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制造商型号 | 制造商 | 数据手册 |
价格/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 收发器数量 | 数据速率 |
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电源
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最大压摆率
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温度等级
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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筛选级别
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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Source Content uid
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是否符合REACH标准
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ECCN代码
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HTS代码
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交付时间
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Date Of Intro
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包装说明
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零件包装代码
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针数
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Country Of Origin
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YTEOL
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制造商包装代码
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RN4871-V/RM118
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Microchip Technology Inc
|
查询价格和库存 |
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Active | 3 V | 10 Mbps | TELECOM CIRCUIT | 1 | COMMERCIAL | R-XXMA-N16 | 70 °C | -20 °C | TS 16949 | 16 | UNSPECIFIED | XMA | MODULE,16LEAD(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | 1.2 mm | UNSPECIFIED | 9 mm | 11.5 mm | 2.16 mm | RN4871-V/RM118 | compliant | 5A992.C | 8529.90.22.00 | [object Object] | 2016-04-26 | |||||||||||||||||||
RN4871-I/RM128
|
Microchip Technology Inc
|
查询价格和库存 |
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Active | 3.3 V | 10 Mbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XXMA-N16 | 85 °C | -40 °C | TS 16949 | 16 | UNSPECIFIED | XMA | MODULE,16LEAD(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.2 mm | UNSPECIFIED | 9 mm | 11.5 mm | 2.16 mm | compliant | 5A992.C | 8529.90.22.00 | [object Object] | MODULE-16 | ||||||||||||||||||||
ATA8403C-6AQY-66
|
Microchip Technology Inc
|
查询价格和库存 |
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Active | 3 V | TELECOM CIRCUIT | 1 | OTHER | S-PDSO-G8 | e3 | 85 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | ATA8403C-6AQY-66 | compliant | 8542.39.00.01 | [object Object] | TSSOP-8 | ||||||||||||||||||
RN4678-V/RM100
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Microchip Technology Inc
|
查询价格和库存 |
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Active | 3.3 V | TELECOM CIRCUIT | 1 | COMMERCIAL | R-XXMA-N33 | 70 °C | -20 °C | 33 | UNSPECIFIED | XMA | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | 1.1 mm | UNSPECIFIED | 12 mm | 22 mm | 2.46 mm | RN4678-V/RM100 | compliant | 5A992.C | 8529.90.22.00 | MODULE-33 | |||||||||||||||||||||||
RN4870-V/RM118
|
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 3.3 V | 10 Mbps | TELECOM CIRCUIT | 1 | COMMERCIAL | R-XXMA-N33 | 70 °C | -20 °C | 33 | UNSPECIFIED | XMA | MODULE,33LEAD(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.1 mm | UNSPECIFIED | 12 mm | 22 mm | 2.46 mm | RN4870-V/RM118 | compliant | 5A992.C | 8529.90.22.00 | [object Object] | 2016-04-26 | MODULE-33 | |||||||||||||||||||
RN4871U-V/RM118
|
Microchip Technology Inc
|
查询价格和库存 |
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Active | 3 V | 10 Mbps | TELECOM CIRCUIT | 1 | R-XXMA-N16 | 70 °C | -20 °C | TS 16949 | 16 | UNSPECIFIED | XMA | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | UNSPECIFIED | 9 mm | 11.5 mm | 2.1 mm | RN4871U-V/RM118 | compliant | 5A992.C | 8529.90.22.00 | 2016-04-26 | |||||||||||||||||||||||
TLK1501IRCP
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 2.5 V | TTL | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TLK1501IRCP | compliant | 5A991.B.1 | 8542.39.00.01 | HVFQFP, TQFP64,.47SQ | QFP | 64 | Taiwan | 15 | |||||||
TLK1501IRCPR
|
Texas Instruments
|
查询价格和库存 |
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Yes | Yes | Active | 2.5 V | TTL | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TLK1501IRCPR | compliant | 5A991.B.1 | 8542.39.00.01 | HVFQFP, TQFP64,.47SQ | QFP | 64 | Taiwan | 15 | |||||||
TUSB212IRWBT
|
Texas Instruments
|
查询价格和库存 |
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Yes | Yes | Active | 3.3 V | 480.24 Gbps | TELECOM CIRCUIT | 1 | 30 µA | INDUSTRIAL | S-PQCC-N12 | e4 | 2 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB212IRWBT | compliant | EAR99 | 8542.39.00.01 | 2017-09-06 | VQCCN, | 15 | ||||||||||||
TUSB214RWBR
|
Texas Instruments
|
查询价格和库存 |
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Yes | Yes | Active | 3.3 V | 4 Gbps | TELECOM CIRCUIT | 1 | 30 µA | COMMERCIAL | S-PQCC-N12 | e4 | 2 | 70 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB214RWBR | compliant | EAR99 | 2017-09-12 | VQCCN, | 15 | ||||||||||||||
HTRC11001T/02EE,11
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NXP Semiconductors
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查询价格和库存 |
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Yes | Active | 5 V | TELECOM CIRCUIT | 1 | 5 V | 10 µA | INDUSTRIAL | R-PDSO-G14 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 4 mm | 8.75 mm | HTRC11001T/02EE,11 | compliant | 8542.39.00.01 | SOP, SOP14,.25 | SOIC | 14 | SOT108-1 | ||||||||||||
TUSB212QRWBRQ1
|
Texas Instruments
|
查询价格和库存 |
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Yes | Yes | Active | 3.3 V | 480.24 Gbps | TELECOM CIRCUIT | 1 | 30 µA | INDUSTRIAL | S-PQCC-N12 | e4 | 2 | 105 °C | -40 °C | 260 | AEC-Q100 | 30 | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB212QRWBRQ1 | compliant | EAR99 | 2017-09-09 | VQCCN, | 15 | ||||||||||||
BLUENRG-345VC
|
STMicroelectronics
|
查询价格和库存 |
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Active | 1.8 V | 2 Gbps | TELECOM CIRCUIT | 1 | S-XBGA-B49 | 85 °C | -40 °C | 49 | UNSPECIFIED | BGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 400 µm | BOTTOM | 3.14 mm | 3.14 mm | 420 µm | BLUENRG-345VC | compliant | 5A992.C | 8542.39.00.01 | [object Object] | 2020-07-16 | Taiwan | 9.17 | ||||||||||||||||||||
TLK2501IRCPR
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 2.5 V | 1 | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TLK2501IRCPR | compliant | 5A991.B.1 | 8542.39.00.01 | HVFQFP, TQFP64,.47SQ | QFP | 64 | Taiwan | 15 | |||||||
TUSB214IRWBR
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 3.3 V | 480.24 Gbps | TELECOM CIRCUIT | 1 | 30 µA | INDUSTRIAL | S-PQCC-N12 | e4 | 2 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB214IRWBR | compliant | EAR99 | 2017-09-12 | VQCCN, | 15 | |||||||||||||
TUSB214QRWBRQ1
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 3.3 V | 480.24 Gbps | TELECOM CIRCUIT | 1 | 30 µA | INDUSTRIAL | S-PQCC-N12 | e4 | 2 | 105 °C | -40 °C | 260 | AEC-Q100 | 30 | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB214QRWBRQ1 | compliant | EAR99 | 2017-08-25 | VQCCN, | 15 | ||||||||||||
TLK2501IRCP
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 2.5 V | 1 | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TLK2501IRCP | compliant | 5A991.B.1 | 8542.39.00.01 | HVFQFP, TQFP64,.47SQ | QFP | 64 | Taiwan | 15 | |||||||
TUSB212IRWBR
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 3.3 V | 480.24 Gbps | TELECOM CIRCUIT | 1 | 30 µA | INDUSTRIAL | S-PQCC-N12 | e4 | 2 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB212IRWBR | compliant | EAR99 | 2017-09-06 | VQCCN, | 15 | |||||||||||||
TUSB212RWBR
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 3.3 V | 480.24 Gbps | TELECOM CIRCUIT | 1 | 30 µA | COMMERCIAL | S-PQCC-N12 | e4 | 2 | 70 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB212RWBR | compliant | EAR99 | 2017-09-13 | VQCCN, | 15 | ||||||||||||||
MRF24J40ME-I/RM
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 3.3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XDMA-N12 | 85 °C | -40 °C | TS 16949 | 12 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 2.54 mm | DUAL | 22.86 mm | 33.02 mm | 3.48 mm | MRF24J40ME-I/RM | compliant | 5A992.C | 8529.90.22.00 | MODULE-12 |