-22	compliant	South Korea	EAR99	8542.39.00.01	8.5
AD8075ARUZ-REEL	Analog Devices Inc		查询价格和库存		No	Yes	Active	40 mV	550 MHz	1350 V/us	10 µA	30 mA	3	BUFFER	5 V	-5 V		10 µA	-6 V		+-5 V	6 V	INDUSTRIAL		R-PDSO-G16	Not Qualified	e3	1	85 °C	-40 °C	260	30	16	PLASTIC/EPOXY	TSSOP	TSSOP16,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		YES	MATTE TIN	GULL WING	650 µm	DUAL	1.2 mm	4.4 mm	5 mm	AD8075ARUZ-REEL	TSSOP	TSSOP, TSSOP16,.25	16	RU-16	compliant	Malaysia	EAR99	8542.39.00.01	8.5
THS7353PWR	Texas Instruments		查询价格和库存		Yes	Yes	Active		150 MHz	300 V/us	5 µA		1	BUFFER	3.3 V		CMOS			40 mA		5.5 V	INDUSTRIAL		R-PDSO-G20	Not Qualified	e4	1	85 °C	-40 °C	260	30	20	PLASTIC/EPOXY	TSSOP	TSSOP20,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TR	YES	NICKEL PALLADIUM GOLD	GULL WING	650 µm	DUAL	1.2 mm	4.4 mm	6.5 mm	THS7353PWR	TSSOP	TSSOP, TSSOP20,.25	20		compliant	Taiwan	EAR99	8542.33.00.01	15
ADCLK905BCPZ-R2	Analog Devices Inc		查询价格和库存		No	Yes	Active						1	BUFFER	3.3 V					35 mA		6 V	AUTOMOTIVE		S-XQCC-N16	Not Qualified	e3	3	125 °C	-40 °C	260	30	16	UNSPECIFIED	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		YES	MATTE TIN	NO LEAD	500 µm	QUAD	900 µm	3 mm	3 mm	ADCLK905BCPZ-R2	QFN	HVQCCN,	16	CP-16-27	compliant	South Korea	EAR99	8542.39.00.01	8.5

1 2 3 4 5 下一页

ICP经营许可证苏B2-20140176 苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司

苏公网安备 32059002001042号

联系我们

美国总部

61 South Fair Oaks Avenue, Suite 200

Pasadena, CA 91105, USA

苏州总部

苏州工业园区新平街 388 号腾飞创新园 B 幢 705

江苏省苏州市, 215021

深圳分部

深圳市南山区粤海街道深圳湾科技生态园 11 栋 A 座 28 层 01 室

广东省深圳市, 518057

邮箱：service@bom2buy.com

电话：(0512) 62988549

缓冲放大器:

站内导航

友情链接

联系我们

美国总部

苏州总部

深圳分部

创建 BOM

确认BOM数据

上传失败

正在上传

登录

缓冲放大器:

站内导航

友情链接

联系我们

美国总部

苏州总部

深圳分部