型号 | Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||
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数据手册 |
单价/库存
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风险等级 |
是否无铅
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是否Rohs认证
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生命周期
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标称供电电压 | 技术 | 运营商类型 | 运营商类型(2) | 功能数量 |
最大压摆率
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温度等级
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电信集成电路类型
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JESD-30 代码 | JESD-609代码 |
认证状态
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湿度敏感等级 | 最高工作温度 | 最低工作温度 |
峰值回流温度(摄氏度)
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处于峰值回流温度下的最长时间
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端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 |
封装形状
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封装形式
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表面贴装
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端子面层
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端子形式
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端子节距
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端子位置
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宽度
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长度 |
座面最大高度
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mfrid
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零件包装代码
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包装说明
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针数
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是否符合REACH标准
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Source Content uid
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HTS代码
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YTEOL
|
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DS2154LNA2+
Rochester Electronics LLC
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQFP-G100 | e3 | COMMERCIAL | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2178096 | QFP | 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | 100 | unknown | ||||||||
PEF22554HT
Infineon Technologies AG
|
查询价格和库存 |
|
Transferred | 1.8 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | INDUSTRIAL | FRAMER | S-PBGA-B160 | e1 | Not Qualified | 85 °C | -40 °C | 160 | PLASTIC/EPOXY | LBGA | QFP144,.87SQ,20 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 15 mm | 15 mm | 1.6 mm | 2065 | BGA | LBGA, QFP144,.87SQ,20 | 160 | compliant | PEF22554HT | 8542.39.00.01 | |||||||||
T-8105---BAL4-DB
LSI Corporation
|
查询价格和库存 |
|
No | No | Transferred | 3.3 V | 1 | 275 µA | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B217 | e0 | Not Qualified | 85 °C | -40 °C | 217 | PLASTIC/EPOXY | BGA | BGA217,17X17,50 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 2.32 mm | 2145 | BGA | BGA, BGA217,17X17,50 | 217 | unknown | 8542.39.00.01 | |||||||||
T-8105---SC4-DB
LSI Corporation
|
查询价格和库存 |
|
No | No | Transferred | 3.3 V | 1 | 275 µA | COMMERCIAL | TIME SLOT ASSIGNER | S-PQFP-G208 | e0 | Not Qualified | 70 °C | 208 | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 28 mm | 28 mm | 4.1 mm | 2145 | QFP | FQFP, QFP208,1.2SQ,20 | 208 | unknown | 8542.39.00.01 | ||||||||||
MT9072AB
Microsemi Corporation
|
查询价格和库存 |
|
No | Transferred | 3.3 V | 8 | INDUSTRIAL | FRAMER | S-PQFP-G208 | Not Qualified | 85 °C | -40 °C | 208 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | 2192 | QFP | , | 208 | unknown | 8542.39.00.01 | |||||||||||||||||||
MT9074AL
Microsemi Corporation
|
查询价格和库存 |
|
No | No | Transferred | 5 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G100 | e0 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | QFP | QFP100,.7X1.0 | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 2192 | QFP | MO-112, MQFP-100 | 100 | unknown | 8542.39.00.01 | |||||||||
IDT82V2108BB
Integrated Device Technology Inc
|
查询价格和库存 |
|
No | No | Transferred | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B144 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 225 | 30 | 144 | PLASTIC/EPOXY | BGA | BGA144,12X12,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 13 mm | 13 mm | 1.97 mm | 2068 | BGA | PLASTIC, BGA-144 | 144 | not_compliant | IDT82V2108BB | 8542.39.00.01 | |||||
PEF22552P
Intel Corporation
|
查询价格和库存 |
|
Contact Manufacturer | 1.8 V | 1 | 165 mA | INDUSTRIAL | FRAMER | S-PBGA-B160 | Not Qualified | 85 °C | -40 °C | 160 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 15 mm | 15 mm | 1.6 mm | 2071 | LBGA, | compliant | 8542.39.00.01 | 2 | |||||||||||||||
PEF22554E
Infineon Technologies AG
|
查询价格和库存 |
|
Transferred | 1.8 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | INDUSTRIAL | FRAMER | S-PQFP-G144 | e3 | Not Qualified | 85 °C | -40 °C | 144 | PLASTIC/EPOXY | LFQFP | BGA160,14X14,40 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | 2065 | QFP | LFQFP, BGA160,14X14,40 | 144 | compliant | PEF22554E | 8542.39.00.01 | |||||||||
PEF22552PG
Intel Corporation
|
查询价格和库存 |
|
Contact Manufacturer | 1.8 V | 1 | 165 mA | INDUSTRIAL | FRAMER | S-PBGA-B160 | Not Qualified | 85 °C | -40 °C | 160 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 15 mm | 15 mm | 1.6 mm | 2071 | LBGA, | compliant | 8542.39.00.01 | ||||||||||||||||
PEF22554E
Lantiq
|
查询价格和库存 |
|
Transferred | 1.8 V | 1 | INDUSTRIAL | FRAMER | S-PQFP-G144 | Not Qualified | 85 °C | -40 °C | 144 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | 2569999 | QFP | LFQFP, | 144 | unknown | 8542.39.00.01 | |||||||||||||||
PEB20560V2.1
Siemens
|
查询价格和库存 |
|
Transferred | 3.3 V | CMOS | 1 | COMMERCIAL | TIME SLOT ASSIGNER | S-PQFP-G160 | Not Qualified | 70 °C | 160 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | 2403 | unknown | 8542.39.00.01 | |||||||||||||||||||||||
MT8976APR1
Rochester Electronics LLC
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | COMMERCIAL | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2178096 | LPCC | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | 44 | unknown | |||||||||
MT8976AP1
Rochester Electronics LLC
|
查询价格和库存 |
|
Yes | Yes | Active | 5 V | 1 | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | COMMERCIAL | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2178096 | LPCC | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | 44 | unknown | |||||||||
PEF22554HT
Lantiq
|
查询价格和库存 |
|
Transferred | 1.8 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B160 | Not Qualified | 85 °C | -40 °C | 160 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 15 mm | 15 mm | 1.6 mm | 2569999 | BGA | LBGA, | 160 | unknown | 8542.39.00.01 | |||||||||||||||
BT8370KPF
Conexant Systems Inc
|
查询价格和库存 |
|
No | No | Transferred | 5 V | CMOS | 1 | 175 µA | COMMERCIAL | FRAMER | S-PQFP-G80 | e0 | Not Qualified | 70 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7SQ | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.3 mm | 1872 | QFP | METRIC, QFP-80 | 80 | compliant | 8542.39.00.01 | |||||||||
PEB2256
Siemens
|
查询价格和库存 |
|
Transferred | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PQFP-G80 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | 2403 | , | unknown | 8542.39.00.01 | |||||||||||||||||||||
BT8375EPF
Rockwell Automation
|
查询价格和库存 |
|
Contact Manufacturer | 5 V | CMOS | 1 | 175 mA | INDUSTRIAL | FRAMER | S-PQFP-G80 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | 4307574 | , | compliant | 8542.39.00.01 | 2 | |||||||||||||||||||
PEB2054-N
Siemens
|
查询价格和库存 |
|
Transferred | 1 | TIME SLOT ASSIGNER | S-PQCC-J44 | Not Qualified | 44 | PLASTIC/EPOXY | SQUARE | CHIP CARRIER | YES | J BEND | QUAD | 2403 | , | unknown | 8542.39.00.01 | ||||||||||||||||||||||||||
BT8370KPF
Rockwell Automation
|
查询价格和库存 |
|
Contact Manufacturer | 5 V | CMOS | 1 | 175 mA | COMMERCIAL | FRAMER | S-PQFP-G80 | Not Qualified | 70 °C | 80 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | 4307574 | compliant | 8542.39.00.01 | 2 |