数字传输控制器封装型号_数字传输控制器厂家价格-bom2buy

型号

型号					Most Relevant			Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	包装说明	是否符合REACH标准	HTS代码	YTEOL	Source Content uid
T8102---BAL-DB Broadcom Limited		查询价格和库存			Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1807	PLASTIC, BGA-217	compliant	8542.39.00.01	2
T8100A--SC3-DB Avago Technologies		查询价格和库存			Active	3.3 V			1	275 mA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e0	Not Qualified		70 °C		225	30	208	PLASTIC/EPOXY	FQFP		SQUARE	FLATPACK, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	1778	FQFP,	unknown	8542.39.00.01	2
T8100A--BAL3-DB Avago Technologies		查询价格和库存			Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA,	unknown	8542.39.00.01	2
T8100---BAL Avago Technologies		查询价格和库存			Active	3.3 V			1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.13 mm	1778	BGA,	unknown	8542.39.00.01	2
MT9076BB Microchip Technology Inc		查询价格和库存		No	Active	3.3 V			1	98 mA	INDUSTRIAL	FRAMER	S-PQFP-G80	e0	Not Qualified		85 °C	-40 °C			80	PLASTIC/EPOXY	LQFP		SQUARE	FLATPACK, LOW PROFILE	YES	TIN LEAD	GULL WING	650 µm	QUAD	14 mm	14 mm	1.6 mm	2188	14 X 14 MM, 1.40 MM HEIGHT, MS-026BEC, LQFP-80	compliant
82V2108BB Renesas Electronics Corporation		查询价格和库存		No	Active	3.3 V	CMOS		1		INDUSTRIAL	FRAMER	S-PBGA-B144	e0	Not Qualified	3	85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	BGA	BGA144,12X12,40	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	13 mm	13 mm	1.97 mm	2354	PLASTIC, BGA-144	not_compliant		2	82V2108BB
MT8979AC Microchip Technology Inc		查询价格和库存		No	Active	5 V	CMOS	CEPT PCM-30/E-1	1	15 mA	INDUSTRIAL	FRAMER	R-CDIP-T28	e0	Not Qualified		85 °C	-40 °C			28	CERAMIC, METAL-SEALED COFIRED	DIP	DIP28,.6	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	10.16 mm	36.83 mm	6.35 mm	2188	CERAMIC, DIP-28	compliant
T-8100A--BAL4-DB Avago Technologies		查询价格和库存		No	Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA, BGA217,17X17,50	compliant	8542.39.00.01
MT8979AE Microchip Technology Inc		查询价格和库存		No	Active	5 V	CMOS	CEPT PCM-30/E-1	1	16 mA	INDUSTRIAL	FRAMER	R-PDIP-T28	e0	Not Qualified		85 °C	-40 °C			28	PLASTIC/EPOXY	DIP	DIP28,.6	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	15.24 mm	37.4 mm	6.35 mm	2188	0.600 INCH, PLASTIC, MS-011AB, DIP-28	compliant
T8105---BAL-DB Broadcom Limited		查询价格和库存			Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1807	PLASTIC, BGA-217	compliant	8542.39.00.01	2
T8105---BAL3-BB Avago Technologies		查询价格和库存			Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA,	unknown	8542.39.00.01	2
T8105---SC3-DB Broadcom Limited		查询价格和库存			Active	3.3 V			1	275 mA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e0	Not Qualified		70 °C		225	30	208	PLASTIC/EPOXY	FQFP		SQUARE	FLATPACK, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	1807	FQFP,	compliant	8542.39.00.01
T8105---SC-DB Avago Technologies		查询价格和库存			Active	3.3 V			1	275 mA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e0	Not Qualified		70 °C		225	30	208	PLASTIC/EPOXY	FQFP		SQUARE	FLATPACK, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	1778	FQFP,	unknown	8542.39.00.01	2
ZL81000GGG2 Microchip Technology Inc		查询价格和库存			Active	1.8 V		T-1(DS1)	1	154 mA	INDUSTRIAL	TIME SLOT 0/16 TRANSCEIVER	S-PBGA-B256				85 °C	-40 °C			256	PLASTIC/EPOXY	LBGA	BGA256,16X16,40	SQUARE	GRID ARRAY, LOW PROFILE	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.7 mm	2188	CSBGA-256	compliant		24.61
T-8105---BAL4-DB Avago Technologies		查询价格和库存		No	Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA, BGA217,17X17,50	compliant	8542.39.00.01	2
TTSI1K16T Broadcom Limited		查询价格和库存			Active	3.3 V	CMOS		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PQFP-G144	e0	Not Qualified		85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	20 mm	20 mm	1.6 mm	1807	LFQFP,	compliant	8542.39.00.01
TTSI1K16T3TL Avago Technologies		查询价格和库存			Active	3.3 V	CMOS		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PQFP-G144	e0	Not Qualified		85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	20 mm	20 mm	1.6 mm	1778	LFQFP,	unknown	8542.39.00.01
TTSI2K32T3BAL Avago Technologies		查询价格和库存			Active	3.3 V	CMOS		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA,	unknown	8542.39.00.01
TTSI4K32T Avago Technologies		查询价格和库存			Active	3.3 V	CMOS		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA,	unknown	8542.39.00.01
TTSI4K32T3BAL Broadcom Limited		查询价格和库存			Active	3.3 V	CMOS		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1807	BGA,	compliant	8542.39.00.01

型号					Most Relevant			Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	包装说明	是否符合REACH标准	HTS代码	YTEOL	Source Content uid
T8102---BAL-DB Broadcom Limited		查询价格和库存			Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1807	PLASTIC, BGA-217	compliant	8542.39.00.01	2
T8100A--SC3-DB Avago Technologies		查询价格和库存			Active	3.3 V			1	275 mA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e0	Not Qualified		70 °C		225	30	208	PLASTIC/EPOXY	FQFP		SQUARE	FLATPACK, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	1778	FQFP,	unknown	8542.39.00.01	2
T8100A--BAL3-DB Avago Technologies		查询价格和库存			Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA,	unknown	8542.39.00.01	2
T8100---BAL Avago Technologies		查询价格和库存			Active	3.3 V			1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.13 mm	1778	BGA,	unknown	8542.39.00.01	2
MT9076BB Microchip Technology Inc		查询价格和库存		No	Active	3.3 V			1	98 mA	INDUSTRIAL	FRAMER	S-PQFP-G80	e0	Not Qualified		85 °C	-40 °C			80	PLASTIC/EPOXY	LQFP		SQUARE	FLATPACK, LOW PROFILE	YES	TIN LEAD	GULL WING	650 µm	QUAD	14 mm	14 mm	1.6 mm	2188	14 X 14 MM, 1.40 MM HEIGHT, MS-026BEC, LQFP-80	compliant
82V2108BB Renesas Electronics Corporation		查询价格和库存		No	Active	3.3 V	CMOS		1		INDUSTRIAL	FRAMER	S-PBGA-B144	e0	Not Qualified	3	85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	BGA	BGA144,12X12,40	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	13 mm	13 mm	1.97 mm	2354	PLASTIC, BGA-144	not_compliant		2	82V2108BB
MT8979AC Microchip Technology Inc		查询价格和库存		No	Active	5 V	CMOS	CEPT PCM-30/E-1	1	15 mA	INDUSTRIAL	FRAMER	R-CDIP-T28	e0	Not Qualified		85 °C	-40 °C			28	CERAMIC, METAL-SEALED COFIRED	DIP	DIP28,.6	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	10.16 mm	36.83 mm	6.35 mm	2188	CERAMIC, DIP-28	compliant
T-8100A--BAL4-DB Avago Technologies		查询价格和库存		No	Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA, BGA217,17X17,50	compliant	8542.39.00.01
MT8979AE Microchip Technology Inc		查询价格和库存		No	Active	5 V	CMOS	CEPT PCM-30/E-1	1	16 mA	INDUSTRIAL	FRAMER	R-PDIP-T28	e0	Not Qualified		85 °C	-40 °C			28	PLASTIC/EPOXY	DIP	DIP28,.6	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	15.24 mm	37.4 mm	6.35 mm	2188	0.600 INCH, PLASTIC, MS-011AB, DIP-28	compliant
T8105---BAL-DB Broadcom Limited		查询价格和库存			Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1807	PLASTIC, BGA-217	compliant	8542.39.00.01	2
T8105---BAL3-BB Avago Technologies		查询价格和库存			Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA,	unknown	8542.39.00.01	2
T8105---SC3-DB Broadcom Limited		查询价格和库存			Active	3.3 V			1	275 mA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e0	Not Qualified		70 °C		225	30	208	PLASTIC/EPOXY	FQFP		SQUARE	FLATPACK, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	1807	FQFP,	compliant	8542.39.00.01
T8105---SC-DB Avago Technologies		查询价格和库存			Active	3.3 V			1	275 mA	COMMERCIAL	TIME SLOT ASSIGNER	S-PQFP-G208	e0	Not Qualified		70 °C		225	30	208	PLASTIC/EPOXY	FQFP		SQUARE	FLATPACK, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	28 mm	28 mm	4.1 mm	1778	FQFP,	unknown	8542.39.00.01	2
ZL81000GGG2 Microchip Technology Inc		查询价格和库存			Active	1.8 V		T-1(DS1)	1	154 mA	INDUSTRIAL	TIME SLOT 0/16 TRANSCEIVER	S-PBGA-B256				85 °C	-40 °C			256	PLASTIC/EPOXY	LBGA	BGA256,16X16,40	SQUARE	GRID ARRAY, LOW PROFILE	YES		BALL	1 mm	BOTTOM	17 mm	17 mm	1.7 mm	2188	CSBGA-256	compliant		24.61
T-8105---BAL4-DB Avago Technologies		查询价格和库存		No	Active	3.3 V			1	275 mA	INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C			217	PLASTIC/EPOXY	BGA	BGA217,17X17,50	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA, BGA217,17X17,50	compliant	8542.39.00.01	2
TTSI1K16T Broadcom Limited		查询价格和库存			Active	3.3 V	CMOS		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PQFP-G144	e0	Not Qualified		85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	20 mm	20 mm	1.6 mm	1807	LFQFP,	compliant	8542.39.00.01
TTSI1K16T3TL Avago Technologies		查询价格和库存			Active	3.3 V	CMOS		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PQFP-G144	e0	Not Qualified		85 °C	-40 °C	225	30	144	PLASTIC/EPOXY	LFQFP		SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN LEAD	GULL WING	500 µm	QUAD	20 mm	20 mm	1.6 mm	1778	LFQFP,	unknown	8542.39.00.01
TTSI2K32T3BAL Avago Technologies		查询价格和库存			Active	3.3 V	CMOS		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA,	unknown	8542.39.00.01
TTSI4K32T Avago Technologies		查询价格和库存			Active	3.3 V	CMOS		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1778	BGA,	unknown	8542.39.00.01
TTSI4K32T3BAL Broadcom Limited		查询价格和库存			Active	3.3 V	CMOS		1		INDUSTRIAL	TIME SLOT ASSIGNER	S-PBGA-B217	e0	Not Qualified		85 °C	-40 °C	225	30	217	PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1.27 mm	BOTTOM	23 mm	23 mm	2.32 mm	1807	BGA,	compliant	8542.39.00.01

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