型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 负电源额定电压 | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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mfrid
|
零件包装代码
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包装说明
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针数
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是否符合REACH标准
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HTS代码
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Source Content uid
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YTEOL
|
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LXT317NE
Level One
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | INDUSTRIAL | CORDLESS TELEPHONE BASEBAND CIRCUIT | R-PDIP-T28 | e0 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | DIP | DIP28(UNSPEC) | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | DUAL | 4317302 | DIP | DIP, DIP28(UNSPEC) | 28 | unknown | 8542.39.00.01 | |||||||||||||
LXT317NE
Intel Corporation
|
查询价格和库存 |
|
No | Transferred | 5 V | CMOS | 1 | INDUSTRIAL | CORDLESS TELEPHONE BASEBAND CIRCUIT | R-PDIP-T28 | e0 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | DIP | DIP28(UNSPEC) | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 37.402 mm | 6.35 mm | 2071 | DIP | DIP, DIP28(UNSPEC) | 28 | compliant | 8542.39.00.01 | |||||||||
MC13158FTB
Freescale Semiconductor
|
查询价格和库存 |
|
No | Transferred | 3 V | BIPOLAR | 1 | INDUSTRIAL | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | S-PQFP-G32 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | 1999 | QFP | LQFP, | 32 | not_compliant | 8542.39.00.01 | MC13158FTB | ||||||||
UPC8139GR-7JH-E1
NEC Electronics Group
|
查询价格和库存 |
|
No | Transferred | 3 V | BIPOLAR | 1 | COMMERCIAL EXTENDED | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G30 | e0 | Not Qualified | 80 °C | -30 °C | 30 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | 2219 | TSSOP | TSSOP, | 30 | compliant | 8542.39.00.01 | ||||||||||
M66260FP
Mitsubishi Electric
|
查询价格和库存 |
|
No | Transferred | 2.5 V | -2.5 V | 1 | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G24 | e0 | Not Qualified | 24 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 5.3 mm | 15.02 mm | 2.1 mm | 2141105 | SOIC | SOP, | 24 | unknown | 8542.39.00.01 | |||||||||||||
TA31136FNG
Toshiba America Electronic Components
|
查询价格和库存 |
|
Yes | Obsolete | 2 V | BIPOLAR | 1 | 4.6 mA | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | LSSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2484 | SOIC | LSSOP, SSOP16,.25 | 16 | unknown | 8542.39.00.01 | TA31136FNG | 0 | ||||||
U3600BM
Temic Semiconductors
|
查询价格和库存 |
|
No | Transferred | 3.6 V | BIPOLAR | 1 | 16 µA | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G44 | e0 | Not Qualified | 85 °C | -25 °C | 44 | PLASTIC/EPOXY | SOP | SO44(UNSPEC) | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | DUAL | 293710942 | SSO-44 | unknown | |||||||||||||||
BU8244F-E2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Obsolete | 5 V | 1 | 8 mA | COMMERCIAL EXTENDED | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 16 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 10 mm | 1.6 mm | 2363 | SOIC | LSOP, | 16 | compliant | 8542.39.00.01 | 0 | ||||||
BU8242F-E2
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Obsolete | 5 V | 1 | 8 mA | COMMERCIAL EXTENDED | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G20 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 20 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 12.5 mm | 1.9 mm | 2363 | SOIC | SOP, | 20 | compliant | 8542.39.00.01 | 0 | ||||||
U2761B-MFSG3
Temic Semiconductors
|
查询价格和库存 |
|
No | Transferred | 3 V | BIPOLAR | 1 | OTHER | CORDLESS TELEPHONE BASEBAND CIRCUIT | R-PDSO-G28 | e0 | Not Qualified | 85 °C | -25 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | 293710942 | SSO-28 | unknown | |||||||||||||||
U2761B
Temic Semiconductors
|
查询价格和库存 |
|
No | Transferred | 3 V | BIPOLAR | 1 | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G28 | e0 | Not Qualified | 85 °C | -25 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | 293710942 | SSO-28 | unknown | |||||||||||||||
BU8241FS
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Obsolete | 5 V | 1 | 8 mA | COMMERCIAL EXTENDED | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 1.9 mm | 2363 | SSOP | SSOP-24 | 24 | compliant | 8542.39.00.01 | 0 | ||||||
TA31136F
Toshiba America Electronic Components
|
查询价格和库存 |
|
Obsolete | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 1 mm | DUAL | 4.6 mm | 8.2 mm | 1.9 mm | 2484 | SOIC | SSOP, | 16 | unknown | 8542.39.00.01 | TA31136F | 0 | ||||||||||||||
U2760B-AFSG3
Temic Semiconductors
|
查询价格和库存 |
|
No | Transferred | 2.9 V | BIPOLAR | 1 | COMMERCIAL | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G28 | e0 | Not Qualified | 45 °C | -5 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | 293710942 | PLASTIC, SSO-28 | unknown | |||||||||||||||
U2801B-MFY
Temic Semiconductors
|
查询价格和库存 |
|
No | Transferred | 3.2 V | BIPOLAR | 1 | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | S-PQFP-G48 | e0 | Not Qualified | 85 °C | -25 °C | 48 | PLASTIC/EPOXY | QFP | QFP48,.35SQ,20 | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 293710942 | TQFP-48 | unknown | |||||||||||||||
U2801B
Temic Semiconductors
|
查询价格和库存 |
|
No | Transferred | 3.2 V | BIPOLAR | 1 | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | S-PQFP-G48 | e0 | Not Qualified | 85 °C | -25 °C | 48 | PLASTIC/EPOXY | QFP | QFP48,.35SQ,20 | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 293710942 | PLASTIC, QFP-48 | unknown | |||||||||||||||
U2801B-MFYG3
Temic Semiconductors
|
查询价格和库存 |
|
No | Transferred | 3.2 V | BIPOLAR | 1 | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | S-PQFP-G48 | e0 | Not Qualified | 85 °C | -25 °C | 48 | PLASTIC/EPOXY | QFP | QFP48,.35SQ,20 | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 293710942 | TQFP-48 | unknown | |||||||||||||||
U3500BM-BFLG3
Temic Semiconductors
|
查询价格和库存 |
|
No | Transferred | 3.6 V | BIPOLAR | 1 | 9.5 µA | COMMERCIAL EXTENDED | CORDLESS TELEPHONE BASEBAND CIRCUIT | R-PDSO-G28 | e0 | Not Qualified | 75 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 293710942 | SO-28 | unknown | ||||||||||||||
U7006B-MFB
Temic Semiconductors
|
查询价格和库存 |
|
No | Transferred | 3 V | 1 | OTHER | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 70 °C | -25 °C | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | DUAL | 293710942 | , | unknown | |||||||||||||||||||
U2763B-AFSG3
Temic Semiconductors
|
查询价格和库存 |
|
No | Transferred | 2.9 V | BIPOLAR | 1 | COMMERCIAL | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G20 | e0 | Not Qualified | 70 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.25 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | 293710942 | SSO-20 | unknown |