| 型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| 数据手册 |
价格/库存
|
风险等级 | 是否无铅 |
是否Rohs认证
|
生命周期 | 内存密度 | 内存宽度 | 组织 |
标称供电电压 (Vsup)
|
最长访问时间 | 最大时钟频率 (fCLK) | 内存集成电路类型 | 其他特性 | 备用内存宽度 | 数据保留时间-最小值 | 耐久性 | I/O 类型 | 功能数量 | 端口数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 并行/串行 |
编程电压
|
反向引出线
|
串行总线类型
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最大待机电流
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最大压摆率
|
最大供电电压 (Vsup)
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最小供电电压 (Vsup)
|
技术 |
温度等级
|
类型
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最长写入周期时间 (tWC)
|
写保护
|
JESD-30 代码 |
认证状态
|
JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度（摄氏度） |
筛选级别
|
处于峰值回流温度下的最长时间
|
端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
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端子面层
|
端子形式
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端子节距
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端子位置
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座面最大高度
|
长度 |
宽度
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Source Content uid
|
mfrid
|
零件包装代码
|
针数
|
制造商包装代码
|
是否符合REACH标准
|
Country Of Origin
|
ECCN代码
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HTS代码
|
YTEOL
|
GPT Applications Level 1
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GPT Applications Level 2
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GPT Applications Level Application
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包装说明
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||
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CAT24C128WI-GT3
onsemi
|
查询价格和库存 |
|
Yes | Active | 131.072 kbit | 8 | 16KX8 | 3.3 V | 1 MHz | EEPROM | 5MICROAMP STANDBY CURRENT AVAILABLE @ 12... more | 1 | 100 | 1000000 Write/Erase Cycles | 1 | 16000 | 16.384 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 3.3 V | I2C | 2 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | CAT24C128WI-GT3 | 2260 | SOIC 8, 150 mils | 8 | 751BD | compliant | Thailand | EAR99 | 8542.32.00.51 | 6.2 | Internet of Things (IoT),Environmental M... more | Intelligent Transportation Systems,Gamin... more | Consumer electronics | ||||||||||
|
AT93C46D-TH-T
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.024 kbit | 16 | 64X16 | 5 V | 2 MHz | EEPROM | ALSO OPERATES AT 1MHZ AT 2.7MIN AND AT 0.25MHZ AT 1.8MIN | 8 | 100 | 1000000 Write/Erase Cycles | SEPARATE | 1 | 1 | 64 | 64 words | SYNCHRONOUS | 3-STATE | SERIAL | 5 V | NO | 3-WIRE | 15 µA | 2 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | AT93C46D-TH-T | 2188 | compliant | Thailand | 3A991.A.2 | 8542.31.00.01 | 5.9 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | TSSOP-8 | ||||||||
|
AT93C46DY6-YH-T
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.024 kbit | 16 | 64X16 | 5 V | 2 MHz | EEPROM | ALSO OPERATES AT 1MHZ AT 2.7MIN AND AT 0.25MHZ AT 1.8MIN | 8 | 100 | 1000000 Write/Erase Cycles | SEPARATE | 1 | 1 | 64 | 64 words | SYNCHRONOUS | 3-STATE | SERIAL | 5 V | NO | 3-WIRE | 15 µA | 2 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | AT93C46DY6-YH-T | 2188 | compliant | Thailand | 3A991.A.2 | 8542.31.00.01 | 5.9 | Consumer Electronics,Internet of Things (IoT),Computing and Data Storage | Portable Devices,Data Storage Devices,Connected Devices | Memory | UDFN-8 | ||||||||
|
CAT24C128HU4IGT3
onsemi
|
查询价格和库存 |
|
Yes | Active | 131.072 kbit | 8 | 16KX8 | 3.3 V | 1 MHz | EEPROM | 5MICROAMP STANDBY CURRENT AVAILABLE @ 12... more | 1 | 100 | 1000000 Write/Erase Cycles | 1 | 16000 | 16.384 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 3.3 V | I2C | 2 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 550 µm | 3 mm | 2 mm | CAT24C128HU4IGT3 | 2260 | UDFN8, 2x3, 0.5P, Extended Pad | 8 | 517AZ | compliant | Thailand | EAR99 | 8542.32.00.51 | 6.3 | Internet of Things (IoT),Environmental M... more | Intelligent Transportation Systems,Gamin... more | Consumer electronics | ||||||||||
|
CAT24C128YI-GT3
onsemi
|
查询价格和库存 |
|
Yes | Active | 131.072 kbit | 8 | 16KX8 | 3.3 V | 1 MHz | EEPROM | 5MICROAMP STANDBY CURRENT AVAILABLE @ 12... more | 1 | 100 | 1000000 Write/Erase Cycles | 1 | 16000 | 16.384 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 3.3 V | I2C | 2 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | CAT24C128YI-GT3 | 2260 | TSSOP8, 4.4x3 | 8 | 948AL | compliant | Thailand | EAR99 | 8542.32.00.51 | 6.2 | Internet of Things (IoT),Environmental M... more | Intelligent Transportation Systems,Gamin... more | Consumer electronics | ||||||||||
|
MX25L25645GZ2I-08G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 8 | 32MX8 | 3 V | 120 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 20 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-XDSO-N8 | e3 | 85 °C | -40 °C | 8 | UNSPECIFIED | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 4307504 | compliant | Taiwan | EAR99 | 8542.32.00.51 | 6.75 | Industrial Automation,Renewable Energy,Robotics and Drones | Control Systems | Industrial control systems | WSON-8 | |||||||||||||||||||
|
MX25L25645GZNI-08G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 8 | 32MX8 | 3 V | 120 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 20 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-XDSO-N8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | UNSPECIFIED | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | 4307504 | unknown | Taiwan | EAR99 | 8542.32.00.51 | 6.2 | Industrial Automation,Renewable Energy,Robotics and Drones | Control Systems | Industrial control systems | WSON-8 | |||||||||||||||||||
|
MX25L25645GXDI-08G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 8 | 32MX8 | 3 V | 120 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 20 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | e1 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | 4307504 | unknown | Taiwan | EAR99 | 8542.32.00.51 | 4.75 | Industrial Automation,Renewable Energy,Robotics and Drones | Control Systems | Industrial control systems | BGA-24 | |||||||||||||||||||
|
MX25L25645GM2I-08G
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 8 | 32MX8 | 3 V | 120 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 20 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.23 mm | 4307504 | unknown | Taiwan | EAR99 | 8542.32.00.51 | 9.25 | Industrial Automation,Renewable Energy,Robotics and Drones | Control Systems | Industrial control systems | SOP-8 | |||||||||||||||||||
|
MD27C256-25/B
Rochester Electronics LLC
|
查询价格和库存 |
|
No | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-J32 | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | CERAMIC, METAL-SEALED COFIRED | QCCJ | RECTANGULAR | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 4.2418 mm | 15.04 mm | 11.557 mm | 2178096 | unknown | 3A001.A.2.C | 8542.32.00.61 | 3.75 | Consumer Electronics | Portable Devices | EPROM memory | CERAMIC, JLCC-32 | ||||||||||||||||||||||||||||||
|
5962-8606312QYX
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Qualified | e0 | 125 °C | -55 °C | MIL-PRF-38535 Class Q | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | QUAD | 1937079 | QFJ | 32 | compliant | USA | 3A001.A.2.C | 8542.32.00.61 | 4.6 | Education and Research,Consumer Electron... more | Control Systems,IoT Devices,Vehicle Elec... more | Precision measurement equipment,Industri... more | CERAMIC, LCC-32 | ||||||||||||||||||||||||||||||
|
5962-8606312QXX
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Qualified | e0 | 125 °C | -55 °C | MIL-PRF-38535 Class Q | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | 1937079 | DIP | 28 | compliant | USA | 3A001.A.2.C | 8542.32.00.61 | 4.25 | Education and Research,Consumer Electron... more | Control Systems,IoT Devices,Vehicle Elec... more | Precision measurement equipment,Industri... more | CERAMIC, DIP-28 | ||||||||||||||||||||||||||||||
|
QP27C256-55/QYA
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | Computing and Data Storage,Financial Technology (Fintech),Telecommunications | Fintech Devices,Data Storage Devices,Communication Devices | EPROMs | HERMETIC SEALED, CERAMIC, DIP-28 | |||||||||||||||||||||||||||||||||
|
QP27C256L-250/ZA
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | QUAD | 1937079 | QFJ | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | Computing and Data Storage,Financial Technology (Fintech),Telecommunications | Fintech Devices,Data Storage Devices,Communication Devices | EPROMs | CERAMIC, LCC-32 | |||||||||||||||||||||||||||||||||
|
QP27C256-55/YA
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | Computing and Data Storage,Financial Technology (Fintech),Telecommunications | Fintech Devices,Data Storage Devices,Communication Devices | EPROMs | HERMETIC SEALED, CERAMIC, DIP-28 | |||||||||||||||||||||||||||||||||
|
QP7C271-55WI
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-GDIP-T28 | 85 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 28 | compliant | EAR99 | 8542.32.00.61 | 3.75 | Industrial Automation,Computing and Data... more | Communication Systems | Communications systems | 0.300 INCH, CERAMIC, WINDOWED, DIP-28 | |||||||||||||||||||||||||||||||||||
|
QP27C256L-250/YC
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | QUAD | 1937079 | QFJ | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | Computing and Data Storage,Financial Technology (Fintech),Telecommunications | Fintech Devices,Data Storage Devices,Communication Devices | EPROMs | CERAMIC, LCC-32 | |||||||||||||||||||||||||||||||||
|
QP7C271-55WC
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 55 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDIP-T28 | 70 °C | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 28 | compliant | EAR99 | 8542.32.00.61 | 3.75 | Industrial Automation,Computing and Data... more | Communication Systems | Communications systems | 0.300 INCH, CERAMIC, WINDOWED, DIP-28 | ||||||||||||||||||||||||||||||||||||
|
QP27C256-200/QYA
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | Computing and Data Storage,Financial Technology (Fintech),Telecommunications | Fintech Devices,Data Storage Devices,Communication Devices | EPROMs | HERMETIC SEALED, CERAMIC, DIP-28 | |||||||||||||||||||||||||||||||||
|
QP27C256-200/YA
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 1937079 | DIP | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | Computing and Data Storage,Financial Technology (Fintech),Telecommunications | Fintech Devices,Data Storage Devices,Communication Devices | EPROMs | HERMETIC SEALED, CERAMIC, DIP-28 | |||||||||||||||||||||||||||||||||