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其他内存集成电路:

57,975 个筛选结果
SRAM (554,964)
闪存 (306,868)
DRAM (266,855)
EEPROM (150,509)
FIFO (72,736)
OTP ROM (40,083)
EPROM (23,319)
MASK ROM (10,201)
PROM (70)
最长访问时间 (50)
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最大时钟频率 (fCLK) (49)
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制造商 (50)
内存密度 (50)
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内存宽度 (18)
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组织 (50)
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
制造商型号 制造商 数据手册 价格/库存
风险等级 是否无铅 是否Rohs认证
生命周期 内存密度 内存宽度 组织 标称供电电压 (Vsup)
电源
最长访问时间 最大时钟频率 (fCLK) 内存集成电路类型 混合内存类型 功能数量 端口数量 字数代码 字数 工作模式 最大待机电流
最大压摆率
最大供电电压 (Vsup)
最小供电电压 (Vsup)
技术 温度等级
JESD-30 代码 认证状态
JESD-609代码 湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度) 筛选级别
处于峰值回流温度下的最长时间
端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 表面贴装
端子面层
端子形式
端子节距
端子位置
座面最大高度
长度 宽度
Objectid
零件包装代码
包装说明
针数
是否符合REACH标准
ECCN代码
HTS代码
Samacsys Manufacturer
Samacsys Modified On
Source Content uid
交付时间
Date Of Intro
Country Of Origin
YTEOL
MR25H40CDF
Everspin Technologies
查询价格和库存
Yes Active 4.1943 Mbit 8 512KX8 3.3 V 3.3 V MEMORY CIRCUIT 1 512000 524.288 k SYNCHRONOUS 400 µA 42 µA 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-N8 Not Qualified 3 85 °C -40 °C 260 8 PLASTIC/EPOXY HVSON SOLCC8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 900 µm 6 mm 5 mm 1154608003 SON DFN-8 8 compliant EAR99 8542.32.00.71 Everspin Technologies 2021-10-25 08:36:49
MR2A16ACYS35
Everspin Technologies
查询价格和库存
Yes Yes Active 4.1943 Mbit 16 256KX16 3.3 V 3.3 V 35 ns MEMORY CIRCUIT 1 256000 262.144 k ASYNCHRONOUS 28 mA 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified 3 85 °C -40 °C 260 40 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm 1811745698 TSOP2 TSOP2, TSOP44,.46,32 44 compliant EAR99 8542.32.00.71 Everspin Technologies 2019-07-31 11:30:55
MR2A16AYS35
Everspin Technologies
查询价格和库存
Yes Active 4.1943 Mbit 16 256KX16 3.3 V 3.3 V 35 ns MEMORY CIRCUIT 1 256000 262.144 k ASYNCHRONOUS 28 mA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G44 Not Qualified 3 70 °C 260 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm 1811745699 TSOP2 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 44 compliant EAR99 8542.32.00.71
47C16-I/SN
Microchip Technology Inc
查询价格和库存
Yes Active 16.384 kbit 8 2KX8 5 V 400 ns MEMORY CIRCUIT EEPROM+SRAM 1 1 2000 2.048 k SYNCHRONOUS 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G8 e3 3 85 °C -40 °C 260 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm 8202486541 SOIC-8 compliant EAR99 8542.32.00.51 47C16-I/SN 12 weeks 2016-10-10
MR0A08BYS35
Everspin Technologies
查询价格和库存
Yes Active 1.0486 Mbit 8 128KX8 3.3 V 3.3 V 35 ns MEMORY CIRCUIT 1 128000 131.072 k ASYNCHRONOUS 7 mA 65 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G44 Not Qualified 3 70 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm 1882163111 TSOP2 TSOP2, TSOP44,.46,32 44 compliant EAR99 8542.32.00.71
USBF129T-I/SN
Microchip Technology Inc
查询价格和库存
Yes Active 4.1943 Mbit 8 512KX8 MEMORY CIRCUIT 1 1 512000 524.288 k SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 e3 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm 8162967414 SOIC-8 compliant EAR99 8542.31.00.01 USBF129T-I/SN 28 weeks 2016-03-10
47L16-I/SN
Microchip Technology Inc
查询价格和库存
Yes Active 16.384 kbit 8 2KX8 400 ns MEMORY CIRCUIT EEPROM+SRAM 1 1 2000 2.048 k SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 e3 3 85 °C -40 °C 260 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm 8202486561 SOIC-8 compliant EAR99 8542.32.00.51 47L16-I/SN 52 weeks 2016-10-10
47L16-E/SN
Microchip Technology Inc
查询价格和库存
Yes Active 16.384 kbit 8 2KX8 400 ns MEMORY CIRCUIT EEPROM+SRAM 1 1 2000 2.048 k SYNCHRONOUS 3.6 V 2.7 V CMOS AUTOMOTIVE R-PDSO-G8 e3 3 125 °C -40 °C 260 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm 8202486558 SOIC-8 compliant EAR99 8542.32.00.71 47L16-E/SN 52 weeks 2016-10-10
MR25H10CDF
Everspin Technologies
查询价格和库存
Yes Active 1.0486 Mbit 8 128KX8 3 V 3/3.3 V MEMORY CIRCUIT 1 128000 131.072 k SYNCHRONOUS 115 µA 27 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-N8 Not Qualified e3 3 85 °C -40 °C 260 30 8 PLASTIC/EPOXY HVSON SOLCC8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 1.27 mm DUAL 900 µm 6 mm 5 mm 1053930318 SON DFN-8 8 compliant EAR99 8542.32.00.71 Everspin Technologies 2021-09-24 06:26:16
MR256A08BCMA35
Everspin Technologies
查询价格和库存
Yes Active 262.144 kbit 8 32KX8 3.3 V 3.3 V 35 ns MEMORY CIRCUIT 1 32000 32.768 k ASYNCHRONOUS 7 mA 65 µA 3.6 V 3 V CMOS INDUSTRIAL S-PBGA-B48 Not Qualified 3 85 °C -40 °C 48 PLASTIC/EPOXY LFBGA BGA48,6X8,30 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 750 µm BOTTOM 1.35 mm 8 mm 8 mm 1029992961 BGA LFBGA, BGA48,6X8,30 48 compliant EAR99 8542.32.00.71 Everspin Technologies 2022-05-02 06:28:35
47L04-I/SN
Microchip Technology Inc
查询价格和库存
Yes Active 4.096 kbit 8 512X8 400 ns MEMORY CIRCUIT EEPROM+SRAM 1 1 512 512 words SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 e3 3 85 °C -40 °C 260 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm 8202486551 SOIC-8 compliant EAR99 8542.32.00.51 47L04-I/SN 52 weeks 2016-10-10
47L04-I/ST
Microchip Technology Inc
查询价格和库存
Yes Active 4.096 kbit 8 512X8 400 ns MEMORY CIRCUIT EEPROM+SRAM 1 1 512 512 words SYNCHRONOUS 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 e3 1 85 °C -40 °C 260 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) - annealed GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm 8202486552 TSSOP-8 compliant EAR99 8542.32.00.51 47L04-I/ST 52 weeks 2016-10-10
MR4A16BMA35
Everspin Technologies
查询价格和库存
Yes Active 16.7772 Mbit 16 1MX16 3.3 V 3.3 V 35 ns MEMORY CIRCUIT N/A 1 1000000 1.0486 M ASYNCHRONOUS 14 mA 3.6 V 3 V CMOS COMMERCIAL S-PBGA-B48 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY LFBGA BGA48,6X8,30 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 750 µm BOTTOM 1.35 mm 10 mm 10 mm 1877295184 BGA LFBGA, BGA48,6X8,30 48 compliant EAR99 8542.32.00.71
47C04-I/SN
Microchip Technology Inc
查询价格和库存
Yes Active 4.096 kbit 8 512X8 5 V 400 ns MEMORY CIRCUIT EEPROM+SRAM 1 1 512 512 words SYNCHRONOUS 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G8 e3 3 85 °C -40 °C 260 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm 8202486531 SOIC-8 compliant EAR99 8542.32.00.51 47C04-I/SN 52 weeks 2016-10-10
MR4A16BCYS35
Everspin Technologies
查询价格和库存
Yes Active 16.7772 Mbit 16 1MX16 3.3 V 3.3 V 35 ns MEMORY CIRCUIT 1 1000000 1.0486 M ASYNCHRONOUS 14 mA 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G54 Not Qualified e3 3 85 °C -40 °C 260 54 PLASTIC/EPOXY TSOP2 TSOP54,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 1877295178 TSSOP2 TSOP2, TSOP54,.46,32 54 compliant EAR99 8542.32.00.71
MR4A16BCMA35
Everspin Technologies
查询价格和库存
Yes Active 16.7772 Mbit 16 1MX16 3.3 V 3.3 V 35 ns MEMORY CIRCUIT N/A 1 1000000 1.0486 M ASYNCHRONOUS 14 mA 3.6 V 3 V CMOS INDUSTRIAL S-PBGA-B48 Not Qualified 6 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY LFBGA BGA48,6X8,30 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 750 µm BOTTOM 1.35 mm 10 mm 10 mm 1877295172 BGA FBGA-48 48 compliant EAR99 8542.32.00.71
DS2401+T&R
Maxim Integrated Products
查询价格和库存
Yes Yes Active 64 bit 1 64X1 5 V 3/5 V MEMORY CIRCUIT 1 64 64 words ASYNCHRONOUS 6 V 2.8 V CMOS INDUSTRIAL O-PBCY-T3 Not Qualified e3 85 °C -40 °C 250 3 PLASTIC/EPOXY TO-92 ROUND CYLINDRICAL NO MATTE TIN THROUGH-HOLE BOTTOM 2063091873 TO-92 TO-92, SIP3,.1,50 3 compliant EAR99 8542.39.00.01 Japan, Mainland China, Malaysia, Philipp... more 9
DS2401+
Maxim Integrated Products
查询价格和库存
Yes Yes Active 64 bit 1 64X1 5 V 3/5 V MEMORY CIRCUIT 1 64 64 words ASYNCHRONOUS 6 V 2.8 V CMOS INDUSTRIAL O-PBCY-T3 Not Qualified e3 1 85 °C -40 °C 250 30 3 PLASTIC/EPOXY TO-92 ROUND CYLINDRICAL NO MATTE TIN THROUGH-HOLE BOTTOM 2063091870 TO-92 TO-92, SIP3,.1,50 3 compliant EAR99 8542.39.00.01 Maxim Integrated 2019-07-16 09:31:27 Japan, Mainland China, Malaysia, Philipp... more 9
MR2A16ACMA35
Everspin Technologies
查询价格和库存
Yes Active 4.1943 Mbit 16 256KX16 3.3 V 3.3 V 35 ns MEMORY CIRCUIT 1 256000 262.144 k ASYNCHRONOUS 28 mA 3.6 V 3 V CMOS INDUSTRIAL S-PBGA-B48 Not Qualified 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY LFBGA BGA48,6X8,30 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 750 µm BOTTOM 1.35 mm 8 mm 8 mm 1784054073 BGA LFBGA, BGA48,6X8,30 48 compliant EAR99 8542.32.00.71
CC2544RHBR
Texas Instruments
查询价格和库存
Yes Yes Active 2.496 GHz MEMORY CIRCUIT 3.6 V 2 V AUTOMOTIVE S-PQCC-N32 e4 3 125 °C -40 °C 260 30 PLASTIC/EPOXY HVQCCN LCC32,.2SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD SILVER NO LEAD 500 µm QUAD 1 mm 5 mm 5 mm 1165389312 HVQCCN, LCC32,.2SQ,20 compliant 5A992.C 8542.31.00.01 Texas Instruments 2021-12-06 06:27:46 CC2544RHBR 15
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