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DRAM:

266,974 个筛选结果
动态随机存取存储器(Dynamic Random Access Memory,DRAM)是一种半导体存储器,主要的作用原理是利用电容内存储电荷的多寡来代表一个二进制比特(bit)是1还是0。由于在现实中晶体管会有漏电电流的现象,导致电容上所存储的电荷数量并不足以正确的判别数据,而导致数据毁损。因此对于DRAM来说,周期性地充电是一个无可避免的要件。由于这种需要定时刷新的特性,因此被称为“动态”存储器。相对来说,静态存储器(SRAM)只要存入数据后,纵使不刷新也不会丢失记忆。
SRAM (540,897)
闪存 (312,420)
DRAM (266,974)
EEPROM (146,536)
FIFO (71,621)
OTP ROM (39,010)
EPROM (21,844)
MASK ROM (10,109)
PROM (70)
型号 访问模式 (18)
最长访问时间 (50)
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最大时钟频率 (fCLK) (50)
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制造商 (50)
内存密度 (50)
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内存宽度 (26)
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组织 (50)
型号
型号 Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
数据手册 单价/库存
风险等级 是否无铅 是否Rohs认证
生命周期 内存密度 内存宽度 组织 标称供电电压 (Vsup)
最长访问时间 最大时钟频率 (fCLK) 刷新周期
访问模式 内存集成电路类型 其他特性 I/O 类型 交错的突发长度 功能数量 端口数量 字数代码 字数 工作模式 输出特性 自我刷新
连续突发长度
最大待机电流
最小待机电流
最大压摆率
最大供电电压 (Vsup)
最小供电电压 (Vsup)
技术 温度等级
JESD-30 代码 认证状态
JESD-609代码 湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度) 处于峰值回流温度下的最长时间
端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 表面贴装
端子面层
端子形式
端子节距
端子位置
座面最大高度
长度 宽度
mfrid
包装说明
是否符合REACH标准
Country Of Origin
ECCN代码
HTS代码
YTEOL
零件包装代码
针数
Date Of Intro
IS42S16320F-7BL
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 536.8709 Mbit 16 32MX16 3.3 V 5.4 ns 143 MHz 8192 FOUR BANK PAGE BURST SYNCHRONOUS DRAM PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 32000000 33.5544 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 4 mA 160 µA 3.6 V 3 V CMOS COMMERCIAL R-PBGA-B54 Not Qualified 70 °C 54 PLASTIC/EPOXY TFBGA BGA54,9X9,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13 mm 8 mm 2070 TFBGA, BGA54,9X9,32 compliant Mainland China, Taiwan EAR99 8542.32.00.28 4
IS42S32800J-6BLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 268.4355 Mbit 32 8MX32 3.3 V 5.4 ns 166 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 8000000 8.3886 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 4 mA 190 µA 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B90 e1 3 85 °C -40 °C 260 10 90 PLASTIC/EPOXY TFBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 13 mm 8 mm 2070 TFBGA, compliant Mainland China, Taiwan EAR99 8542.32.00.24 4
IS42S16320F-7BLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 536.8709 Mbit 16 32MX16 3.3 V 5.4 ns 143 MHz 8192 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 32000000 33.5544 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 4 mA 160 µA 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B54 Not Qualified e1 3 85 °C -40 °C 260 30 54 PLASTIC/EPOXY TFBGA BGA54,9X9,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 13 mm 8 mm 2070 TFBGA, BGA54,9X9,32 compliant Mainland China, Taiwan EAR99 8542.32.00.28 4
AS4C4M32S-6BIN
Alliance Memory Inc
查询价格和库存
Yes Active 134.2177 Mbit 32 4MX32 3.3 V 5.4 ns 166 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 4000000 4.1943 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 3 mA 200 µA 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B90 Not Qualified 3 85 °C -40 °C 90 PLASTIC/EPOXY TFBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13 mm 8 mm 1689 8 X 13 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-90 compliant Taiwan EAR99 8542.32.00.02 4
IS42S83200J-7TLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 268.4355 Mbit 8 32MX8 3.3 V 5.4 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH 1 1 32000000 33.5544 M SYNCHRONOUS YES 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G54 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 54 PLASTIC/EPOXY TSOP2 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2070 TSOP2, compliant Mainland China, Taiwan EAR99 8542.32.00.24 4
MT47H64M8SH-25E:H
Micron Technology Inc
查询价格和库存
Yes Yes Active 536.8709 Mbit 8 64MX8 1.8 V 400 ps 400 MHz 8192 FOUR BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH COMMON 4,8 1 1 64000000 67.1089 M SYNCHRONOUS 3-STATE YES 4,8 10 mA 150 µA 1.9 V 1.7 V CMOS OTHER R-PBGA-B60 Not Qualified e1 85 °C 260 30 60 PLASTIC/EPOXY TFBGA BGA60,9X11,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 10 mm 8 mm 2190 TFBGA, BGA60,9X11,32 compliant EAR99 8542.32.00.28 4.75 BGA 60
MT40A512M16TB-062E:R
Micron Technology Inc
查询价格和库存
Yes Active 8.5899 Gbit 16 512MX16 1.2 V 1.6 GHz 8192 MULTI BANK PAGE BURST DDR4 DRAM COMMON 8 1 1 512000000 536.8709 M SYNCHRONOUS YES 8 1.26 V 1.14 V CMOS R-PBGA-B96 95 °C 260 30 96 PLASTIC/EPOXY TFBGA BGA96,9X16,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13 mm 7.5 mm 2190 compliant 5.1
AS4C4M16SA-7B2CN
Alliance Memory Inc
查询价格和库存
Yes Active 67.1089 Mbit 16 4MX16 3.3 V 5.4 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 4000000 4.1943 M SYNCHRONOUS YES 3.6 V 3 V CMOS COMMERCIAL R-PBGA-B60 3 70 °C 60 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 10.1 mm 6.4 mm 1689 FBGA-60 compliant Taiwan EAR99 8542.32.00.02 4
MT48LC8M16A2P-6A
Micron Technology Inc
查询价格和库存
Yes Yes Active 134.2177 Mbit 16 8MX16 3.3 V 5.4 ns 167 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 8000000 8.3886 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 2 mA 330 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G54 Not Qualified e3 70 °C 260 30 54 PLASTIC/EPOXY TSOP2 TSOP54,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2190 TSOP2, TSOP54,.46,32 compliant EAR99 8542.32.00.02 4 TSOP2 54
IS43TR16512BL-125KBLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 8.5899 Gbit 16 512MX16 1.35 V 800 MHz 8192 MULTI BANK PAGE BURST DDR3L DRAM AUTO/SELF REFRESH 4,8 1 1 512000000 536.8709 M SYNCHRONOUS YES 4,8 83 mA 1.283 V 101 µA 1.45 V 1.283 V CMOS INDUSTRIAL R-PBGA-B96 e1 3 95 °C -40 °C 260 10 96 PLASTIC/EPOXY TFBGA BGA96,6X16,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 14 mm 10 mm 2070 TFBGA, compliant Mainland China, Taiwan EAR99 8542.32.00.36 5.17 2017-09-18
IS42S16800F-6TLI
Integrated Silicon Solution Inc
查询价格和库存
Yes End Of Life 134.2177 Mbit 16 8MX16 3.3 V 5.4 ns 166 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 8000000 8.3886 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 2 mA 120 µA 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G54 Not Qualified 85 °C -40 °C 54 PLASTIC/EPOXY TSOP2 TSOP54,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2070 TSOP2, TSOP54,.46,32 compliant Mainland China, Taiwan EAR99 8542.32.00.02 0.89 TSOP2 54
W9812G6KH-6
Winbond Electronics Corp
查询价格和库存
Yes Active 134.2177 Mbit 16 8MX16 3.3 V 5 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 8000000 8.3886 M SYNCHRONOUS YES 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G54 e3 70 °C 54 PLASTIC/EPOXY TSOP2 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2558 TSOP2-54 compliant EAR99 8542.32.00.02 4
IS42S32160F-7BLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 536.8709 Mbit 32 16MX32 3.3 V 5.4 ns 143 MHz 8192 FOUR BANK PAGE BURST SYNCHRONOUS DRAM PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 16000000 16.7772 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 4 mA 230 µA 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B90 Not Qualified 85 °C -40 °C 90 PLASTIC/EPOXY TFBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13 mm 8 mm 2070 TFBGA, BGA90,9X15,32 compliant Mainland China, Taiwan EAR99 8542.32.00.28 4
IS43R83200F-6TLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 268.4355 Mbit 8 32MX8 2.5 V 700 ps 166 MHz FOUR BANK PAGE BURST DDR1 DRAM COMMON 2,4,8 1 1 32000000 33.5544 M SYNCHRONOUS 3-STATE YES 2,4,8 30 mA 190 µA 2.7 V 2.3 V CMOS INDUSTRIAL R-PDSO-G66 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 66 PLASTIC/EPOXY TSOP2 TSSOP66,.46 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 650 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2070 TSOP2, TSSOP66,.46 compliant Mainland China, Taiwan EAR99 8542.32.00.24 4.25
IS42S32800J-7TL
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 268.4355 Mbit 32 8MX32 3.3 V 5.4 ns 143 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 8000000 8.3886 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 4 mA 170 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G86 e3 3 70 °C 260 10 86 PLASTIC/EPOXY TSOP2 TSSOP86,.46,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin (Sn) GULL WING 500 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2070 TSOP2, compliant Mainland China, Taiwan EAR99 8542.32.00.24 4
AS4C32M16SB-7TCNTR
Alliance Memory Inc
查询价格和库存
Yes Yes Active 536.8709 Mbit 16 32MX16 3.3 V 5.4 ns 143 MHz 8192 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 32000000 33.5544 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 60 mA 150 µA 3.6 V 3 V CMOS R-PDSO-G54 e3 3 70 °C 54 PLASTIC/EPOXY TSOP2 TSSOP54,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 1689 compliant Taiwan EAR99 8542.32.00.28 4
W949D2DBJX5I
Winbond Electronics Corp
查询价格和库存
Yes Active 536.8709 Mbit 32 16MX32 1.8 V 5 ns DUAL BANK PAGE BURST LPDDR1 DRAM AUTO/SELF REFRESH 1 1 16000000 16.7772 M SYNCHRONOUS YES 1.95 V 1.7 V CMOS INDUSTRIAL R-PBGA-B90 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 90 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.025 mm 13 mm 8 mm 2558 VFBGA-90 compliant EAR99 8542.32.00.28 4.65
AS4C64M32MD2A-25BIN
Alliance Memory Inc
查询价格和库存
Yes Active 2.1475 Gbit 32 64MX32 1.2 V MULTI BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY 1 1 64000000 67.1089 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS INDUSTRIAL R-PBGA-B134 3 85 °C -40 °C 134 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 11.5 mm 10 mm 1689 FBGA-134 compliant Taiwan EAR99 8542.32.00.36 4.75
MT46V64M8CY-5B:J
Micron Technology Inc
查询价格和库存
Yes Active 536.8709 Mbit 8 64MX8 2.6 V 700 ps 200 MHz 8192 FOUR BANK PAGE BURST DDR1 DRAM AUTO/SELF REFRESH COMMON 2,4,8 1 1 64000000 67.1089 M SYNCHRONOUS 3-STATE YES 2,4,8 5 mA 230 µA 2.7 V 2.5 V CMOS COMMERCIAL R-PBGA-B60 Not Qualified e1 3 70 °C 260 30 60 PLASTIC/EPOXY TBGA BGA60,9X12,40/32 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 12.5 mm 8 mm 2190 FBGA-60 compliant EAR99 8542.32.00.28 4.25 BGA 60
IS43TR16512BL-125KBL
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 8.5899 Gbit 16 512MX16 1.35 V 800 MHz 8192 MULTI BANK PAGE BURST DDR3L DRAM AUTO/SELF REFRESH 4,8 1 1 512000000 536.8709 M SYNCHRONOUS YES 4,8 83 mA 1.283 V 101 µA 1.45 V 1.283 V CMOS OTHER R-PBGA-B96 e1 3 95 °C 260 10 96 PLASTIC/EPOXY TFBGA BGA96,6X16,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 14 mm 10 mm 2070 TFBGA, compliant Mainland China, Taiwan EAR99 8542.32.00.36 5.17 2017-09-18
型号 Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
数据手册 单价/库存
风险等级 是否无铅 是否Rohs认证
生命周期 内存密度 内存宽度 组织 标称供电电压 (Vsup)
最长访问时间 最大时钟频率 (fCLK) 刷新周期
访问模式 内存集成电路类型 其他特性 I/O 类型 交错的突发长度 功能数量 端口数量 字数代码 字数 工作模式 输出特性 自我刷新
连续突发长度
最大待机电流
最小待机电流
最大压摆率
最大供电电压 (Vsup)
最小供电电压 (Vsup)
技术 温度等级
JESD-30 代码 认证状态
JESD-609代码 湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度) 处于峰值回流温度下的最长时间
端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 表面贴装
端子面层
端子形式
端子节距
端子位置
座面最大高度
长度 宽度
mfrid
包装说明
是否符合REACH标准
Country Of Origin
ECCN代码
HTS代码
YTEOL
零件包装代码
针数
Date Of Intro
IS42S16320F-7BL
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 536.8709 Mbit 16 32MX16 3.3 V 5.4 ns 143 MHz 8192 FOUR BANK PAGE BURST SYNCHRONOUS DRAM PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 32000000 33.5544 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 4 mA 160 µA 3.6 V 3 V CMOS COMMERCIAL R-PBGA-B54 Not Qualified 70 °C 54 PLASTIC/EPOXY TFBGA BGA54,9X9,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13 mm 8 mm 2070 TFBGA, BGA54,9X9,32 compliant Mainland China, Taiwan EAR99 8542.32.00.28 4
IS42S32800J-6BLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 268.4355 Mbit 32 8MX32 3.3 V 5.4 ns 166 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 8000000 8.3886 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 4 mA 190 µA 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B90 e1 3 85 °C -40 °C 260 10 90 PLASTIC/EPOXY TFBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 13 mm 8 mm 2070 TFBGA, compliant Mainland China, Taiwan EAR99 8542.32.00.24 4
IS42S16320F-7BLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 536.8709 Mbit 16 32MX16 3.3 V 5.4 ns 143 MHz 8192 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 32000000 33.5544 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 4 mA 160 µA 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B54 Not Qualified e1 3 85 °C -40 °C 260 30 54 PLASTIC/EPOXY TFBGA BGA54,9X9,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 13 mm 8 mm 2070 TFBGA, BGA54,9X9,32 compliant Mainland China, Taiwan EAR99 8542.32.00.28 4
AS4C4M32S-6BIN
Alliance Memory Inc
查询价格和库存
Yes Active 134.2177 Mbit 32 4MX32 3.3 V 5.4 ns 166 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 4000000 4.1943 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 3 mA 200 µA 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B90 Not Qualified 3 85 °C -40 °C 90 PLASTIC/EPOXY TFBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13 mm 8 mm 1689 8 X 13 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-90 compliant Taiwan EAR99 8542.32.00.02 4
IS42S83200J-7TLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 268.4355 Mbit 8 32MX8 3.3 V 5.4 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH 1 1 32000000 33.5544 M SYNCHRONOUS YES 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G54 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 54 PLASTIC/EPOXY TSOP2 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2070 TSOP2, compliant Mainland China, Taiwan EAR99 8542.32.00.24 4
MT47H64M8SH-25E:H
Micron Technology Inc
查询价格和库存
Yes Yes Active 536.8709 Mbit 8 64MX8 1.8 V 400 ps 400 MHz 8192 FOUR BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH COMMON 4,8 1 1 64000000 67.1089 M SYNCHRONOUS 3-STATE YES 4,8 10 mA 150 µA 1.9 V 1.7 V CMOS OTHER R-PBGA-B60 Not Qualified e1 85 °C 260 30 60 PLASTIC/EPOXY TFBGA BGA60,9X11,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 10 mm 8 mm 2190 TFBGA, BGA60,9X11,32 compliant EAR99 8542.32.00.28 4.75 BGA 60
MT40A512M16TB-062E:R
Micron Technology Inc
查询价格和库存
Yes Active 8.5899 Gbit 16 512MX16 1.2 V 1.6 GHz 8192 MULTI BANK PAGE BURST DDR4 DRAM COMMON 8 1 1 512000000 536.8709 M SYNCHRONOUS YES 8 1.26 V 1.14 V CMOS R-PBGA-B96 95 °C 260 30 96 PLASTIC/EPOXY TFBGA BGA96,9X16,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13 mm 7.5 mm 2190 compliant 5.1
AS4C4M16SA-7B2CN
Alliance Memory Inc
查询价格和库存
Yes Active 67.1089 Mbit 16 4MX16 3.3 V 5.4 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 4000000 4.1943 M SYNCHRONOUS YES 3.6 V 3 V CMOS COMMERCIAL R-PBGA-B60 3 70 °C 60 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 10.1 mm 6.4 mm 1689 FBGA-60 compliant Taiwan EAR99 8542.32.00.02 4
MT48LC8M16A2P-6A
Micron Technology Inc
查询价格和库存
Yes Yes Active 134.2177 Mbit 16 8MX16 3.3 V 5.4 ns 167 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 8000000 8.3886 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 2 mA 330 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G54 Not Qualified e3 70 °C 260 30 54 PLASTIC/EPOXY TSOP2 TSOP54,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2190 TSOP2, TSOP54,.46,32 compliant EAR99 8542.32.00.02 4 TSOP2 54
IS43TR16512BL-125KBLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 8.5899 Gbit 16 512MX16 1.35 V 800 MHz 8192 MULTI BANK PAGE BURST DDR3L DRAM AUTO/SELF REFRESH 4,8 1 1 512000000 536.8709 M SYNCHRONOUS YES 4,8 83 mA 1.283 V 101 µA 1.45 V 1.283 V CMOS INDUSTRIAL R-PBGA-B96 e1 3 95 °C -40 °C 260 10 96 PLASTIC/EPOXY TFBGA BGA96,6X16,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 14 mm 10 mm 2070 TFBGA, compliant Mainland China, Taiwan EAR99 8542.32.00.36 5.17 2017-09-18
IS42S16800F-6TLI
Integrated Silicon Solution Inc
查询价格和库存
Yes End Of Life 134.2177 Mbit 16 8MX16 3.3 V 5.4 ns 166 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 8000000 8.3886 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 2 mA 120 µA 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G54 Not Qualified 85 °C -40 °C 54 PLASTIC/EPOXY TSOP2 TSOP54,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2070 TSOP2, TSOP54,.46,32 compliant Mainland China, Taiwan EAR99 8542.32.00.02 0.89 TSOP2 54
W9812G6KH-6
Winbond Electronics Corp
查询价格和库存
Yes Active 134.2177 Mbit 16 8MX16 3.3 V 5 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 8000000 8.3886 M SYNCHRONOUS YES 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G54 e3 70 °C 54 PLASTIC/EPOXY TSOP2 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2558 TSOP2-54 compliant EAR99 8542.32.00.02 4
IS42S32160F-7BLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 536.8709 Mbit 32 16MX32 3.3 V 5.4 ns 143 MHz 8192 FOUR BANK PAGE BURST SYNCHRONOUS DRAM PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 16000000 16.7772 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 4 mA 230 µA 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B90 Not Qualified 85 °C -40 °C 90 PLASTIC/EPOXY TFBGA BGA90,9X15,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 13 mm 8 mm 2070 TFBGA, BGA90,9X15,32 compliant Mainland China, Taiwan EAR99 8542.32.00.28 4
IS43R83200F-6TLI
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 268.4355 Mbit 8 32MX8 2.5 V 700 ps 166 MHz FOUR BANK PAGE BURST DDR1 DRAM COMMON 2,4,8 1 1 32000000 33.5544 M SYNCHRONOUS 3-STATE YES 2,4,8 30 mA 190 µA 2.7 V 2.3 V CMOS INDUSTRIAL R-PDSO-G66 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 66 PLASTIC/EPOXY TSOP2 TSSOP66,.46 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 650 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2070 TSOP2, TSSOP66,.46 compliant Mainland China, Taiwan EAR99 8542.32.00.24 4.25
IS42S32800J-7TL
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 268.4355 Mbit 32 8MX32 3.3 V 5.4 ns 143 MHz 4096 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 8000000 8.3886 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 4 mA 170 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G86 e3 3 70 °C 260 10 86 PLASTIC/EPOXY TSOP2 TSSOP86,.46,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin (Sn) GULL WING 500 µm DUAL 1.2 mm 22.22 mm 10.16 mm 2070 TSOP2, compliant Mainland China, Taiwan EAR99 8542.32.00.24 4
AS4C32M16SB-7TCNTR
Alliance Memory Inc
查询价格和库存
Yes Yes Active 536.8709 Mbit 16 32MX16 3.3 V 5.4 ns 143 MHz 8192 FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH COMMON 1,2,4,8 1 1 32000000 33.5544 M SYNCHRONOUS 3-STATE YES 1,2,4,8,FP 60 mA 150 µA 3.6 V 3 V CMOS R-PDSO-G54 e3 3 70 °C 54 PLASTIC/EPOXY TSOP2 TSSOP54,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm 1689 compliant Taiwan EAR99 8542.32.00.28 4
W949D2DBJX5I
Winbond Electronics Corp
查询价格和库存
Yes Active 536.8709 Mbit 32 16MX32 1.8 V 5 ns DUAL BANK PAGE BURST LPDDR1 DRAM AUTO/SELF REFRESH 1 1 16000000 16.7772 M SYNCHRONOUS YES 1.95 V 1.7 V CMOS INDUSTRIAL R-PBGA-B90 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 90 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.025 mm 13 mm 8 mm 2558 VFBGA-90 compliant EAR99 8542.32.00.28 4.65
AS4C64M32MD2A-25BIN
Alliance Memory Inc
查询价格和库存
Yes Active 2.1475 Gbit 32 64MX32 1.2 V MULTI BANK PAGE BURST DDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY 1 1 64000000 67.1089 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS INDUSTRIAL R-PBGA-B134 3 85 °C -40 °C 134 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 11.5 mm 10 mm 1689 FBGA-134 compliant Taiwan EAR99 8542.32.00.36 4.75
MT46V64M8CY-5B:J
Micron Technology Inc
查询价格和库存
Yes Active 536.8709 Mbit 8 64MX8 2.6 V 700 ps 200 MHz 8192 FOUR BANK PAGE BURST DDR1 DRAM AUTO/SELF REFRESH COMMON 2,4,8 1 1 64000000 67.1089 M SYNCHRONOUS 3-STATE YES 2,4,8 5 mA 230 µA 2.7 V 2.5 V CMOS COMMERCIAL R-PBGA-B60 Not Qualified e1 3 70 °C 260 30 60 PLASTIC/EPOXY TBGA BGA60,9X12,40/32 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 12.5 mm 8 mm 2190 FBGA-60 compliant EAR99 8542.32.00.28 4.25 BGA 60
IS43TR16512BL-125KBL
Integrated Silicon Solution Inc
查询价格和库存
Yes Active 8.5899 Gbit 16 512MX16 1.35 V 800 MHz 8192 MULTI BANK PAGE BURST DDR3L DRAM AUTO/SELF REFRESH 4,8 1 1 512000000 536.8709 M SYNCHRONOUS YES 4,8 83 mA 1.283 V 101 µA 1.45 V 1.283 V CMOS OTHER R-PBGA-B96 e1 3 95 °C 260 10 96 PLASTIC/EPOXY TFBGA BGA96,6X16,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 14 mm 10 mm 2070 TFBGA, compliant Mainland China, Taiwan EAR99 8542.32.00.36 5.17 2017-09-18
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