所有内容版权所有 © 2006 - 2021
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||
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| 制造商型号 |
Composite Price
|
风险等级 |
是否无铅
|
是否Rohs认证
|
生命周期
|
RAM（字节） | RAM（字数） | 外部数据总线宽度 | 最大时钟频率 |
表面贴装
|
标称供电电压 |
uPs/uCs/外围集成电路类型
|
技术 | 其他特性 | 具有ADC |
电源
|
最大供电电压
|
最小供电电压
|
温度等级
|
总线兼容性 | JESD-30 代码 |
认证状态
|
JESD-609代码 |
湿度敏感等级
|
最高工作温度
|
最低工作温度
|
峰值回流温度（摄氏度）
|
筛选级别
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处于峰值回流温度下的最长时间
|
端子数量
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封装主体材料
|
封装代码
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封装等效代码
|
封装形状
|
封装形式
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端子面层
|
端子形式
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端子节距
|
端子位置
|
座面最大高度
|
宽度
|
长度 |
IHS 制造商
|
包装说明
|
是否符合REACH标准
|
交付时间
|
Samacsys Description
|
HTS代码
|
零件包装代码
|
针数
|
ECCN代码
|
|
|
ATWINC1510-MR210PB1952
Microchip Technology Inc
|
查询价格 |
|
Active | 48 MHz | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | 3.6 V | 2.7 V | INDUSTRIAL | R-XXMA-N28 | 80 °C | -40 °C | TS 16949 | 28 | UNSPECIFIED | MODULE28(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO LEAD | UNSPECIFIED | 2.11 mm | 14.73 mm | 21.72 mm | MICROCHIP TECHNOLOGY INC | MODULE-28 | compliant | ||||||||||||||||||||||||
|
ATWINC1500-MR210UB1954
Microchip Technology Inc
|
查询价格 |
|
Active | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | 3.6 V | 2.7 V | INDUSTRIAL | R-XXMA-N28 | 85 °C | -40 °C | 28 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO LEAD | UNSPECIFIED | 2.113 mm | 14.73 mm | 21.72 mm | MICROCHIP TECHNOLOGY INC | MODULE-28 | compliant | 12 weeks | MICROCHIP - ATWINC1500-MR210UB1954 - SMART CONNECT IOT MODULE, 2.412-2.472GHZ | |||||||||||||||||||||||||
|
ATWINC1510B-MU-T
Microchip Technology Inc
|
查询价格 |
|
Yes | Active | 48 MHz | YES | 3.3 V | NETWORK CONTROLLER | CMOS | 3.6 V | 2.7 V | INDUSTRIAL | S-PQCC-N40 | 85 °C | -40 °C | 40 | PLASTIC/EPOXY | HQCCN | LCC40,.2SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 400 µm | QUAD | 1 mm | 5 mm | 5 mm | MICROCHIP TECHNOLOGY INC | VQFN-40 | compliant | 8 weeks | |||||||||||||||||||||
|
ATWINC1500-MR210PB
Microchip Technology Inc
|
查询价格 |
|
Yes | Active | YES | 3.6 V | MICROPROCESSOR CIRCUIT | CMOS | SEATED HGT-NOM | 4.2 V | 3 V | INDUSTRIAL | R-XXMA-N28 | 85 °C | -40 °C | 28 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO LEAD | UNSPECIFIED | 2.113 mm | 14.73 mm | 21.72 mm | MICROCHIP TECHNOLOGY INC | MODULE PACKAGE-28 | compliant | 12 weeks | ||||||||||||||||||||||||
|
MCP19118T-E/MJVAO
Microchip Technology Inc
|
查询价格 |
|
Active | YES | 12 V | MICROPROCESSOR CIRCUIT | CMOS | 40 V | 4.5 V | AUTOMOTIVE | S-PQCC-N24 | 125 °C | -40 °C | AEC-Q100; TS 16949 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 900 µm | 4 mm | 4 mm | MICROCHIP TECHNOLOGY INC | QFN-24 | compliant | ||||||||||||||||||||||||
|
MCP2221A-I/ST
Microchip Technology Inc
|
查询价格 |
|
Yes | Active | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | 5.5 V | 3 V | INDUSTRIAL | R-PDSO-G14 | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 14 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 5 mm | MICROCHIP TECHNOLOGY INC | TSSOP-14 | compliant | 11 weeks | USB 2.0 to I2C/UART Protocol Converter | 8542.31.00.01 | ||||||||||||||||
|
MCP2221AT-I/ST
Microchip Technology Inc
|
查询价格 |
|
Yes | Active | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | 5.5 V | 3 V | INDUSTRIAL | R-PDSO-G14 | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 14 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 5 mm | MICROCHIP TECHNOLOGY INC | TSSOP-14 | compliant | 11 weeks | USB Interface IC USB 2.0 to I2C Converter with GPIO | 8542.31.00.01 | ||||||||||||||||
|
OMAPL138EZWT3
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 32 | 50 MHz | YES | 1.3 V | MICROPROCESSOR CIRCUIT | CMOS | IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY | 1.35 V | 1.25 V | OTHER | I2C; SPI; UART; USB | S-PBGA-B361 | e1 | 3 | 90 °C | 260 | NOT SPECIFIED | 361 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.4 mm | 16 mm | 16 mm | TEXAS INSTRUMENTS INC | LFBGA, | compliant | 6 weeks | BGA | 361 | 3A991A2 | |||||||||||
|
TIR1000IPWR
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | YES | 3 V | MICROPROCESSOR CIRCUIT | CMOS | CAN ALSO OPERATE AT 5V SUPPLY | 3/5 V | 3.3 V | 2.7 V | INDUSTRIAL | UART | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 3 mm | 4.4 mm | TEXAS INSTRUMENTS INC | TSSOP, TSSOP8,.25 | compliant | 1 week | 8542.39.00.01 | SOIC | 8 | EAR99 | ||||||||
|
TIR1000IPSR
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | YES | 3 V | MICROPROCESSOR CIRCUIT | CMOS | CAN ALSO OPERATE AT 5V SUPPLY | 3/5 V | 3.3 V | 2.7 V | INDUSTRIAL | UART | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 2 mm | 5.3 mm | 6.2 mm | TEXAS INSTRUMENTS INC | SOP, SOP8,.3 | compliant | 6 weeks | STANDALONE IrDA ENCODER AND DECODER | 8542.39.00.01 | SOIC | 8 | EAR99 | |||||||
|
MSP430F67621IPZ
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 4096 | 4 | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY | YES | 3.6 V | 2.4 V | INDUSTRIAL | I2C; SPI; UART | S-PQFP-G100 | e4 | 3 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | TEXAS INSTRUMENTS INC | LFQFP, | compliant | 6 weeks | 8542.31.00.01 | QFP | 100 | EAR99 | ||||||||||
|
OMAPL138EZWTA3
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 32 | 50 MHz | YES | 1.3 V | MICROPROCESSOR CIRCUIT | CMOS | IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY | 1.35 V | 1.25 V | INDUSTRIAL | I2C; SPI; UART; USB | S-PBGA-B361 | e1 | 3 | 105 °C | -40 °C | 260 | NOT SPECIFIED | 361 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.4 mm | 16 mm | 16 mm | TEXAS INSTRUMENTS INC | LFBGA, | compliant | 6 weeks | BGA | 361 | 3A991A2 | ||||||||||
|
TIR1000PS
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | YES | 3 V | MICROPROCESSOR CIRCUIT | CMOS | CAN ALSO OPERATE AT 5V SUPPLY | 3/5 V | 3.3 V | 2.7 V | COMMERCIAL | R-PDSO-G8 | Not Qualified | e4 | 1 | 70 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 2 mm | 5.3 mm | 6.2 mm | TEXAS INSTRUMENTS INC | SOP, SOP8,.3 | compliant | 1 week | 8542.31.00.01 | SOIC | 8 | |||||||||||
|
TIR1000PWR
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | YES | 3 V | MICROPROCESSOR CIRCUIT | CMOS | CAN ALSO OPERATE AT 5V SUPPLY | 3/5 V | 3.3 V | 2.7 V | COMMERCIAL | UART | R-PDSO-G8 | Not Qualified | e4 | 1 | 70 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 3 mm | 4.4 mm | TEXAS INSTRUMENTS INC | TSSOP, TSSOP8,.25 | compliant | 1 week | 8542.39.00.01 | SOIC | 8 | EAR99 | |||||||||
|
TIR1000PSR
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | YES | 3 V | MICROPROCESSOR CIRCUIT | CMOS | CAN ALSO OPERATE AT 5V SUPPLY | 3/5 V | 3.3 V | 2.7 V | COMMERCIAL | UART | R-PDSO-G8 | Not Qualified | e4 | 1 | 70 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 2 mm | 5.3 mm | 6.2 mm | TEXAS INSTRUMENTS INC | SOP, SOP8,.3 | compliant | 1 week | 8542.39.00.01 | SOIC | 8 | EAR99 | |||||||||
|
ATWILC1000B-UU-T
Microchip Technology Inc
|
查询价格 |
|
Yes | Yes | Active | 3.4 MHz | YES | 3.3 V | NETWORK CONTROLLER | CMOS | 3.6 V | 2.7 V | INDUSTRIAL | S-PBGA-B55 | e1 | 85 °C | -40 °C | 55 | PLASTIC/EPOXY | VFBGA | BGA55,8X8,14 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 350 µm | BOTTOM | 589 µm | 3.25 mm | 3.25 mm | MICROCHIP TECHNOLOGY INC | WLCSP-55 | compliant | 14 weeks | ||||||||||||||||||
|
MCP2221A-I/ML
Microchip Technology Inc
|
查询价格 |
|
Yes | Active | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | 5.5 V | 3 V | INDUSTRIAL | S-PQCC-N16 | e3 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 650 µm | QUAD | 1 mm | 4 mm | 4 mm | MICROCHIP TECHNOLOGY INC | QFN-16 | compliant | 8 weeks | Microchip Technology MCP2221A-I/ML, USB Controller, 12Mbit/s, 16-Pin QFN | 8542.31.00.01 | |||||||||||||||||||
|
MCP2221A-I/SL
Microchip Technology Inc
|
查询价格 |
|
Yes | Active | YES | 3.3 V | MICROPROCESSOR CIRCUIT | CMOS | 5.5 V | 3 V | INDUSTRIAL | R-PDSO-G14 | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 14 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | Matte Tin (Sn) - annealed | GULL WING | 1.27 mm | DUAL | 1.75 mm | 3.9 mm | 8.65 mm | MICROCHIP TECHNOLOGY INC | SOIC-14 | compliant | 8 weeks | USB Interface IC USB 2.0 to I2C Converter with GPIO | 8542.31.00.01 | ||||||||||||||||
|
OMAPL138EZWTA3E
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | 32 | 50 MHz | YES | 1.3 V | MICROPROCESSOR CIRCUIT | CMOS | IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY | 1.35 V | 1.25 V | INDUSTRIAL | I2C; SPI; UART; USB | S-PBGA-B361 | e1 | 3 | 105 °C | -40 °C | 260 | NOT SPECIFIED | 361 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.4 mm | 16 mm | 16 mm | TEXAS INSTRUMENTS INC | LFBGA, | compliant | 6 weeks | BGA | 361 | 3A991A2 | ||||||||||
|
OMAPL132EZWTA2
Texas Instruments
|
查询价格 |
|
Yes | Yes | Active | YES | 1.2 V | MICROPROCESSOR CIRCUIT | CMOS | IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY | 1.32 V | 1.14 V | INDUSTRIAL | S-PBGA-B361 | e1 | 3 | 105 °C | -40 °C | 260 | NOT SPECIFIED | 361 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.4 mm | 16 mm | 16 mm | TEXAS INSTRUMENTS INC | LFBGA, | compliant | 1 week | BGA | 361 | 3A991A2 | |||||||||||||
所有内容版权所有 © 2006 - 2021
ICP经营许可证 苏B2-20140176
苏ICP备14012660号-4
版权所有@苏州灵动帧格网络科技有限公司
