型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 运营商类型 | 数据速率 | 运营商类型(2) | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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mfrid
|
零件包装代码
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包装说明
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针数
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是否符合REACH标准
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HTS代码
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ECCN代码
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YTEOL
|
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DS2175SN+
Rochester Electronics LLC
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | INDUSTRIAL | ELASTIC BUFFER | R-PDSO-G16 | e3 | COMMERCIAL | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 2178096 | SOIC | SOP, | 16 | unknown | ||||||||||
DS2175SN
Rochester Electronics LLC
|
查询价格和库存 |
|
No | No | Active | 5 V | CMOS | 1 | INDUSTRIAL | ELASTIC BUFFER | R-PDSO-G16 | e0 | COMMERCIAL | 1 | 85 °C | -40 °C | 245 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 2178096 | SOIC | 0.300 INCH, SOIC-16 | 16 | unknown | ||||||||||
LXP2175NC
Level One
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | COMMERCIAL | ELASTIC BUFFER | R-PDIP-T16 | e0 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 4317302 | DIP, DIP16,.3 | unknown | 8542.39.00.01 | ||||||||||||||||||
LXP2175NE
Level One
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | INDUSTRIAL | ELASTIC BUFFER | R-PDIP-T16 | e0 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 4317302 | DIP, DIP16,.3 | unknown | 8542.39.00.01 | |||||||||||||||||
LXP2175SC
Level One
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | COMMERCIAL | ELASTIC BUFFER | R-PDSO-G16 | e0 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.3 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 4317302 | SOIC | SOP, SOP16,.3 | 16 | unknown | 8542.39.00.01 | |||||||||||||
LXP2175SE
Level One
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | INDUSTRIAL | ELASTIC BUFFER | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 4317302 | SOP, SOP16,.4 | unknown | 8542.39.00.01 | |||||||||||||||||
DS2175S
Rochester Electronics LLC
|
查询价格和库存 |
|
No | No | Active | 5 V | CMOS | 1 | COMMERCIAL | ELASTIC BUFFER | R-PDSO-G16 | e0 | COMMERCIAL | 1 | 70 °C | 245 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 2178096 | SOIC | SOP, | 16 | unknown | |||||||||||
DS2175
Rochester Electronics LLC
|
查询价格和库存 |
|
No | No | Active | 5 V | CMOS | 1 | COMMERCIAL | ELASTIC BUFFER | R-PDIP-T16 | e0 | COMMERCIAL | 1 | 70 °C | 240 | 20 | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 19.175 mm | 4.572 mm | 2178096 | DIP | DIP, | 16 | unknown | |||||||||||
DS2175N
Rochester Electronics LLC
|
查询价格和库存 |
|
No | No | Active | 5 V | CMOS | 1 | INDUSTRIAL | ELASTIC BUFFER | R-PDIP-T16 | e0 | COMMERCIAL | 1 | 85 °C | -40 °C | 240 | 20 | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 19.175 mm | 4.572 mm | 2178096 | DIP | DIP, | 16 | unknown | ||||||||||
DS2176
Rochester Electronics LLC
|
查询价格和库存 |
|
No | No | Active | 5 V | CMOS | 1 | COMMERCIAL | ELASTIC BUFFER | R-PDIP-T24 | e0 | COMMERCIAL | 1 | 70 °C | 240 | 20 | 24 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 30.545 mm | 4.572 mm | 2178096 | DIP | DIP, | 24 | unknown | |||||||||||
DS2176Q
Rochester Electronics LLC
|
查询价格和库存 |
|
No | No | Active | 5 V | CMOS | 1 | COMMERCIAL | ELASTIC BUFFER | S-PQCC-J28 | e0 | COMMERCIAL | 1 | 70 °C | 245 | NOT SPECIFIED | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 11.505 mm | 11.505 mm | 4.57 mm | 2178096 | QLCC | QCCJ, | 28 | unknown | |||||||||||
LXP2176PE
Level One
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | CEPT PCM-30/E-1 | 2.048 Gbps | T-1(DS1) | 1 | 10 mA | INDUSTRIAL | ELASTIC BUFFER | S-PQCC-J28 | e0 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 4317302 | QCCJ, LDCC28,.5SQ | unknown | 8542.39.00.01 | |||||||||||||
LXP2176NE
Level One
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | CEPT PCM-30/E-1 | 2.048 Gbps | T-1(DS1) | 1 | 10 mA | INDUSTRIAL | ELASTIC BUFFER | R-PDIP-T24 | e0 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 4317302 | DIP, DIP24,.3 | unknown | 8542.39.00.01 | |||||||||||||
DS2175S+T&R
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | 2.048 Gbps | 1 | 16 µA | COMMERCIAL | ELASTIC BUFFER | R-PDSO-G16 | e3 | Not Qualified | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 2164 | SOIC | 0.300 INCH, SOIC-16 | 16 | compliant | 8542.32.00.71 | EAR99 | 0 | ||||
DS2175+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | 2.048 Gbps | 1 | 16 µA | COMMERCIAL | ELASTIC BUFFER | R-PDIP-T16 | e3 | Not Qualified | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 19.175 mm | 4.572 mm | 2164 | DIP | 0.300 INCH, DIP-16 | 16 | compliant | 8473.30.11.40 | EAR99 | 0 | ||||
DS2175S+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | 2.048 Gbps | 1 | 16 µA | COMMERCIAL | ELASTIC BUFFER | R-PDSO-G16 | e3 | Not Qualified | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 2164 | SOIC | 0.300 INCH, SOIC-16 | 16 | compliant | 8542.32.00.71 | EAR99 | 0 | ||||
DS2175S
Dallas Semiconductor
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | 16 mA | COMMERCIAL | ELASTIC BUFFER | R-PDSO-G16 | e0 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 285649165 | 0.300 INCH, SOIC-16 | unknown | |||||||||||||||
DS2175
Dallas Semiconductor
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | 16 mA | COMMERCIAL | ELASTIC BUFFER | R-PDIP-T16 | e0 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 285649165 | 0.300 INCH, DIP-16 | unknown | ||||||||||||||||||
DS2175N
Dallas Semiconductor
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | 16 mA | INDUSTRIAL | ELASTIC BUFFER | R-PDIP-T16 | e0 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 285649165 | 0.300 INCH, DIP-16 | unknown | |||||||||||||||||
DS2175SN+T&R
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | 2.048 Gbps | 1 | 16 µA | INDUSTRIAL | ELASTIC BUFFER | R-PDSO-G16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 2164 | SOIC | SOP, SOP16,.4 | 16 | compliant | 8542.39.00.01 | 0 |