蜂窝电话电路封装型号_蜂窝电话电路厂家价格-bom2buy

型号

型号						Most Relevant			Technical					Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	标称供电电压 (Vsup)	模拟集成电路 - 其他类型	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	mfrid	包装说明	是否符合REACH标准	ECCN代码	HTS代码	零件包装代码	针数	制造商包装代码	Country Of Origin	YTEOL	最大供电电压 (Vsup)	最小供电电压 (Vsup)	Date Of Intro
LMV225SD/NOPB National Semiconductor Corporation		查询价格和库存			Yes	Transferred	2.7 V				1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	R-XDSO-N6	e3	Not Qualified	1	85 °C	-40 °C	260	40	6	UNSPECIFIED	VSON		RECTANGULAR	SMALL OUTLINE, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	650 µm	DUAL	2.2 mm	2.5 mm	800 µm	LMV225SD/NOPB	2216	2.20 X 2.50 MM, 0.80 MM HEIGHT, LEAD FREE, LLP-6	compliant	EAR99	8542.39.00.01
ADF4360-0BCPZRL7 Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-0BCPZRL7	1742	4 X 4 MM, LEAD FREE, MO-220-VGGD-2, LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	Philippines	8.5	3.6 V	3 V
ADF4360-4BCPZ Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-4BCPZ	1742	4 X 4 MM, LEAD FREE, MO-220-VGGD-2, LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	Philippines	8.5	3.6 V	3 V
MAX2308ETI+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	2.75 V				1	41.5 µA	INDUSTRIAL	BASEBAND CIRCUIT	S-XQCC-N28	e3	Not Qualified	1	85 °C	-40 °C	260	30	28	UNSPECIFIED	HVQCCN	LCC28,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	500 µm	QUAD	5 mm	5 mm	800 µm		2164	HVQCCN, LCC28,.2SQ,20	compliant	EAR99	8542.39.00.01	QFN	28		Japan, Mainland China, Malaysia, Philipp... more	9
MAX2306ETI+T Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	2.75 V				1	41.5 µA	INDUSTRIAL	BASEBAND CIRCUIT	S-XQCC-N28	e3	Not Qualified	1	85 °C	-40 °C	260	30	28	UNSPECIFIED	HVQCCN	LCC28,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	500 µm	QUAD	5 mm	5 mm	800 µm		2164	5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, TQFN-28	compliant	EAR99	8542.39.00.01	QFN	28		Japan, Mainland China, Malaysia, Philipp... more	9
BGA7H1BN6E6327XTSA1 Infineon Technologies AG		查询价格和库存			Yes	Active	2.8 V				1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	R-PBCC-N6	e3		1	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	6	PLASTIC/EPOXY	VQCCN		RECTANGULAR	CHIP CARRIER, VERY THIN PROFILE	YES	Tin (Sn)	NO LEAD	400 µm	BOTTOM	700 µm	1.1 mm	400 µm		2065	VQCCN,	compliant		8542.39.00.01					9.2
BGA7L1BN6E6327XTSA1 Infineon Technologies AG		查询价格和库存			Yes	Active	2.8 V				1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	R-PBCC-N6	e3		1	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	6	PLASTIC/EPOXY	VQCCN		RECTANGULAR	CHIP CARRIER, VERY THIN PROFILE	YES	Tin (Sn)	NO LEAD	400 µm	BOTTOM	700 µm	1.1 mm	400 µm		2065	VQCCN,	compliant		8542.39.00.01					9.2
LMV225TL/NOPB National Semiconductor Corporation		查询价格和库存			Yes	Transferred	2.7 V				1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-PBGA-B4	e1	Not Qualified	1	85 °C	-40 °C	260	40	4	PLASTIC/EPOXY	VFBGA		SQUARE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	500 µm	BOTTOM	1.014 mm	1.014 mm	675 µm	LMV225TL/NOPB	2216	1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4	compliant	EAR99	8542.39.00.01
MAX2055EUP+D Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	5 V	BICMOS			1		INDUSTRIAL	BASEBAND CIRCUIT	R-PDSO-G20	e3	Not Qualified	1	85 °C	-40 °C	260	30	20	PLASTIC/EPOXY	HTSSOP		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	4.4 mm	6.5 mm	1.1 mm		2164	4.40 MM, ROHS COMPLIANT, MO-153AC, TSSOP-20	compliant	EAR99	8542.39.00.01	TSSOP	20		Japan, Mainland China, Malaysia, Philipp... more	9
ADF4360-2BCPZRL7 Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-2BCPZRL7	1742	LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	South Korea	8.5	3.6 V	3 V
BGU7258X NXP Semiconductors		查询价格和库存			Yes	Active	3.3 V				1			RF AND BASEBAND CIRCUIT	S-PDSO-N6	e4		1	85 °C	-40 °C	260	30	6	PLASTIC/EPOXY	HVSON	SOLCC6,.06,20	SQUARE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	500 µm	DUAL	1.6 mm	1.6 mm	500 µm	BGU7258X	2245	XSON-6	compliant		8542.33.00.01	DFN	6	SOT1189-1	Malaysia, Thailand	10
ADF4360-1BCPZRL7 Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-1BCPZRL7	1742	4 X 4 MM, LEAD FREE, MO-220-VGGD-2, LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	South Korea	8.5	3.6 V	3 V
ADF4360-1BCPZ Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-1BCPZ	1742	4 X 4 MM, LEAD FREE, MO-220-VGGD-2, LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14		8.5	3.6 V	3 V
ADF4360-2BCPZ Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-2BCPZ	1742	LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	South Korea	8.5	3.6 V	3 V
ADL5561ACPZ-R7 Analog Devices Inc		查询价格和库存		No	Yes	Active	3.3 V				1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-XQCC-N16	e3		3	85 °C	-40 °C	260	30	16	UNSPECIFIED	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	3 mm	3 mm	1 mm	ADL5561ACPZ-R7	1742	LFCSP-16	compliant	EAR99	8542.33.00.01	QFN	16	CP-16-27		8.5
BGA725L6E6327FTSA1 Infineon Technologies AG		查询价格和库存			Yes	Active	1.8 V				1		INDUSTRIAL	BASEBAND CIRCUIT	R-XBCC-B6	e4		1	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	6	UNSPECIFIED	BCC		RECTANGULAR	CHIP CARRIER	YES	Gold (Au)	BUTT	200 µm	BOTTOM	700 µm	1.1 mm	400 µm	BGA725L6E6327FTSA1	2065	BCC,	compliant		8542.39.00.01					6.2
BGS8L2X NXP Semiconductors		查询价格和库存			Yes	Active								RF FRONT END CIRCUIT				1			260	NOT SPECIFIED															BGS8L2X	2245		compliant		8542.33.00.01	SON	6	SOT1232	Mainland China	9
S2-LPCBQTR STMicroelectronics		查询价格和库存			Yes	Active								RF AND BASEBAND CIRCUIT							NOT SPECIFIED	NOT SPECIFIED															S2-LPCBQTR	2443		compliant	EAR99	8542.39.00.01				Philippines	8.24			2018-02-01
ADF4360-5BCPZRL7 Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-5BCPZRL7	1742	4 X 4 MM, LEAD FREE, MO-220-VGGD-2, LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	South Korea	8.5	3.6 V	3 V
MAX2055EUP+TD Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	5 V	BICMOS			1		INDUSTRIAL	BASEBAND CIRCUIT	R-PDSO-G20	e3	Not Qualified	1	85 °C	-40 °C	260	30	20	PLASTIC/EPOXY	HTSSOP		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	4.4 mm	6.5 mm	1.1 mm		2164	HTSSOP,	compliant	EAR99	8542.39.00.01	TSSOP	20		Japan, Mainland China, Malaysia, Philipp... more	9

型号						Most Relevant			Technical					Compliance			Operating Conditions					Physical											Dimensions			Other
型号	数据手册	单价/库存	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	标称供电电压 (Vsup)	模拟集成电路 - 其他类型	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	Source Content uid	mfrid	包装说明	是否符合REACH标准	ECCN代码	HTS代码	零件包装代码	针数	制造商包装代码	Country Of Origin	YTEOL	最大供电电压 (Vsup)	最小供电电压 (Vsup)	Date Of Intro
LMV225SD/NOPB National Semiconductor Corporation		查询价格和库存			Yes	Transferred	2.7 V				1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	R-XDSO-N6	e3	Not Qualified	1	85 °C	-40 °C	260	40	6	UNSPECIFIED	VSON		RECTANGULAR	SMALL OUTLINE, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	650 µm	DUAL	2.2 mm	2.5 mm	800 µm	LMV225SD/NOPB	2216	2.20 X 2.50 MM, 0.80 MM HEIGHT, LEAD FREE, LLP-6	compliant	EAR99	8542.39.00.01
ADF4360-0BCPZRL7 Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-0BCPZRL7	1742	4 X 4 MM, LEAD FREE, MO-220-VGGD-2, LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	Philippines	8.5	3.6 V	3 V
ADF4360-4BCPZ Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-4BCPZ	1742	4 X 4 MM, LEAD FREE, MO-220-VGGD-2, LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	Philippines	8.5	3.6 V	3 V
MAX2308ETI+ Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	2.75 V				1	41.5 µA	INDUSTRIAL	BASEBAND CIRCUIT	S-XQCC-N28	e3	Not Qualified	1	85 °C	-40 °C	260	30	28	UNSPECIFIED	HVQCCN	LCC28,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	500 µm	QUAD	5 mm	5 mm	800 µm		2164	HVQCCN, LCC28,.2SQ,20	compliant	EAR99	8542.39.00.01	QFN	28		Japan, Mainland China, Malaysia, Philipp... more	9
MAX2306ETI+T Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	2.75 V				1	41.5 µA	INDUSTRIAL	BASEBAND CIRCUIT	S-XQCC-N28	e3	Not Qualified	1	85 °C	-40 °C	260	30	28	UNSPECIFIED	HVQCCN	LCC28,.2SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	MATTE TIN	NO LEAD	500 µm	QUAD	5 mm	5 mm	800 µm		2164	5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, TQFN-28	compliant	EAR99	8542.39.00.01	QFN	28		Japan, Mainland China, Malaysia, Philipp... more	9
BGA7H1BN6E6327XTSA1 Infineon Technologies AG		查询价格和库存			Yes	Active	2.8 V				1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	R-PBCC-N6	e3		1	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	6	PLASTIC/EPOXY	VQCCN		RECTANGULAR	CHIP CARRIER, VERY THIN PROFILE	YES	Tin (Sn)	NO LEAD	400 µm	BOTTOM	700 µm	1.1 mm	400 µm		2065	VQCCN,	compliant		8542.39.00.01					9.2
BGA7L1BN6E6327XTSA1 Infineon Technologies AG		查询价格和库存			Yes	Active	2.8 V				1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	R-PBCC-N6	e3		1	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	6	PLASTIC/EPOXY	VQCCN		RECTANGULAR	CHIP CARRIER, VERY THIN PROFILE	YES	Tin (Sn)	NO LEAD	400 µm	BOTTOM	700 µm	1.1 mm	400 µm		2065	VQCCN,	compliant		8542.39.00.01					9.2
LMV225TL/NOPB National Semiconductor Corporation		查询价格和库存			Yes	Transferred	2.7 V				1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-PBGA-B4	e1	Not Qualified	1	85 °C	-40 °C	260	40	4	PLASTIC/EPOXY	VFBGA		SQUARE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	YES	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	500 µm	BOTTOM	1.014 mm	1.014 mm	675 µm	LMV225TL/NOPB	2216	1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4	compliant	EAR99	8542.39.00.01
MAX2055EUP+D Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	5 V	BICMOS			1		INDUSTRIAL	BASEBAND CIRCUIT	R-PDSO-G20	e3	Not Qualified	1	85 °C	-40 °C	260	30	20	PLASTIC/EPOXY	HTSSOP		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	4.4 mm	6.5 mm	1.1 mm		2164	4.40 MM, ROHS COMPLIANT, MO-153AC, TSSOP-20	compliant	EAR99	8542.39.00.01	TSSOP	20		Japan, Mainland China, Malaysia, Philipp... more	9
ADF4360-2BCPZRL7 Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-2BCPZRL7	1742	LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	South Korea	8.5	3.6 V	3 V
BGU7258X NXP Semiconductors		查询价格和库存			Yes	Active	3.3 V				1			RF AND BASEBAND CIRCUIT	S-PDSO-N6	e4		1	85 °C	-40 °C	260	30	6	PLASTIC/EPOXY	HVSON	SOLCC6,.06,20	SQUARE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	NO LEAD	500 µm	DUAL	1.6 mm	1.6 mm	500 µm	BGU7258X	2245	XSON-6	compliant		8542.33.00.01	DFN	6	SOT1189-1	Malaysia, Thailand	10
ADF4360-1BCPZRL7 Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-1BCPZRL7	1742	4 X 4 MM, LEAD FREE, MO-220-VGGD-2, LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	South Korea	8.5	3.6 V	3 V
ADF4360-1BCPZ Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-1BCPZ	1742	4 X 4 MM, LEAD FREE, MO-220-VGGD-2, LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14		8.5	3.6 V	3 V
ADF4360-2BCPZ Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-2BCPZ	1742	LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	South Korea	8.5	3.6 V	3 V
ADL5561ACPZ-R7 Analog Devices Inc		查询价格和库存		No	Yes	Active	3.3 V				1		INDUSTRIAL	RF AND BASEBAND CIRCUIT	S-XQCC-N16	e3		3	85 °C	-40 °C	260	30	16	UNSPECIFIED	HVQCCN		SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	3 mm	3 mm	1 mm	ADL5561ACPZ-R7	1742	LFCSP-16	compliant	EAR99	8542.33.00.01	QFN	16	CP-16-27		8.5
BGA725L6E6327FTSA1 Infineon Technologies AG		查询价格和库存			Yes	Active	1.8 V				1		INDUSTRIAL	BASEBAND CIRCUIT	R-XBCC-B6	e4		1	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	6	UNSPECIFIED	BCC		RECTANGULAR	CHIP CARRIER	YES	Gold (Au)	BUTT	200 µm	BOTTOM	700 µm	1.1 mm	400 µm	BGA725L6E6327FTSA1	2065	BCC,	compliant		8542.39.00.01					6.2
BGS8L2X NXP Semiconductors		查询价格和库存			Yes	Active								RF FRONT END CIRCUIT				1			260	NOT SPECIFIED															BGS8L2X	2245		compliant		8542.33.00.01	SON	6	SOT1232	Mainland China	9
S2-LPCBQTR STMicroelectronics		查询价格和库存			Yes	Active								RF AND BASEBAND CIRCUIT							NOT SPECIFIED	NOT SPECIFIED															S2-LPCBQTR	2443		compliant	EAR99	8542.39.00.01				Philippines	8.24			2018-02-01
ADF4360-5BCPZRL7 Analog Devices Inc		查询价格和库存		No	Yes	Active		BICMOS	3.3 V	PLL FREQUENCY SYNTHESIZER	1				S-XQCC-N24	e3		3	85 °C	-40 °C	260	30	24	UNSPECIFIED	HVQCCN	LCC24,.16SQ,20	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Matte Tin (Sn) - annealed	NO LEAD	500 µm	QUAD	4 mm	4 mm	800 µm	ADF4360-5BCPZRL7	1742	4 X 4 MM, LEAD FREE, MO-220-VGGD-2, LFCSP-24	compliant	EAR99	8542.39.00.01	QFN	24	CP-24-14	South Korea	8.5	3.6 V	3 V
MAX2055EUP+TD Maxim Integrated Products		查询价格和库存		Yes	Yes	Transferred	5 V	BICMOS			1		INDUSTRIAL	BASEBAND CIRCUIT	R-PDSO-G20	e3	Not Qualified	1	85 °C	-40 °C	260	30	20	PLASTIC/EPOXY	HTSSOP		RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	YES	MATTE TIN	GULL WING	650 µm	DUAL	4.4 mm	6.5 mm	1.1 mm		2164	HTSSOP,	compliant	EAR99	8542.39.00.01	TSSOP	20		Japan, Mainland China, Malaysia, Philipp... more	9

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