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其他 uPs/uCs/外围集成电路: 81,391 个筛选结果
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地址总线宽度 (4)
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位大小 (3)
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CPU系列 (8)
最大时钟频率 (16)
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外部数据总线宽度 (6)
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制造商 (50)
位数 (1)
I/O 线路数量 (5)
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RAM(字节) (13)
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RAM(字数) (15)
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速度 (16)
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标称供电电压 (45)
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uPs/uCs/外围集成电路类型 (8)
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制造商型号 Composite Price
风险等级 是否无铅 是否Rohs认证 生命周期 外部数据总线宽度 最大时钟频率 表面贴装 标称供电电压 uPs/uCs/外围集成电路类型 技术 其他特性 总线兼容性 电源 最大压摆率 最大供电电压 最小供电电压 温度等级 JESD-30 代码 认证状态 JESD-609代码 湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度) 处于峰值回流温度下的最长时间 端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 端子面层 端子形式 端子节距 端子位置 座面最大高度 宽度 长度 零件包装代码
包装说明
针数
制造商包装代码
SCANSTA112VS/NOPB
Texas Instruments
$9.9427
Yes Yes Active 0 YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 3.3 V 3.6 V 3 V INDUSTRIAL S-PQFP-G100 Not Qualified e4 3 85 °C -40 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY TFQFP TQFP100,.63SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 0.5 mm QUAD 1.2 mm 14 mm 14 mm QFP TQFP-100 100
SCANSTA112SM/NOPB
Texas Instruments
$9.9427
Yes Yes Active 0 YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 3.3 V 3.6 V 3 V INDUSTRIAL S-PBGA-B100 Not Qualified e1 4 85 °C -40 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY LFBGA BGA100,10X10,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 0.8 mm BOTTOM 1.5 mm 10 mm 10 mm BGA FBGA-100 100
P82B715D
Texas Instruments
$1.2283
Yes Yes Active 0 0.4 MHz YES 5 V MICROPROCESSOR CIRCUIT BIPOLAR I2C 12 V 4.5 V INDUSTRIAL R-PDSO-G8 Not Qualified e4 1 85 °C -40 °C 260 NOT SPECIFIED 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 1.75 mm 3.91 mm 4.9 mm SOIC GREEN, PLASTIC, MS-012AA, SOIC-8 8
P82B715DR
Texas Instruments
$1.2287
Yes Yes Active 0 0.4 MHz YES 5 V MICROPROCESSOR CIRCUIT BIPOLAR I2C 12 V 4.5 V INDUSTRIAL R-PDSO-G8 Not Qualified e4 1 85 °C -40 °C 260 NOT SPECIFIED 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 1.75 mm 3.91 mm 4.9 mm SOIC GREEN, PLASTIC, MS-012AA, SOIC-8 8
SCANSTA101SM/NOPB
Texas Instruments
$11.7951
Yes Yes Active 32 YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 3.3 V 3.6 V 3 V INDUSTRIAL S-PBGA-B49 Not Qualified e1 4 85 °C -40 °C 260 NOT SPECIFIED 49 PLASTIC/EPOXY LFBGA BGA49,7X7,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 0.8 mm BOTTOM 1.5 mm 7 mm 7 mm BGA LFBGA, BGA49,7X7,32 49
TIR1000IPWR
Texas Instruments
$0.9737
Yes Yes Active YES 3 V MICROPROCESSOR CIRCUIT CMOS CAN ALSO OPERATE AT 5V SUPPLY UART 3/5 V 3.3 V 2.7 V INDUSTRIAL R-PDSO-G8 Not Qualified e4 1 85 °C -40 °C 260 NOT SPECIFIED 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 0.65 mm DUAL 1.2 mm 3 mm 4.4 mm SOIC TSSOP-8 8
TIR1000PWR
Texas Instruments
$0.7285
Yes Yes Active YES 3 V MICROPROCESSOR CIRCUIT CMOS CAN ALSO OPERATE AT 5V SUPPLY UART 3/5 V 3.3 V 2.7 V COMMERCIAL R-PDSO-G8 Not Qualified e4 1 70 °C 0 °C 260 NOT SPECIFIED 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 0.65 mm DUAL 1.2 mm 3 mm 4.4 mm SOIC TSSOP-8 8
TIR1000PSR
Texas Instruments
$1.0481
Yes Yes Active YES 3 V MICROPROCESSOR CIRCUIT CMOS CAN ALSO OPERATE AT 5V SUPPLY UART 3/5 V 3.3 V 2.7 V COMMERCIAL R-PDSO-G8 Not Qualified e4 1 70 °C 0 °C 260 NOT SPECIFIED 8 PLASTIC/EPOXY SOP SOP8,.3 RECTANGULAR SMALL OUTLINE Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 2 mm 5.3 mm 6.2 mm SOIC SOP, SOP8,.3 8
TIR1000IPSR
Texas Instruments
$0.9737
Yes Yes Active YES 3 V MICROPROCESSOR CIRCUIT CMOS CAN ALSO OPERATE AT 5V SUPPLY UART 3/5 V 3.3 V 2.7 V INDUSTRIAL R-PDSO-G8 Not Qualified e4 1 85 °C -40 °C 260 NOT SPECIFIED 8 PLASTIC/EPOXY SOP SOP8,.3 RECTANGULAR SMALL OUTLINE Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 2 mm 5.3 mm 6.2 mm SOIC SOP, SOP8,.3 8
P82B715TD
NXP Semiconductors
Check for Price
Yes Yes Active YES 5 V MICROPROCESSOR CIRCUIT BIPOLAR 12 V 4.5 V INDUSTRIAL R-PDSO-G8 Not Qualified e4 1 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 1.75 mm 3.9 mm 4.9 mm SOIC SOP, 8
P82B715TD,118
NXP Semiconductors
$3.2153
Yes Active YES 5 V MICROPROCESSOR CIRCUIT BIPOLAR 12 V 4.5 V INDUSTRIAL R-PDSO-G8 Not Qualified e4 1 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE NICKEL PALLADIUM GOLD GULL WING 1.27 mm DUAL 1.75 mm 3.9 mm 4.9 mm SOIC SOP, 8 SOT96-1
P82B715TD,112
NXP Semiconductors
$3.0090
Yes Active YES 5 V MICROPROCESSOR CIRCUIT BIPOLAR 12 V 4.5 V INDUSTRIAL R-PDSO-G8 Not Qualified 1 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE GULL WING 1.27 mm DUAL 1.75 mm 3.9 mm 4.9 mm SOIC SOP, 8 SOT96-1
FT231XS-R
FTDI Chip
$2.4914
Yes Active YES 5 V MICROPROCESSOR CIRCUIT CMOS 3.3/5 V 8.4 mA 5.5 V 2.97 V INDUSTRIAL R-PDSO-G20 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 20 PLASTIC/EPOXY SSOP SSOP20,.25 RECTANGULAR SMALL OUTLINE, SHRINK PITCH Matte Tin (Sn) - annealed GULL WING 0.635 mm DUAL 1.7526 mm 3.9116 mm 8.6614 mm SOIC SSOP, SSOP20,.25 20
FT231XQ-T
FTDI Chip
Check for Price
Yes Active YES 5 V MICROPROCESSOR CIRCUIT CMOS 3.3/5 V 8.4 mA 5.5 V 2.97 V INDUSTRIAL S-XQCC-N20 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 20 UNSPECIFIED HVQCCN LCC20,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 0.5 mm QUAD 0.8 mm 4 mm 4 mm QFN HVQCCN, LCC20,.16SQ,20 20
FT231XQ-R
FTDI Chip
$2.4077
Yes Active YES 5 V MICROPROCESSOR CIRCUIT CMOS 3.3/5 V 8.4 mA 5.5 V 2.97 V INDUSTRIAL S-XQCC-N20 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 20 UNSPECIFIED HVQCCN LCC20,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 0.5 mm QUAD 0.8 mm 4 mm 4 mm QFN HVQCCN, LCC20,.16SQ,20 20
FT231XS-U
FTDI Chip
Check for Price
Yes Active YES 5 V MICROPROCESSOR CIRCUIT CMOS 3.3/5 V 8.4 mA 5.5 V 2.97 V INDUSTRIAL R-PDSO-G20 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 20 PLASTIC/EPOXY SSOP SSOP20,.25 RECTANGULAR SMALL OUTLINE, SHRINK PITCH GULL WING 0.635 mm DUAL 1.7526 mm 3.9116 mm 8.6614 mm SOIC SSOP, SSOP20,.25 20
9LPRS436CKILFT
Integrated Device Technology Inc
Check for Price
Yes Yes Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 3.3 V 100 mA 3.465 V 3.135 V INDUSTRIAL S-PQCC-N48 Not Qualified e3 1 85 °C -40 °C 260 NOT SPECIFIED 48 PLASTIC/EPOXY HVQCCN LCC48,.24SQ,16 SQUARE CHIP CARRIER Matte Tin (Sn) NO LEAD 0.4 mm QUAD 1 mm 6 mm 6 mm VFQFPN MLF-48 48 NDG48P2
SN74LVT8980ADWR
Texas Instruments
Check for Price
Yes Yes Active 8 YES 3 V MICROPROCESSOR CIRCUIT CMOS 3.3 V 3.6 V 2.7 V INDUSTRIAL R-PDSO-G24 Not Qualified e4 1 85 °C -40 °C 260 NOT SPECIFIED 24 PLASTIC/EPOXY SOP SOP24,.4 RECTANGULAR SMALL OUTLINE Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 15.4 mm SOIC GREEN, PLASTIC, SOIC-24 24
SCANSTA111MT/NOPB
Texas Instruments
$9.3273
Yes Yes Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 3.3 V 3.6 V 3 V INDUSTRIAL R-PDSO-G48 Not Qualified e3 2 85 °C -40 °C 260 NOT SPECIFIED 48 PLASTIC/EPOXY TSSOP TSSOP48,.3,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 0.5 mm DUAL 1.1 mm 6.1 mm 12.5 mm TSSOP TSSOP, TSSOP48,.3,20 48
SN74LVT8996PWR
Texas Instruments
$7.4391
Yes Yes Active 0 YES 3 V MICROPROCESSOR CIRCUIT BICMOS 3.3 V 3.6 V 2.7 V INDUSTRIAL R-PDSO-G24 Not Qualified e4 1 85 °C -40 °C 260 NOT SPECIFIED 24 PLASTIC/EPOXY TSSOP TSSOP24,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 0.65 mm DUAL 1.2 mm 4.4 mm 7.8 mm TSSOP TSSOP-24 24
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