其他电信集成电路封装型号_其他电信集成电路厂家价格-bom2buy

						Most Relevant					Technical				Compliance			Operating Conditions						Physical											Dimensions			Other
制造商型号	Composite Price	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	收发器数量	数据速率	电信集成电路类型	功能数量	电源	最大压摆率	温度等级	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	筛选级别	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	包装说明	是否符合REACH标准	ECCN代码	HTS代码	交付时间	Date Of Intro	Samacsys Manufacturer	零件包装代码	针数	制造商包装代码
RN4678-V/RM100 Microchip Technology Inc	查询价格				Active	1.9 V			1 Gbps	TELECOM CIRCUIT	1			OTHER	R-XXMA-N33				70 °C	-20 °C		TS 16949		33	UNSPECIFIED			RECTANGULAR	MICROELECTRONIC ASSEMBLY	YES		NO LEAD		UNSPECIFIED	12 mm	22 mm	2.4 mm	RN4678-V/RM100	MODULE-33	compliant	5A992.C	8529.90.22.00	4 weeks 3 days
RN4871-I/RM128 Microchip Technology Inc	查询价格				Active	3.3 V			10 Mbps	TELECOM CIRCUIT	1			INDUSTRIAL	R-XXMA-N16				85 °C	-40 °C				16	UNSPECIFIED		MODULE,16LEAD(UNSPEC)	RECTANGULAR	MICROELECTRONIC ASSEMBLY	NO		NO LEAD	1.2 mm	UNSPECIFIED	9 mm	11.5 mm	2.1 mm		MODULE-16	compliant	5A992.C	8529.90.22.00	13 weeks
RN4871-V/RM118 Microchip Technology Inc	查询价格				Active					TELECOM CIRCUIT																												RN4871-V/RM118		compliant	5A992.C	8529.90.22.00	12 weeks	2016-04-26
IS1870SF-202 Microchip Technology Inc	查询价格				Active	3 V				TELECOM CIRCUIT	1			INDUSTRIAL	S-XQCC-N48				85 °C	-40 °C		TS 16949		48	UNSPECIFIED	HVQCCN	LCC48,.24SQ,16	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES		NO LEAD	400 µm	QUAD	6 mm	6 mm	900 µm	IS1870SF-202	QFN-48	compliant	5A992.C	8517.70.00.00
RN4870-V/RM118 Microchip Technology Inc	查询价格				Active	3.3 V			10 Mbps	TELECOM CIRCUIT	1			COMMERCIAL	R-XXMA-N33				70 °C	-20 °C				33	UNSPECIFIED		MODULE,33LEAD(UNSPEC)	RECTANGULAR	MICROELECTRONIC ASSEMBLY	NO		NO LEAD	1.1 mm	UNSPECIFIED	12 mm	22 mm	2.4 mm	RN4870-V/RM118	MODULE-33	compliant	5A992.C	8529.90.22.00	4 weeks 1 day	2016-04-26
ATA8403C-6AQY-66 Microchip Technology Inc	查询价格				Active	3 V				TELECOM CIRCUIT	1			OTHER	S-PDSO-G8				85 °C	-55 °C				8	PLASTIC/EPOXY	TSSOP		SQUARE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES		GULL WING	650 µm	DUAL	3 mm	3 mm	1.05 mm	ATA8403C-6AQY-66	TSSOP-8	compliant		8542.39.00.01	18 weeks
IS1871SF-202 Microchip Technology Inc	查询价格				Active	3 V				TELECOM CIRCUIT	1			INDUSTRIAL	S-XQCC-N32				85 °C	-40 °C		TS 16949		32	UNSPECIFIED	HVQCCN	LCC32,.16SQ,16	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES		NO LEAD	400 µm	QUAD	4 mm	4 mm	900 µm	IS1871SF-202	QFN-32	compliant		8542.39.00.01
RN4871U-V/RM118 Microchip Technology Inc	查询价格				Active					TELECOM CIRCUIT																												RN4871U-V/RM118		compliant	5A992.C	8529.90.22.00	12 weeks	2016-04-26
CYW4343WKUBGT Cypress Semiconductor	查询价格				Active	1.2 V				TELECOM CIRCUIT	1			OTHER	R-PBGA-B74				70 °C	-30 °C				74	PLASTIC/EPOXY	VFBGA		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES		BALL	400 µm	BOTTOM	2.87 mm	4.87 mm	550 µm		VFBGA,	compliant		8542.39.00.01			Cypress Semiconductor
RN4020-V/RMBEC133 Microchip Technology Inc	查询价格				Active	3.3 V				TELECOM CIRCUIT	1			OTHER	R-XXMA-N24				85 °C	-30 °C		TS 16949		24	UNSPECIFIED			RECTANGULAR	MICROELECTRONIC ASSEMBLY	YES		NO LEAD		UNSPECIFIED	11.5 mm	19.5 mm	2.3 mm	RN4020-V/RMBEC133	MODULE-24	compliant	5A992.C	8529.90.22.00	10 weeks
TLK2501IRCPR Texas Instruments	查询价格		Yes	Yes	Active	2.5 V		1	2.5 Tbps	TELECOM CIRCUIT	1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		NOT SPECIFIED	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK2501IRCPR	HVFQFP, TQFP64,.47SQ	compliant	5A991.B.1	8542.39.00.01	6 weeks			QFP	64
TLK2501IRCP Texas Instruments	查询价格		Yes	Yes	Active	2.5 V		1	2.5 Tbps	TELECOM CIRCUIT	1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		NOT SPECIFIED	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK2501IRCP	HVFQFP, TQFP64,.47SQ	compliant	5A991.B.1	8542.39.00.01	1 week		Texas Instruments	QFP	64
MRF24J40ME-I/RM Microchip Technology Inc	查询价格		Yes		Active	3.3 V				TELECOM CIRCUIT	1			INDUSTRIAL	R-XDMA-N12				85 °C	-40 °C		TS 16949		12	UNSPECIFIED			RECTANGULAR	MICROELECTRONIC ASSEMBLY	NO		NO LEAD	2.54 mm	DUAL	22.86 mm	33.02 mm	3.48 mm	MRF24J40ME-I/RM	MODULE-12	compliant	5A992.C	8529.90.22.00	11 weeks 6 days
MCP2122-E/SN Microchip Technology Inc	查询价格		Yes	Yes	Active	5 V	CMOS			TELECOM CIRCUIT	1	2/5 V	1 µA	AUTOMOTIVE	R-PDSO-G8	e3	Not Qualified	3	125 °C	-40 °C	260		40	8	PLASTIC/EPOXY	SOP	SOP8,.25	RECTANGULAR	SMALL OUTLINE	YES	Matte Tin (Sn)	GULL WING	1.27 mm	DUAL	3.91 mm	4.9 mm	1.75 mm	MCP2122-E/SN	0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8	compliant	EAR99	8542.39.00.01	7 weeks			SOIC	8
HTRC11001T/02EE,11 NXP Semiconductors	查询价格			Yes	Active	5 V				TELECOM CIRCUIT	1	5 V	10 µA	INDUSTRIAL	R-PDSO-G14	e4	Not Qualified	1	85 °C	-40 °C	260		30	14	PLASTIC/EPOXY	SOP	SOP14,.25	RECTANGULAR	SMALL OUTLINE	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	1.27 mm	DUAL	4 mm	8.75 mm		HTRC11001T/02EE,11	SOP, SOP14,.25	compliant		8542.39.00.01			NXP	SOIC	14	SOT108-1
SA616DK/01,118 NXP Semiconductors	查询价格			Yes	Active	3 V				TELECOM CIRCUIT	1			INDUSTRIAL	R-PDSO-G20	e4	Not Qualified	1	85 °C	-40 °C	260		NOT SPECIFIED	20	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	650 µm	DUAL	4.4 mm	6.5 mm	1.5 mm	SA616DK/01,118	LSSOP,	compliant		8542.39.00.01				SSOP2	20	SOT266-1
TLK1501IRCPR Texas Instruments	查询价格		Yes	Yes	Active	2.5 V	TTL		2.5 Tbps	TELECOM CIRCUIT	1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		NOT SPECIFIED	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK1501IRCPR	HVFQFP, TQFP64,.47SQ	compliant	5A991.B.1	8542.39.00.01	6 weeks			QFP	64
HTRC11001T/03EE,11 NXP Semiconductors	查询价格			Yes	Active	5 V				TELECOM CIRCUIT	1	5 V	10 µA	INDUSTRIAL	R-PDSO-G14	e4	Not Qualified	1	85 °C	-40 °C	260		30	14	PLASTIC/EPOXY	SOP	SOP14,.25	RECTANGULAR	SMALL OUTLINE	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	1.27 mm	DUAL	4 mm	8.75 mm		HTRC11001T/03EE,11	SOP, SOP14,.25	compliant		8542.39.00.01			NXP	SOIC	14	SOT108-1
TLK1501IRCP Texas Instruments	查询价格		Yes	Yes	Active	2.5 V	TTL		2.5 Tbps	TELECOM CIRCUIT	1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		NOT SPECIFIED	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK1501IRCP	HVFQFP, TQFP64,.47SQ	compliant	5A991.B.1	8542.39.00.01	1 week		Texas Instruments	QFP	64
SA606DK/01,118 NXP Semiconductors	查询价格			Yes	Active	3 V				TELECOM CIRCUIT	1			INDUSTRIAL	R-PDSO-G20	e4	Not Qualified	1	85 °C	-40 °C	260		30	20	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	650 µm	DUAL	4.4 mm	6.5 mm	1.5 mm	SA606DK/01,118	LSSOP,	compliant		8542.39.00.01			NXP	SSOP2	20	SOT266-1

1 2 3 4 5 下一页

ICP经营许可证苏B2-20140176 苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司

苏公网安备 32059002001042号

联系我们

美国总部

61 South Fair Oaks Avenue, Suite 200

Pasadena, CA 91105, USA

苏州总部

苏州工业园区新平街 388 号腾飞创新园 B 幢 705

江苏省苏州市, 215021

深圳分部

深圳市南山区粤海街道深圳湾科技生态园 11 栋 A 座 28 层 01 室

广东省深圳市, 518057

邮箱：service@bom2buy.com

电话：(0512) 62988549

站内导航

友情链接

联系我们

美国总部

苏州总部

深圳分部

创建 BOM

确认BOM数据

上传失败

正在上传

登录

站内导航

友情链接

联系我们

美国总部

苏州总部

深圳分部