FIFO封装型号_FIFO厂家价格-bom2buy

型号

型号						Most Relevant							Technical																Compliance			Operating Conditions							Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	内存密度	内存宽度	组织	标称供电电压 (Vsup)	最长访问时间	最大时钟频率 (fCLK)	周期时间	内存集成电路类型	其他特性	备用内存宽度	功能数量	字数代码	字数	工作模式	输出特性	可输出	并行/串行	最大待机电流	最大压摆率	最大供电电压 (Vsup)	最小供电电压 (Vsup)	技术	温度等级	JESD-30 代码	认证状态	JESD-609代码	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	筛选级别	处于峰值回流温度下的最长时间	总剂量	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	座面最大高度	长度	宽度	Source Content uid	mfrid	零件包装代码	包装说明	针数	制造商包装代码	是否符合REACH标准	ECCN代码	HTS代码	Date Of Intro	YTEOL	Country Of Origin
72V3642L10PFG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	36.864 kbit	36	1KX36	3.3 V	6.5 ns	100 MHz	10 ns	BI-DIRECTIONAL FIFO	MAIL BOX BYPASS REGISTER		1	1000	1.024 k	SYNCHRONOUS		YES	PARALLEL	5 mA		3.45 V	3.15 V	CMOS	COMMERCIAL	S-PQFP-G120	Not Qualified	e3	3	70 °C		260				120	PLASTIC/EPOXY	LFQFP	QFP120,.63SQ,16	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN	GULL WING	400 µm	QUAD	1.6 mm	14 mm	14 mm	72V3642L10PFG	2068	TQFP	GREEN, TQFP-120	120	PNG120	compliant	EAR99	8542.32.00.71
72V3612L12PFG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	2.304 kbit	36	64X36	3.3 V	8 ns	83 MHz	12 ns	BI-DIRECTIONAL FIFO	MAIL BOX BYPASS REGISTER; PARITY GENERATOR/CHECKER		1	64	64 words	SYNCHRONOUS		YES	PARALLEL	500 µA		3.6 V	3 V	CMOS	COMMERCIAL	S-PQFP-G120	Not Qualified	e3	3	70 °C		260		40		120	PLASTIC/EPOXY	LFQFP	QFP120,.63SQ,16	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	MATTE TIN	GULL WING	400 µm	QUAD	1.6 mm	14 mm	14 mm	72V3612L12PFG	2068	TQFP	TQFP-120	120	PNG120	compliant	EAR99	8542.32.00.71	1993-01-01
72T18125L10BB Integrated Device Technology Inc		查询价格和库存		No	No	Transferred	9.4372 Mbit	18	512KX18	2.5 V	4.5 ns	50 MHz	10 ns	OTHER FIFO	ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE	9	1	512000	524.288 k	SYNCHRONOUS		YES	PARALLEL	20 mA	70 µA	2.625 V	2.375 V	CMOS	COMMERCIAL	S-PBGA-B240	Not Qualified	e0	3	70 °C		225		30		240	PLASTIC/EPOXY	BGA	BGA240,18X18,40	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	1.97 mm	19 mm	19 mm	72T18125L10BB	2068	PBGA	BGA-240	240	BB240	not_compliant	EAR99	8542.32.00.71
72V223L6BC Integrated Device Technology Inc		查询价格和库存		No	No	Transferred	9.216 kbit	18	512X18	3.3 V	4 ns	166 MHz	6 ns	OTHER FIFO	IT CAN ALSO BE CONFIGURED AS 1K X 9; RET... more	9	1	512	512 words	SYNCHRONOUS		YES	PARALLEL	15 mA	35 µA	3.45 V	3.15 V	CMOS	COMMERCIAL	S-PBGA-B100	Not Qualified	e0	3	70 °C		225		30		100	PLASTIC/EPOXY	LBGA	BGA100,10X10,40	SQUARE	GRID ARRAY, LOW PROFILE	YES	TIN LEAD	BALL	1 mm	BOTTOM	1.5 mm	11 mm	11 mm	72V223L6BC	2068	CABGA	11 X 11 MM, 1 MM PITCH, BGA-100	100	BC100	not_compliant	EAR99	8542.32.00.71	1998-11-01
72V06L15JG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	147.456 kbit	9	16KX9	3.3 V	15 ns		25 ns		RETRANSMIT		1	16000	16.384 k	ASYNCHRONOUS		NO	PARALLEL			3.6 V	3 V	CMOS	COMMERCIAL	R-PQCC-J32	Not Qualified	e3	3	70 °C		260		30		32	PLASTIC/EPOXY	QCCJ		RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn) - annealed	J BEND	1.27 mm	QUAD	3.55 mm	13.97 mm	11.43 mm	72V06L15JG	2068	PLCC	LCC-32	32	PLG32	compliant	EAR99	8542.32.00.71	1988-01-01
72V04L15JG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	36.864 kbit	9	4KX9	3.3 V	15 ns		25 ns		RETRANSMIT		1	4000	4.096 k	ASYNCHRONOUS		NO	PARALLEL			3.6 V	3 V	CMOS	COMMERCIAL	R-PQCC-J32	Not Qualified	e3	3	70 °C		260		30		32	PLASTIC/EPOXY	QCCJ		RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn) - annealed	J BEND	1.27 mm	QUAD	3.55 mm	13.97 mm	11.43 mm	72V04L15JG	2068	PLCC	LCC-32	32	PLG32	compliant	EAR99	8542.32.00.71	1988-01-01
72V02L15JG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	9.216 kbit	9	1KX9	3.3 V	15 ns		25 ns	OTHER FIFO			1	1000	1.024 k	ASYNCHRONOUS	3-STATE	NO	PARALLEL	5 mA	60 µA	3.6 V	3 V	CMOS	COMMERCIAL	R-PQCC-N32		e3	3	70 °C		260		30		32	PLASTIC/EPOXY	QCCN	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn) - annealed	J BEND	1.27 mm	QUAD	2.79 mm	13.97 mm	11.43 mm	72V02L15JG	2068	PLCC	LCC-32	32	PLG32	compliant	EAR99	8542.32.00.71	1988-01-01
72V04L25JGI Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	36.864 kbit	9	4KX9	3.3 V	25 ns		35 ns		RETRANSMIT		1	4000	4.096 k	ASYNCHRONOUS		NO	PARALLEL			3.6 V	3 V	CMOS	INDUSTRIAL	R-PQCC-J32	Not Qualified	e3	3	85 °C	-40 °C	260		30		32	PLASTIC/EPOXY	QCCJ		RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn) - annealed	J BEND	1.27 mm	QUAD	3.55 mm	13.97 mm	11.43 mm	72V04L25JGI	2068	PLCC	LCC-32	32	PLG32	compliant	EAR99	8542.32.00.71	1988-01-01
72V06L25JGI Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	147.456 kbit	9	16KX9	3.3 V	25 ns		35 ns		RETRANSMIT		1	16000	16.384 k	ASYNCHRONOUS		NO	PARALLEL			3.6 V	3 V	CMOS	INDUSTRIAL	R-PQCC-J32	Not Qualified	e3	3	85 °C	-40 °C	260		30		32	PLASTIC/EPOXY	QCCJ		RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn) - annealed	J BEND	1.27 mm	QUAD	3.55 mm	13.97 mm	11.43 mm	72V06L25JGI	2068	PLCC	LCC-32	32	PLG32	compliant	EAR99	8542.32.00.71	1988-01-01
723624L15PFG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	9.216 kbit	36	256X36	5 V	10 ns		15 ns		AUTO POWER DOWN		1	256	256 words	SYNCHRONOUS		YES	PARALLEL			5.5 V	4.5 V	CMOS	COMMERCIAL	R-PQFP-G128		e3	3	70 °C		260				128	PLASTIC/EPOXY	QFP		RECTANGULAR	FLATPACK	YES	TIN	GULL WING		QUAD				723624L15PFG	2068	TQFP	TQFP-128	128	PKG128	compliant	EAR99	8542.32.00.71
5962-8753103XA Integrated Device Technology Inc		查询价格和库存		No	No	Transferred	4.608 kbit	9	512X9	5 V	80 ns	10 MHz	100 ns	OTHER FIFO	RETRANSMIT		1	512	512 words	ASYNCHRONOUS	3-STATE	NO	PARALLEL	900 µA	100 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified	e0	1	125 °C	-55 °C	240	MIL-STD-883			28	CERAMIC, GLASS-SEALED	DIP	DIP28,.6	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	5.08 mm	37.211 mm	15.24 mm	5962-8753103XA	2068	CDIP	CERAMIC, DIP-28	28	CD28	not_compliant	EAR99	8542.32.00.71	1990-01-01
CD74HC40105E Harris Semiconductor		查询价格和库存			No	Transferred	64 bit	4	16X4	5 V	500 ns	10 MHz	71.42 ns	OTHER FIFO			1	16	16 words	ASYNCHRONOUS	3-STATE	NO	PARALLEL			6 V	2 V	CMOS	MILITARY	R-PDIP-T16	Not Qualified	e0		125 °C	-55 °C					16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL					2178092		DIP-16			unknown	EAR99	8542.32.00.71
CD74HC40105M Harris Semiconductor		查询价格和库存			No	Transferred	64 bit	4	16X4	5 V		10 MHz		OTHER FIFO			1	16	16 words	ASYNCHRONOUS	3-STATE	NO	PARALLEL			6 V	2 V	CMOS	MILITARY	R-PDSO-G16	Not Qualified	e0		125 °C	-55 °C					16	PLASTIC/EPOXY	SOP	SOP16,.25	RECTANGULAR	SMALL OUTLINE	YES	Tin/Lead (Sn/Pb)	GULL WING	1.27 mm	DUAL					2178092					unknown	EAR99	8542.32.00.71
CD74HCT40105E Harris Semiconductor		查询价格和库存			No	Transferred	64 bit	4	16X4	5 V	100 ns	10 MHz	83.33 ns	OTHER FIFO			1	16	16 words	ASYNCHRONOUS	3-STATE	NO	PARALLEL			5.5 V	4.5 V	CMOS	MILITARY	R-PDIP-T16	Not Qualified	e0		125 °C	-55 °C					16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL					2178092		DIP-16			unknown	EAR99	8542.32.00.71
5962-8753101YA Integrated Device Technology Inc		查询价格和库存		No	No	Transferred	4.608 kbit	9	512X9	5 V	30 ns	25 MHz	40 ns	OTHER FIFO	RETRANSMIT		1	512	512 words	ASYNCHRONOUS	3-STATE	NO	PARALLEL	900 µA	100 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified	e0	1	125 °C	-55 °C	240	MIL-STD-883			32	CERAMIC, METAL-SEALED COFIRED	QCCN	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	YES	TIN LEAD	NO LEAD	1.27 mm	QUAD	3.048 mm	13.97 mm	11.43 mm	5962-8753101YA	2068	LCC	CERAMIC, LCC-32	32	LC32	not_compliant	EAR99	8542.32.00.71	1990-01-01
7200L15TPGI Renesas Electronics Corporation		查询价格和库存			Yes	Active	2.304 kbit	9	256X9	5 V	15 ns	40 MHz	25 ns	OTHER FIFO	RETRANSMIT		1	256	256 words	ASYNCHRONOUS		NO	PARALLEL	5 mA	80 µA	5.5 V	4.5 V	CMOS	INDUSTRIAL	R-PDIP-T28	Not Qualified	e3		85 °C	-40 °C					28	PLASTIC/EPOXY	DIP	DIP28,.3	RECTANGULAR	IN-LINE	NO	MATTE TIN	THROUGH-HOLE	2.54 mm	DUAL	4.572 mm	34.671 mm	7.62 mm	7200L15TPGI	2354		GREEN, PLASTIC, DIP-28			compliant				4.85
HX6136TSRC Honeywell Sensing and Control		查询价格和库存				Active	36.864 kbit	36	1KX36	5 V	30 ns	28 MHz	34 ns	OTHER FIFO			1	1000	1.024 k	SYNCHRONOUS		YES	PARALLEL	1 mA	500 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CDFP-F32	Not Qualified			125 °C	-55 °C		38535V;38534K;883S			32	CERAMIC, METAL-SEALED COFIRED	DFP	FL32,.6	RECTANGULAR	FLATPACK	YES		FLAT	1.27 mm	DUAL	3.81 mm	20.828 mm	15.24 mm	HX6136TSRC	2039		DFP, FL32,.6			unknown	EAR99	8542.32.00.71		4.82	USA
HX6136TEHC Honeywell Sensing and Control		查询价格和库存				Active	36.864 kbit	36	1KX36	5 V	30 ns		34 ns				1	1000	1.024 k	SYNCHRONOUS		YES	PARALLEL			5.5 V	4.5 V	CMOS	MILITARY	R-CDFP-F32	Not Qualified			125 °C	-55 °C					32	CERAMIC, METAL-SEALED COFIRED	DFP		RECTANGULAR	FLATPACK	YES		FLAT		DUAL				HX6136TEHC	2039		DFP,			unknown	EAR99	8542.32.00.71		4.82	USA
HX6136FSRT Honeywell Microelectronics & Precision Sensors		查询价格和库存				Active	36.864 kbit	36	1KX36	5 V	30 ns	29.4 MHz	36 ns	OTHER FIFO			1	1000	1.024 k	SYNCHRONOUS		YES	PARALLEL	500 µA	500 µA	5.5 V	4.5 V	CMOS	MILITARY	S-CQFP-F132	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class S		100k Rad(Si) V	132	CERAMIC, METAL-SEALED COFIRED	GQFF	TPAK132,2.5SQ,25	SQUARE	FLATPACK, GUARD RING	YES		FLAT	635 µm	QUAD	2.7686 mm	24.13 mm	24.13 mm		4317494	QFP	GQFF, TPAK132,2.5SQ,25	132		unknown	EAR99	8542.32.00.71		4.82	USA
HX6136TBHC Honeywell Microelectronics & Precision Sensors		查询价格和库存				Active	36.864 kbit	36	1KX36	5 V	30 ns	28 MHz	34 ns	OTHER FIFO			1	1000	1.024 k	SYNCHRONOUS		YES	PARALLEL	1 mA	500 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CDFP-F32	Not Qualified			125 °C	-55 °C		38535Q/M;38534H;883B			32	CERAMIC, METAL-SEALED COFIRED	DFP	FL32,.6	RECTANGULAR	FLATPACK	YES		FLAT	1.27 mm	DUAL	3.81 mm	20.828 mm	15.24 mm		4317494	DFP	DFP, FL32,.6	32		unknown	EAR99	8542.32.00.71		4.82	USA

型号						Most Relevant							Technical																Compliance			Operating Conditions							Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	内存密度	内存宽度	组织	标称供电电压 (Vsup)	最长访问时间	最大时钟频率 (fCLK)	周期时间	内存集成电路类型	其他特性	备用内存宽度	功能数量	字数代码	字数	工作模式	输出特性	可输出	并行/串行	最大待机电流	最大压摆率	最大供电电压 (Vsup)	最小供电电压 (Vsup)	技术	温度等级	JESD-30 代码	认证状态	JESD-609代码	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	筛选级别	处于峰值回流温度下的最长时间	总剂量	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	座面最大高度	长度	宽度	Source Content uid	mfrid	零件包装代码	包装说明	针数	制造商包装代码	是否符合REACH标准	ECCN代码	HTS代码	Date Of Intro	YTEOL	Country Of Origin
72V3642L10PFG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	36.864 kbit	36	1KX36	3.3 V	6.5 ns	100 MHz	10 ns	BI-DIRECTIONAL FIFO	MAIL BOX BYPASS REGISTER		1	1000	1.024 k	SYNCHRONOUS		YES	PARALLEL	5 mA		3.45 V	3.15 V	CMOS	COMMERCIAL	S-PQFP-G120	Not Qualified	e3	3	70 °C		260				120	PLASTIC/EPOXY	LFQFP	QFP120,.63SQ,16	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	TIN	GULL WING	400 µm	QUAD	1.6 mm	14 mm	14 mm	72V3642L10PFG	2068	TQFP	GREEN, TQFP-120	120	PNG120	compliant	EAR99	8542.32.00.71
72V3612L12PFG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	2.304 kbit	36	64X36	3.3 V	8 ns	83 MHz	12 ns	BI-DIRECTIONAL FIFO	MAIL BOX BYPASS REGISTER; PARITY GENERATOR/CHECKER		1	64	64 words	SYNCHRONOUS		YES	PARALLEL	500 µA		3.6 V	3 V	CMOS	COMMERCIAL	S-PQFP-G120	Not Qualified	e3	3	70 °C		260		40		120	PLASTIC/EPOXY	LFQFP	QFP120,.63SQ,16	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	YES	MATTE TIN	GULL WING	400 µm	QUAD	1.6 mm	14 mm	14 mm	72V3612L12PFG	2068	TQFP	TQFP-120	120	PNG120	compliant	EAR99	8542.32.00.71	1993-01-01
72T18125L10BB Integrated Device Technology Inc		查询价格和库存		No	No	Transferred	9.4372 Mbit	18	512KX18	2.5 V	4.5 ns	50 MHz	10 ns	OTHER FIFO	ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE	9	1	512000	524.288 k	SYNCHRONOUS		YES	PARALLEL	20 mA	70 µA	2.625 V	2.375 V	CMOS	COMMERCIAL	S-PBGA-B240	Not Qualified	e0	3	70 °C		225		30		240	PLASTIC/EPOXY	BGA	BGA240,18X18,40	SQUARE	GRID ARRAY	YES	TIN LEAD	BALL	1 mm	BOTTOM	1.97 mm	19 mm	19 mm	72T18125L10BB	2068	PBGA	BGA-240	240	BB240	not_compliant	EAR99	8542.32.00.71
72V223L6BC Integrated Device Technology Inc		查询价格和库存		No	No	Transferred	9.216 kbit	18	512X18	3.3 V	4 ns	166 MHz	6 ns	OTHER FIFO	IT CAN ALSO BE CONFIGURED AS 1K X 9; RET... more	9	1	512	512 words	SYNCHRONOUS		YES	PARALLEL	15 mA	35 µA	3.45 V	3.15 V	CMOS	COMMERCIAL	S-PBGA-B100	Not Qualified	e0	3	70 °C		225		30		100	PLASTIC/EPOXY	LBGA	BGA100,10X10,40	SQUARE	GRID ARRAY, LOW PROFILE	YES	TIN LEAD	BALL	1 mm	BOTTOM	1.5 mm	11 mm	11 mm	72V223L6BC	2068	CABGA	11 X 11 MM, 1 MM PITCH, BGA-100	100	BC100	not_compliant	EAR99	8542.32.00.71	1998-11-01
72V06L15JG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	147.456 kbit	9	16KX9	3.3 V	15 ns		25 ns		RETRANSMIT		1	16000	16.384 k	ASYNCHRONOUS		NO	PARALLEL			3.6 V	3 V	CMOS	COMMERCIAL	R-PQCC-J32	Not Qualified	e3	3	70 °C		260		30		32	PLASTIC/EPOXY	QCCJ		RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn) - annealed	J BEND	1.27 mm	QUAD	3.55 mm	13.97 mm	11.43 mm	72V06L15JG	2068	PLCC	LCC-32	32	PLG32	compliant	EAR99	8542.32.00.71	1988-01-01
72V04L15JG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	36.864 kbit	9	4KX9	3.3 V	15 ns		25 ns		RETRANSMIT		1	4000	4.096 k	ASYNCHRONOUS		NO	PARALLEL			3.6 V	3 V	CMOS	COMMERCIAL	R-PQCC-J32	Not Qualified	e3	3	70 °C		260		30		32	PLASTIC/EPOXY	QCCJ		RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn) - annealed	J BEND	1.27 mm	QUAD	3.55 mm	13.97 mm	11.43 mm	72V04L15JG	2068	PLCC	LCC-32	32	PLG32	compliant	EAR99	8542.32.00.71	1988-01-01
72V02L15JG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	9.216 kbit	9	1KX9	3.3 V	15 ns		25 ns	OTHER FIFO			1	1000	1.024 k	ASYNCHRONOUS	3-STATE	NO	PARALLEL	5 mA	60 µA	3.6 V	3 V	CMOS	COMMERCIAL	R-PQCC-N32		e3	3	70 °C		260		30		32	PLASTIC/EPOXY	QCCN	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn) - annealed	J BEND	1.27 mm	QUAD	2.79 mm	13.97 mm	11.43 mm	72V02L15JG	2068	PLCC	LCC-32	32	PLG32	compliant	EAR99	8542.32.00.71	1988-01-01
72V04L25JGI Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	36.864 kbit	9	4KX9	3.3 V	25 ns		35 ns		RETRANSMIT		1	4000	4.096 k	ASYNCHRONOUS		NO	PARALLEL			3.6 V	3 V	CMOS	INDUSTRIAL	R-PQCC-J32	Not Qualified	e3	3	85 °C	-40 °C	260		30		32	PLASTIC/EPOXY	QCCJ		RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn) - annealed	J BEND	1.27 mm	QUAD	3.55 mm	13.97 mm	11.43 mm	72V04L25JGI	2068	PLCC	LCC-32	32	PLG32	compliant	EAR99	8542.32.00.71	1988-01-01
72V06L25JGI Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	147.456 kbit	9	16KX9	3.3 V	25 ns		35 ns		RETRANSMIT		1	16000	16.384 k	ASYNCHRONOUS		NO	PARALLEL			3.6 V	3 V	CMOS	INDUSTRIAL	R-PQCC-J32	Not Qualified	e3	3	85 °C	-40 °C	260		30		32	PLASTIC/EPOXY	QCCJ		RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn) - annealed	J BEND	1.27 mm	QUAD	3.55 mm	13.97 mm	11.43 mm	72V06L25JGI	2068	PLCC	LCC-32	32	PLG32	compliant	EAR99	8542.32.00.71	1988-01-01
723624L15PFG Integrated Device Technology Inc		查询价格和库存		Yes	Yes	Transferred	9.216 kbit	36	256X36	5 V	10 ns		15 ns		AUTO POWER DOWN		1	256	256 words	SYNCHRONOUS		YES	PARALLEL			5.5 V	4.5 V	CMOS	COMMERCIAL	R-PQFP-G128		e3	3	70 °C		260				128	PLASTIC/EPOXY	QFP		RECTANGULAR	FLATPACK	YES	TIN	GULL WING		QUAD				723624L15PFG	2068	TQFP	TQFP-128	128	PKG128	compliant	EAR99	8542.32.00.71
5962-8753103XA Integrated Device Technology Inc		查询价格和库存		No	No	Transferred	4.608 kbit	9	512X9	5 V	80 ns	10 MHz	100 ns	OTHER FIFO	RETRANSMIT		1	512	512 words	ASYNCHRONOUS	3-STATE	NO	PARALLEL	900 µA	100 µA	5.5 V	4.5 V	CMOS	MILITARY	R-GDIP-T28	Not Qualified	e0	1	125 °C	-55 °C	240	MIL-STD-883			28	CERAMIC, GLASS-SEALED	DIP	DIP28,.6	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	5.08 mm	37.211 mm	15.24 mm	5962-8753103XA	2068	CDIP	CERAMIC, DIP-28	28	CD28	not_compliant	EAR99	8542.32.00.71	1990-01-01
CD74HC40105E Harris Semiconductor		查询价格和库存			No	Transferred	64 bit	4	16X4	5 V	500 ns	10 MHz	71.42 ns	OTHER FIFO			1	16	16 words	ASYNCHRONOUS	3-STATE	NO	PARALLEL			6 V	2 V	CMOS	MILITARY	R-PDIP-T16	Not Qualified	e0		125 °C	-55 °C					16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL					2178092		DIP-16			unknown	EAR99	8542.32.00.71
CD74HC40105M Harris Semiconductor		查询价格和库存			No	Transferred	64 bit	4	16X4	5 V		10 MHz		OTHER FIFO			1	16	16 words	ASYNCHRONOUS	3-STATE	NO	PARALLEL			6 V	2 V	CMOS	MILITARY	R-PDSO-G16	Not Qualified	e0		125 °C	-55 °C					16	PLASTIC/EPOXY	SOP	SOP16,.25	RECTANGULAR	SMALL OUTLINE	YES	Tin/Lead (Sn/Pb)	GULL WING	1.27 mm	DUAL					2178092					unknown	EAR99	8542.32.00.71
CD74HCT40105E Harris Semiconductor		查询价格和库存			No	Transferred	64 bit	4	16X4	5 V	100 ns	10 MHz	83.33 ns	OTHER FIFO			1	16	16 words	ASYNCHRONOUS	3-STATE	NO	PARALLEL			5.5 V	4.5 V	CMOS	MILITARY	R-PDIP-T16	Not Qualified	e0		125 °C	-55 °C					16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL					2178092		DIP-16			unknown	EAR99	8542.32.00.71
5962-8753101YA Integrated Device Technology Inc		查询价格和库存		No	No	Transferred	4.608 kbit	9	512X9	5 V	30 ns	25 MHz	40 ns	OTHER FIFO	RETRANSMIT		1	512	512 words	ASYNCHRONOUS	3-STATE	NO	PARALLEL	900 µA	100 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CQCC-N32	Not Qualified	e0	1	125 °C	-55 °C	240	MIL-STD-883			32	CERAMIC, METAL-SEALED COFIRED	QCCN	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	YES	TIN LEAD	NO LEAD	1.27 mm	QUAD	3.048 mm	13.97 mm	11.43 mm	5962-8753101YA	2068	LCC	CERAMIC, LCC-32	32	LC32	not_compliant	EAR99	8542.32.00.71	1990-01-01
7200L15TPGI Renesas Electronics Corporation		查询价格和库存			Yes	Active	2.304 kbit	9	256X9	5 V	15 ns	40 MHz	25 ns	OTHER FIFO	RETRANSMIT		1	256	256 words	ASYNCHRONOUS		NO	PARALLEL	5 mA	80 µA	5.5 V	4.5 V	CMOS	INDUSTRIAL	R-PDIP-T28	Not Qualified	e3		85 °C	-40 °C					28	PLASTIC/EPOXY	DIP	DIP28,.3	RECTANGULAR	IN-LINE	NO	MATTE TIN	THROUGH-HOLE	2.54 mm	DUAL	4.572 mm	34.671 mm	7.62 mm	7200L15TPGI	2354		GREEN, PLASTIC, DIP-28			compliant				4.85
HX6136TSRC Honeywell Sensing and Control		查询价格和库存				Active	36.864 kbit	36	1KX36	5 V	30 ns	28 MHz	34 ns	OTHER FIFO			1	1000	1.024 k	SYNCHRONOUS		YES	PARALLEL	1 mA	500 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CDFP-F32	Not Qualified			125 °C	-55 °C		38535V;38534K;883S			32	CERAMIC, METAL-SEALED COFIRED	DFP	FL32,.6	RECTANGULAR	FLATPACK	YES		FLAT	1.27 mm	DUAL	3.81 mm	20.828 mm	15.24 mm	HX6136TSRC	2039		DFP, FL32,.6			unknown	EAR99	8542.32.00.71		4.82	USA
HX6136TEHC Honeywell Sensing and Control		查询价格和库存				Active	36.864 kbit	36	1KX36	5 V	30 ns		34 ns				1	1000	1.024 k	SYNCHRONOUS		YES	PARALLEL			5.5 V	4.5 V	CMOS	MILITARY	R-CDFP-F32	Not Qualified			125 °C	-55 °C					32	CERAMIC, METAL-SEALED COFIRED	DFP		RECTANGULAR	FLATPACK	YES		FLAT		DUAL				HX6136TEHC	2039		DFP,			unknown	EAR99	8542.32.00.71		4.82	USA
HX6136FSRT Honeywell Microelectronics & Precision Sensors		查询价格和库存				Active	36.864 kbit	36	1KX36	5 V	30 ns	29.4 MHz	36 ns	OTHER FIFO			1	1000	1.024 k	SYNCHRONOUS		YES	PARALLEL	500 µA	500 µA	5.5 V	4.5 V	CMOS	MILITARY	S-CQFP-F132	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class S		100k Rad(Si) V	132	CERAMIC, METAL-SEALED COFIRED	GQFF	TPAK132,2.5SQ,25	SQUARE	FLATPACK, GUARD RING	YES		FLAT	635 µm	QUAD	2.7686 mm	24.13 mm	24.13 mm		4317494	QFP	GQFF, TPAK132,2.5SQ,25	132		unknown	EAR99	8542.32.00.71		4.82	USA
HX6136TBHC Honeywell Microelectronics & Precision Sensors		查询价格和库存				Active	36.864 kbit	36	1KX36	5 V	30 ns	28 MHz	34 ns	OTHER FIFO			1	1000	1.024 k	SYNCHRONOUS		YES	PARALLEL	1 mA	500 µA	5.5 V	4.5 V	CMOS	MILITARY	R-CDFP-F32	Not Qualified			125 °C	-55 °C		38535Q/M;38534H;883B			32	CERAMIC, METAL-SEALED COFIRED	DFP	FL32,.6	RECTANGULAR	FLATPACK	YES		FLAT	1.27 mm	DUAL	3.81 mm	20.828 mm	15.24 mm		4317494	DFP	DFP, FL32,.6	32		unknown	EAR99	8542.32.00.71		4.82	USA

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