数字传输控制器封装型号_数字传输控制器厂家价格-bom2buy

型号

型号						Most Relevant				Technical										Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	数据速率	运营商类型（2）	ISDN访问速率	功能数量	最小输出高电压	最大输出低电流	最大输出低电压	参照点	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	mfrid	包装说明	是否符合REACH标准	HTS代码	零件包装代码	针数	制造商包装代码	ECCN代码	Country Of Origin	YTEOL
TP3404V National Semiconductor Corporation		查询价格和库存			No	Transferred	5 V			144 Mbps		BASIC	1	2.4 V	1 mA	400 mV	U		COMMERCIAL	TIME SLOT ASSIGNER	S-PQCC-J28	e0	Not Qualified	2A	70 °C		245	30	28	PLASTIC/EPOXY	QCCJ	LDCC28,.5SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD	11.43 mm	11.43 mm	4.57 mm	TP3404V	2216	PLASTIC, LCC-28	not_compliant	8542.39.00.01
82V2108PXG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	3.3 V	CMOS					1						INDUSTRIAL	FRAMER	R-PQFP-G128	e3	Not Qualified	3	85 °C	-40 °C	260	30	128	PLASTIC/EPOXY	FQFP	QFP128,.67X.93,20	RECTANGULAR	FLATPACK, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	20 mm	3.4 mm	82V2108PXG	2068	GREEN, PLASTIC, QFP-128	compliant	8542.39.00.01	PQFP	128	PXG128	EAR99
DS26518GN+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	1.8 V		CEPT PCM-30/E-1		T-1(DS1)		1					450 µA	INDUSTRIAL	FRAMER	S-PBGA-B256		Not Qualified	3	85 °C	-40 °C	260	30	256	PLASTIC/EPOXY	BGA	BGA256,16X16,40	SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.76 mm		2164	17 X 17 MM, 1 MM, PITCH, ROHS COMPLIANT, TECSBGA-256	compliant	8542.39.00.01	BGA	256		EAR99	Japan, Mainland China, Malaysia, Philipp... more	3
DS21Q59L+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	3.3 V	CMOS	CEPT PCM-30/E-1				1						COMMERCIAL	FRAMER	S-PQFP-G100	e3	Not Qualified	3	70 °C		260	30	100	PLASTIC/EPOXY	LFQFP	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	14 mm	1.6 mm		2164	14 X 14 MM, ROHS COMPLIANT, LQFP-100	compliant	8542.39.00.01	QFP	100		EAR99	Japan, Mainland China, Malaysia, Philipp... more	3
MT9076BB1 Microsemi Corporation		查询价格和库存			Yes	Transferred	3.3 V						1						INDUSTRIAL	FRAMER	S-PQFP-G80	e3	Not Qualified		85 °C	-40 °C			80	PLASTIC/EPOXY	LQFP		SQUARE	FLATPACK, LOW PROFILE	YES	MATTE TIN	GULL WING	650 µm	QUAD	14 mm	14 mm	1.6 mm		2192	14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BEC, LQFP-80	compliant	8542.39.00.01	QFP	80
MT9076BP1 Microsemi Corporation		查询价格和库存			Yes	Transferred	3.3 V		CEPT PCM-30/E-1		T-1(DS1)		1					98 µA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C			68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm		2192	LEAD FREE, PLASTIC, MS-018AE, LCC-68	compliant	8542.39.00.01	LCC	68
MT9075BP1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V	CMOS	CEPT PCM-30/E-1				1					150 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C			68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm		2192	LEAD FREE, PLASTIC, MS-018AE, LCC-68	compliant	8542.39.00.01	LCC	68
TP3404V/NOPB National Semiconductor Corporation		查询价格和库存			Yes	Transferred	5 V			144 Mbps		BASIC	1	2.4 V	1 mA	400 mV	U		COMMERCIAL	TIME SLOT ASSIGNER	S-PQCC-J28	e3	Not Qualified	3	70 °C		245	30	28	PLASTIC/EPOXY	QCCJ	LDCC28,.5SQ	SQUARE	CHIP CARRIER	YES	Matte Tin (Sn)	J BEND	1.27 mm	QUAD	11.43 mm	11.43 mm	4.57 mm	TP3404V/NOPB	2216	PLASTIC, LCC-28	compliant	8542.39.00.01
DS34T108GN+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	1.8 V						1					550 µA	INDUSTRIAL	FRAMER	S-PBGA-B484	e1	Not Qualified	3	85 °C	-40 °C	260	30	484	PLASTIC/EPOXY	BGA	BGA484,22X22,40	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	23 mm	23 mm	2.41 mm		2164	BGA, BGA484,22X22,40	compliant	8542.39.00.01	BGA	484		EAR99	Japan, Mainland China, Malaysia, Philipp... more	3
DS34S104GN+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	1.8 V						1					280 µA	INDUSTRIAL	FRAMER	S-PBGA-B256	e1	Not Qualified	3	85 °C	-40 °C	260	30	256	PLASTIC/EPOXY	BGA	BGA256,16X16,40	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	17 mm	17 mm	1.76 mm		2164	BGA, BGA256,16X16,40	compliant	8542.39.00.01	BGA	256		EAR99	Japan, Mainland China, Malaysia, Philipp... more	3
DS26518GNB1+ Maxim Integrated Products		查询价格和库存		Yes		Transferred														FRAMER																								2164		unknown
PM4358-NGI Microchip Technology Inc		查询价格和库存				Active	1.8 V	CMOS					1						INDUSTRIAL	FRAMER	S-PBGA-B256			3	85 °C	-40 °C			256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM					2188	BGA,	compliant	8542.31.00.01				5A991.B
MT8979APR1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS					1					16 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e3	Not Qualified		85 °C	-40 °C			44	PLASTIC/EPOXY	QCCJ		SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	16.585 mm	16.585 mm	4.57 mm		2188	LEAD FREE, PLASTIC, MS-018AC, LCC-44	compliant
82V2108PXG8 Renesas Electronics Corporation		查询价格和库存			Yes	End Of Life	3.3 V	CMOS					1						INDUSTRIAL	FRAMER	R-PQFP-G128	e3	Not Qualified		85 °C	-40 °C			128	PLASTIC/EPOXY	FQFP	QFP128,.67X.93,20	RECTANGULAR	FLATPACK, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	20 mm	3.4 mm	82V2108PXG8	2354	PLASTIC, QFP-128	compliant							0.47
PM4351-RGI Microchip Technology Inc		查询价格和库存			Yes	Active	3.3 V	CMOS					1						INDUSTRIAL	FRAMER	S-PBGA-B81	e3			85 °C	-40 °C			81	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	MATTE TIN	BALL		BOTTOM					2188	CABGA-81	compliant	8542.31.00.01				5A991.B	Thailand	24.9
DS2154LA2+ Rochester Electronics LLC		查询价格和库存		Yes	Yes	Active	5 V	CMOS					1						COMMERCIAL	FRAMER	S-PQFP-G100	e3	COMMERCIAL	3	70 °C		260	NOT SPECIFIED	100	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	14 mm	1.6 mm		2178096	14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100	unknown		QFP	100
L-TTSI001041BL-2 Broadcom Limited		查询价格和库存				Active	1.5 V						1						INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C	260	40	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm		1807	BGA,	compliant	8542.39.00.01
TTSI004161BL-2 Broadcom Limited		查询价格和库存				Active	1.5 V						1						INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e0	Not Qualified		85 °C	-40 °C	225	30	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm		1807	BGA,	compliant	8542.39.00.01
L-TTSI004161BL-2 Avago Technologies		查询价格和库存				Active	1.5 V						1						INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C	260	40	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm		1778	BGA,	unknown	8542.39.00.01
L-TTSI002081BL-2 Avago Technologies		查询价格和库存				Active	1.5 V						1						INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C	260	40	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm		1778	BGA,	unknown	8542.39.00.01

型号						Most Relevant				Technical										Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	数据速率	运营商类型（2）	ISDN访问速率	功能数量	最小输出高电压	最大输出低电流	最大输出低电压	参照点	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	mfrid	包装说明	是否符合REACH标准	HTS代码	零件包装代码	针数	制造商包装代码	ECCN代码	Country Of Origin	YTEOL
TP3404V National Semiconductor Corporation		查询价格和库存			No	Transferred	5 V			144 Mbps		BASIC	1	2.4 V	1 mA	400 mV	U		COMMERCIAL	TIME SLOT ASSIGNER	S-PQCC-J28	e0	Not Qualified	2A	70 °C		245	30	28	PLASTIC/EPOXY	QCCJ	LDCC28,.5SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD	11.43 mm	11.43 mm	4.57 mm	TP3404V	2216	PLASTIC, LCC-28	not_compliant	8542.39.00.01
82V2108PXG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	3.3 V	CMOS					1						INDUSTRIAL	FRAMER	R-PQFP-G128	e3	Not Qualified	3	85 °C	-40 °C	260	30	128	PLASTIC/EPOXY	FQFP	QFP128,.67X.93,20	RECTANGULAR	FLATPACK, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	20 mm	3.4 mm	82V2108PXG	2068	GREEN, PLASTIC, QFP-128	compliant	8542.39.00.01	PQFP	128	PXG128	EAR99
DS26518GN+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	1.8 V		CEPT PCM-30/E-1		T-1(DS1)		1					450 µA	INDUSTRIAL	FRAMER	S-PBGA-B256		Not Qualified	3	85 °C	-40 °C	260	30	256	PLASTIC/EPOXY	BGA	BGA256,16X16,40	SQUARE	GRID ARRAY	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.76 mm		2164	17 X 17 MM, 1 MM, PITCH, ROHS COMPLIANT, TECSBGA-256	compliant	8542.39.00.01	BGA	256		EAR99	Japan, Mainland China, Malaysia, Philipp... more	3
DS21Q59L+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	3.3 V	CMOS	CEPT PCM-30/E-1				1						COMMERCIAL	FRAMER	S-PQFP-G100	e3	Not Qualified	3	70 °C		260	30	100	PLASTIC/EPOXY	LFQFP	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	14 mm	1.6 mm		2164	14 X 14 MM, ROHS COMPLIANT, LQFP-100	compliant	8542.39.00.01	QFP	100		EAR99	Japan, Mainland China, Malaysia, Philipp... more	3
MT9076BB1 Microsemi Corporation		查询价格和库存			Yes	Transferred	3.3 V						1						INDUSTRIAL	FRAMER	S-PQFP-G80	e3	Not Qualified		85 °C	-40 °C			80	PLASTIC/EPOXY	LQFP		SQUARE	FLATPACK, LOW PROFILE	YES	MATTE TIN	GULL WING	650 µm	QUAD	14 mm	14 mm	1.6 mm		2192	14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BEC, LQFP-80	compliant	8542.39.00.01	QFP	80
MT9076BP1 Microsemi Corporation		查询价格和库存			Yes	Transferred	3.3 V		CEPT PCM-30/E-1		T-1(DS1)		1					98 µA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C			68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm		2192	LEAD FREE, PLASTIC, MS-018AE, LCC-68	compliant	8542.39.00.01	LCC	68
MT9075BP1 Microsemi Corporation		查询价格和库存		Yes	Yes	Transferred	5 V	CMOS	CEPT PCM-30/E-1				1					150 mA	INDUSTRIAL	FRAMER	S-PQCC-J68	e3	Not Qualified		85 °C	-40 °C			68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	24.23 mm	24.23 mm	4.57 mm		2192	LEAD FREE, PLASTIC, MS-018AE, LCC-68	compliant	8542.39.00.01	LCC	68
TP3404V/NOPB National Semiconductor Corporation		查询价格和库存			Yes	Transferred	5 V			144 Mbps		BASIC	1	2.4 V	1 mA	400 mV	U		COMMERCIAL	TIME SLOT ASSIGNER	S-PQCC-J28	e3	Not Qualified	3	70 °C		245	30	28	PLASTIC/EPOXY	QCCJ	LDCC28,.5SQ	SQUARE	CHIP CARRIER	YES	Matte Tin (Sn)	J BEND	1.27 mm	QUAD	11.43 mm	11.43 mm	4.57 mm	TP3404V/NOPB	2216	PLASTIC, LCC-28	compliant	8542.39.00.01
DS34T108GN+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	1.8 V						1					550 µA	INDUSTRIAL	FRAMER	S-PBGA-B484	e1	Not Qualified	3	85 °C	-40 °C	260	30	484	PLASTIC/EPOXY	BGA	BGA484,22X22,40	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	23 mm	23 mm	2.41 mm		2164	BGA, BGA484,22X22,40	compliant	8542.39.00.01	BGA	484		EAR99	Japan, Mainland China, Malaysia, Philipp... more	3
DS34S104GN+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	1.8 V						1					280 µA	INDUSTRIAL	FRAMER	S-PBGA-B256	e1	Not Qualified	3	85 °C	-40 °C	260	30	256	PLASTIC/EPOXY	BGA	BGA256,16X16,40	SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	17 mm	17 mm	1.76 mm		2164	BGA, BGA256,16X16,40	compliant	8542.39.00.01	BGA	256		EAR99	Japan, Mainland China, Malaysia, Philipp... more	3
DS26518GNB1+ Maxim Integrated Products		查询价格和库存		Yes		Transferred														FRAMER																								2164		unknown
PM4358-NGI Microchip Technology Inc		查询价格和库存				Active	1.8 V	CMOS					1						INDUSTRIAL	FRAMER	S-PBGA-B256			3	85 °C	-40 °C			256	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES		BALL		BOTTOM					2188	BGA,	compliant	8542.31.00.01				5A991.B
MT8979APR1 Microchip Technology Inc		查询价格和库存			Yes	Active	5 V	CMOS					1					16 mA	INDUSTRIAL	FRAMER	S-PQCC-J44	e3	Not Qualified		85 °C	-40 °C			44	PLASTIC/EPOXY	QCCJ		SQUARE	CHIP CARRIER	YES	MATTE TIN	J BEND	1.27 mm	QUAD	16.585 mm	16.585 mm	4.57 mm		2188	LEAD FREE, PLASTIC, MS-018AC, LCC-44	compliant
82V2108PXG8 Renesas Electronics Corporation		查询价格和库存			Yes	End Of Life	3.3 V	CMOS					1						INDUSTRIAL	FRAMER	R-PQFP-G128	e3	Not Qualified		85 °C	-40 °C			128	PLASTIC/EPOXY	FQFP	QFP128,.67X.93,20	RECTANGULAR	FLATPACK, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	20 mm	3.4 mm	82V2108PXG8	2354	PLASTIC, QFP-128	compliant							0.47
PM4351-RGI Microchip Technology Inc		查询价格和库存			Yes	Active	3.3 V	CMOS					1						INDUSTRIAL	FRAMER	S-PBGA-B81	e3			85 °C	-40 °C			81	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	MATTE TIN	BALL		BOTTOM					2188	CABGA-81	compliant	8542.31.00.01				5A991.B	Thailand	24.9
DS2154LA2+ Rochester Electronics LLC		查询价格和库存		Yes	Yes	Active	5 V	CMOS					1						COMMERCIAL	FRAMER	S-PQFP-G100	e3	COMMERCIAL	3	70 °C		260	NOT SPECIFIED	100	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	MATTE TIN	GULL WING	500 µm	QUAD	14 mm	14 mm	1.6 mm		2178096	14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100	unknown		QFP	100
L-TTSI001041BL-2 Broadcom Limited		查询价格和库存				Active	1.5 V						1						INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C	260	40	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm		1807	BGA,	compliant	8542.39.00.01
TTSI004161BL-2 Broadcom Limited		查询价格和库存				Active	1.5 V						1						INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e0	Not Qualified		85 °C	-40 °C	225	30	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm		1807	BGA,	compliant	8542.39.00.01
L-TTSI004161BL-2 Avago Technologies		查询价格和库存				Active	1.5 V						1						INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C	260	40	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm		1778	BGA,	unknown	8542.39.00.01
L-TTSI002081BL-2 Avago Technologies		查询价格和库存				Active	1.5 V						1						INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B240	e1	Not Qualified		85 °C	-40 °C	260	40	240	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN SILVER COPPER	BALL	1 mm	BOTTOM	19 mm	19 mm	2.07 mm		1778	BGA,	unknown	8542.39.00.01

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