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型号
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制造商 (50)
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型号
型号 Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
数据手册 单价/库存
风险等级 是否无铅
是否Rohs认证
生命周期
标称供电电压 技术 其他特性 破损率 负电源额定电压 功能数量 最大压摆率
温度等级
电信集成电路类型
JESD-30 代码 JESD-609代码 认证状态
湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度)
处于峰值回流温度下的最长时间
端子数量 封装主体材料 封装代码 封装等效代码 封装形状
封装形式
表面贴装
端子面层
端子形式
端子节距
端子位置
宽度
长度 座面最大高度
Source Content uid
mfrid
零件包装代码
包装说明
针数
是否符合REACH标准
HTS代码
YTEOL
AS2536W
ams
查询价格和库存
Active CMOS SELECTABLE MAKE/BREAK RATIO 1:1.5 1:2 1 OTHER TELEPHONE MULTIFUNCTION CIRCUIT R-XUUC-N32 Not Qualified 70 °C -25 °C 32 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER AS2536W 1731037 DIE DIE, 32 unknown 8542.39.00.01
TA31075AF-TP1
Toshiba America Electronic Components
查询价格和库存
Active 1 OTHER TELEPHONE RINGER CIRCUIT R-PDSO-G10 Not Qualified 70 °C -30 °C 10 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 4.4 mm 5.2 mm 1.9 mm TA31075AF-TP1 2484 SSOP SSOP, 10 unknown 8542.39.00.01
TCA3385-FP
Rochester Electronics LLC
查询价格和库存
Active 1 COMMERCIAL TELEPHONE RINGER CIRCUIT R-PDSO-G16 COMMERCIAL 70 °C 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES NOT SPECIFIED GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm 2178096 SOIC PLASTIC, SO-16 16 unknown
TEA1062T/C4
NXP Semiconductors
查询价格和库存
Yes Yes Active 2.7 V 1 COMMERCIAL EXTENDED TELEPHONE SPEECH CIRCUIT R-PDSO-G16 e4 Not Qualified 75 °C -25 °C 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES NICKEL PALLADIUM GOLD GULL WING 1.27 mm DUAL 3.9 mm 9.9 mm 1.75 mm TEA1062T/C4 2245 SOIC PLASTIC, SOT-109, SO-16 16 compliant 8542.39.00.01
AS2534BW
ams
查询价格和库存
Active CMOS SELECTABLE MAKE/BREAK RATIO 1:1.5 1:2 1 OTHER TELEPHONE MULTIFUNCTION CIRCUIT R-XUUC-N32 Not Qualified 70 °C -25 °C 32 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER AS2534BW 1731037 DIE DIE, 32 unknown 8542.39.00.01
TEA1062A/C4/M1
NXP Semiconductors
查询价格和库存
Yes Yes Active 2.7 V 1 COMMERCIAL EXTENDED TELEPHONE SPEECH CIRCUIT R-PDIP-T16 e4 Not Qualified 75 °C -25 °C NOT SPECIFIED NOT SPECIFIED 16 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO Nickel/Palladium/Gold (Ni/Pd/Au) THROUGH-HOLE 2.54 mm DUAL 7.62 mm 38.1 mm 4.32 mm TEA1062A/C4/M1 2245 DIP DIP, 16 compliant 8542.39.00.01
AS2534BF
ams
查询价格和库存
Active CMOS SELECTABLE MAKE/BREAK RATIO 1:1.5 1:2 1 OTHER TELEPHONE MULTIFUNCTION CIRCUIT R-XUUC-N32 Not Qualified 70 °C -25 °C 32 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER AS2534BF 1731037 DIE DIE, 32 unknown 8542.39.00.01
AS2533W
ams
查询价格和库存
Active CMOS SELECTABLE MAKE/BREAK RATIO 1:1.5 1:2 1 OTHER TELEPHONE MULTIFUNCTION CIRCUIT R-XUUC-N32 Not Qualified 70 °C -25 °C 32 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER AS2533W 1731037 DIE DIE, 32 unknown 8542.39.00.01
TEA1062AT/C4
NXP Semiconductors
查询价格和库存
Yes Yes Active 2.7 V 1 COMMERCIAL EXTENDED TELEPHONE SPEECH CIRCUIT R-PDSO-G16 e4 Not Qualified 1 75 °C -25 °C NOT SPECIFIED NOT SPECIFIED 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 3.9 mm 9.9 mm 1.75 mm TEA1062AT/C4 2245 SOIC SOP, 16 compliant 8542.39.00.01
TA31066F(ER)
Toshiba America Electronic Components
查询价格和库存
Active 1 COMMERCIAL TELEPHONE SPEECH CIRCUIT R-PDSO-G24 Not Qualified 60 °C -20 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 6 mm 13 mm 1.9 mm TA31066F(ER) 2484 SSOP SSOP, 24 unknown 8542.39.00.01 2
8265NGW
Intel Corporation
查询价格和库存
Active 1 COMMERCIAL EXTENDED TELECOM CIRCUIT R-XXMA-X 80 °C UNSPECIFIED XMA MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED 2071 PACKAGE compliant
LUCL7590BAE
LSI Corporation
查询价格和库存
No No Transferred 5 V CMOS -170 V 1 3 µA INDUSTRIAL TELEPHONE RINGER CIRCUIT R-PDSO-G16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 2145 SOIC SOP, SOP16,.4 16 unknown 8542.39.00.01
ATTL7590AAE
LSI Corporation
查询价格和库存
No No Transferred 5 V CMOS -170 V 1 3 mA INDUSTRIAL TELEPHONE RINGER CIRCUIT R-PDSO-G16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 2145 SOIC SOP, SOP16,.4 16 unknown 8542.39.00.01
TA31066F
Toshiba America Electronic Components
查询价格和库存
Active 1 COMMERCIAL TELEPHONE SPEECH CIRCUIT R-PDSO-G24 Not Qualified 60 °C -20 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 6 mm 13 mm 1.9 mm TA31066F 2484 SSOP SSOP, 24 unknown 8542.39.00.01 2
8265D2W
Intel Corporation
查询价格和库存
Active 1 COMMERCIAL EXTENDED TELECOM CIRCUIT R-XXMA-X 80 °C UNSPECIFIED XMA MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED 2071 PACKAGE compliant
TA31066F(EL)
Toshiba America Electronic Components
查询价格和库存
Active 1 COMMERCIAL TELEPHONE SPEECH CIRCUIT R-PDSO-G24 Not Qualified 60 °C -20 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 6 mm 13 mm 1.9 mm TA31066F(EL) 2484 SSOP SSOP, 24 unknown 8542.39.00.01 2
TA31066F-TP1
Toshiba America Electronic Components
查询价格和库存
Active 1 COMMERCIAL TELEPHONE SPEECH CIRCUIT R-PDSO-G24 Not Qualified 60 °C -20 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 6 mm 13 mm 1.9 mm TA31066F-TP1 2484 SSOP SSOP, 24 unknown 8542.39.00.01 2
NTE1691
NTE Electronics Inc
查询价格和库存
Active CMOS 1 OTHER TELEPHONE DIALER CIRCUIT R-PDIP-T18 Not Qualified 60 °C -30 °C 18 PLASTIC/EPOXY RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL 2243 DIP , 18 unknown 8542.39.00.01
BA8206
ROHM Semiconductor
查询价格和库存
Yes Yes Active 24 V BIPOLAR 1 1.7 µA COMMERCIAL EXTENDED TELEPHONE RINGER CIRCUIT R-PDIP-T8 e3/e2 Not Qualified 75 °C -25 °C 260 10 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO TIN/TIN COPPER THROUGH-HOLE 2.54 mm DUAL 7.62 mm 9.3 mm 3.7 mm 2363 DIP DIP-8 8 compliant 8542.39.00.01
NTE1649
NTE Electronics Inc
查询价格和库存
Active BIPOLAR 1 OTHER TELEPHONE RINGER CIRCUIT R-PDIP-T8 Not Qualified 65 °C -45 °C 8 PLASTIC/EPOXY RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL 2243 DIP , 8 unknown 8542.39.00.01
型号 Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
数据手册 单价/库存
风险等级 是否无铅
是否Rohs认证
生命周期
标称供电电压 技术 其他特性 破损率 负电源额定电压 功能数量 最大压摆率
温度等级
电信集成电路类型
JESD-30 代码 JESD-609代码 认证状态
湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度)
处于峰值回流温度下的最长时间
端子数量 封装主体材料 封装代码 封装等效代码 封装形状
封装形式
表面贴装
端子面层
端子形式
端子节距
端子位置
宽度
长度 座面最大高度
Source Content uid
mfrid
零件包装代码
包装说明
针数
是否符合REACH标准
HTS代码
YTEOL
AS2536W
ams
查询价格和库存
Active CMOS SELECTABLE MAKE/BREAK RATIO 1:1.5 1:2 1 OTHER TELEPHONE MULTIFUNCTION CIRCUIT R-XUUC-N32 Not Qualified 70 °C -25 °C 32 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER AS2536W 1731037 DIE DIE, 32 unknown 8542.39.00.01
TA31075AF-TP1
Toshiba America Electronic Components
查询价格和库存
Active 1 OTHER TELEPHONE RINGER CIRCUIT R-PDSO-G10 Not Qualified 70 °C -30 °C 10 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 4.4 mm 5.2 mm 1.9 mm TA31075AF-TP1 2484 SSOP SSOP, 10 unknown 8542.39.00.01
TCA3385-FP
Rochester Electronics LLC
查询价格和库存
Active 1 COMMERCIAL TELEPHONE RINGER CIRCUIT R-PDSO-G16 COMMERCIAL 70 °C 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES NOT SPECIFIED GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm 2178096 SOIC PLASTIC, SO-16 16 unknown
TEA1062T/C4
NXP Semiconductors
查询价格和库存
Yes Yes Active 2.7 V 1 COMMERCIAL EXTENDED TELEPHONE SPEECH CIRCUIT R-PDSO-G16 e4 Not Qualified 75 °C -25 °C 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES NICKEL PALLADIUM GOLD GULL WING 1.27 mm DUAL 3.9 mm 9.9 mm 1.75 mm TEA1062T/C4 2245 SOIC PLASTIC, SOT-109, SO-16 16 compliant 8542.39.00.01
AS2534BW
ams
查询价格和库存
Active CMOS SELECTABLE MAKE/BREAK RATIO 1:1.5 1:2 1 OTHER TELEPHONE MULTIFUNCTION CIRCUIT R-XUUC-N32 Not Qualified 70 °C -25 °C 32 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER AS2534BW 1731037 DIE DIE, 32 unknown 8542.39.00.01
TEA1062A/C4/M1
NXP Semiconductors
查询价格和库存
Yes Yes Active 2.7 V 1 COMMERCIAL EXTENDED TELEPHONE SPEECH CIRCUIT R-PDIP-T16 e4 Not Qualified 75 °C -25 °C NOT SPECIFIED NOT SPECIFIED 16 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO Nickel/Palladium/Gold (Ni/Pd/Au) THROUGH-HOLE 2.54 mm DUAL 7.62 mm 38.1 mm 4.32 mm TEA1062A/C4/M1 2245 DIP DIP, 16 compliant 8542.39.00.01
AS2534BF
ams
查询价格和库存
Active CMOS SELECTABLE MAKE/BREAK RATIO 1:1.5 1:2 1 OTHER TELEPHONE MULTIFUNCTION CIRCUIT R-XUUC-N32 Not Qualified 70 °C -25 °C 32 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER AS2534BF 1731037 DIE DIE, 32 unknown 8542.39.00.01
AS2533W
ams
查询价格和库存
Active CMOS SELECTABLE MAKE/BREAK RATIO 1:1.5 1:2 1 OTHER TELEPHONE MULTIFUNCTION CIRCUIT R-XUUC-N32 Not Qualified 70 °C -25 °C 32 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER AS2533W 1731037 DIE DIE, 32 unknown 8542.39.00.01
TEA1062AT/C4
NXP Semiconductors
查询价格和库存
Yes Yes Active 2.7 V 1 COMMERCIAL EXTENDED TELEPHONE SPEECH CIRCUIT R-PDSO-G16 e4 Not Qualified 1 75 °C -25 °C NOT SPECIFIED NOT SPECIFIED 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 3.9 mm 9.9 mm 1.75 mm TEA1062AT/C4 2245 SOIC SOP, 16 compliant 8542.39.00.01
TA31066F(ER)
Toshiba America Electronic Components
查询价格和库存
Active 1 COMMERCIAL TELEPHONE SPEECH CIRCUIT R-PDSO-G24 Not Qualified 60 °C -20 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 6 mm 13 mm 1.9 mm TA31066F(ER) 2484 SSOP SSOP, 24 unknown 8542.39.00.01 2
8265NGW
Intel Corporation
查询价格和库存
Active 1 COMMERCIAL EXTENDED TELECOM CIRCUIT R-XXMA-X 80 °C UNSPECIFIED XMA MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED 2071 PACKAGE compliant
LUCL7590BAE
LSI Corporation
查询价格和库存
No No Transferred 5 V CMOS -170 V 1 3 µA INDUSTRIAL TELEPHONE RINGER CIRCUIT R-PDSO-G16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 2145 SOIC SOP, SOP16,.4 16 unknown 8542.39.00.01
ATTL7590AAE
LSI Corporation
查询价格和库存
No No Transferred 5 V CMOS -170 V 1 3 mA INDUSTRIAL TELEPHONE RINGER CIRCUIT R-PDSO-G16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 2145 SOIC SOP, SOP16,.4 16 unknown 8542.39.00.01
TA31066F
Toshiba America Electronic Components
查询价格和库存
Active 1 COMMERCIAL TELEPHONE SPEECH CIRCUIT R-PDSO-G24 Not Qualified 60 °C -20 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 6 mm 13 mm 1.9 mm TA31066F 2484 SSOP SSOP, 24 unknown 8542.39.00.01 2
8265D2W
Intel Corporation
查询价格和库存
Active 1 COMMERCIAL EXTENDED TELECOM CIRCUIT R-XXMA-X 80 °C UNSPECIFIED XMA MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED 2071 PACKAGE compliant
TA31066F(EL)
Toshiba America Electronic Components
查询价格和库存
Active 1 COMMERCIAL TELEPHONE SPEECH CIRCUIT R-PDSO-G24 Not Qualified 60 °C -20 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 6 mm 13 mm 1.9 mm TA31066F(EL) 2484 SSOP SSOP, 24 unknown 8542.39.00.01 2
TA31066F-TP1
Toshiba America Electronic Components
查询价格和库存
Active 1 COMMERCIAL TELEPHONE SPEECH CIRCUIT R-PDSO-G24 Not Qualified 60 °C -20 °C 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 6 mm 13 mm 1.9 mm TA31066F-TP1 2484 SSOP SSOP, 24 unknown 8542.39.00.01 2
NTE1691
NTE Electronics Inc
查询价格和库存
Active CMOS 1 OTHER TELEPHONE DIALER CIRCUIT R-PDIP-T18 Not Qualified 60 °C -30 °C 18 PLASTIC/EPOXY RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL 2243 DIP , 18 unknown 8542.39.00.01
BA8206
ROHM Semiconductor
查询价格和库存
Yes Yes Active 24 V BIPOLAR 1 1.7 µA COMMERCIAL EXTENDED TELEPHONE RINGER CIRCUIT R-PDIP-T8 e3/e2 Not Qualified 75 °C -25 °C 260 10 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO TIN/TIN COPPER THROUGH-HOLE 2.54 mm DUAL 7.62 mm 9.3 mm 3.7 mm 2363 DIP DIP-8 8 compliant 8542.39.00.01
NTE1649
NTE Electronics Inc
查询价格和库存
Active BIPOLAR 1 OTHER TELEPHONE RINGER CIRCUIT R-PDIP-T8 Not Qualified 65 °C -45 °C 8 PLASTIC/EPOXY RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL 2243 DIP , 8 unknown 8542.39.00.01
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