其他电信集成电路封装型号_其他电信集成电路厂家价格-bom2buy

							Most Relevant					Technical					Compliance			Operating Conditions						Physical											Dimensions			Other
制造商型号	制造商	数据手册	价格/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	收发器数量	数据速率	电信集成电路类型	其他特性	功能数量	电源	最大压摆率	温度等级	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	筛选级别	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	Objectid	是否符合REACH标准	ECCN代码	HTS代码	交付时间	Date Of Intro	包装说明	零件包装代码	针数	Country Of Origin	Samacsys Manufacturer	Samacsys Modified On	YTEOL	制造商包装代码
RN4871-V/RM118	Microchip Technology Inc		查询价格和库存				Active	3 V			10 Mbps	TELECOM CIRCUIT		1			COMMERCIAL	R-XXMA-N16				70 °C	-20 °C		TS 16949		16	UNSPECIFIED	XMA	MODULE,16LEAD(UNSPEC)	RECTANGULAR	MICROELECTRONIC ASSEMBLY	YES		NO LEAD	1.2 mm	UNSPECIFIED	9 mm	11.5 mm	2.16 mm	RN4871-V/RM118	8286989219	compliant	5A992.C	8529.90.22.00	52 weeks	2016-04-26
RN4871-I/RM128	Microchip Technology Inc		查询价格和库存				Active	3.3 V			10 Mbps	TELECOM CIRCUIT		1			INDUSTRIAL	R-XXMA-N16				85 °C	-40 °C		TS 16949		16	UNSPECIFIED	XMA	MODULE,16LEAD(UNSPEC)	RECTANGULAR	MICROELECTRONIC ASSEMBLY	NO		NO LEAD	1.2 mm	UNSPECIFIED	9 mm	11.5 mm	2.16 mm		145071139364	compliant	5A992.C	8529.90.22.00	52 weeks		MODULE-16
RN4678-V/RM100	Microchip Technology Inc		查询价格和库存				Active	3.3 V				TELECOM CIRCUIT		1			COMMERCIAL	R-XXMA-N33				70 °C	-20 °C				33	UNSPECIFIED	XMA		RECTANGULAR	MICROELECTRONIC ASSEMBLY	YES		NO LEAD	1.1 mm	UNSPECIFIED	12 mm	22 mm	2.46 mm	RN4678-V/RM100	8196558866	compliant	5A992.C	8529.90.22.00			MODULE-33
ATA8403C-6AQY-66	Microchip Technology Inc		查询价格和库存				Active	3 V				TELECOM CIRCUIT		1			OTHER	S-PDSO-G8	e3			85 °C	-55 °C	NOT SPECIFIED		NOT SPECIFIED	8	PLASTIC/EPOXY	TSSOP	TSSOP8,.19	SQUARE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	3 mm	3 mm	1.05 mm	ATA8403C-6AQY-66	8229514693	compliant		8542.39.00.01	7 weeks		TSSOP-8
RN4870-V/RM118	Microchip Technology Inc		查询价格和库存				Active	3.3 V			10 Mbps	TELECOM CIRCUIT		1			COMMERCIAL	R-XXMA-N33				70 °C	-20 °C				33	UNSPECIFIED	XMA	MODULE,33LEAD(UNSPEC)	RECTANGULAR	MICROELECTRONIC ASSEMBLY	NO		NO LEAD	1.1 mm	UNSPECIFIED	12 mm	22 mm	2.46 mm	RN4870-V/RM118	8169168742	compliant	5A992.C	8529.90.22.00	52 weeks	2016-04-26	MODULE-33
RN4020-V/RMBEC133	Microchip Technology Inc		查询价格和库存				Active	3.3 V			1 Gbps	TELECOM CIRCUIT	Bluetooth Module	1			OTHER	R-XXMA-N24	e4			85 °C	-30 °C		TS 16949		24	UNSPECIFIED	XMA	MODULE,24LEAD(UNSPEC)	RECTANGULAR	MICROELECTRONIC ASSEMBLY	YES	GOLD OVER NICKEL	NO LEAD	1.2 mm	UNSPECIFIED	11.5 mm	19.5 mm	2.38 mm	RN4020-V/RMBEC133	8324003566	compliant	5A992.C	8529.90.22.00	24 weeks		MODULE-24
RN4871U-V/RM118	Microchip Technology Inc		查询价格和库存				Active	3 V			10 Mbps	TELECOM CIRCUIT		1				R-XXMA-N16				70 °C	-20 °C		TS 16949		16	UNSPECIFIED	XMA		RECTANGULAR	MICROELECTRONIC ASSEMBLY	YES		NO LEAD		UNSPECIFIED	9 mm	11.5 mm	2.1 mm	RN4871U-V/RM118	8286989220	compliant	5A992.C	8529.90.22.00		2016-04-26
TLK2501IRCPR	Texas Instruments		查询价格和库存		Yes	Yes	Active	2.5 V		1	2.5 Tbps	TELECOM CIRCUIT		1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		30	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK2501IRCPR	1526410212	compliant	5A991.B.1	8542.39.00.01			HVFQFP, TQFP64,.47SQ	QFP	64	Taiwan	Texas Instruments	2021-12-26 06:27:06	15
TLK2501IRCP	Texas Instruments		查询价格和库存		Yes	Yes	Active	2.5 V		1	2.5 Tbps	TELECOM CIRCUIT		1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		30	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK2501IRCP	1523129219	compliant	5A991.B.1	8542.39.00.01			HVFQFP, TQFP64,.47SQ	QFP	64	Taiwan	Texas Instruments	2021-04-13 06:26:51	15
TLK1501IRCPR	Texas Instruments		查询价格和库存		Yes	Yes	Active	2.5 V	TTL		2.5 Tbps	TELECOM CIRCUIT		1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		30	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK1501IRCPR	1526410211	compliant	5A991.B.1	8542.39.00.01			HVFQFP, TQFP64,.47SQ	QFP	64	Taiwan	Texas Instruments	2022-02-26 06:28:03	15
TLK1501IRCP	Texas Instruments		查询价格和库存		Yes	Yes	Active	2.5 V	TTL		2.5 Tbps	TELECOM CIRCUIT		1	2.5 V		INDUSTRIAL	S-PQFP-G64	e4	Not Qualified	3	85 °C	-40 °C	260		30	64	PLASTIC/EPOXY	HVFQFP	TQFP64,.47SQ	SQUARE	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	YES	NICKEL PALLADIUM GOLD	GULL WING	500 µm	QUAD	10 mm	10 mm	1 mm	TLK1501IRCP	1523129218	compliant	5A991.B.1	8542.39.00.01			HVFQFP, TQFP64,.47SQ	QFP	64	Taiwan	Texas Instruments	2020-11-01 06:25:54	15
TUSB212IRWBT	Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT		1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	85 °C	-40 °C	260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB212IRWBT	8277828567	compliant	EAR99	8542.39.00.01		2017-09-06	VQCCN,						15
TUSB212QRWBRQ1	Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT		1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	105 °C	-40 °C	260	AEC-Q100	30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB212QRWBRQ1	8280459260	compliant	EAR99			2017-09-09	VQCCN,						15
TUSB214RWBR	Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			4 Gbps	TELECOM CIRCUIT		1		30 µA	COMMERCIAL	S-PQCC-N12	e4		2	70 °C		260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB214RWBR	8286130568	compliant	EAR99			2017-09-12	VQCCN,						15
HTRC11001T/02EE,11	NXP Semiconductors		查询价格和库存			Yes	Active	5 V				TELECOM CIRCUIT		1	5 V	10 µA	INDUSTRIAL	R-PDSO-G14	e4	Not Qualified	1	85 °C	-40 °C	260		30	14	PLASTIC/EPOXY	SOP	SOP14,.25	RECTANGULAR	SMALL OUTLINE	YES	NICKEL PALLADIUM GOLD	GULL WING	1.27 mm	DUAL	4 mm	8.75 mm		HTRC11001T/02EE,11	1670462596	compliant		8542.39.00.01			SOP, SOP14,.25	SOIC	14		NXP	2020-03-16 14:18:31		SOT108-1
TUSB212IRWBR	Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT		1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	85 °C	-40 °C	260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB212IRWBR	8277828566	compliant	EAR99			2017-09-06	VQCCN,						15
TUSB214IRWBR	Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT		1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	85 °C	-40 °C	260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB214IRWBR	8286130566	compliant	EAR99			2017-09-12	VQCCN,						15
TUSB212RWBR	Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT		1		30 µA	COMMERCIAL	S-PQCC-N12	e4		2	70 °C		260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB212RWBR	8286130565	compliant	EAR99			2017-09-13	VQCCN,				Texas Instruments	2021-06-09 06:25:40	15
TUSB212QRWBTQ1	Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT		1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	105 °C	-40 °C	260	AEC-Q100	30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB212QRWBTQ1	8280459261	compliant	EAR99	8542.39.00.01		2017-09-09	VQCCN,				Texas Instruments	2022-04-28 13:17:55	15
TUSB214IRWBT	Texas Instruments		查询价格和库存		Yes	Yes	Active	3.3 V			480.24 Gbps	TELECOM CIRCUIT		1		30 µA	INDUSTRIAL	S-PQCC-N12	e4		2	85 °C	-40 °C	260		30	12	PLASTIC/EPOXY	VQCCN		SQUARE	CHIP CARRIER, VERY THIN PROFILE	YES	NICKEL PALLADIUM GOLD	NO LEAD	400 µm	QUAD	1.6 mm	1.6 mm	400 µm	TUSB214IRWBT	8286130567	compliant	EAR99	8542.39.00.01		2017-09-12	VQCCN,						15

1 2 3 4 5 下一页

ICP经营许可证苏B2-20140176 苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司

苏公网安备 32059002001042号

联系我们

美国总部

61 South Fair Oaks Avenue, Suite 200

Pasadena, CA 91105, USA

苏州总部

苏州工业园区新平街 388 号腾飞创新园 B 幢 705

江苏省苏州市, 215021

深圳分部

深圳市南山区粤海街道深圳湾科技生态园 11 栋 A 座 28 层 01 室

广东省深圳市, 518057

邮箱：service@bom2buy.com

电话：(0512) 62988549

其他电信集成电路:

站内导航

友情链接

联系我们

美国总部

苏州总部

深圳分部

创建 BOM

确认BOM数据

上传失败

正在上传

登录

其他电信集成电路:

站内导航

友情链接

联系我们

美国总部

苏州总部

深圳分部