型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否Rohs认证
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生命周期 | 内存密度 | 内存宽度 | 组织 |
标称供电电压 (Vsup)
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最长访问时间 | 最大时钟频率 (fCLK) |
刷新周期
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访问模式 | 内存集成电路类型 | 其他特性 | I/O 类型 | 交错的突发长度 | 功能数量 | 端口数量 | 字数代码 | 字数 | 工作模式 | 输出特性 |
自我刷新
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连续突发长度
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最大待机电流
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最小待机电流
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最大压摆率
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最大供电电压 (Vsup)
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最小供电电压 (Vsup)
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技术 |
温度等级
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JESD-30 代码 |
认证状态
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JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) |
筛选级别
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 |
表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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座面最大高度
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长度 |
宽度
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mfrid
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是否符合REACH标准
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YTEOL
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包装说明
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Country Of Origin
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ECCN代码
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HTS代码
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Date Of Intro
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零件包装代码
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针数
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S27KS0642GABHI020
Infineon Technologies AG
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 1.8 V | 200 MHz | HYPERRAM | COMMON | 1 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | YES | 220 µA | 25 µA | 2 V | 1.7 V | CMOS | R-PBGA-B24 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | VBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1 mm | 8 mm | 6 mm | 2065 | compliant | 5.35 | |||||||||||||||||||||
IS43R16160F-5BLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 2.5 V | 700 ps | 200 MHz | FOUR BANK PAGE BURST | DDR1 DRAM | COMMON | 2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | YES | 2,4,8 | 30 mA | 220 µA | 2.7 V | 2.3 V | CMOS | INDUSTRIAL | R-PBGA-B60 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 60 | PLASTIC/EPOXY | TBGA | BGA60,9X12,40/32 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 13 mm | 8 mm | 2070 | compliant | 4.25 | TBGA, BGA60,9X12,40/32 | Mainland China, Taiwan | EAR99 | 8542.32.00.24 | |||||||||||||
MT40A512M16TB-062E:J
Micron Technology Inc
|
查询价格和库存 |
|
Active | 8.5899 Gbit | 16 | 512MX16 | 1.2 V | 1.6 GHz | 8192 | MULTI BANK PAGE BURST | DDR4 DRAM | COMMON | 8 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | YES | 8 | 1.26 V | 1.14 V | CMOS | R-PBGA-B96 | 95 °C | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 13 mm | 7.5 mm | 2190 | compliant | 5.1 | |||||||||||||||||||||||||
IS43DR16320E-25DBL
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 400 ps | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | 85 °C | NOT SPECIFIED | NOT SPECIFIED | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 10.5 mm | 8 mm | 2070 | compliant | 4.75 | TFBGA, | Mainland China, Taiwan | EAR99 | 8542.32.00.28 | |||||||||||||||||||||
AS4C1G8D3LA-10BCN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 8.5899 Gbit | 8 | 1GX8 | 1.35 V | MULTI BANK PAGE BURST | DDR DRAM MODULE | AUTO/SELF REFRESH | 1 | 1 | 1000000000 | 1.0737 G | SYNCHRONOUS | YES | 1.45 V | 1.283 V | CMOS | OTHER | R-PBGA-B78 | 3 | 95 °C | 78 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 10.6 mm | 9 mm | 1689 | compliant | 5.15 | FBGA-78 | Taiwan | EAR99 | 8542.32.00.36 | 2019-03-07 | ||||||||||||||||||||||
IS43DR16320E-25DBLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 400 ps | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | 85 °C | -40 °C | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 10.5 mm | 8 mm | 2070 | compliant | 4.75 | TFBGA, | Mainland China, Taiwan | EAR99 | 8542.32.00.28 | ||||||||||||||||||||||
IS43DR16320E-3DBLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 450 ps | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 10.5 mm | 8 mm | 2070 | compliant | 4.75 | TFBGA, | Mainland China, Taiwan | EAR99 | 8542.32.00.28 | ||||||||||||||||||||
IS43DR16320E-3DBL
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 450 ps | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | 85 °C | NOT SPECIFIED | NOT SPECIFIED | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 10.5 mm | 8 mm | 2070 | compliant | 4.75 | TFBGA, | Mainland China, Taiwan | EAR99 | 8542.32.00.28 | |||||||||||||||||||||
IS42S32800J-7BL
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 32 | 8MX32 | 3.3 V | 5.4 ns | 143 MHz | 4096 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 4 mA | 170 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PBGA-B90 | e1 | 3 | 70 °C | 260 | 10 | 90 | PLASTIC/EPOXY | TFBGA | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 13 mm | 8 mm | 2070 | compliant | 4 | TFBGA, | Mainland China, Taiwan | EAR99 | 8542.32.00.24 | |||||||||
AS4C4M16SA-6BIN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PBGA-B54 | e1 | 3 | 85 °C | -40 °C | 54 | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 8 mm | 1689 | compliant | 4 | TFBGA-54 | Taiwan | EAR99 | 8542.32.00.02 | |||||||||||||||||||
IS43R16320F-6TLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 2.5 V | 700 ps | FOUR BANK PAGE BURST | DDR1 DRAM | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 2.7 V | 2.3 V | CMOS | INDUSTRIAL | R-PDSO-G66 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 66 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 2070 | compliant | 4.25 | TSOP2, | Mainland China, Taiwan | EAR99 | 8542.32.00.28 | ||||||||||||||||||||
AS4C32M16D2A-25BIN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 400 ps | 400 MHz | 8192 | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 8 mA | 180 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | Not Qualified | 3 | 85 °C | -40 °C | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 8 mm | 1689 | compliant | 4.75 | 8 X 12.50 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 | Taiwan | EAR99 | 8542.32.00.28 | |||||||||||
AS4C4M16SA-6BAN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 5.4 ns | 166 MHz | 4096 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO REFRESH/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 30 mA | 75 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PBGA-B54 | e1 | 3 | 105 °C | -40 °C | AEC-Q100 | 54 | PLASTIC/EPOXY | TFBGA | BGA54,9X9,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 8 mm | 1689 | compliant | 4 | FBGA-54 | Taiwan | EAR99 | 8542.32.00.02 | |||||||||
IS42S32400F-7TL
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | End Of Life | 134.2177 Mbit | 32 | 4MX32 | 3.3 V | 5.4 ns | 143 MHz | 4096 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 2 mA | 160 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G86 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 86 | PLASTIC/EPOXY | TSOP2 | TSSOP86,.46,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 2070 | compliant | 0.89 | TSOP2, TSSOP86,.46,20 | Mainland China, Taiwan | EAR99 | 8542.32.00.02 | TSOP2 | 86 | ||||||
IS43R16320F-6TL
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 2.5 V | 700 ps | FOUR BANK PAGE BURST | DDR1 DRAM | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 2.7 V | 2.3 V | CMOS | COMMERCIAL | R-PDSO-G66 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 66 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 2070 | compliant | 4.25 | TSOP2, | Mainland China, Taiwan | EAR99 | 8542.32.00.28 | |||||||||||||||||||||
AS4C128M16D3LC-12BIN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 2.1475 Gbit | 16 | 128MX16 | 1.35 V | 800 MHz | 8192 | MULTI BANK PAGE BURST | DDR3L DRAM | AUTO REFRESH, SELF REFRESH | COMMON | 4,8 | 1 | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 15 mA | 1.283 V | 240 µA | 1.45 V | 1.283 V | CMOS | INDUSTRIAL | R-PBGA-B96 | 95 °C | -40 °C | 96 | PLASTIC/EPOXY | VFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 13 mm | 7.5 mm | 1689 | compliant | 5.1 | FBGA-96 | EAR99 | 8542.32.00.36 | ||||||||||||||
IS42S16160J-7BLI
Integrated Silicon Solution Inc
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 7 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PBGA-B54 | e1 | 85 °C | -40 °C | 260 | 54 | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 8 mm | 2070 | compliant | 4 | TFBGA, | Mainland China, Taiwan | EAR99 | 8542.32.00.24 | |||||||||||||||||||
AS4C128M16D3LC-12BCN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 2.1475 Gbit | 16 | 128MX16 | 1.35 V | 800 MHz | 8192 | MULTI BANK PAGE BURST | DDR3L DRAM | AUTO REFRESH, SELF REFRESH | COMMON | 4,8 | 1 | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 15 mA | 1.283 V | 240 µA | 1.45 V | 1.283 V | CMOS | OTHER | R-PBGA-B96 | 95 °C | 96 | PLASTIC/EPOXY | VFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 13 mm | 7.5 mm | 1689 | compliant | 5.1 | FBGA-96 | EAR99 | 8542.32.00.36 | |||||||||||||||
MT60B2G8HB-48B:A
Micron Technology Inc
|
查询价格和库存 |
|
End Of Life | 17.1799 Gbit | 8 | 2GX8 | 1.1 V | 2.4038 GHz | 8192 | MULTI BANK PAGE BURST | DDR5 DRAM | SELF REFRESH | COMMON | 1 | 1 | 2000000000 | 2.1475 G | SYNCHRONOUS | 3-STATE | YES | CMOS | R-PBGA-B82 | 95 °C | 82 | PLASTIC/EPOXY | VFBGA | BGA82,11X13,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1 mm | 11 mm | 9 mm | 2190 | compliant | 0.48 | |||||||||||||||||||||||||||
AS4C16M16SA-7BCN
Alliance Memory Inc
|
查询价格和库存 |
|
Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 5.4 ns | 143 MHz | 8192 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | YES | 1,2,4,8,FP | 20 mA | 55 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PBGA-B54 | 3 | 70 °C | 54 | PLASTIC/EPOXY | TFBGA | BGA54,9X9,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 8 mm | 1689 | compliant | 4 | TFBGA-54 | Taiwan | EAR99 | 8542.32.00.24 |