| 型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||
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| 数据手册 |
价格/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 运营商类型 | 数据速率 | 运营商类型（2） | ISDN访问速率 | 功能数量 | 最小输出高电压 | 最大输出低电流 | 最大输出低电压 |
参照点
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最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度（摄氏度）
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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mfrid
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包装说明
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是否符合REACH标准
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GPT Applications Level 1
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GPT Applications Level 2
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GPT Applications Level Application
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Source Content uid
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HTS代码
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零件包装代码
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针数
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制造商包装代码
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ECCN代码
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Country Of Origin
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YTEOL
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MT9076BB1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 3.3 V | 1 | INDUSTRIAL | FRAMER | S-PQFP-G80 | e3 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2188 | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BEC, LQFP-80 | compliant | Consumer Electronics,Security and Survei... more | Network Infrastructure,Data Storage Devi... more | Telecom ICs,PBX systems | |||||||||||||||||||||||||
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TP3404V
National Semiconductor Corporation
|
查询价格和库存 |
|
No | Transferred | 5 V | 144 Mbps | BASIC | 1 | 2.4 V | 1 mA | 400 mV | U | COMMERCIAL | TIME SLOT ASSIGNER | S-PQCC-J28 | e0 | Not Qualified | 2A | 70 °C | 245 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 11.43 mm | 11.43 mm | 4.57 mm | 2216 | PLASTIC, LCC-28 | not_compliant | Consumer Electronics,Energy and Power Sy... more | Portable Devices,Vehicle Electronics,Energy Management | Power management,Portable devices | TP3404V | 8542.39.00.01 | ||||||||||||||
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82V2108PXG
Integrated Device Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 2068 | GREEN, PLASTIC, QFP-128 | compliant | 82V2108PXG | 8542.39.00.01 | PQFP | 128 | PXG128 | EAR99 | ||||||||||||||||
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DS26518GN+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 1.8 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | 450 µA | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | 2164 | 17 X 17 MM, 1 MM, PITCH, ROHS COMPLIANT, TECSBGA-256 | compliant | Industrial Automation,Renewable Energy,Robotics and Drones | Control Systems | Industrial control systems | 8542.39.00.01 | BGA | 256 | EAR99 | Japan, Mainland China, Malaysia, Philipp... more | 3 | |||||||||||||
|
DS21Q59L+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | 1 | COMMERCIAL | FRAMER | S-PQFP-G100 | e3 | Not Qualified | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2164 | 14 X 14 MM, ROHS COMPLIANT, LQFP-100 | compliant | Telecommunications | Telecom Components | Communication ICs | 8542.39.00.01 | QFP | 100 | EAR99 | Japan, Mainland China, Malaysia, Philipp... more | 3 | |||||||||||||
|
MT9076BP1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Transferred | 3.3 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | 98 µA | INDUSTRIAL | FRAMER | S-PQCC-J68 | e3 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | 2192 | LEAD FREE, PLASTIC, MS-018AE, LCC-68 | compliant | Consumer Electronics,Security and Survei... more | Network Infrastructure,Data Storage Devi... more | Telecom ICs,PBX systems | 8542.39.00.01 | LCC | 68 | ||||||||||||||||||
|
MT9076BB1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Transferred | 3.3 V | 1 | INDUSTRIAL | FRAMER | S-PQFP-G80 | e3 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2192 | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BEC, LQFP-80 | compliant | Consumer Electronics,Security and Survei... more | Network Infrastructure,Data Storage Devi... more | Telecom ICs,PBX systems | 8542.39.00.01 | QFP | 80 | ||||||||||||||||||||||
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MT9075BP1
Microsemi Corporation
|
查询价格和库存 |
|
Yes | Yes | Transferred | 5 V | CMOS | CEPT PCM-30/E-1 | 1 | 150 mA | INDUSTRIAL | FRAMER | S-PQCC-J68 | e3 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | 2192 | LEAD FREE, PLASTIC, MS-018AE, LCC-68 | compliant | 8542.39.00.01 | LCC | 68 | ||||||||||||||||||||
|
TP3404V/NOPB
National Semiconductor Corporation
|
查询价格和库存 |
|
Yes | Transferred | 5 V | 144 Mbps | BASIC | 1 | 2.4 V | 1 mA | 400 mV | U | COMMERCIAL | TIME SLOT ASSIGNER | S-PQCC-J28 | e3 | Not Qualified | 3 | 70 °C | 245 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 11.43 mm | 11.43 mm | 4.57 mm | 2216 | PLASTIC, LCC-28 | compliant | Consumer Electronics,Energy and Power Sy... more | Portable Devices,Vehicle Electronics,Energy Management | Power management,Portable devices | TP3404V/NOPB | 8542.39.00.01 | ||||||||||||||
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DS34S104GN+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 1.8 V | 1 | 280 µA | INDUSTRIAL | FRAMER | S-PBGA-B256 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | 2164 | BGA, BGA256,16X16,40 | compliant | Education and Research,Environmental Mon... more | IoT Devices,Vehicle Electronics,Network ... more | Data acquisition systems,Instrumentation | 8542.39.00.01 | BGA | 256 | EAR99 | Japan, Mainland China, Malaysia, Philipp... more | 3 | |||||||||||||
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DS34T108GN+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Yes | Transferred | 1.8 V | 1 | 550 µA | INDUSTRIAL | FRAMER | S-PBGA-B484 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.41 mm | 2164 | BGA, BGA484,22X22,40 | compliant | 8542.39.00.01 | BGA | 484 | EAR99 | Japan, Mainland China, Malaysia, Philipp... more | 3 | ||||||||||||||||
|
DS26518GNB1+
Maxim Integrated Products
|
查询价格和库存 |
|
Yes | Transferred | FRAMER | 2164 | unknown | Industrial Automation,Renewable Energy,Robotics and Drones | Control Systems | Industrial control systems | |||||||||||||||||||||||||||||||||||||||||||||||
|
PM4358-NGI
Microchip Technology Inc
|
查询价格和库存 |
|
Active | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | 2188 | BGA, | compliant | Consumer Electronics | Portable Devices | Portable devices | 8542.31.00.01 | 5A991.B | |||||||||||||||||||||||||||||
|
MT8979APR1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2188 | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | compliant | |||||||||||||||||||||||||||
|
82V2108PXG8
Renesas Electronics Corporation
|
查询价格和库存 |
|
Yes | Active | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 85 °C | -40 °C | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 2354 | PLASTIC, QFP-128 | compliant | 82V2108PXG8 | |||||||||||||||||||||||||
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PM4351-RGI
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B81 | e3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | MATTE TIN | BALL | BOTTOM | 2188 | CABGA-81 | compliant | 8542.31.00.01 | 5A991.B | ||||||||||||||||||||||||||||||
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DS2154LA2+
Rochester Electronics LLC
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | COMMERCIAL | FRAMER | S-PQFP-G100 | e3 | COMMERCIAL | 3 | 70 °C | 260 | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2178096 | 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | unknown | QFP | 100 | ||||||||||||||||||||||
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MT9074AP1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 5 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | 200 mA | INDUSTRIAL | FRAMER | S-PQCC-J68 | e3 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | 2188 | LEAD FREE, PLASTIC, MS-018AE, LCC-68 | compliant | ||||||||||||||||||||||||
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MT9074APR1
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 5 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | 200 mA | INDUSTRIAL | FRAMER | S-PQCC-J68 | e3 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | 2188 | LEAD FREE, PLASTIC, MS-018AE, LCC-68 | compliant | ||||||||||||||||||||||||
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L-TTSI001041BL-2
Broadcom Limited
|
查询价格和库存 |
|
Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||