型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 | 是否无铅 |
是否Rohs认证
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生命周期 | 内存密度 | 内存宽度 |
部门规模
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组织 |
标称供电电压 (Vsup)
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最长访问时间 | 最大时钟频率 (fCLK) | 内存集成电路类型 | 其他特性 | 备用内存宽度 | 启动块 | 命令用户界面 | 通用闪存接口 | 数据轮询 | 数据保留时间-最小值 | 耐久性 | 功能数量 | 端口数量 | 部门数/规模 | 字数代码 | 字数 | 工作模式 | 输出特性 | 并行/串行 |
编程电压
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就绪/忙碌
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串行总线类型
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最大待机电流
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最大压摆率
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最大供电电压 (Vsup)
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最小供电电压 (Vsup)
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技术 |
温度等级
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切换位
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类型
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写保护
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JESD-30 代码 |
认证状态
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JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) |
筛选级别
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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座面最大高度
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长度 |
宽度
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mfrid
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包装说明
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是否符合REACH标准
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ECCN代码
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HTS代码
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YTEOL
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Source Content uid
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零件包装代码
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针数
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Country Of Origin
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Date Of Intro
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W25Q80DVZPIG
Winbond Electronics Corp
|
查询价格和库存 |
|
Yes | Active | 8.3886 Mbit | 8 | 1MX8 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 60 µA | 25 µA | 3.6 V | 2.7 V | CMOS | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | 2558 | WSON-8 | compliant | EAR99 | 8542.32.00.51 | 5.2 | |||||||||||||||||||||||||
SST39VF010-70-4C-WHE
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.0486 Mbit | 8 | 4K | 128KX8 | 3 V | 70 ns | FLASH | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 32 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | 15 µA | 30 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PDSO-G32 | Not Qualified | e3 | 3 | 70 °C | 260 | 40 | 32 | PLASTIC/EPOXY | TSOP1 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 12.4 mm | 8 mm | 2188 | 8 X 14 MM, ROHS COMPLIANT, MO-142BA, TSOP1-32 | compliant | 3A991.B.1.A | 8542.32.00.51 | 24.48 | SST39VF010-70-4C-WHE | TSOP1 | 32 | Thailand | |||||||||||||
SST39SF010A-70-4I-NHE
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.0486 Mbit | 8 | 4K | 128KX8 | 5 V | 70 ns | FLASH | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 32 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 100 µA | 35 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 245 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | 2188 | ROHS COMPLIANT, PLASTIC, MO-016AE, LCC-32 | compliant | 3A991.B.1.A | 8542.32.00.51 | 24.48 | SST39SF010A-70-4I-NHE | QFJ | 32 | Thailand | |||||||||||||
SST39SF010A-55-4C-NHE
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.0486 Mbit | 8 | 4K | 128KX8 | 5 V | 55 ns | FLASH | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 32 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 100 µA | 35 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | YES | NOR TYPE | HARDWARE/SOFTWARE | R-PQCC-J32 | Not Qualified | e3 | 3 | 70 °C | 245 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | 2188 | LCC-32 | compliant | 3A991.B.1.A | 8542.32.00.51 | 24.48 | SST39SF010A-55-4C-NHE | QFJ | 32 | Thailand | ||||||||||||
SST39SF010A-55-4I-NHE
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.0486 Mbit | 8 | 4K | 128KX8 | 5 V | 55 ns | FLASH | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 32 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 100 µA | 35 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 245 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | 2188 | ROHS COMPLIANT, PLASTIC, MO-016AE, LCC-32 | compliant | 3A991.B.1.A | 8542.32.00.51 | 24.48 | SST39SF010A-55-4I-NHE | QFJ | 32 | Thailand | ||||||||||||
S29AL008J70BFI020
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 8.3886 Mbit | 16 | 8K,4K,16K,32K | 512KX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 12 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | 2065 | compliant | 4.25 | Thailand | ||||||||||||||||||
IS25LP032D-JBLE-TR
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 33.5544 Mbit | 8 | 4MX8 | 3 V | 133 MHz | FLASH | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.3 V | CMOS | INDUSTRIAL | S-PDSO-G8 | 105 °C | -40 °C | 250 | 30 | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2070 | SOP, | unknown | EAR99 | 8542.32.00.51 | 5.5 | Mainland China, Taiwan | 2018-04-25 | ||||||||||||||||||||||||||||||
W25Q128JVEIQ
Winbond Electronics Corp
|
查询价格和库存 |
|
Yes | Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 4 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 60 µA | 25 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | e3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2558 | compliant | EAR99 | 8542.32.00.51 | 5.75 | ||||||||||||||||||||||||
SST39SF010A-55-4I-NHE-T
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 1.0486 Mbit | 8 | 4K | 128KX8 | 5 V | 55 ns | FLASH | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 32 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 100 µA | 35 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 245 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | 2188 | ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32 | compliant | 3A991.B.1.A | 8542.32.00.51 | 24.48 | SST39SF010A-55-4I-NHE-T | Thailand | |||||||||||||||
IS25LP128-JBLE
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 1 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 2.7 V | 4-WIRE | 65 µA | 14 µA | 3.6 V | 2.3 V | CMOS | INDUSTRIAL | HARDWARE/SOFTWARE | S-PDSO-G8 | e3 | 1 | 105 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | YES | Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2070 | SOP, SOP8,.3 | compliant | EAR99 | 8542.32.00.51 | 5.65 | Mainland China, Taiwan | |||||||||||||||||||||||
W25Q32JVSSIQ
Winbond Electronics Corp
|
查询价格和库存 |
|
Yes | Yes | Active | 33.5544 Mbit | 8 | 4MX8 | 3 V | 133 MHz | FLASH | 2.7V NOMINAL AVAILABLE WITH 104MHZ | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PDSO-G8 | e3 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2558 | compliant | EAR99 | 8542.32.00.51 | 5.5 | Taiwan | |||||||||||||||||||||||||||||
SST39SF010A-70-4C-NHE
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Yes | Active | 1.0486 Mbit | 8 | 4K | 128KX8 | 5 V | 70 ns | FLASH | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 32 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 100 µA | 35 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PQCC-J32 | Not Qualified | e3 | 3 | 70 °C | 245 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | 2188 | ROHS COMPLIANT, PLASTIC, MO-016AE, LCC-32 | compliant | 3A991.B.1.A | 8542.32.00.51 | 24.48 | SST39SF010A-70-4C-NHE | QFJ | 32 | Thailand | ||||||||||||||
IS25LP128-JKLE
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 1 | NO | NO | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 2.7 V | 4-WIRE | 3.6 V | 2.3 V | CMOS | INDUSTRIAL | HARDWARE/SOFTWARE | R-PDSO-N8 | e3 | 105 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.2 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | 2070 | WSON-8 | compliant | EAR99 | 8542.32.00.51 | 5.75 | Mainland China, Taiwan | ||||||||||||||||||||||||
SST26VF064BT-104I/SM
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 1 | 64MX1 | 3 V | 104 MHz | FLASH | 100 | 100000 Write/Erase Cycles | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 45 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G8 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.03 mm | 5.26 mm | 5.25 mm | 2188 | SOP, SOP8,.3 | compliant | 3A991.B.1.A | 8542.32.00.51 | 24.48 | SST26VF064BT-104I/SM | Thailand | |||||||||||||||||||
S29JL032J70TFI320
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 33.5544 Mbit | 16 | 8K,64K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 1 | 8,63 | 2000000 | 2.0972 M | SYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 45 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | 2065 | compliant | 4.4 | Thailand | ||||||||||||||||||
IS25LP128-JLLE
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 1 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 60 µA | 14 µA | 3.6 V | 2.3 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | e3 | 105 °C | -40 °C | 260 | 10 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2070 | WSON-8 | compliant | EAR99 | 8542.32.00.51 | 5.75 | Mainland China, Taiwan | ||||||||||||||||||||||
SST26VF064B-104I/MF
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 1 | 64MX1 | 3 V | 104 MHz | FLASH | 100 | 100000 Write/Erase Cycles | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 45 µA | 25 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | 2188 | HVSON, SOLCC8,.25 | compliant | EAR99 | 8542.32.00.51 | 24.48 | SST26VF064B-104I/MF | Taiwan, Thailand | |||||||||||||||||||||
S29GL01GT10TFI010
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 1.0737 Gbit | 16 | 64MX16 | 3 V | 100 ns | FLASH | 1 | 64000000 | 67.1089 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 60 µA | 3.6 V | 2.7 V | CMOS | NOR TYPE | R-PDSO-G56 | e3 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 56 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | 2065 | compliant | 9.8 | |||||||||||||||||||||||||||||||||
S29AL016J70TFI020
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 16.7772 Mbit | 16 | 16K,8K,32K,64K | 1MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | 2065 | compliant | 4.3 | Mainland China, Taiwan, Thailand | ||||||||||||||||||
SST26VF032B-104I/SM
Microchip Technology Inc
|
查询价格和库存 |
|
Yes | Active | 33.5544 Mbit | 8 | 4MX8 | 3 V | 104 MHz | EEPROM | 100 | 100000 Write/Erase Cycles | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 45 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.03 mm | 5.26 mm | 5.25 mm | 2188 | SOP, SOP8,.3 | compliant | EAR99 | 8542.32.00.51 | 24.48 | SST26VF032B-104I/SM | Thailand |