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Composite Price
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风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 最大输入失调电压 | 标称带宽 (3dB) | 标称压摆率 | 最大平均偏置电流 (IIB) | 最大压摆率 | 功能数量 | 放大器类型 | 标称供电电压 (Vsup) | 标称负供电电压 (Vsup) | 技术 | 25C 时的最大偏置电流 (IIB) | 负供电电压上限 | 最小输出电流 | 电源 | 供电电压上限 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度（摄氏度） | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 包装方法 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 宽度 | 长度 |
零件包装代码
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包装说明
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针数
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是否符合REACH标准
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ECCN代码
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交付时间
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HTS代码
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制造商包装代码
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DS15BA101SDE/NOPB
Texas Instruments
|
查询价格 |
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Yes | Yes | Active | 49 mA | 1 | BUFFER | 3.3 V | 3.6 V | INDUSTRIAL | S-PDSO-N8 | e3 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | TR | YES | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 3 mm | SON | HVSON, | 8 | compliant | EAR99 | 1 week | |||||||||||||||
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DS15BA101SD/NOPB
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 49 mA | 1 | BUFFER | 3.3 V | 3.6 V | INDUSTRIAL | S-PDSO-N8 | e3 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | TR | YES | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 3 mm | SON | HVSON, | 8 | compliant | 6 weeks | ||||||||||||||||
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LMH6559MF
Texas Instruments
|
查询价格 |
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Active | 1 mV | 1.05 GHz | 4580 V/us | 14 µA | 17 mA | 1 | BUFFER | 5 V | -5 V | BIPOLAR | -6.5 V | 6.5 V | INDUSTRIAL | R-PDSO-G5 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | TAPE AND REEL | YES | Tin/Lead (Sn/Pb) | GULL WING | 950 µm | DUAL | 1.45 mm | 1.6 mm | 2.9 mm | SOT-23 | LSSOP, TSOP5/6,.11,37 | 5 | not_compliant | EAR99 | 1 week | 8542.39.00.01 | |||||||||
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MAX4219ESD+
Maxim Integrated Products
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查询价格 |
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Yes | Yes | Active | 10 mV | 200 MHz | 600 V/us | 12 µA | 21 mA | 3 | BUFFER | 5 V | BIPOLAR | 60 mA | 3.3/5/+-5 V | 12 V | INDUSTRIAL | R-PDSO-G14 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 3.9 mm | 8.65 mm | SOIC | SOP, SOP14,.25 | 14 | compliant | EAR99 | 6 weeks | 8542.39.00.01 | ||||||
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AD8074ARUZ-REEL
Analog Devices Inc
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查询价格 |
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No | Yes | Active | 27 mV | 600 MHz | 1600 V/us | 9.5 µA | 30 mA | 3 | BUFFER | 5 V | -5 V | 9.5 µA | -6 V | +-5 V | 6 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 5 mm | TSSOP | TSSOP, TSSOP16,.25 | 16 | compliant | EAR99 | 8542.39.00.01 | RU-16 | |||||
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AD8074ARUZ-REEL7
Analog Devices Inc
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查询价格 |
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No | Yes | Active | 27 mV | 600 MHz | 1600 V/us | 9.5 µA | 30 mA | 3 | BUFFER | 5 V | -5 V | 9.5 µA | -6 V | +-5 V | 6 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 5 mm | TSSOP | TSSOP, TSSOP16,.25 | 16 | compliant | EAR99 | 8542.39.00.01 | RU-16 | |||||
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AD8075ARUZ-REEL
Analog Devices Inc
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查询价格 |
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No | Yes | Active | 40 mV | 550 MHz | 1350 V/us | 10 µA | 30 mA | 3 | BUFFER | 5 V | -5 V | 10 µA | -6 V | +-5 V | 6 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 5 mm | TSSOP | TSSOP, TSSOP16,.25 | 16 | compliant | EAR99 | 8542.39.00.01 | RU-16 | |||||
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AD8075ARUZ-REEL7
Analog Devices Inc
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查询价格 |
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No | Yes | Active | 40 mV | 550 MHz | 1350 V/us | 10 µA | 30 mA | 3 | BUFFER | 5 V | -5 V | 10 µA | -6 V | +-5 V | 6 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 5 mm | TSSOP | TSSOP, TSSOP16,.25 | 16 | compliant | EAR99 | 8542.39.00.01 | RU-16 | |||||
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ADCLK925BCPZ-R7
Analog Devices Inc
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查询价格 |
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No | Yes | Active | 1 | BUFFER | 3.3 V | 35 mA | 6 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | QFN | HVQCCN, | 16 | compliant | EAR99 | 8542.39.00.01 | CP-16-27 | ||||||||||||||
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ADCLK905BCPZ-WP
Analog Devices Inc
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查询价格 |
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No | Yes | Active | 1 | BUFFER | 3.3 V | 35 mA | 6 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | QFN | HVQCCN, | 16 | compliant | EAR99 | 8542.39.00.01 | CP-16-27 | ||||||||||||||
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ADCLK905BCPZ-R7
Analog Devices Inc
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查询价格 |
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No | Yes | Active | 1 | BUFFER | 3.3 V | 35 mA | 6 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | QFN | HVQCCN, | 16 | compliant | EAR99 | 8542.39.00.01 | CP-16-27 | ||||||||||||||
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THS7353PWR
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 150 MHz | 300 V/us | 5 µA | 3 | BUFFER | 3.3 V | CMOS | 40 mA | 5.5 V | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 20 | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 6.5 mm | TSSOP | TSSOP, TSSOP20,.25 | 20 | compliant | EAR99 | 1 week | 8542.33.00.01 | ||||||||
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THS7353PW
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 150 MHz | 300 V/us | 5 µA | 3 | BUFFER | 3.3 V | CMOS | 40 mA | 5.5 V | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 20 | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TUBE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 6.5 mm | TSSOP | TSSOP, TSSOP20,.25 | 20 | compliant | EAR99 | 1 week | 8542.33.00.01 | ||||||||
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THS7347IPHP
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 550 MHz | 1050 V/us | 3.5 µA | 3 | BUFFER | 3.3 V | CMOS | 45 mA | 5.5 V | INDUSTRIAL | S-PQFP-G48 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TRAY | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.2 mm | 7 mm | 7 mm | QFP | HTFQFP, | 48 | compliant | EAR99 | 1 week | 8542.33.00.01 | |||||||||
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THS7347IPHPR
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 550 MHz | 1050 V/us | 3.5 µA | 3 | BUFFER | 3.3 V | CMOS | 45 mA | 5.5 V | INDUSTRIAL | S-PQFP-G48 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TR | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.2 mm | 7 mm | 7 mm | QFP | HTFQFP, | 48 | compliant | EAR99 | 6 weeks | 8542.33.00.01 | |||||||||
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ADCLK914BCPZ-R7
Analog Devices Inc
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查询价格 |
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No | Yes | Active | 1 | BUFFER | 3.3 V | BICMOS | 6 V | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 900 µm | 3 mm | 3 mm | QFN | HVQCCN, | 16 | compliant | EAR99 | 8542.39.00.01 | CP-16-22 | ||||||||||||||
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THS7327PHP
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 500 MHz | 1050 V/us | 3.5 µA | 3 | BUFFER | 3.3 V | CMOS | 45 mA | 5.5 V | INDUSTRIAL | S-PQFP-G48 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TRAY | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.2 mm | 7 mm | 7 mm | QFP | HTFQFP, | 48 | compliant | EAR99 | 6 weeks | 8542.33.00.01 | |||||||||
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THS7327PHPR
Texas Instruments
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查询价格 |
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Yes | Yes | Active | 500 MHz | 1050 V/us | 3.5 µA | 3 | BUFFER | 3.3 V | CMOS | 45 mA | 5.5 V | INDUSTRIAL | S-PQFP-G48 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 48 | PLASTIC/EPOXY | HTFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | TR | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.2 mm | 7 mm | 7 mm | QFP | HTFQFP, | 48 | compliant | EAR99 | 1 week | 8542.33.00.01 | |||||||||
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LMH6559MA/NOPB
Texas Instruments
|
查询价格 |
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Yes | Yes | Active | 1 mV | 1.05 GHz | 4580 V/us | 14 µA | 17 mA | 1 | BUFFER | 5 V | -5 V | BIPOLAR | -6.5 V | 6.5 V | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 3.895 mm | 4.905 mm | SOIC | SOP, SOP8,.25 | 8 | compliant | EAR99 | 1 week | 8542.39.00.01 | ||||||
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LMH6559MF/NOPB
Texas Instruments
|
查询价格 |
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Yes | Yes | Active | 1 mV | 1.05 GHz | 4580 V/us | 14 µA | 17 mA | 1 | BUFFER | 5 V | -5 V | BIPOLAR | -6.5 V | 6.5 V | INDUSTRIAL | R-PDSO-G5 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | TAPE AND REEL | YES | Matte Tin (Sn) | GULL WING | 950 µm | DUAL | 1.45 mm | 1.6 mm | 2.9 mm | SOT-23 | LSSOP, TSOP5/6,.11,37 | 5 | compliant | EAR99 | 6 weeks | 8542.39.00.01 | |||||