型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
数据手册 |
单价/库存
|
风险等级 | 是否无铅 |
是否Rohs认证
|
生命周期 | 内存密度 | 内存宽度 | 组织 |
标称供电电压 (Vsup)
|
最长访问时间 | 最大时钟频率 (fCLK) | 内存集成电路类型 | 其他特性 | I/O 类型 | 混合内存类型 | 功能数量 | 端口数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 并行/串行 |
编程电压
|
串行总线类型
|
最大待机电流
|
最大压摆率
|
最大供电电压 (Vsup)
|
最小供电电压 (Vsup)
|
技术 |
温度等级
|
JESD-30 代码 |
认证状态
|
JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) |
筛选级别
|
处于峰值回流温度下的最长时间
|
端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
|
端子面层
|
端子形式
|
端子节距
|
端子位置
|
座面最大高度
|
长度 |
宽度
|
mfrid
|
零件包装代码
|
包装说明
|
针数
|
是否符合REACH标准
|
ECCN代码
|
HTS代码
|
Source Content uid
|
Country Of Origin
|
YTEOL
|
制造商包装代码
|
Date Of Intro
|
||
MR0A16AYS35
Everspin Technologies
|
查询价格和库存 |
|
Yes | Active | 1.0486 Mbit | 16 | 64KX16 | 3.3 V | 35 ns | MEMORY CIRCUIT | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 28 mA | 155 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | 1623927 | TSOP2 | 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | 44 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
MR0D08BMA45R
Everspin Technologies
|
查询价格和库存 |
|
Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 45 ns | MEMORY CIRCUIT | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 8 mA | 65 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PBGA-B48 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | LFBGA | BGA48,6X8,30 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 750 µm | BOTTOM | 1.35 mm | 8 mm | 8 mm | 1623927 | BGA | LFBGA, BGA48,6X8,30 | 48 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
CC2544RHBR
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 2.496 GHz | MEMORY CIRCUIT | Frequency range : 2379-2496 MHz | 3.6 V | 2 V | AUTOMOTIVE | S-PQCC-N32 | e4 | 3 | 125 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 5 mm | 5 mm | 2477 | compliant | 5A992.C | 8542.31.00.01 | CC2544RHBR | Philippines | 15 | ||||||||||||||||||||||||||||
CC2544RHBT
Texas Instruments
|
查询价格和库存 |
|
Yes | Yes | Active | 2.496 GHz | MEMORY CIRCUIT | Frequency range : 2379-2496 MHz | 3.6 V | 2 V | AUTOMOTIVE | S-PQCC-N32 | e4 | 3 | 125 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 1 mm | 5 mm | 5 mm | 2477 | HVQCCN, LCC32,.2SQ,20 | compliant | 5A992.C | 8542.31.00.01 | CC2544RHBT | Philippines | 15 | |||||||||||||||||||||||||||
DS2401A+
Analog Devices Inc
|
查询价格和库存 |
|
Yes | Active | MEMORY CIRCUIT | e3 | 250 | NOT SPECIFIED | Matte Tin (Sn) | 1742 | 3-TO92-N/A | 3 | compliant | DS2401A+ | Japan, Mainland China, Malaysia, Philipp... more | 8.5 | 3-TO92-N/A | 2002-02-22 | |||||||||||||||||||||||||||||||||||||||||||||||||
MBM27128-25
FUJITSU Limited
|
查询价格和库存 |
|
Active | 131.072 kbit | 8 | 16KX8 | 5 V | 250 ns | UVPROM | COMMON | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 35 mA | 100 µA | 5.5 V | 4.5 V | NMOS | R-CQCC-N32 | 70 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | NO LEAD | 1.27 mm | QUAD | 3.3 mm | 14.03 mm | 11.49 mm | 2000 | QFJ | LCC-32 | 32 | compliant | EAR99 | 8542.32.00.61 | 2 | ||||||||||||||||||||||
MR2A08ACYS35
Everspin Technologies
|
查询价格和库存 |
|
Yes | Active | 2.0972 Mbit | 8 | 256KX8 | 3.3 V | 35 ns | MEMORY CIRCUIT | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 20 mA | 135 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | 1623927 | TSOP2 | TSOP2, TSOP44,.46,32 | 44 | compliant | EAR99 | 8542.32.00.71 | |||||||||||||||||||||
MR2A08AYS35
Everspin Technologies
|
查询价格和库存 |
|
Yes | Active | 4.1943 Mbit | 8 | 512KX8 | 3.3 V | 35 ns | MEMORY CIRCUIT | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 20 mA | 135 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | 1623927 | TSOP2 | TSOP2, TSOP44,.46,32 | 44 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||||
MR2A16AVYS35
Everspin Technologies
|
查询价格和库存 |
|
Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 35 ns | MEMORY CIRCUIT | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 28 mA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | 1623927 | TSOP2 | 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | 44 | compliant | EAR99 | 8542.32.00.71 | |||||||||||||||||||||
47C16-E/SN
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 16.384 kbit | 8 | 2KX8 | 5 V | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 5.5 V | 4.5 V | CMOS | AUTOMOTIVE | R-PDSO-G8 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2188 | SOIC-8 | compliant | EAR99 | 8542.32.00.71 | 47C16-E/SN | Thailand | 24.61 | 2016-10-10 | |||||||||||||||||
47L04-E/SN
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 4.096 kbit | 8 | 512X8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 512 | 512 words | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | AUTOMOTIVE | R-PDSO-G8 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2188 | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | 47L04-E/SN | Thailand | 24.61 | 2016-10-10 | ||||||||||||||||||
47C16-E/ST
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 16.384 kbit | 8 | 2KX8 | 5 V | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 5.5 V | 4.5 V | CMOS | AUTOMOTIVE | R-PDSO-G8 | e3 | 1 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2188 | TSSOP-8 | compliant | EAR99 | 8542.32.00.51 | 47C16-E/ST | Thailand | 24.61 | 2016-10-10 | |||||||||||||||||
MR25H40MDF
Everspin Technologies
|
查询价格和库存 |
|
Yes | Active | 4.1943 Mbit | 8 | 512KX8 | 3.3 V | 40 MHz | MRAM | 1 | 512000 | 524.288 k | SYNCHRONOUS | SERIAL | SPI | 3.6 V | 3 V | CMOS | AUTOMOTIVE | R-PDSO-N8 | Not Qualified | 3 | 125 °C | -40 °C | 260 | AEC-Q100 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 900 µm | 6 mm | 5 mm | 1623927 | SON | DFN-8 | 8 | compliant | EAR99 | ||||||||||||||||||||
47C04-I/ST
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 512 | 512 words | SYNCHRONOUS | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2188 | TSSOP-8 | compliant | EAR99 | 8542.32.00.51 | 47C04-I/ST | Thailand | 24.61 | 2016-10-10 | |||||||||||||||||
47C04-E/SN
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 512 | 512 words | SYNCHRONOUS | 5.5 V | 4.5 V | CMOS | AUTOMOTIVE | R-PDSO-G8 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2188 | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | 47C04-E/SN | Thailand | 24.61 | 2016-10-10 | |||||||||||||||||
47L16-E/ST
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 16.384 kbit | 8 | 2KX8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | AUTOMOTIVE | R-PDSO-G8 | e3 | 1 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2188 | TSSOP-8 | compliant | EAR99 | 8542.32.00.51 | 47L16-E/ST | Thailand | 24.61 | 2016-10-10 | ||||||||||||||||||
47L16-I/ST
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 16.384 kbit | 8 | 2KX8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2188 | TSSOP-8 | compliant | EAR99 | 8542.32.00.51 | 47L16-I/ST | Thailand | 24.61 | 2016-10-10 | ||||||||||||||||||
47C16-I/ST
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 16.384 kbit | 8 | 2KX8 | 5 V | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2188 | compliant | EAR99 | 8542.32.00.51 | 47C16-I/ST | Thailand | 24.61 | 2016-10-10 | ||||||||||||||||||
47C04-E/ST
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 4.096 kbit | 8 | 512X8 | 5 V | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 512 | 512 words | SYNCHRONOUS | 5.5 V | 4.5 V | CMOS | AUTOMOTIVE | R-PDSO-G8 | e3 | 1 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2188 | TSSOP-8 | compliant | EAR99 | 8542.32.00.51 | 47C04-E/ST | Thailand | 24.61 | 2016-10-10 | |||||||||||||||||
47L16-E/SN
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 16.384 kbit | 8 | 2KX8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | AUTOMOTIVE | R-PDSO-G8 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2188 | SOIC-8 | compliant | EAR99 | 8542.32.00.71 | 47L16-E/SN | Thailand | 24.61 | 2016-10-10 |