Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||
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制造商型号 | 制造商 | 数据手册 |
价格/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 功能数量 |
电源
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最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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筛选级别
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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Source Content uid
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零件包装代码
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包装说明
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针数
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是否符合REACH标准
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ECCN代码
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HTS代码
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交付时间
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HCS301-I/SN
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Microchip Technology Inc
|
查询价格和库存 |
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Yes | Yes | Active | 5 V | 1 | 12 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS301-I/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | |||
HCS301T-I/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 12 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS301T-I/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | |||
HCS301/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 12 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS301/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | ||||
HCS301T/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 12 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS301T/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | ||||
HCS300T-I/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 2.5 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300T-I/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | |||
HCS300T/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300T/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | [object Object] | |||||||||
HCS515-I/SL
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 5 V | 2 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G14 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 8.65 mm | 1.75 mm | HCS515-I/SL | SOIC | 0.150 INCH, PLASTIC, SOIC-14 | 14 | compliant | EAR99 | 8542.31.00.01 | [object Object] | ||
HCS201/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 2 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS201/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 8542.39.00.01 | [object Object] | |||||
HCS300-I/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 2.5 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300-I/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | |||
HCS300/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | [object Object] | |||||||||
HCS300-I/P
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 2.5 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDIP-T8 | e3 | Not Qualified | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.271 mm | 5.33 mm | HCS300-I/P | DIP | 0.300 INCH, PLASTIC, DIP-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | ||||||
HCS200-I/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 12 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS200-I/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | |||
HCS515/SL
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 5 V | 2 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G14 | e3 | Not Qualified | 1 | 70 °C | 260 | TS 16949 | 40 | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 8.65 mm | 1.75 mm | HCS515/SL | SOIC | 0.150 INCH, PLASTIC, SOIC-14 | 14 | compliant | EAR99 | 8542.31.00.01 | [object Object] | |||
HCS200/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9116 mm | 4.9 mm | 1.75 mm | HCS200/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | [object Object] | |||||||||
HCS200T/SN
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9116 mm | 4.9 mm | 1.75 mm | HCS200T/SN | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | [object Object] | |||||||||
HCS200-I/P
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 12 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDIP-T8 | e3 | Not Qualified | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.46 mm | 4.32 mm | HCS200-I/P | DIP | 0.300 INCH, PLASTIC, DIP-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | ||||||
HCS500-I/SM
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.3/5 V | 2.4 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 5.25 mm | 5.26 mm | 2.03 mm | HCS500-I/SM | SOIC | 0.207 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | |
HCS500/SM
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | 3.3/5 V | 2.4 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 3 | 70 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 5.25 mm | 5.26 mm | 2.03 mm | HCS500/SM | SOIC | 0.207 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | [object Object] | ||
HCS301/P
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | 12 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDIP-T8 | e3 | Not Qualified | 70 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.46 mm | 4.32 mm | HCS301/P | DIP | 0.300 INCH, PLASTIC, DIP-8 | 8 | compliant | 8542.39.00.01 | [object Object] | ||||||||
HCS300/P
|
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDIP-T8 | e3 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | Matte Tin (Sn) | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.271 mm | 5.33 mm | HCS300/P | DIP | 0.300 INCH, PLASTIC, DIP-8 | 8 | compliant | [object Object] |