所有内容版权所有 © 2006 - 2022
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 制造商型号 | 制造商 | 数据手册 |
价格/库存
|
风险等级 |
是否无铅
|
是否Rohs认证
|
生命周期
|
标称供电电压 | 技术 | 运营商类型 | 数据速率 | ISDN访问速率 | 功能数量 | 最小输出高电压 | 最大输出低电流 | 最大输出低电压 |
电源
|
参照点
|
最大压摆率
|
温度等级
|
电信集成电路类型
|
JESD-30 代码 | JESD-609代码 |
认证状态
|
湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度（摄氏度）
|
处于峰值回流温度下的最长时间
|
端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
|
封装形式
|
表面贴装
|
端子面层
|
端子形式
|
端子节距
|
端子位置
|
宽度
|
长度 |
座面最大高度
|
Source Content uid
|
Objectid
|
包装说明
|
是否符合REACH标准
|
HTS代码
|
零件包装代码
|
针数
|
制造商包装代码
|
ECCN代码
|
Samacsys Manufacturer
|
交付时间
|
|
TP3404V
|
National Semiconductor Corporation
|
查询价格和库存 |
|
No | Transferred | 5 V | 144 Mbps | BASIC | 1 | 2.4 V | 1 mA | 400 mV | 5 V | U | COMMERCIAL | TIME SLOT ASSIGNER | S-PQCC-J28 | e0 | Not Qualified | 2A | 70 °C | 245 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 11.43 mm | 11.43 mm | 4.57 mm | TP3404V | 1438748748 | PLASTIC, LCC-28 | not_compliant | 8542.39.00.01 | ||||||||||||
|
82V2108PXG
|
Integrated Device Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | CMOS | 1 | 3.3 V | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 82V2108PXG | 2011872154 | GREEN, PLASTIC, QFP-128 | compliant | 8542.39.00.01 | PQFP | 128 | PXG128 | EAR99 | IDT | ||||||||||
|
MT9076BB1
|
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Transferred | 3.3 V | 1 | INDUSTRIAL | FRAMER | S-PQFP-G80 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 30 | 80 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 1846164418 | LQFP, | compliant | 8542.39.00.01 | QFP | 80 | |||||||||||||||||||
|
IDT82V2108PXG
|
Integrated Device Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | CMOS | 1 | 3.3 V | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | IDT82V2108PXG | 2040302341 | PLASTIC, QFP-128 | compliant | 8542.39.00.01 | QFP | 128 | ||||||||||||||
|
MT8979APR1
|
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Yes | Transferred | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 1846164294 | QCCJ, | compliant | 8542.39.00.01 | LPCC | 44 | |||||||||||||||||
|
MT8977AP
|
Zarlink Semiconductor Inc
|
查询价格和库存 |
|
No | Obsolete | 5 V | CMOS | 1 | 5 V | 10 µA | INDUSTRIAL | FRAMER | S-PQCC-J44 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 225 | 30 | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 1916531112 | QCCJ, LDCC44,.7SQ | compliant | 8542.39.00.01 | ||||||||||||||||
|
MT8976AP1
|
Zarlink Semiconductor Inc
|
查询价格和库存 |
|
Yes | Obsolete | 5 V | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2055879313 | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | compliant | 8542.39.00.01 | ||||||||||||||||||||
|
MT8976APR1
|
Zarlink Semiconductor Inc
|
查询价格和库存 |
|
Yes | Obsolete | 5 V | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2055879316 | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | compliant | 8542.39.00.01 | ||||||||||||||||||||
|
MT8977APR
|
Zarlink Semiconductor Inc
|
查询价格和库存 |
|
No | Obsolete | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 225 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 1978731995 | QCCJ, | compliant | 8542.39.00.01 | |||||||||||||||||||
|
82V2108PX
|
Integrated Device Technology Inc
|
查询价格和库存 |
|
No | No | Obsolete | 3.3 V | CMOS | 1 | 3.3 V | INDUSTRIAL | FRAMER | R-PQFP-G128 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 225 | 20 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 82V2108PX | 2011872155 | PLASTIC, QFP-128 | not_compliant | 8542.39.00.01 | QFP | 128 | EAR99 | ||||||||||||
|
MT8979AP1
|
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Yes | Obsolete | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 1846164292 | QCCJ, | compliant | 8542.39.00.01 | LPCC | 44 | |||||||||||||||||
|
IDT82V2108PX
|
Integrated Device Technology Inc
|
查询价格和库存 |
|
No | No | Obsolete | 3.3 V | CMOS | 1 | 3.3 V | INDUSTRIAL | FRAMER | R-PQFP-G128 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 225 | 20 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | IDT82V2108PX | 1944411695 | PLASTIC, QFP-128 | not_compliant | 8542.39.00.01 | QFP | 128 | |||||||||||||
|
82V2108PXG8
|
Integrated Device Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | CMOS | 1 | 3.3 V | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 82V2108PXG8 | 1816253132 | PLASTIC, QFP-128 | compliant | 8542.39.00.01 | QFP | 128 | EAR99 | |||||||||||||
|
PM4358-NGI
|
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | 8365916329 | BGA, | compliant | 8542.31.00.01 | 5A991.B | 52 weeks | ||||||||||||||||||||||||||||
|
82V2108PX8
|
Integrated Device Technology Inc
|
查询价格和库存 |
|
No | No | Obsolete | 3.3 V | CMOS | 1 | 3.3 V | INDUSTRIAL | FRAMER | R-PQFP-G128 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 225 | 20 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 82V2108PX8 | 1816253130 | PLASTIC, QFP-128 | not_compliant | 8542.39.00.01 | QFP | 128 | EAR99 | ||||||||||||
|
MT8979APR
|
Microsemi Corporation
|
查询价格和库存 |
|
No | No | Transferred | 5 V | CMOS | CEPT PCM-30/E-1 | 1 | 5 V | 16 mA | INDUSTRIAL | FRAMER | S-PQCC-J44 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 1846164296 | PLASTIC, MS-018AC, LCC-44 | unknown | 8542.39.00.01 | LPCC | 44 | |||||||||||||
|
MT8976APR
|
Microsemi Corporation
|
查询价格和库存 |
|
No | No | Obsolete | 5 V | CMOS | 1 | 5 V | 10 µA | INDUSTRIAL | FRAMER | S-PQCC-J44 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 225 | 30 | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 1978731992 | QCCJ, LDCC44,.7SQ | compliant | 8542.39.00.01 | LPCC | 44 | |||||||||||||
|
MT8977APR1
|
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Yes | Obsolete | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2025210101 | QCCJ, | compliant | 8542.39.00.01 | LPCC | 44 | ||||||||||||||||
|
MT9079AP1
|
Zarlink Semiconductor Inc
|
查询价格和库存 |
|
Yes | Obsolete | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2055879331 | QCCJ, | compliant | 8542.39.00.01 | |||||||||||||||||||
|
MT8977AP
|
Microsemi Corporation
|
查询价格和库存 |
|
No | No | Transferred | 5 V | CMOS | 1 | 5 V | 10 mA | INDUSTRIAL | FRAMER | S-PQCC-J44 | e0 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 1445012671 | QCCJ, LDCC44,.7SQ | unknown | 8542.39.00.01 | LPCC | 44 | |||||||||||||||||||
所有内容版权所有 © 2006 - 2022
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
