所有内容版权所有 © 2006 - 2022
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||
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| 制造商型号 | 制造商 | 数据手册 |
价格/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 收发器数量 | 数据速率 |
电信集成电路类型
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功能数量 |
电源
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最大压摆率
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温度等级
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度（摄氏度）
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筛选级别
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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Source Content uid
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Objectid
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是否符合REACH标准
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ECCN代码
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HTS代码
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交付时间
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Date Of Intro
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包装说明
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零件包装代码
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针数
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制造商包装代码
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Samacsys Manufacturer
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RN4871-V/RM118
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Microchip Technology Inc
|
查询价格和库存 |
|
Active | TELECOM CIRCUIT | RN4871-V/RM118 | 8286989219 | compliant | 5A992.C | 8529.90.22.00 | 52 weeks | 2016-04-26 | |||||||||||||||||||||||||||||||||||||||
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RN4678-V/RM100
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Microchip Technology Inc
|
查询价格和库存 |
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Active | 1.9 V | 1 Gbps | TELECOM CIRCUIT | 1 | OTHER | R-XXMA-N33 | 70 °C | -20 °C | TS 16949 | 33 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | UNSPECIFIED | 12 mm | 22 mm | 2.4 mm | RN4678-V/RM100 | 8196558866 | compliant | 5A992.C | 8529.90.22.00 | MODULE-33 | ||||||||||||||||||||||
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RN4871-I/RM128
|
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 3.3 V | 10 Mbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XXMA-N16 | 85 °C | -40 °C | 16 | UNSPECIFIED | MODULE,16LEAD(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.2 mm | UNSPECIFIED | 9 mm | 11.5 mm | 2.1 mm | 145071139364 | compliant | 5A992.C | 8529.90.22.00 | 52 weeks | MODULE-16 | |||||||||||||||||||||
|
RN4870-V/RM118
|
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 3.3 V | 10 Mbps | TELECOM CIRCUIT | 1 | COMMERCIAL | R-XXMA-N33 | 70 °C | -20 °C | 33 | UNSPECIFIED | MODULE,33LEAD(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.1 mm | UNSPECIFIED | 12 mm | 22 mm | 2.4 mm | RN4870-V/RM118 | 8169168742 | compliant | 5A992.C | 8529.90.22.00 | 52 weeks | 2016-04-26 | MODULE-33 | |||||||||||||||||||
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IS1871SF-202
|
Microchip Technology Inc
|
查询价格和库存 |
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Active | 3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N32 | 85 °C | -40 °C | TS 16949 | 32 | UNSPECIFIED | HVQCCN | LCC32,.16SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 4 mm | 4 mm | 900 µm | IS1871SF-202 | 8255196988 | compliant | 8542.39.00.01 | 52 weeks | QFN-32 | ||||||||||||||||||||
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IS1870SF-202
|
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N48 | 85 °C | -40 °C | TS 16949 | 48 | UNSPECIFIED | HVQCCN | LCC48,.24SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | 900 µm | IS1870SF-202 | 8255196986 | compliant | 5A992.C | 8517.70.00.00 | 52 weeks | QFN-48 | |||||||||||||||||||
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RN4020-V/RMBEC133
|
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 3.3 V | TELECOM CIRCUIT | 1 | OTHER | R-XXMA-N24 | 85 °C | -30 °C | TS 16949 | 24 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | UNSPECIFIED | 11.5 mm | 19.5 mm | 2.3 mm | RN4020-V/RMBEC133 | 8324003566 | compliant | 5A992.C | 8529.90.22.00 | 24 weeks | MODULE-24 | ||||||||||||||||||||||
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SA606DK/01,118
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G20 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.5 mm | SA606DK/01,118 | 1670846606 | compliant | 8542.39.00.01 | 14 weeks 5 days | LSSOP, | SSOP2 | 20 | SOT266-1 | NXP | |||||||||||
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TLK1501IRCPR
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 2.5 V | TTL | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TLK1501IRCPR | 1526410211 | compliant | 5A991.B.1 | 8542.39.00.01 | HVFQFP, TQFP64,.47SQ | QFP | 64 | Texas Instruments | |||||||
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TLK1501IRCP
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 2.5 V | TTL | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TLK1501IRCP | 1523129218 | compliant | 5A991.B.1 | 8542.39.00.01 | HVFQFP, TQFP64,.47SQ | QFP | 64 | Texas Instruments | |||||||
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HTRC11001T/02EE,11
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 5 V | TELECOM CIRCUIT | 1 | 5 V | 10 µA | INDUSTRIAL | R-PDSO-G14 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 4 mm | 8.75 mm | HTRC11001T/02EE,11 | 1670462596 | compliant | 8542.39.00.01 | SOP, SOP14,.25 | SOIC | 14 | SOT108-1 | NXP | ||||||||||
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TLK2501IRCPR
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 2.5 V | 1 | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TLK2501IRCPR | 1526410212 | compliant | 5A991.B.1 | 8542.39.00.01 | HVFQFP, TQFP64,.47SQ | QFP | 64 | Texas Instruments | |||||||
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TUSB212IRWBR
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 3.3 V | 480.24 Gbps | TELECOM CIRCUIT | 1 | 30 µA | INDUSTRIAL | S-PQCC-N12 | e4 | 2 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB212IRWBR | 8277828566 | compliant | EAR99 | 2017-09-06 | VQCCN, | |||||||||||||
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TLK2501IRCP
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 2.5 V | 1 | 2.5 Tbps | TELECOM CIRCUIT | 1 | 2.5 V | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | TLK2501IRCP | 1523129219 | compliant | 5A991.B.1 | 8542.39.00.01 | HVFQFP, TQFP64,.47SQ | QFP | 64 | Texas Instruments | |||||||
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TUSB212RWBR
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 3.3 V | 480.24 Gbps | TELECOM CIRCUIT | 1 | 30 µA | COMMERCIAL | S-PQCC-N12 | e4 | 2 | 70 °C | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB212RWBR | 8286130565 | compliant | EAR99 | 2017-09-13 | VQCCN, | Texas Instruments | |||||||||||||||
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HTRC11001T/03EE,11
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 5 V | TELECOM CIRCUIT | 1 | 5 V | 10 µA | INDUSTRIAL | R-PDSO-G14 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 4 mm | 8.75 mm | HTRC11001T/03EE,11 | 1670462597 | compliant | 8542.39.00.01 | SOP, SOP14,.25 | SOIC | 14 | SOT108-1 | NXP | ||||||||||
|
HTRC11001T/02EE
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | 5 V | 10 µA | INDUSTRIAL | R-PDSO-G14 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 8.65 mm | 1.75 mm | HTRC11001T/02EE | 1546732130 | compliant | 8542.39.00.01 | SOP, SOP14,.25 | SOIC | 14 | ||||||||||
|
TUSB212IRWBT
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 3.3 V | 480.24 Gbps | TELECOM CIRCUIT | 1 | 30 µA | INDUSTRIAL | S-PQCC-N12 | e4 | 2 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB212IRWBT | 8277828567 | compliant | EAR99 | 8542.39.00.01 | 2017-09-06 | VQCCN, | ||||||||||||
|
TUSB212QRWBRQ1
|
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 3.3 V | 480.24 Gbps | TELECOM CIRCUIT | 1 | 30 µA | INDUSTRIAL | S-PQCC-N12 | e4 | 2 | 105 °C | -40 °C | 260 | AEC-Q100 | NOT SPECIFIED | 12 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 400 µm | QUAD | 1.6 mm | 1.6 mm | 400 µm | TUSB212QRWBRQ1 | 8280459260 | compliant | EAR99 | 2017-09-09 | VQCCN, | ||||||||||||
|
SA616DK/01,118
|
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Active | 3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G20 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 20 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.5 mm | SA616DK/01,118 | 1670846612 | compliant | 8542.39.00.01 | 52 weeks | LSSOP, | SSOP2 | 20 | SOT266-1 | ||||||||||||
所有内容版权所有 © 2006 - 2022
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
