参考设计
(12)
CC25XXEM Reference Design
CC25XXEM_REF_DES: The CC25XX Folded Dipole reference design contains schematics and layout files for a CC2500EM with a folded dipole PCB antenna. This antenna requires maximum two capacitors in the matching network and can be used together with the following products; CC2500, CC2510, CC2511 and CC2511 The reference design shows the dimensions of the antenna and how it should be connected to the radio. For more information about antenna dimensions and performance please see Design Note 004.
CC2500EM_REFDES CC2500EM Reference Design | TI.com
CC2500EM_REFDES: The CC2500EM reference design contains schematics and layout files for the CC2500EM evaluation module used in the CC2500-CC2550DK development kit. The reference design demonstrates good techniques for CC2500 decoupling and RF layout. For optimum RF performance, these parts should be copied accurately. This is a 2-layer reference design with a discrete balun and SMA antenna connector designed for a single ended 50 ohm antenna.
CC2500_REFDES_062 CC2500 Reference Design (62 mil layer spacing) | TI.com
CC2500_REFDES_062: The CC2500EM_REFDES_062 reference design contains schematics and layout files of a board similar to the CC2500EM evaluation module used in the CC2500-CC2550DK development kit, but modified to use a 62 mil (0.062 inch or 1.6mm) layer spacing. The reference design demonstrates proper techniques for CC2500 decoupling and layout. The layout supports optimum RF performance for this part and should be copied accurately. This is a 2-layer reference design with a discrete balun and SMA antenna connector designed for use with a single ended 50 ohm antenna.
CC2500 Reference Design (62 mil layer spacing)
CC2500_REFDES_062: The CC2500EM_REFDES_062 reference design contains schematics and layout files of a board similar to the CC2500EM evaluation module used in the CC2500-CC2550DK development kit, but modified to use a 62 mil (0.062 inch or 1.6mm) layer spacing. The reference design demonstrates proper techniques for CC2500 decoupling and layout. The layout supports optimum RF performance for this part and should be copied accurately. This is a 2-layer reference design with a discrete balun and SMA antenna connector designed for use with a single ended 50 ohm antenna.
Evaluation Module (EM) Adaptor
TIDM-LPBP-EMADAPTER: This BoosterPack kit contains one "EM Adapter BoosterPack". The purpose of the EM adapter board is to provide an-easy-to-use bridge between any of the TI MCU LaunchPads and the vide variety of TI RF evaluation modules (EM), for instance the CCxxxx Low-Power RF evaluation modules. No specific software is provided, so it is up to the user to write the appropriate code to interconnect the MCU with the RF device.
Battery-Operated Wireless Sensor Monitoring Reference Design
TIDM-WIRELESS-SENSORNODE: This design, featuring the ultra-low-power MSP430 MCU paired with a sub-GHz RF transceiver, enables a battery-operated wireless sensor monitoring solution. This design demonstrates both access point and wireless nodes, which can share sensor data wirelessly using a network protocol called "SimpliciTI". A PC-side GUI is also provided to visualize the wireless data that is being transmitted/received between the various nodes and access point.
TIDM-WIRELESS-SENSORNODE Battery-Operated Wireless Sensor Monitoring Reference Design | TI.com
TIDM-WIRELESS-SENSORNODE: This design, featuring the ultra-low-power MSP430 MCU paired with a sub-GHz RF transceiver, enables a battery-operated wireless sensor monitoring solution. This design demonstrates both access point and wireless nodes, which can share sensor data wirelessly using a network protocol called "SimpliciTI". A PC-side GUI is also provided to visualize the wireless data that is being transmitted/received between the various nodes and access point.
TIDM-LPBP-EMADAPTER Evaluation Module (EM) Adaptor | TI.com
TIDM-LPBP-EMADAPTER: This BoosterPack kit contains one "EM Adapter BoosterPack". The purpose of the EM adapter board is to provide an-easy-to-use bridge between any of the TI MCU LaunchPads and the vide variety of TI RF evaluation modules (EM), for instance the CCxxxx Low-Power RF evaluation modules. No specific software is provided, so it is up to the user to write the appropriate code to interconnect the MCU with the RF device.
CC25XXEM_REF_DES CC25XXEM Reference Design | TI.com
CC25XXEM_REF_DES: The CC25XX Folded Dipole reference design contains schematics and layout files for a CC2500EM with a folded dipole PCB antenna. This antenna requires maximum two capacitors in the matching network and can be used together with the following products; CC2500, CC2510, CC2511 and CC2511 The reference design shows the dimensions of the antenna and how it should be connected to the radio. For more information about antenna dimensions and performance please see Design Note 004.
CC2500EM Reference Design
CC2500EM_REFDES: The CC2500EM reference design contains schematics and layout files for the CC2500EM evaluation module used in the CC2500-CC2550DK development kit. The reference design demonstrates good techniques for CC2500 decoupling and RF layout. For optimum RF performance, these parts should be copied accurately. This is a 2-layer reference design with a discrete balun and SMA antenna connector designed for a single ended 50 ohm antenna.
