型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 信道数量 | 其他特性 | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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mfrid
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包装说明
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是否符合REACH标准
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YTEOL
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Country Of Origin
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HTS代码
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Source Content uid
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ECCN代码
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Date Of Intro
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零件包装代码
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针数
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制造商包装代码
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BGSX24MU16E6327XUSA1
Infineon Technologies AG
|
查询价格和库存 |
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Yes | Obsolete | 2.8 V | RFCMOS | 1 | RF AND BASEBAND CIRCUIT | S-XBGA-N16 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | UNSPECIFIED | HLGA | LGA16,5X5,16 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | YES | NO LEAD | 400 µm | BOTTOM | 2 mm | 2 mm | 640 µm | 2065 | LGA-16 | compliant | 0 | ||||||||||||||||||
MAX2609EUT+
Maxim Integrated Products
|
查询价格和库存 |
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Yes | Yes | Transferred | 2.75 V | 1 | INDUSTRIAL | BASEBAND CIRCUIT | R-PDSO-G6 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.625 mm | 2.9 mm | 1.45 mm | 2164 | LSSOP, | compliant | 9 | Japan, Mainland China, Malaysia, Philipp... more | 8542.39.00.01 | ||||||||||||||
SKY66115-11
Skyworks Solutions Inc
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查询价格和库存 |
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Yes | Yes | Active | 3.3 V | 1 | RF AND BASEBAND CIRCUIT | S-XQCC-N16 | e4 | 3 | 85 °C | -40 °C | 260 | 16 | HVQCCN | LCC16,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | GOLD OVER NICKEL | NO LEAD | 800 µm | QUAD | 4 mm | 4 mm | 1 mm | 2408 | compliant | 9 | 8542.39.00.01 | ||||||||||||||||||
RFX8422S
Skyworks Solutions Inc
|
查询价格和库存 |
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Yes | Yes | Active | INDUSTRIAL | GAS DISCHARGE TUBE SUPPRESSOR | NOT SPECIFIED | NOT SPECIFIED | 2408 | QFN-16 | compliant | 9.3 | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||
SKY66100-11
Skyworks Solutions Inc
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查询价格和库存 |
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Yes | Active | 3.3 V | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQMA-N16 | 3 | 85 °C | -40 °C | 260 | 16 | UNSPECIFIED | SQUARE | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | 800 µm | QUAD | 4 mm | 4 mm | 1 mm | 2408 | GREEN, PACKAGE-16 | compliant | 8.8 | 8542.39.00.01 | ||||||||||||||||||||
SKY65366-21
Skyworks Solutions Inc
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查询价格和库存 |
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Yes | Yes | Active | 3.3 V | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQMA-N28 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | UNSPECIFIED | SQUARE | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | QUAD | 6 mm | 6 mm | 1.15 mm | 2408 | , | unknown | 8.8 | 8542.39.00.01 | ||||||||||||||||||||
RFX2411
Skyworks Solutions Inc
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查询价格和库存 |
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Yes | Yes | Active | 3.3 V | CMOS | 1 | AUTOMOTIVE | RF AND BASEBAND CIRCUIT | S-XQCC-N16 | 125 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 3 mm | 3 mm | 600 µm | 2408 | QFN-16 | compliant | 9.3 | 8542.39.00.01 | |||||||||||||||||
SKY13526-485LF
Skyworks Solutions Inc
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查询价格和库存 |
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Yes | Active | 2.85 V | 1 | OTHER | RF AND BASEBAND CIRCUIT | S-XQCC-N14 | 90 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 14 | UNSPECIFIED | HQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | YES | NO LEAD | QUAD | 2 mm | 2 mm | 600 µm | 2408 | QFN-14 | compliant | 9.1 | 8542.39.00.01 | ||||||||||||||||||||
SKY67022-396LF
Skyworks Solutions Inc
|
查询价格和库存 |
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Yes | Active | 1 | 260 | 2408 | unknown | 9 | Malaysia | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||||
BGC100GN6E6327XTSA1
Infineon Technologies AG
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查询价格和库存 |
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Yes | Active | CMOS | 1 | RF AND BASEBAND CIRCUIT | R-XBCC-B6 | 1 | NOT SPECIFIED | NOT SPECIFIED | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | BOTTOM | 2065 | BCC, | compliant | 9.1 | 8542.39.00.01 | |||||||||||||||||||||||||
LMH9226IRRLR
Texas Instruments
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查询价格和库存 |
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Yes | Yes | Active | 3.3 V | 1 | 1 | 100 mA | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PQCC-N12 | e4 | 2 | 105 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | HVQCCN | LCC12,.08SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD SILVER | NO LEAD | 500 µm | QUAD | 2 mm | 2 mm | 800 µm | 2477 | HVQCCN, LCC12,.08SQ,20 | compliant | 15 | 8542.33.00.01 | LMH9226IRRLR | EAR99 | 2019-12-22 | |||||||||
AFE7989IABJ
Texas Instruments
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查询价格和库存 |
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Yes | Yes | Active | RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000 | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PBGA-B400 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 400 | PLASTIC/EPOXY | FBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 17 mm | 17 mm | 2.65 mm | 2477 | FBGA, BGA400,20X20,32 | compliant | 15 | 8542.39.00.01 | AFE7989IABJ | 5A991.B | 2019-12-20 | |||||||||||
MAX2010ETI+T
Maxim Integrated Products
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查询价格和库存 |
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Yes | Yes | Transferred | 5 V | BICMOS | 1 | 12.1 µA | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N28 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 28 | UNSPECIFIED | HVQCCN | LCC28,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 800 µm | 2164 | HVQCCN, LCC28,.2SQ,20 | compliant | 9 | Japan, Mainland China, Malaysia, Philipp... more | 8542.39.00.01 | EAR99 | QFN | 28 | |||||||
AFE7988IABJ
Texas Instruments
|
查询价格和库存 |
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Yes | Yes | Active | RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000 | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PBGA-B400 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 400 | PLASTIC/EPOXY | FBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 17 mm | 17 mm | 2.65 mm | 2477 | FBGA, BGA400,20X20,32 | compliant | 15 | 8542.39.00.01 | AFE7988IABJ | 5A991.B | 2019-12-20 | |||||||||||
AFE7921IABJ
Texas Instruments
|
查询价格和库存 |
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Yes | Yes | Active | RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000 | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PBGA-B400 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 400 | PLASTIC/EPOXY | FBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 17 mm | 17 mm | 2.65 mm | 2477 | FBGA, BGA400,20X20,32 | compliant | 15 | 8542.39.00.01 | AFE7921IABJ | 5A991.B | 2019-12-20 | |||||||||||
LMH9126IRRLR
Texas Instruments
|
查询价格和库存 |
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Yes | Yes | Active | 3.3 V | 1 | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N12 | e4 | 2 | 105 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | HQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | YES | NICKEL PALLADIUM GOLD SILVER | NO LEAD | QUAD | 2477 | HQCCN, | compliant | 15 | 8542.33.00.01 | LMH9126IRRLR | EAR99 | 2020-04-08 | |||||||||||||||
LTC5599IUF#PBF
Analog Devices Inc
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查询价格和库存 |
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No | Yes | Active | 3.3 V | CMOS | 1 | RF AND BASEBAND CIRCUIT | S-PQCC-N24 | e3 | 1 | 260 | NOT SPECIFIED | 24 | PLASTIC/EPOXY | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | 1742 | 4 X 4 MM, LEAD FREE, PLASTIC, QFN-24 | compliant | 8.5 | Malaysia | 8542.39.00.01 | LTC5599IUF#PBF | 24 | 05-08-1697 | |||||||||||||
LTC5584IUF#PBF
Analog Devices Inc
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查询价格和库存 |
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No | Yes | Active | 5 V | CMOS | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PQCC-N24 | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | 1742 | 4 X 4 MM, LEAD FREE, PLASTIC, MO-220WGGD-X, QFN-24 | compliant | 8.5 | Malaysia | LTC5584IUF#PBF | 24 | 05-08-1697 | |||||||||||
ADL5502ACBZ-P7
Analog Devices Inc
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查询价格和库存 |
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No | Yes | Active | 3 V | BICMOS | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PBGA-B8 | e1 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.46 mm | 1.46 mm | 625 µm | 1742 | WLCSP-8 | compliant | 8.5 | Taiwan | 8542.39.00.01 | ADL5502ACBZ-P7 | EAR99 | BGA | 8 | CB-8-3 | |||||||
STA8089FGB
STMicroelectronics
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查询价格和库存 |
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Active | 1.2 V | CMOS | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N56 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 400 µm | QUAD | 7 mm | 7 mm | 900 µm | 2443 | VFQFPN-56 | compliant | 9.2 | Philippines | 8542.39.00.01 | STA8089FGB | 7A994 |