型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 其他特性 | 破损率 | 负电源额定电压 | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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Source Content uid
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mfrid
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零件包装代码
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包装说明
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针数
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是否符合REACH标准
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HTS代码
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YTEOL
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AS2536W
ams
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查询价格和库存 |
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Active | CMOS | SELECTABLE MAKE/BREAK RATIO 1:1.5 | 1:2 | 1 | OTHER | TELEPHONE MULTIFUNCTION CIRCUIT | R-XUUC-N32 | Not Qualified | 70 °C | -25 °C | 32 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | AS2536W | 1731037 | DIE | DIE, | 32 | unknown | 8542.39.00.01 | |||||||||||||||||
TA31075AF-TP1
Toshiba America Electronic Components
|
查询价格和库存 |
|
Active | 1 | OTHER | TELEPHONE RINGER CIRCUIT | R-PDSO-G10 | Not Qualified | 70 °C | -30 °C | 10 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 1 mm | DUAL | 4.4 mm | 5.2 mm | 1.9 mm | TA31075AF-TP1 | 2484 | SSOP | SSOP, | 10 | unknown | 8542.39.00.01 | ||||||||||||||||
TCA3385-FP
Rochester Electronics LLC
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查询价格和库存 |
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Active | 1 | COMMERCIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | COMMERCIAL | 70 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | NOT SPECIFIED | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 2178096 | SOIC | PLASTIC, SO-16 | 16 | unknown | ||||||||||||||||||
TEA1062T/C4
NXP Semiconductors
|
查询价格和库存 |
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Yes | Yes | Active | 2.7 V | 1 | COMMERCIAL EXTENDED | TELEPHONE SPEECH CIRCUIT | R-PDSO-G16 | e4 | Not Qualified | 75 °C | -25 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | TEA1062T/C4 | 2245 | SOIC | PLASTIC, SOT-109, SO-16 | 16 | compliant | 8542.39.00.01 | |||||||||||
AS2534BW
ams
|
查询价格和库存 |
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Active | CMOS | SELECTABLE MAKE/BREAK RATIO 1:1.5 | 1:2 | 1 | OTHER | TELEPHONE MULTIFUNCTION CIRCUIT | R-XUUC-N32 | Not Qualified | 70 °C | -25 °C | 32 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | AS2534BW | 1731037 | DIE | DIE, | 32 | unknown | 8542.39.00.01 | |||||||||||||||||
TEA1062A/C4/M1
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Yes | Active | 2.7 V | 1 | COMMERCIAL EXTENDED | TELEPHONE SPEECH CIRCUIT | R-PDIP-T16 | e4 | Not Qualified | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | Nickel/Palladium/Gold (Ni/Pd/Au) | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 38.1 mm | 4.32 mm | TEA1062A/C4/M1 | 2245 | DIP | DIP, | 16 | compliant | 8542.39.00.01 | |||||||||
AS2534BF
ams
|
查询价格和库存 |
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Active | CMOS | SELECTABLE MAKE/BREAK RATIO 1:1.5 | 1:2 | 1 | OTHER | TELEPHONE MULTIFUNCTION CIRCUIT | R-XUUC-N32 | Not Qualified | 70 °C | -25 °C | 32 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | AS2534BF | 1731037 | DIE | DIE, | 32 | unknown | 8542.39.00.01 | |||||||||||||||||
AS2533W
ams
|
查询价格和库存 |
|
Active | CMOS | SELECTABLE MAKE/BREAK RATIO 1:1.5 | 1:2 | 1 | OTHER | TELEPHONE MULTIFUNCTION CIRCUIT | R-XUUC-N32 | Not Qualified | 70 °C | -25 °C | 32 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | AS2533W | 1731037 | DIE | DIE, | 32 | unknown | 8542.39.00.01 | |||||||||||||||||
TEA1062AT/C4
NXP Semiconductors
|
查询价格和库存 |
|
Yes | Yes | Active | 2.7 V | 1 | COMMERCIAL EXTENDED | TELEPHONE SPEECH CIRCUIT | R-PDSO-G16 | e4 | Not Qualified | 1 | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | TEA1062AT/C4 | 2245 | SOIC | SOP, | 16 | compliant | 8542.39.00.01 | ||||||||
TA31066F(ER)
Toshiba America Electronic Components
|
查询价格和库存 |
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Active | 1 | COMMERCIAL | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | Not Qualified | 60 °C | -20 °C | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 1 mm | DUAL | 6 mm | 13 mm | 1.9 mm | TA31066F(ER) | 2484 | SSOP | SSOP, | 24 | unknown | 8542.39.00.01 | 2 | |||||||||||||||
8265NGW
Intel Corporation
|
查询价格和库存 |
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Active | 1 | COMMERCIAL EXTENDED | TELECOM CIRCUIT | R-XXMA-X | 80 °C | UNSPECIFIED | XMA | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | 2071 | PACKAGE | compliant | ||||||||||||||||||||||||||||
LUCL7590BAE
LSI Corporation
|
查询价格和库存 |
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No | No | Transferred | 5 V | CMOS | -170 V | 1 | 3 µA | INDUSTRIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 2145 | SOIC | SOP, SOP16,.4 | 16 | unknown | 8542.39.00.01 | |||||||||||
ATTL7590AAE
LSI Corporation
|
查询价格和库存 |
|
No | No | Transferred | 5 V | CMOS | -170 V | 1 | 3 mA | INDUSTRIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 2145 | SOIC | SOP, SOP16,.4 | 16 | unknown | 8542.39.00.01 | |||||||||||
TA31066F
Toshiba America Electronic Components
|
查询价格和库存 |
|
Active | 1 | COMMERCIAL | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | Not Qualified | 60 °C | -20 °C | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 1 mm | DUAL | 6 mm | 13 mm | 1.9 mm | TA31066F | 2484 | SSOP | SSOP, | 24 | unknown | 8542.39.00.01 | 2 | |||||||||||||||
8265D2W
Intel Corporation
|
查询价格和库存 |
|
Active | 1 | COMMERCIAL EXTENDED | TELECOM CIRCUIT | R-XXMA-X | 80 °C | UNSPECIFIED | XMA | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | 2071 | PACKAGE | compliant | ||||||||||||||||||||||||||||
TA31066F(EL)
Toshiba America Electronic Components
|
查询价格和库存 |
|
Active | 1 | COMMERCIAL | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | Not Qualified | 60 °C | -20 °C | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 1 mm | DUAL | 6 mm | 13 mm | 1.9 mm | TA31066F(EL) | 2484 | SSOP | SSOP, | 24 | unknown | 8542.39.00.01 | 2 | |||||||||||||||
TA31066F-TP1
Toshiba America Electronic Components
|
查询价格和库存 |
|
Active | 1 | COMMERCIAL | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | Not Qualified | 60 °C | -20 °C | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 1 mm | DUAL | 6 mm | 13 mm | 1.9 mm | TA31066F-TP1 | 2484 | SSOP | SSOP, | 24 | unknown | 8542.39.00.01 | 2 | |||||||||||||||
NTE1691
NTE Electronics Inc
|
查询价格和库存 |
|
Active | CMOS | 1 | OTHER | TELEPHONE DIALER CIRCUIT | R-PDIP-T18 | Not Qualified | 60 °C | -30 °C | 18 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 2243 | DIP | , | 18 | unknown | 8542.39.00.01 | |||||||||||||||||||||
BA8206
ROHM Semiconductor
|
查询价格和库存 |
|
Yes | Yes | Active | 24 V | BIPOLAR | 1 | 1.7 µA | COMMERCIAL EXTENDED | TELEPHONE RINGER CIRCUIT | R-PDIP-T8 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | TIN/TIN COPPER | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.3 mm | 3.7 mm | 2363 | DIP | DIP-8 | 8 | compliant | 8542.39.00.01 | |||||||
NTE1649
NTE Electronics Inc
|
查询价格和库存 |
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Active | BIPOLAR | 1 | OTHER | TELEPHONE RINGER CIRCUIT | R-PDIP-T8 | Not Qualified | 65 °C | -45 °C | 8 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 2243 | DIP | , | 8 | unknown | 8542.39.00.01 |