| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| 制造商型号 | 制造商 | 数据手册 |
价格/库存
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风险等级 | 是否无铅 |
是否Rohs认证
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生命周期 | 内存密度 | 内存宽度 | 组织 |
标称供电电压 (Vsup)
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电源
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最长访问时间 | 最大时钟频率 (fCLK) | 内存集成电路类型 | 其他特性 | 备用内存宽度 | 数据保留时间-最小值 | 耐久性 | I/O 类型 | I2C控制字节 | 功能数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 并行/串行 |
编程电压
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串行总线类型
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最大待机电流
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最大压摆率
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最大供电电压 (Vsup)
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最小供电电压 (Vsup)
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技术 |
温度等级
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最长写入周期时间 (tWC)
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写保护
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JESD-30 代码 |
认证状态
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JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度（摄氏度） |
筛选级别
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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座面最大高度
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长度 |
宽度
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Objectid
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零件包装代码
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包装说明
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针数
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是否符合REACH标准
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ECCN代码
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HTS代码
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Source Content uid
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交付时间
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制造商包装代码
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Samacsys Manufacturer
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5962-8606305YA
|
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 5 V | 150 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 1821471775 | QFJ | CERAMIC, LCC-32 | 32 | compliant | EAR99 | 8542.32.00.61 | ||||||||||||||||||||||
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5962-8606304XA
|
e2v technologies
|
查询价格和库存 |
|
Active | 262.144 kbit | 8 | 32KX8 | 5 V | 5 V | 170 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 1821471753 | DIP | CERAMIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.61 | ||||||||||||||||||||||
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AT93C46DY6-YH-E
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Microchip Technology Inc
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查询价格和库存 |
|
Yes | Active | 1.024 kbit | 16 | 64X16 | 5 V | 2 MHz | EEPROM | ALSO OPERATES AT 1MHZ AT 2.7MIN AND AT 0.25MHZ AT 1.8MIN | 8 | 100 | 1000000 Write/Erase Cycles | SEPARATE | 1 | 64 | 64 words | SYNCHRONOUS | 3-STATE | SERIAL | 5 V | 3-WIRE | 15 µA | 2 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-N8 | e4 | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | 4001774900 | UDFN-8 | compliant | EAR99 | 8542.32.00.51 | AT93C46DY6-YH-E | 52 weeks | ||||||||||||||
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AT93C46DY6-YH-T
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Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.024 kbit | 16 | 64X16 | 5 V | 2/5 V | 2 MHz | EEPROM | ALSO OPERATES AT 1MHZ AT 2.7MIN | 8 | 100 | 1000000 Write/Erase Cycles | SEPARATE | 1 | 64 | 64 words | SYNCHRONOUS | SERIAL | 5 V | MICROWIRE | 15 µA | 2 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | 4001777262 | UDFN-8 | compliant | 3A991.A.2 | 8542.31.00.01 | AT93C46DY6-YH-T | 52 weeks | |||||||||
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5962-8606302XA
|
e2v technologies
|
查询价格和库存 |
|
No | No | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 5 V | 250 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Qualified | e0 | 125 °C | -55 °C | NOT SPECIFIED | 38535Q/M;38534H;883B | NOT SPECIFIED | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 1821471719 | DIP | DIP, DIP28,.6 | 28 | compliant | EAR99 | 8542.32.00.61 | ||||||||||||||||||
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CAT24C128HU4IGT3
|
onsemi
|
查询价格和库存 |
|
Yes | Active | 2/5 V | 100 | 1000000 Write/Erase Cycles | 1010DDDR | I2C | HARDWARE | Not Qualified | e4 | 1 | NOT SPECIFIED | NOT SPECIFIED | Nickel/Palladium/Gold (Ni/Pd/Au) | 1032616757 | , | 8 | compliant | EAR99 | 8542.32.00.51 | CAT24C128HU4IGT3 | 22 weeks | 517AZ | onsemi | ||||||||||||||||||||||||||||||||||||||||||||
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CAT24C128YI-GT3
|
onsemi
|
查询价格和库存 |
|
Yes | Active | 2/5 V | 100 | 1000000 Write/Erase Cycles | 1010DDDR | I2C | HARDWARE | Not Qualified | e4 | 1 | 260 | 40 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1810603744 | TSSOP | , | 8 | compliant | EAR99 | 8542.32.00.51 | CAT24C128YI-GT3 | 50 weeks | 948AL | ||||||||||||||||||||||||||||||||||||||||||||
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CAT24C128WI-GT3
|
onsemi
|
查询价格和库存 |
|
Yes | Active | 131.072 kbit | 8 | 16KX8 | 5 V | 2/5 V | 400 kHz | EEPROM | 100 YEAR DATA RETENTION | 100 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 16000 | 16.384 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | I2C | 2 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 1810603740 | SOIC | , | 8 | compliant | EAR99 | 8542.32.00.51 | CAT24C128WI-GT3 | 751BD | onsemi | ||||||||
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MX25L25645GZ2I-08G
|
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | NOT SPECIFIED | NOT SPECIFIED | 8227101639 | WSON-8 | unknown | EAR99 | 8542.32.00.51 | 24 weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT93C46D-TH-T
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.024 kbit | 16 | 64X16 | 5 V | 2/5 V | 2 MHz | EEPROM | ALSO OPERATES AT 1MHZ AT 2.7MIN | 8 | 100 | 1000000 Write/Erase Cycles | SEPARATE | 1 | 64 | 64 words | SYNCHRONOUS | SERIAL | 5 V | MICROWIRE | 15 µA | 2 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSOP1 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 4001776890 | TSSOP-8 | compliant | 3A991.A.2 | 8542.31.00.01 | AT93C46D-TH-T | 52 weeks | |||||||||
|
MX25L25645GZNI-08G
|
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | NOT SPECIFIED | NOT SPECIFIED | 8227101640 | WSON-8 | unknown | EAR99 | 8542.32.00.51 | 24 weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT93C46EN-SH-T
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Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.024 kbit | 16 | 64X16 | 5 V | 2/5 V | 2 MHz | EEPROM | ALSO OPERATES AT 1MHZ AT 2.7MIN | 100 | 1000000 Write/Erase Cycles | SEPARATE | 1 | 64 | 64 words | SYNCHRONOUS | SERIAL | 5 V | MICROWIRE | 15 µA | 2 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 4001774122 | SOIC-8 | compliant | 3A991.A.2 | 8542.31.00.01 | AT93C46EN-SH-T | 53 weeks 4 days | ||||||||||
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AT93C46E-TH-B
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.024 kbit | 16 | 64X16 | 5 V | 2/5 V | 2 MHz | EEPROM | ALSO OPERATES AT 1MHZ AT 2.7MIN | 100 | 1000000 Write/Erase Cycles | SEPARATE | 1 | 64 | 64 words | SYNCHRONOUS | SERIAL | 5 V | MICROWIRE | 15 µA | 2 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSOP1 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 4001773855 | TSSOP-8 | compliant | 3A991.A.2 | 8542.31.00.01 | AT93C46E-TH-B | 53 weeks 4 days | ||||||||||
|
AT93C46DN-SH-B
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.024 kbit | 16 | 64X16 | 5 V | 2/5 V | 2 MHz | EEPROM | ALSO OPERATES AT 1MHZ AT 2.7MIN | 8 | 100 | 1000000 Write/Erase Cycles | SEPARATE | 1 | 64 | 64 words | SYNCHRONOUS | SERIAL | 5 V | MICROWIRE | 15 µA | 2 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 4001775570 | SOIC-8 | compliant | 3A991.A.2 | 8542.31.00.01 | AT93C46DN-SH-B | 52 weeks | |||||||||
|
MX25L25645GXDI-08G
|
Macronix International Co Ltd
|
查询价格和库存 |
|
Yes | Active | e1 | NOT SPECIFIED | NOT SPECIFIED | Tin/Silver/Copper (Sn/Ag/Cu) | 8227101637 | BGA-24 | unknown | EAR99 | 8542.32.00.51 | 24 weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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NTE2716
|
NTE Electronics Inc
|
查询价格和库存 |
|
Yes | Active | 16.384 kbit | 8 | 2KX8 | 5 V | 5 V | 350 ns | UVPROM | COMMON | 1 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 25 V | 160 µA | 5.25 V | 4.75 V | NMOS | COMMERCIAL | R-XDIP-T24 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | UNSPECIFIED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 1544086507 | DIP | DIP, DIP24,.6 | 24 | unknown | EAR99 | 8542.32.00.61 | ||||||||||||||||||||||||
|
5962-87515073A
|
e2v technologies
|
查询价格和库存 |
|
Active | 65.536 kbit | 8 | 8KX8 | 5 V | 5 V | 35 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 120 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CQCC-N28 | Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC28,.45SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 1822918844 | QLCC | CERAMIC, LCC-28 | 28 | compliant | EAR99 | 8542.32.00.61 | |||||||||||||||||||||||
|
5962-8764801XA
|
e2v technologies
|
查询价格和库存 |
|
Active | 524.288 kbit | 8 | 64KX8 | 5 V | 5 V | 150 ns | UVPROM | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 325 µA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 1821472733 | DIP | DIP, DIP28,.6 | 28 | compliant | EAR99 | 8542.32.00.61 | |||||||||||||||||||||||
|
5962-8751508LA
|
e2v technologies
|
查询价格和库存 |
|
Active | 65.536 kbit | 8 | 8KX8 | 5 V | 5 V | 35 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 120 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T24 | Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 24 | CERAMIC, GLASS-SEALED | WDIP | DIP24,.3 | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 32.005 mm | 7.62 mm | 1822918862 | WDIP, DIP24,.3 | compliant | EAR99 | 8542.32.00.61 | ||||||||||||||||||||||
|
5962-8680503QA
|
e2v technologies
|
查询价格和库存 |
|
Active | 1.0486 Mbit | 16 | 64KX16 | 5 V | 5 V | 90 ns | UVPROM | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 120 µA | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T40 | Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 40 | CERAMIC, GLASS-SEALED | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 1821472159 | DIP | DIP, DIP40,.6 | 40 | compliant | EAR99 | 8542.32.00.61 | |||||||||||||||||||||||