其他逻辑集成电路封装型号_其他逻辑集成电路厂家价格-bom2buy

型号

型号						Most Relevant										Technical									Compliance			Operating Conditions						Physical										Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压 (Vsup)	传播延迟（tpd）	Prop。Delay @ Nom-Sup	功能数量	位数	表面贴装	封装代码	负载电容（CL）	施密特触发器	系列	逻辑集成电路类型	技术	其他特性	最大I（ol）	输出极性	最大电源电流（ICC）	最大供电电压 (Vsup)	最小供电电压 (Vsup)	温度等级	JESD-30 代码	认证状态	JESD-609代码	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	筛选级别	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装等效代码	封装形状	封装形式	包装方法	端子面层	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	Source Content uid	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	ECCN代码	HTS代码	YTEOL	Country Of Origin	制造商包装代码
SN54LS628J Texas Instruments		查询价格和库存		Yes	No	Active	5 V	15 ns	15 ns	1	1	NO	DIP			LS	LOGIC CIRCUIT	TTL		24 mA	COMPLEMENTARY	55 mA	5.25 V	4.75 V	MILITARY	R-GDIP-T14	Not Qualified	e0		125 °C	-55 °C				14	CERAMIC, GLASS-SEALED		RECTANGULAR	IN-LINE	TUBE	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	5.08 mm	7.62 mm	19.56 mm	SN54LS628J	2477	DIP	DIP,	14	not_compliant	EAR99	8542.39.00.01	15
5962-9204601MCA Texas Instruments		查询价格和库存		Yes	No	Active	5 V	15 ns	15 ns	1	1	NO	DIP			LS	LOGIC CIRCUIT	TTL		24 mA	COMPLEMENTARY	55 mA	5.25 V	4.75 V	MILITARY	R-GDIP-T14	Qualified	e0		125 °C	-55 °C		MIL-STD-883		14	CERAMIC, GLASS-SEALED		RECTANGULAR	IN-LINE	TUBE	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	5.08 mm	7.62 mm	19.56 mm	5962-9204601MCA	2477	DIP	CERAMIC, DIP-14	14	not_compliant	EAR99	8542.39.00.01	15	USA
SY58051AUMG Microchip Technology Inc		查询价格和库存			Yes	Active	2.5 V			1		YES	HVQCCN			58051	LOGIC CIRCUIT		ALSO OPERATES AT 2.97 TO 3.63 V SUPPLY				2.625 V	2.375 V	INDUSTRIAL	S-XQCC-N16		e4	2	85 °C	-40 °C	260		40	16	UNSPECIFIED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	TUBE	NICKEL PALLADIUM GOLD	NO LEAD	500 µm	QUAD	950 µm	3 mm	3 mm	SY58051AUMG	2188		3 X 3 MM, LEAD FREE, QFN-16		compliant	EAR99	8542.39.00.01	24.48	Malaysia
SY58051AUMG-TR Microchip Technology Inc		查询价格和库存			Yes	Active	2.5 V			1		YES	HVQCCN			58051	LOGIC CIRCUIT		ALSO OPERATES AT 2.97 TO 3.63 V SUPPLY				2.625 V	2.375 V	INDUSTRIAL	S-XQCC-N16		e4	2	85 °C	-40 °C	260		40	16	UNSPECIFIED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	TR	NICKEL PALLADIUM GOLD	NO LEAD	500 µm	QUAD	950 µm	3 mm	3 mm	SY58051AUMG-TR	2188		3 X 3 MM, LEAD FREE, QFN-16		compliant	EAR99	8542.39.00.01	24.48	Malaysia
SN74LS628D Texas Instruments		查询价格和库存		Yes	Yes	Active	5 V	15 ns	15 ns	1	1	YES	SOP			LS	LOGIC CIRCUIT	TTL		24 mA	COMPLEMENTARY	55 mA	5.25 V	4.75 V	COMMERCIAL	R-PDSO-G14	Not Qualified	e4	1	70 °C		260		30	14	PLASTIC/EPOXY		RECTANGULAR	SMALL OUTLINE	TUBE	NICKEL PALLADIUM GOLD	GULL WING	1.27 mm	DUAL	1.75 mm	3.9 mm	8.65 mm	SN74LS628D	2477	SOIC	PLASTIC, SOP-14	14	compliant	EAR99	8542.39.00.01	15	Malaysia
SNJ54S124J Texas Instruments		查询价格和库存		Yes	No	Active	5 V	70 ns	70 ns	2	1	NO	DIP			S	LOGIC CIRCUIT	TTL		20 mA	CONFIGURABLE	160 mA	5.25 V	4.75 V	MILITARY	R-CDIP-T16	Not Qualified	e0		125 °C	-55 °C		MIL-PRF-38535		16	CERAMIC, METAL-SEALED COFIRED		RECTANGULAR	IN-LINE	TUBE	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	5.08 mm	7.62 mm	19.56 mm	SNJ54S124J	2477	DIP	DIP,	16	not_compliant	EAR99	8542.39.00.01	15
74AUP1G58GW Nexperia		查询价格和库存			Yes	Active	1.1 V			1		YES	TSSOP			AUP/ULP/V	LOGIC CIRCUIT	CMOS					3.6 V	800 mV	AUTOMOTIVE	R-PDSO-G6	Not Qualified	e3	1	125 °C	-40 °C	260		30	6	PLASTIC/EPOXY		RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		TIN	GULL WING	650 µm	DUAL	1.1 mm	1.25 mm	2 mm	74AUP1G58GW	229119436		TSSOP,		compliant		8542.39.00.01
CD54HC297F3A Texas Instruments		查询价格和库存		Yes	No	Active	4.5 V	43 ns	43 ns	1	1	NO	DIP			HC/UH	LOGIC CIRCUIT	CMOS		5.2 mA		160 µA	6 V	2 V	MILITARY	R-GDIP-T16	Not Qualified	e0		125 °C	-55 °C				16	CERAMIC, GLASS-SEALED		RECTANGULAR	IN-LINE	TUBE	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	5.08 mm	7.62 mm	19.56 mm	CD54HC297F3A	2477	DIP	DIP,	16	not_compliant	EAR99	8542.39.00.01	15
74AUP1T97UKAZ Nexperia		查询价格和库存				Active				1		YES	VFBGA			AUP/ULP/V	LOGIC CIRCUIT	CMOS	TERM PITCH-MAX				3.6 V	2.3 V	AUTOMOTIVE	R-PBGA-B6				125 °C	-40 °C				6	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			BALL	230 µm	BOTTOM	300 µm	440 µm	650 µm	74AUP1T97UKAZ	229119436		WLCSP-6		compliant					SOT1454-1
74AUP1G97UKAZ Nexperia		查询价格和库存				Active	1.1 V			1		YES	VFBGA			AUP/ULP/V	LOGIC CIRCUIT	CMOS	TERM PITCH-MAX				3.6 V	800 mV	AUTOMOTIVE	R-PBGA-B6				125 °C	-40 °C				6	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			BALL	230 µm	BOTTOM	300 µm	440 µm	650 µm	74AUP1G97UKAZ	229119436		WLCSP-6		compliant					SOT1454-1
SNJ54LS629W Texas Instruments		查询价格和库存		Yes	No	Active	5 V	15 ns	15 ns	2	2	YES	DFP			LS	LOGIC CIRCUIT	TTL		24 mA	COMPLEMENTARY	55 mA	5.25 V	4.75 V	MILITARY	R-GDFP-F16	Not Qualified	e0		125 °C	-55 °C		MIL-PRF-38535		16	CERAMIC, GLASS-SEALED		RECTANGULAR	FLATPACK	TUBE	TIN LEAD	FLAT	1.27 mm	DUAL	2.03 mm	6.73 mm	10.16 mm	SNJ54LS629W	2477	DFP	DFP,	16	not_compliant	EAR99	8542.39.00.01	15
SNJ54LS629FK Texas Instruments		查询价格和库存		Yes	No	Active	5 V	15 ns	15 ns	2	2	YES	QCCN			LS	LOGIC CIRCUIT	TTL		24 mA	COMPLEMENTARY	55 mA	5.25 V	4.75 V	MILITARY	S-CQCC-N20	Not Qualified	e0		125 °C	-55 °C				20	CERAMIC, METAL-SEALED COFIRED		SQUARE	CHIP CARRIER	TUBE	TIN LEAD	NO LEAD	1.27 mm	QUAD	2.03 mm	8.89 mm	8.89 mm	SNJ54LS629FK	2477	QLCC	QCCN,	20	not_compliant	EAR99	8542.39.00.01	15
HMC850LC3 Analog Devices Inc		查询价格和库存		No	Yes	Active				1		YES	HVQCCN			850	LOGIC CIRCUIT								INDUSTRIAL	S-CQCC-N16		e4	3	85 °C	-40 °C	260		30	16	CERAMIC, METAL-SEALED COFIRED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		Gold (Au) - with Nickel (Ni) barrier	NO LEAD	500 µm	QUAD	920 µm	3 mm	3 mm	HMC850LC3	1742		SMT-16	16	compliant	EAR99	8542.39.00.01	8.5	USA	E-16-1
HMC724LC3 Analog Devices Inc		查询价格和库存		No	Yes	Active				1		YES	HVQCCN			724	LOGIC CIRCUIT								INDUSTRIAL	S-CQCC-N16		e4	3	85 °C	-40 °C	260		30	16	CERAMIC, METAL-SEALED COFIRED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		Gold (Au) - with Nickel (Ni) barrier	NO LEAD	500 µm	QUAD	920 µm	3 mm	3 mm	HMC724LC3	1742		3 X 3 MM, RPHS COMPLIANT, CERAMIC, SMT-16	16	compliant	EAR99	8542.39.00.01	8.5	USA	E-16-1
HMC850LC3TR Analog Devices Inc		查询价格和库存		No	Yes	Active				1		YES	HVQCCN			850	LOGIC CIRCUIT								INDUSTRIAL	S-CQCC-N16	Not Qualified		3	85 °C	-40 °C	260		30	16	CERAMIC, METAL-SEALED COFIRED	LCC16,.12SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	TR		NO LEAD	500 µm	QUAD	920 µm	3 mm	3 mm	HMC850LC3TR	1742		3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT-16	16	compliant	EAR99	8542.39.00.01	8.5	USA	E-16-1
HMC744LC3 Analog Devices Inc		查询价格和库存		No	Yes	Active	3.3 V			1		YES	HVQCCN			744	LOGIC CIRCUIT						3.6 V	3 V	INDUSTRIAL	S-CQCC-N16		e4	3	85 °C	-40 °C	260		30	16	CERAMIC, METAL-SEALED COFIRED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		Gold (Au) - with Nickel (Ni) barrier	NO LEAD	500 µm	QUAD	920 µm	3 mm	3 mm	HMC744LC3	1742		3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT-16	16	compliant	EAR99	8542.39.00.01	8.5	USA	E-16-1
HMC746LC3C Analog Devices Inc		查询价格和库存		No	Yes	Active	3.3 V			4		YES	HQCCN			746	LOGIC CIRCUIT						3.6 V	3 V	INDUSTRIAL	S-CQCC-N16	Not Qualified	e4	3	85 °C	-40 °C	260		30	16	CERAMIC, METAL-SEALED COFIRED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG		Gold (Au) - with Nickel (Ni) barrier	NO LEAD	500 µm	QUAD	1.31 mm	3 mm	3 mm	HMC746LC3C	1742		3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT, 16 PIN	16	compliant	EAR99	8542.39.00.01	8.5	USA	E-16-1
74LVC1G57W6-7 Diodes Incorporated		查询价格和库存		Yes	Yes	Active	3.3 V		7.9 ns	1		YES	LSSOP	50 pF	YES	LVC/LCX/Z	LOGIC CIRCUIT	CMOS		24 mA			5.5 V	1.65 V	AUTOMOTIVE	R-PDSO-G6	Not Qualified	e3	1	125 °C	-40 °C	260		30	6	PLASTIC/EPOXY	TSOP6,.11,37	RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TR	MATTE TIN	GULL WING	950 µm	DUAL	1.35 mm	1.6 mm	2.85 mm		1926	SOT	LSSOP, TSOP6,.11,37	6	compliant	EAR99	8542.39.00.01
74LVC1G57DW-7 Diodes Incorporated		查询价格和库存		Yes	Yes	Active	3.3 V		7.9 ns	1		YES	TSSOP	50 pF	YES	LVC/LCX/Z	LOGIC CIRCUIT	CMOS		24 mA			5.5 V	1.65 V	AUTOMOTIVE	R-PDSO-G6	Not Qualified	e3	1	125 °C	-40 °C	260		30	6	PLASTIC/EPOXY	TSSOP6,.08	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TR	MATTE TIN	GULL WING	650 µm	DUAL	1.1 mm	1.25 mm	2 mm		1926	SOT-363	ROHS COMPLIANT, SOT-363, 6 PIN	6	compliant	EAR99	8542.39.00.01
74LVC1G97W6-7 Diodes Incorporated		查询价格和库存		Yes	Yes	Active	3.3 V		7.9 ns	1		YES	LSSOP	50 pF	YES	LVC/LCX/Z	LOGIC CIRCUIT	CMOS		24 mA			5.5 V	1.65 V	AUTOMOTIVE	R-PDSO-G6	Not Qualified	e3	1	125 °C	-40 °C	260		30	6	PLASTIC/EPOXY	TSOP6,.11,37	RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TR	MATTE TIN	GULL WING	950 µm	DUAL	1.35 mm	1.6 mm	2.85 mm		1926	SOT	LSSOP, TSOP6,.11,37	6	compliant	EAR99	8542.39.00.01

型号						Most Relevant										Technical									Compliance			Operating Conditions						Physical										Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压 (Vsup)	传播延迟（tpd）	Prop。Delay @ Nom-Sup	功能数量	位数	表面贴装	封装代码	负载电容（CL）	施密特触发器	系列	逻辑集成电路类型	技术	其他特性	最大I（ol）	输出极性	最大电源电流（ICC）	最大供电电压 (Vsup)	最小供电电压 (Vsup)	温度等级	JESD-30 代码	认证状态	JESD-609代码	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	筛选级别	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装等效代码	封装形状	封装形式	包装方法	端子面层	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	Source Content uid	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	ECCN代码	HTS代码	YTEOL	Country Of Origin	制造商包装代码
SN54LS628J Texas Instruments		查询价格和库存		Yes	No	Active	5 V	15 ns	15 ns	1	1	NO	DIP			LS	LOGIC CIRCUIT	TTL		24 mA	COMPLEMENTARY	55 mA	5.25 V	4.75 V	MILITARY	R-GDIP-T14	Not Qualified	e0		125 °C	-55 °C				14	CERAMIC, GLASS-SEALED		RECTANGULAR	IN-LINE	TUBE	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	5.08 mm	7.62 mm	19.56 mm	SN54LS628J	2477	DIP	DIP,	14	not_compliant	EAR99	8542.39.00.01	15
5962-9204601MCA Texas Instruments		查询价格和库存		Yes	No	Active	5 V	15 ns	15 ns	1	1	NO	DIP			LS	LOGIC CIRCUIT	TTL		24 mA	COMPLEMENTARY	55 mA	5.25 V	4.75 V	MILITARY	R-GDIP-T14	Qualified	e0		125 °C	-55 °C		MIL-STD-883		14	CERAMIC, GLASS-SEALED		RECTANGULAR	IN-LINE	TUBE	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	5.08 mm	7.62 mm	19.56 mm	5962-9204601MCA	2477	DIP	CERAMIC, DIP-14	14	not_compliant	EAR99	8542.39.00.01	15	USA
SY58051AUMG Microchip Technology Inc		查询价格和库存			Yes	Active	2.5 V			1		YES	HVQCCN			58051	LOGIC CIRCUIT		ALSO OPERATES AT 2.97 TO 3.63 V SUPPLY				2.625 V	2.375 V	INDUSTRIAL	S-XQCC-N16		e4	2	85 °C	-40 °C	260		40	16	UNSPECIFIED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	TUBE	NICKEL PALLADIUM GOLD	NO LEAD	500 µm	QUAD	950 µm	3 mm	3 mm	SY58051AUMG	2188		3 X 3 MM, LEAD FREE, QFN-16		compliant	EAR99	8542.39.00.01	24.48	Malaysia
SY58051AUMG-TR Microchip Technology Inc		查询价格和库存			Yes	Active	2.5 V			1		YES	HVQCCN			58051	LOGIC CIRCUIT		ALSO OPERATES AT 2.97 TO 3.63 V SUPPLY				2.625 V	2.375 V	INDUSTRIAL	S-XQCC-N16		e4	2	85 °C	-40 °C	260		40	16	UNSPECIFIED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	TR	NICKEL PALLADIUM GOLD	NO LEAD	500 µm	QUAD	950 µm	3 mm	3 mm	SY58051AUMG-TR	2188		3 X 3 MM, LEAD FREE, QFN-16		compliant	EAR99	8542.39.00.01	24.48	Malaysia
SN74LS628D Texas Instruments		查询价格和库存		Yes	Yes	Active	5 V	15 ns	15 ns	1	1	YES	SOP			LS	LOGIC CIRCUIT	TTL		24 mA	COMPLEMENTARY	55 mA	5.25 V	4.75 V	COMMERCIAL	R-PDSO-G14	Not Qualified	e4	1	70 °C		260		30	14	PLASTIC/EPOXY		RECTANGULAR	SMALL OUTLINE	TUBE	NICKEL PALLADIUM GOLD	GULL WING	1.27 mm	DUAL	1.75 mm	3.9 mm	8.65 mm	SN74LS628D	2477	SOIC	PLASTIC, SOP-14	14	compliant	EAR99	8542.39.00.01	15	Malaysia
SNJ54S124J Texas Instruments		查询价格和库存		Yes	No	Active	5 V	70 ns	70 ns	2	1	NO	DIP			S	LOGIC CIRCUIT	TTL		20 mA	CONFIGURABLE	160 mA	5.25 V	4.75 V	MILITARY	R-CDIP-T16	Not Qualified	e0		125 °C	-55 °C		MIL-PRF-38535		16	CERAMIC, METAL-SEALED COFIRED		RECTANGULAR	IN-LINE	TUBE	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	5.08 mm	7.62 mm	19.56 mm	SNJ54S124J	2477	DIP	DIP,	16	not_compliant	EAR99	8542.39.00.01	15
74AUP1G58GW Nexperia		查询价格和库存			Yes	Active	1.1 V			1		YES	TSSOP			AUP/ULP/V	LOGIC CIRCUIT	CMOS					3.6 V	800 mV	AUTOMOTIVE	R-PDSO-G6	Not Qualified	e3	1	125 °C	-40 °C	260		30	6	PLASTIC/EPOXY		RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		TIN	GULL WING	650 µm	DUAL	1.1 mm	1.25 mm	2 mm	74AUP1G58GW	229119436		TSSOP,		compliant		8542.39.00.01
CD54HC297F3A Texas Instruments		查询价格和库存		Yes	No	Active	4.5 V	43 ns	43 ns	1	1	NO	DIP			HC/UH	LOGIC CIRCUIT	CMOS		5.2 mA		160 µA	6 V	2 V	MILITARY	R-GDIP-T16	Not Qualified	e0		125 °C	-55 °C				16	CERAMIC, GLASS-SEALED		RECTANGULAR	IN-LINE	TUBE	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	5.08 mm	7.62 mm	19.56 mm	CD54HC297F3A	2477	DIP	DIP,	16	not_compliant	EAR99	8542.39.00.01	15
74AUP1T97UKAZ Nexperia		查询价格和库存				Active				1		YES	VFBGA			AUP/ULP/V	LOGIC CIRCUIT	CMOS	TERM PITCH-MAX				3.6 V	2.3 V	AUTOMOTIVE	R-PBGA-B6				125 °C	-40 °C				6	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			BALL	230 µm	BOTTOM	300 µm	440 µm	650 µm	74AUP1T97UKAZ	229119436		WLCSP-6		compliant					SOT1454-1
74AUP1G97UKAZ Nexperia		查询价格和库存				Active	1.1 V			1		YES	VFBGA			AUP/ULP/V	LOGIC CIRCUIT	CMOS	TERM PITCH-MAX				3.6 V	800 mV	AUTOMOTIVE	R-PBGA-B6				125 °C	-40 °C				6	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH			BALL	230 µm	BOTTOM	300 µm	440 µm	650 µm	74AUP1G97UKAZ	229119436		WLCSP-6		compliant					SOT1454-1
SNJ54LS629W Texas Instruments		查询价格和库存		Yes	No	Active	5 V	15 ns	15 ns	2	2	YES	DFP			LS	LOGIC CIRCUIT	TTL		24 mA	COMPLEMENTARY	55 mA	5.25 V	4.75 V	MILITARY	R-GDFP-F16	Not Qualified	e0		125 °C	-55 °C		MIL-PRF-38535		16	CERAMIC, GLASS-SEALED		RECTANGULAR	FLATPACK	TUBE	TIN LEAD	FLAT	1.27 mm	DUAL	2.03 mm	6.73 mm	10.16 mm	SNJ54LS629W	2477	DFP	DFP,	16	not_compliant	EAR99	8542.39.00.01	15
SNJ54LS629FK Texas Instruments		查询价格和库存		Yes	No	Active	5 V	15 ns	15 ns	2	2	YES	QCCN			LS	LOGIC CIRCUIT	TTL		24 mA	COMPLEMENTARY	55 mA	5.25 V	4.75 V	MILITARY	S-CQCC-N20	Not Qualified	e0		125 °C	-55 °C				20	CERAMIC, METAL-SEALED COFIRED		SQUARE	CHIP CARRIER	TUBE	TIN LEAD	NO LEAD	1.27 mm	QUAD	2.03 mm	8.89 mm	8.89 mm	SNJ54LS629FK	2477	QLCC	QCCN,	20	not_compliant	EAR99	8542.39.00.01	15
HMC850LC3 Analog Devices Inc		查询价格和库存		No	Yes	Active				1		YES	HVQCCN			850	LOGIC CIRCUIT								INDUSTRIAL	S-CQCC-N16		e4	3	85 °C	-40 °C	260		30	16	CERAMIC, METAL-SEALED COFIRED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		Gold (Au) - with Nickel (Ni) barrier	NO LEAD	500 µm	QUAD	920 µm	3 mm	3 mm	HMC850LC3	1742		SMT-16	16	compliant	EAR99	8542.39.00.01	8.5	USA	E-16-1
HMC724LC3 Analog Devices Inc		查询价格和库存		No	Yes	Active				1		YES	HVQCCN			724	LOGIC CIRCUIT								INDUSTRIAL	S-CQCC-N16		e4	3	85 °C	-40 °C	260		30	16	CERAMIC, METAL-SEALED COFIRED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		Gold (Au) - with Nickel (Ni) barrier	NO LEAD	500 µm	QUAD	920 µm	3 mm	3 mm	HMC724LC3	1742		3 X 3 MM, RPHS COMPLIANT, CERAMIC, SMT-16	16	compliant	EAR99	8542.39.00.01	8.5	USA	E-16-1
HMC850LC3TR Analog Devices Inc		查询价格和库存		No	Yes	Active				1		YES	HVQCCN			850	LOGIC CIRCUIT								INDUSTRIAL	S-CQCC-N16	Not Qualified		3	85 °C	-40 °C	260		30	16	CERAMIC, METAL-SEALED COFIRED	LCC16,.12SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	TR		NO LEAD	500 µm	QUAD	920 µm	3 mm	3 mm	HMC850LC3TR	1742		3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT-16	16	compliant	EAR99	8542.39.00.01	8.5	USA	E-16-1
HMC744LC3 Analog Devices Inc		查询价格和库存		No	Yes	Active	3.3 V			1		YES	HVQCCN			744	LOGIC CIRCUIT						3.6 V	3 V	INDUSTRIAL	S-CQCC-N16		e4	3	85 °C	-40 °C	260		30	16	CERAMIC, METAL-SEALED COFIRED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		Gold (Au) - with Nickel (Ni) barrier	NO LEAD	500 µm	QUAD	920 µm	3 mm	3 mm	HMC744LC3	1742		3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT-16	16	compliant	EAR99	8542.39.00.01	8.5	USA	E-16-1
HMC746LC3C Analog Devices Inc		查询价格和库存		No	Yes	Active	3.3 V			4		YES	HQCCN			746	LOGIC CIRCUIT						3.6 V	3 V	INDUSTRIAL	S-CQCC-N16	Not Qualified	e4	3	85 °C	-40 °C	260		30	16	CERAMIC, METAL-SEALED COFIRED		SQUARE	CHIP CARRIER, HEAT SINK/SLUG		Gold (Au) - with Nickel (Ni) barrier	NO LEAD	500 µm	QUAD	1.31 mm	3 mm	3 mm	HMC746LC3C	1742		3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT, 16 PIN	16	compliant	EAR99	8542.39.00.01	8.5	USA	E-16-1
74LVC1G57W6-7 Diodes Incorporated		查询价格和库存		Yes	Yes	Active	3.3 V		7.9 ns	1		YES	LSSOP	50 pF	YES	LVC/LCX/Z	LOGIC CIRCUIT	CMOS		24 mA			5.5 V	1.65 V	AUTOMOTIVE	R-PDSO-G6	Not Qualified	e3	1	125 °C	-40 °C	260		30	6	PLASTIC/EPOXY	TSOP6,.11,37	RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TR	MATTE TIN	GULL WING	950 µm	DUAL	1.35 mm	1.6 mm	2.85 mm		1926	SOT	LSSOP, TSOP6,.11,37	6	compliant	EAR99	8542.39.00.01
74LVC1G57DW-7 Diodes Incorporated		查询价格和库存		Yes	Yes	Active	3.3 V		7.9 ns	1		YES	TSSOP	50 pF	YES	LVC/LCX/Z	LOGIC CIRCUIT	CMOS		24 mA			5.5 V	1.65 V	AUTOMOTIVE	R-PDSO-G6	Not Qualified	e3	1	125 °C	-40 °C	260		30	6	PLASTIC/EPOXY	TSSOP6,.08	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TR	MATTE TIN	GULL WING	650 µm	DUAL	1.1 mm	1.25 mm	2 mm		1926	SOT-363	ROHS COMPLIANT, SOT-363, 6 PIN	6	compliant	EAR99	8542.39.00.01
74LVC1G97W6-7 Diodes Incorporated		查询价格和库存		Yes	Yes	Active	3.3 V		7.9 ns	1		YES	LSSOP	50 pF	YES	LVC/LCX/Z	LOGIC CIRCUIT	CMOS		24 mA			5.5 V	1.65 V	AUTOMOTIVE	R-PDSO-G6	Not Qualified	e3	1	125 °C	-40 °C	260		30	6	PLASTIC/EPOXY	TSOP6,.11,37	RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TR	MATTE TIN	GULL WING	950 µm	DUAL	1.35 mm	1.6 mm	2.85 mm		1926	SOT	LSSOP, TSOP6,.11,37	6	compliant	EAR99	8542.39.00.01

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