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其他 uPs/uCs/外围集成电路: 85,656 个筛选结果
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外部数据总线宽度 (6)
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标称供电电压 (47)
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uPs/uCs/外围集成电路类型 (13)
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
制造商型号 Composite Price
风险等级 是否无铅 是否Rohs认证 生命周期 外部数据总线宽度 最大时钟频率 表面贴装 标称供电电压 uPs/uCs/外围集成电路类型 技术 其他特性 电源 最大供电电压 最小供电电压 温度等级 总线兼容性 JESD-30 代码 认证状态 JESD-609代码 湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度) 筛选级别 处于峰值回流温度下的最长时间 端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 端子面层 端子形式 端子节距 端子位置 座面最大高度 宽度 长度 IHS 制造商
包装说明
是否符合REACH标准
交付时间
Samacsys Description
HTS代码
零件包装代码
针数
ECCN代码
ATWINC1500-MR210PB1954
Microchip Technology Inc
查询价格
Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 3.6 V 2.7 V INDUSTRIAL R-XXMA-N28 85 °C -40 °C 28 UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY NO LEAD UNSPECIFIED 2.113 mm 14.73 mm 21.72 mm MICROCHIP TECHNOLOGY INC , compliant 12 weeks MICROCHIP - ATWINC1500-MR210PB1954 - SMART CONNECT IOT MODULE, 2.412-2.472GHZ
ATWINC1500-MR210PB
Microchip Technology Inc
查询价格
Yes Active YES 3.6 V MICROPROCESSOR CIRCUIT CMOS SEATED HGT-NOM 4.2 V 3 V INDUSTRIAL R-XXMA-N28 85 °C -40 °C 28 UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY NO LEAD UNSPECIFIED 2.113 mm 14.73 mm 21.72 mm MICROCHIP TECHNOLOGY INC , compliant 12 weeks
ATWINC1510-MR210PB1952
Microchip Technology Inc
查询价格
Active 48 MHz YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 3.6 V 2.7 V INDUSTRIAL R-XXMA-N28 80 °C -40 °C TS 16949 28 UNSPECIFIED MODULE28(UNSPEC) RECTANGULAR MICROELECTRONIC ASSEMBLY NO LEAD UNSPECIFIED 2.11 mm 14.73 mm 21.72 mm MICROCHIP TECHNOLOGY INC , MODULE28(UNSPEC) compliant
ATWINC1500B-MU-T
Microchip Technology Inc
查询价格
Yes Active 48 MHz YES 3.3 V NETWORK CONTROLLER CMOS 3.6 V 2.7 V INDUSTRIAL S-PQCC-N40 85 °C -40 °C 40 PLASTIC/EPOXY HQCCN LCC40,.2SQ,16 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 400 µm QUAD 1 mm 5 mm 5 mm MICROCHIP TECHNOLOGY INC VQFN-40 compliant 8 weeks RF System on a Chip - SoC SmartConnect C... more
ATWINC1510B-MU-T
Microchip Technology Inc
查询价格
Yes Active 48 MHz YES 3.3 V NETWORK CONTROLLER CMOS 3.6 V 2.7 V INDUSTRIAL S-PQCC-N40 85 °C -40 °C 40 PLASTIC/EPOXY HQCCN LCC40,.2SQ,16 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 400 µm QUAD 1 mm 5 mm 5 mm MICROCHIP TECHNOLOGY INC VQFN-40 compliant 8 weeks
MCP2221A-I/ML
Microchip Technology Inc
查询价格
Yes Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 5.5 V 3 V INDUSTRIAL S-PQCC-N16 e3 85 °C -40 °C 16 PLASTIC/EPOXY HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) - annealed NO LEAD 650 µm QUAD 1 mm 4 mm 4 mm MICROCHIP TECHNOLOGY INC HVQCCN, compliant 8 weeks Microchip Technology MCP2221A-I/ML, USB Controller, 12Mbit/s, 16-Pin QFN 8542.31.00.01
MCP2221A-I/ST
Microchip Technology Inc
查询价格
Yes Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 5.5 V 3 V INDUSTRIAL R-PDSO-G14 e3 1 85 °C -40 °C 260 40 14 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) - annealed GULL WING 650 µm DUAL 1.2 mm 4.4 mm 5 mm MICROCHIP TECHNOLOGY INC TSSOP, compliant 11 weeks USB 2.0 to I2C/UART Protocol Converter 8542.31.00.01
MCP2221A-I/SL
Microchip Technology Inc
查询价格
Yes Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 5.5 V 3 V INDUSTRIAL R-PDSO-G14 e3 1 85 °C -40 °C 260 40 14 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 1.75 mm 3.9 mm 8.65 mm MICROCHIP TECHNOLOGY INC SOP, compliant 8 weeks USB Interface IC USB 2.0 to I2C Converter with GPIO 8542.31.00.01
OMAPL138EZWT3
Texas Instruments
查询价格
Yes Yes Active 32 50 MHz YES 1.3 V MICROPROCESSOR CIRCUIT CMOS IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY 1.35 V 1.25 V OTHER I2C; SPI; UART; USB S-PBGA-B361 e1 3 90 °C 260 NOT SPECIFIED 361 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.4 mm 16 mm 16 mm TEXAS INSTRUMENTS INC LFBGA, compliant 6 weeks BGA 361 3A991A2
OMAPL138EZWTA3
Texas Instruments
查询价格
Yes Yes Active TEXAS INSTRUMENTS INC LFBGA, compliant 6 weeks BGA 361 3A991A2
MCP2221AT-I/ST
Microchip Technology Inc
查询价格
Yes Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 5.5 V 3 V INDUSTRIAL R-PDSO-G14 e3 1 85 °C -40 °C 260 40 14 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) - annealed GULL WING 650 µm DUAL 1.2 mm 4.4 mm 5 mm MICROCHIP TECHNOLOGY INC TSSOP, compliant 11 weeks USB Interface IC USB 2.0 to I2C Converter with GPIO 8542.31.00.01
SCANSTA112VS/NOPB
Texas Instruments
查询价格
Yes Yes Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 3.3 V 3.6 V 3 V INDUSTRIAL S-PQFP-G100 Not Qualified e4 3 85 °C -40 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY TFQFP TQFP100,.63SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 500 µm QUAD 1.2 mm 14 mm 14 mm TEXAS INSTRUMENTS INC TFQFP, TQFP100,.63SQ compliant 1 week Texas Instruments SCANSTA112VS/NOPB, Mul... more 8542.39.00.01 QFP 100 EAR99
TIR1000IPWR
Texas Instruments
查询价格
Yes Yes Active TEXAS INSTRUMENTS INC TSSOP, TSSOP8,.25 compliant 1 week 8542.39.00.01 SOIC 8 EAR99
MCP2221AT-I/ML
Microchip Technology Inc
查询价格
Yes Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 5.5 V 3 V INDUSTRIAL S-PQCC-N16 e3 85 °C -40 °C 16 PLASTIC/EPOXY HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) - annealed NO LEAD 650 µm QUAD 1 mm 4 mm 4 mm MICROCHIP TECHNOLOGY INC HVQCCN, compliant 8 weeks USB Interface IC USB 2.0 to I2C Converter with GPIO 8542.31.00.01
TIR1000PSR
Texas Instruments
查询价格
Yes Yes Active YES 3 V MICROPROCESSOR CIRCUIT CMOS CAN ALSO OPERATE AT 5V SUPPLY 3/5 V 3.3 V 2.7 V COMMERCIAL UART R-PDSO-G8 Not Qualified e4 1 70 °C 260 NOT SPECIFIED 8 PLASTIC/EPOXY SOP SOP8,.3 RECTANGULAR SMALL OUTLINE Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 2 mm 5.3 mm 6.2 mm TEXAS INSTRUMENTS INC SOP, SOP8,.3 compliant 1 week 8542.39.00.01 SOIC 8 EAR99
TIR1000PWR
Texas Instruments
查询价格
Yes Yes Active TEXAS INSTRUMENTS INC TSSOP, TSSOP8,.25 compliant 1 week 8542.39.00.01 SOIC 8 EAR99
SCANSTA112SM/NOPB
Texas Instruments
查询价格
Yes Yes Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 3.3 V 3.6 V 3 V INDUSTRIAL S-PBGA-B100 Not Qualified e1 4 85 °C -40 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY LFBGA BGA100,10X10,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.5 mm 10 mm 10 mm TEXAS INSTRUMENTS INC LFBGA, BGA100,10X10,32 compliant 6 weeks 8542.39.00.01 BGA 100 EAR99
SCANSTA112SMX/NOPB
Texas Instruments
查询价格
Yes Yes Active YES 3.3 V MICROPROCESSOR CIRCUIT CMOS 3.3 V 3.6 V 3 V INDUSTRIAL S-PBGA-B100 Not Qualified e1 4 85 °C -40 °C 260 NOT SPECIFIED 100 PLASTIC/EPOXY LFBGA BGA100,10X10,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.5 mm 10 mm 10 mm TEXAS INSTRUMENTS INC LFBGA, BGA100,10X10,32 compliant 6 weeks 8542.39.00.01 BGA 100 EAR99
OMAPL138EZWTA3E
Texas Instruments
查询价格
Yes Yes Active TEXAS INSTRUMENTS INC LFBGA, compliant 6 weeks BGA 361 3A991A2
FT230XS-R
FTDI Chip
查询价格
Yes Active YES 5 V MICROPROCESSOR CIRCUIT CMOS 1.8/3.3,3.3/5 V 5.5 V 2.97 V INDUSTRIAL R-PDSO-G16 Not Qualified 3 85 °C -40 °C 260