无绳电话集成电路封装型号_无绳电话集成电路厂家价格-bom2buy

型号

型号						Most Relevant		Technical				Compliance			Operating Conditions				Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	HTS代码	YTEOL	ECCN代码
TA8103F Toshiba America Electronic Components		查询价格和库存				Active	2.5 V		1		COMMERCIAL EXTENDED	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G24		Not Qualified	80 °C	-30 °C			24	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES		GULL WING	1 mm	DUAL	6 mm	13 mm	2.2 mm	TA8103F	2484	SSOP	SSOP,	24	unknown	8542.39.00.01
AN8953NFA Panasonic Electronic Components		查询价格和库存				Active		BICMOS	1	30 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G56		Not Qualified	75 °C	-20 °C			56	PLASTIC/EPOXY	QFP	QFP56,.47SQ	SQUARE	FLATPACK	YES		GULL WING	650 µm	QUAD	10 mm	10 mm	2.35 mm		2274	QFP	QFP, QFP56,.47SQ	56	unknown	8542.39.00.01
AN29000A Panasonic Electronic Components		查询价格和库存				Active		BICMOS	1	30 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G56		Not Qualified	75 °C	-20 °C			56	PLASTIC/EPOXY	QFP	QFP56,.47SQ	SQUARE	FLATPACK	YES		GULL WING	650 µm	QUAD	10 mm	10 mm	2.35 mm		2274	QFP	QFP, QFP56,.47SQ	56	unknown	8542.39.00.01
TA31101AP Toshiba America Electronic Components		查询价格和库存		No	No	Active	3 V	BIPOLAR	1	5 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDIP-T16	e0	Not Qualified	75 °C	-25 °C			16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	19.25 mm	4.45 mm	TA31101AP	2484	DIP	DIP, DIP16,.3	16	unknown	8542.39.00.01	2
TA31101P Toshiba America Electronic Components		查询价格和库存		No	No	Active	3 V	BIPOLAR	1	5 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDIP-T16	e0	Not Qualified	75 °C	-25 °C			16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	19.25 mm	4.45 mm	TA31101P	2484	DIP	DIP, DIP16,.3	16	unknown	8542.39.00.01	2
BH4127FV ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	3 V		1		INDUSTRIAL	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified	85 °C	-40 °C	260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	650 µm	DUAL	4.4 mm	5 mm	1.25 mm		2363	SOIC	SSOP-16	16	compliant	8542.39.00.01
TG2403CT Toshiba America Electronic Components		查询价格和库存		Yes	Yes	Active	3 V	GAAS	1	180 mA	INDUSTRIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	R-XBCC-B20		Not Qualified	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	20	UNSPECIFIED	HVBCC		RECTANGULAR	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES		BUTT	500 µm	BOTTOM	2.9 mm	3.9 mm	530 µm	TG2403CT	2484		HVBCC,		unknown	8542.39.00.01
HPMX-5002-STR Hewlett Packard Co		查询价格和库存				Transferred	3 V		1	27 mA		CORDLESS TELEPHONE BASEBAND CIRCUIT	S-PQFP-G48		Not Qualified					48	PLASTIC/EPOXY			SQUARE	FLATPACK	YES		GULL WING		QUAD					4317242	QFP	,	48	unknown	8542.39.00.01
CXG1034TN-T2 Sony Semiconductor		查询价格和库存		Yes	Yes	Active	3 V		1	7 mA	OTHER	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G10	e6/e4	Not Qualified	85 °C	-35 °C	260	10	10	PLASTIC/EPOXY	TSSOP		RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	TIN BISMUTH/PALLADIUM	GULL WING	500 µm	DUAL	2.2 mm	2.8 mm	1.2 mm		2415	TSSOP	TSSOP,	10	unknown	8542.39.00.01
HPMX-5002-TR1 Hewlett Packard Co		查询价格和库存				Transferred	3 V		1			CORDLESS TELEPHONE BASEBAND CIRCUIT	S-PQFP-G48		Not Qualified					48	PLASTIC/EPOXY			SQUARE	FLATPACK	YES		GULL WING		QUAD					4317242	QFP	PLASTIC, TQFP-48	48	unknown	8542.39.00.01
HPMX-5002-TY1 Hewlett Packard Co		查询价格和库存				Transferred	3 V		1	27 mA		CORDLESS TELEPHONE BASEBAND CIRCUIT	S-PQFP-G48		Not Qualified					48	PLASTIC/EPOXY			SQUARE	FLATPACK	YES		GULL WING		QUAD					4317242	QFP	,	48	unknown	8542.39.00.01
NJM2292V-(TE2) New Japan Radio Co Ltd		查询价格和库存				Transferred	5 V		1	2.7 mA	OTHER	CORDLESS TELEPHONE BASEBAND CIRCUIT	R-PDSO-G20		Not Qualified	85 °C	-30 °C			20	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES		GULL WING	650 µm	DUAL	4.4 mm	6.5 mm	1.45 mm		2236	SSOP	LSSOP,	20	compliant	8542.39.00.01
ML2724DH-T RF Micro Devices Inc		查询价格和库存				Transferred	3.3 V		1		COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G32		Not Qualified	60 °C	-10 °C			32	PLASTIC/EPOXY	TQFP		SQUARE	FLATPACK, THIN PROFILE	YES		GULL WING	800 µm	QUAD	7 mm	7 mm	1.2 mm		2355	QFP	TQFP,	32	unknown	8542.39.00.01
CXG1053FN Sony Semiconductor		查询价格和库存		Yes	Yes	Active	3 V		1	10 mA	OTHER	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-N26	e6/e4	Not Qualified	85 °C	-35 °C	260	10	26	PLASTIC/EPOXY	HVSON		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	YES		NO LEAD	400 µm	DUAL	4.4 mm	5.6 mm	1 mm		2415	SOF	HVSON,	26	unknown	8542.39.00.01
ML2724DH RF Micro Devices Inc		查询价格和库存				Transferred	3.3 V		1		COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G32		Not Qualified	60 °C	-10 °C			32	PLASTIC/EPOXY	TQFP		SQUARE	FLATPACK, THIN PROFILE	YES		GULL WING	800 µm	QUAD	7 mm	7 mm	1.2 mm		2355	QFP	TQFP,	32	unknown	8542.39.00.01		5A991.G
ML2722DH RF Micro Devices Inc		查询价格和库存				Transferred	3.3 V	BICMOS	1	63.5 mA	COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G32	e3	Not Qualified	60 °C	-10 °C			32	PLASTIC/EPOXY	TQFP	TQFP32,.35SQ,32	SQUARE	FLATPACK, THIN PROFILE	YES	MATTE TIN	GULL WING	800 µm	QUAD	7 mm	7 mm	1.2 mm		2355	QFP	TQFP, TQFP32,.35SQ,32	32	unknown	8542.39.00.01
ML2722DH-T RF Micro Devices Inc		查询价格和库存				Transferred	3.3 V	BICMOS	1	63.5 mA	COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G32		Not Qualified	60 °C	-10 °C			32	PLASTIC/EPOXY	TQFP		SQUARE	FLATPACK, THIN PROFILE	YES		GULL WING	800 µm	QUAD	7 mm	7 mm	1.2 mm		2355	QFP	TQFP,	32	unknown	8517.70.00.00		5A991.G
TB31261AF Toshiba America Electronic Components		查询价格和库存		No	No	Active	3.6 V	BICMOS	1	33.3 µA	COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G52		Not Qualified	70 °C	-20 °C	NOT SPECIFIED	NOT SPECIFIED	52	PLASTIC/EPOXY	QFP	QFP52,.52SQ	SQUARE	FLATPACK	YES		GULL WING	650 µm	QUAD	10 mm	10 mm	2.45 mm	TB31261AF	2484	QFP	QFP, QFP52,.52SQ	52	unknown	8542.39.00.01	2
TB31262F Toshiba America Electronic Components		查询价格和库存		No	No	Active	3.6 V	BICMOS	1	84 mA	COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G52		Not Qualified	70 °C	-20 °C	NOT SPECIFIED	NOT SPECIFIED	52	PLASTIC/EPOXY	QFP		SQUARE	FLATPACK	YES		GULL WING	650 µm	QUAD	10 mm	10 mm	2.45 mm	TB31262F	2484	QFP	QFP,	52	unknown	8542.39.00.01	2
TA31092F Toshiba America Electronic Components		查询价格和库存		No	No	Active	2 V	BIPOLAR	1	1.4 mA	COMMERCIAL	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G10	e0	Not Qualified	70 °C	-20 °C			10	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN LEAD	GULL WING	1 mm	DUAL	4.4 mm	5.2 mm	1.9 mm	TA31092F	2484	SSOP	SSOP,	10	unknown	8542.39.00.01

型号						Most Relevant		Technical				Compliance			Operating Conditions				Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	mfrid	零件包装代码	包装说明	针数	是否符合REACH标准	HTS代码	YTEOL	ECCN代码
TA8103F Toshiba America Electronic Components		查询价格和库存				Active	2.5 V		1		COMMERCIAL EXTENDED	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G24		Not Qualified	80 °C	-30 °C			24	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES		GULL WING	1 mm	DUAL	6 mm	13 mm	2.2 mm	TA8103F	2484	SSOP	SSOP,	24	unknown	8542.39.00.01
AN8953NFA Panasonic Electronic Components		查询价格和库存				Active		BICMOS	1	30 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G56		Not Qualified	75 °C	-20 °C			56	PLASTIC/EPOXY	QFP	QFP56,.47SQ	SQUARE	FLATPACK	YES		GULL WING	650 µm	QUAD	10 mm	10 mm	2.35 mm		2274	QFP	QFP, QFP56,.47SQ	56	unknown	8542.39.00.01
AN29000A Panasonic Electronic Components		查询价格和库存				Active		BICMOS	1	30 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G56		Not Qualified	75 °C	-20 °C			56	PLASTIC/EPOXY	QFP	QFP56,.47SQ	SQUARE	FLATPACK	YES		GULL WING	650 µm	QUAD	10 mm	10 mm	2.35 mm		2274	QFP	QFP, QFP56,.47SQ	56	unknown	8542.39.00.01
TA31101AP Toshiba America Electronic Components		查询价格和库存		No	No	Active	3 V	BIPOLAR	1	5 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDIP-T16	e0	Not Qualified	75 °C	-25 °C			16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	19.25 mm	4.45 mm	TA31101AP	2484	DIP	DIP, DIP16,.3	16	unknown	8542.39.00.01	2
TA31101P Toshiba America Electronic Components		查询价格和库存		No	No	Active	3 V	BIPOLAR	1	5 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDIP-T16	e0	Not Qualified	75 °C	-25 °C			16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	19.25 mm	4.45 mm	TA31101P	2484	DIP	DIP, DIP16,.3	16	unknown	8542.39.00.01	2
BH4127FV ROHM Semiconductor		查询价格和库存		Yes	Yes	Active	3 V		1		INDUSTRIAL	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified	85 °C	-40 °C	260	10	16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	650 µm	DUAL	4.4 mm	5 mm	1.25 mm		2363	SOIC	SSOP-16	16	compliant	8542.39.00.01
TG2403CT Toshiba America Electronic Components		查询价格和库存		Yes	Yes	Active	3 V	GAAS	1	180 mA	INDUSTRIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	R-XBCC-B20		Not Qualified	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	20	UNSPECIFIED	HVBCC		RECTANGULAR	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES		BUTT	500 µm	BOTTOM	2.9 mm	3.9 mm	530 µm	TG2403CT	2484		HVBCC,		unknown	8542.39.00.01
HPMX-5002-STR Hewlett Packard Co		查询价格和库存				Transferred	3 V		1	27 mA		CORDLESS TELEPHONE BASEBAND CIRCUIT	S-PQFP-G48		Not Qualified					48	PLASTIC/EPOXY			SQUARE	FLATPACK	YES		GULL WING		QUAD					4317242	QFP	,	48	unknown	8542.39.00.01
CXG1034TN-T2 Sony Semiconductor		查询价格和库存		Yes	Yes	Active	3 V		1	7 mA	OTHER	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G10	e6/e4	Not Qualified	85 °C	-35 °C	260	10	10	PLASTIC/EPOXY	TSSOP		RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	TIN BISMUTH/PALLADIUM	GULL WING	500 µm	DUAL	2.2 mm	2.8 mm	1.2 mm		2415	TSSOP	TSSOP,	10	unknown	8542.39.00.01
HPMX-5002-TR1 Hewlett Packard Co		查询价格和库存				Transferred	3 V		1			CORDLESS TELEPHONE BASEBAND CIRCUIT	S-PQFP-G48		Not Qualified					48	PLASTIC/EPOXY			SQUARE	FLATPACK	YES		GULL WING		QUAD					4317242	QFP	PLASTIC, TQFP-48	48	unknown	8542.39.00.01
HPMX-5002-TY1 Hewlett Packard Co		查询价格和库存				Transferred	3 V		1	27 mA		CORDLESS TELEPHONE BASEBAND CIRCUIT	S-PQFP-G48		Not Qualified					48	PLASTIC/EPOXY			SQUARE	FLATPACK	YES		GULL WING		QUAD					4317242	QFP	,	48	unknown	8542.39.00.01
NJM2292V-(TE2) New Japan Radio Co Ltd		查询价格和库存				Transferred	5 V		1	2.7 mA	OTHER	CORDLESS TELEPHONE BASEBAND CIRCUIT	R-PDSO-G20		Not Qualified	85 °C	-30 °C			20	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES		GULL WING	650 µm	DUAL	4.4 mm	6.5 mm	1.45 mm		2236	SSOP	LSSOP,	20	compliant	8542.39.00.01
ML2724DH-T RF Micro Devices Inc		查询价格和库存				Transferred	3.3 V		1		COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G32		Not Qualified	60 °C	-10 °C			32	PLASTIC/EPOXY	TQFP		SQUARE	FLATPACK, THIN PROFILE	YES		GULL WING	800 µm	QUAD	7 mm	7 mm	1.2 mm		2355	QFP	TQFP,	32	unknown	8542.39.00.01
CXG1053FN Sony Semiconductor		查询价格和库存		Yes	Yes	Active	3 V		1	10 mA	OTHER	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-N26	e6/e4	Not Qualified	85 °C	-35 °C	260	10	26	PLASTIC/EPOXY	HVSON		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	YES		NO LEAD	400 µm	DUAL	4.4 mm	5.6 mm	1 mm		2415	SOF	HVSON,	26	unknown	8542.39.00.01
ML2724DH RF Micro Devices Inc		查询价格和库存				Transferred	3.3 V		1		COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G32		Not Qualified	60 °C	-10 °C			32	PLASTIC/EPOXY	TQFP		SQUARE	FLATPACK, THIN PROFILE	YES		GULL WING	800 µm	QUAD	7 mm	7 mm	1.2 mm		2355	QFP	TQFP,	32	unknown	8542.39.00.01		5A991.G
ML2722DH RF Micro Devices Inc		查询价格和库存				Transferred	3.3 V	BICMOS	1	63.5 mA	COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G32	e3	Not Qualified	60 °C	-10 °C			32	PLASTIC/EPOXY	TQFP	TQFP32,.35SQ,32	SQUARE	FLATPACK, THIN PROFILE	YES	MATTE TIN	GULL WING	800 µm	QUAD	7 mm	7 mm	1.2 mm		2355	QFP	TQFP, TQFP32,.35SQ,32	32	unknown	8542.39.00.01
ML2722DH-T RF Micro Devices Inc		查询价格和库存				Transferred	3.3 V	BICMOS	1	63.5 mA	COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G32		Not Qualified	60 °C	-10 °C			32	PLASTIC/EPOXY	TQFP		SQUARE	FLATPACK, THIN PROFILE	YES		GULL WING	800 µm	QUAD	7 mm	7 mm	1.2 mm		2355	QFP	TQFP,	32	unknown	8517.70.00.00		5A991.G
TB31261AF Toshiba America Electronic Components		查询价格和库存		No	No	Active	3.6 V	BICMOS	1	33.3 µA	COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G52		Not Qualified	70 °C	-20 °C	NOT SPECIFIED	NOT SPECIFIED	52	PLASTIC/EPOXY	QFP	QFP52,.52SQ	SQUARE	FLATPACK	YES		GULL WING	650 µm	QUAD	10 mm	10 mm	2.45 mm	TB31261AF	2484	QFP	QFP, QFP52,.52SQ	52	unknown	8542.39.00.01	2
TB31262F Toshiba America Electronic Components		查询价格和库存		No	No	Active	3.6 V	BICMOS	1	84 mA	COMMERCIAL	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	S-PQFP-G52		Not Qualified	70 °C	-20 °C	NOT SPECIFIED	NOT SPECIFIED	52	PLASTIC/EPOXY	QFP		SQUARE	FLATPACK	YES		GULL WING	650 µm	QUAD	10 mm	10 mm	2.45 mm	TB31262F	2484	QFP	QFP,	52	unknown	8542.39.00.01	2
TA31092F Toshiba America Electronic Components		查询价格和库存		No	No	Active	2 V	BIPOLAR	1	1.4 mA	COMMERCIAL	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G10	e0	Not Qualified	70 °C	-20 °C			10	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN LEAD	GULL WING	1 mm	DUAL	4.4 mm	5.2 mm	1.9 mm	TA31092F	2484	SSOP	SSOP,	10	unknown	8542.39.00.01

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